SEMTECH SX1240

SX1240
DATASHEET
ADVANCED COMMUNICATIONS & SENSING
SX1240 - Low Cost Integrated Transmitter IC
434 MHz and 868 MHz Band RF Transmitter
GENERAL DESCRIPTION
APPLICATIONS
The SX1240 is an ultra-low-cost, fully integrated FSK or
OOK compatible transmitter suitable for operation in the
418, 434 and 868 MHz licence free ISM bands.
For applications where economy is paramount, the SX1240
may be used without the requirement for configuration via
an MCU. The transmitter is configured for default operation
at a frequency of 433.92 MHz or 868.3 MHz. However, in
conjunction with a microcontroller the communication link
parameters may be re-configured. Including, output power,
modulation format and operating channel.
The SX1240 offers integrated radio performance with cost
efficiency and is suited for worldwide operations in
particular Europe (ETSI EN 300-220-1), North America
(FCC part 15.231).
ORDERING INFORMATION
Part Number
Temperature Range
Qty. per Reel
Package
SX1240ISTRT
-40 °C to +85 °C
2500
SOIC8-EP
Pb-Free, Halogen Free, RoHS/WEEE compliant product.
SX1240, Rev 1, Oct 2010
©2010 Semtech Corp.
Š
Š
Š
Š
Š
Š
Low-Cost Consumer Electronic Applications
Remote Keyless Entry (RKE)
Remote Control / Security Systems
Audio Accessories
Process and building / home control
Active RFID
KEY PRODUCT FEATURES
Š
Š
Š
Š
+10 dBm or 0 dBm Configurable output power
Š
Š
Š
Š
1.8 to 3.7 V supply range
Page 1
Bit rates up to 100 kbps
FSK and OOK modulation
2 Preconfigured Modes for Operation without MCU
433.92 MHz OOK & 868.3 MHz FSK
Low BOM Fully Integrated Tx
8 Selectable Centre Frequencies
Programmable Frequency Tuning of low cost XTAL
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SX1240
ADVANCED COMMUNICATIONS & SENSING
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Table of contents
Section
1.
2.
Page
General Description ................................................................................................................................................. 3
1.1.
Pin Diagram ..................................................................................................................................................... 3
1.2.
Marking Diagram.............................................................................................................................................. 4
1.3.
Pin Description................................................................................................................................................. 4
Electrical Characteristics ......................................................................................................................................... 5
2.1.
ESD Notice ...................................................................................................................................................... 5
2.2.
Absolute Maximum Ratings ............................................................................................................................. 5
2.3.
Operating Range.............................................................................................................................................. 5
2.4. Electrical Specifications 6
2.5.
3.
Timing Characteristics ..................................................................................................................................... 7
Application Modes ................................................................................................................................................... 8
3.1. Application Mode: Power & Go 9
3.1.1.
‘Power & Go’ Mode: Configuration............................................................................................................ 9
3.1.2.
Transmitter Operation in ‘Power & Go’ Mode ........................................................................................... 9
3.2.
Application Mode: Advanced ......................................................................................................................... 10
3.2.1.
Advanced Mode: Configuration............................................................................................................... 10
3.2.2.
Transmitter Operation in Advanced Mode .............................................................................................. 11
4.
Configuration Register ........................................................................................................................................... 13
5.
Application Information .......................................................................................................................................... 14
5.1.
Crystal Specification ...................................................................................................................................... 14
5.2.
Reference Design Schematics....................................................................................................................... 14
5.3. Reference Design PCB Layout 15
5.4. Reference Design BOM 16
6.
7.
Packaging Information ........................................................................................................................................... 17
6.1.
Package Outline Drawing .............................................................................................................................. 17
6.2.
Land Pattern .................................................................................................................................................. 17
6.3.
Tape & Reel Specification.............................................................................................................................. 18
Revision History..................................................................................................................................................... 19
SX1240, Rev 1, Oct 2010
©2010 Semtech Corp.
Page 2
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SX1240
Integrated Transmitter IC
ADVANCED COMMUNICATIONS & SENSING
DATASHEET
This product datasheet contains a detailed description of the SX1240 performance and functionality.
1. General Description
The SX1240 is a fully-integrated frequency-agile, single chip transmitter IC capable of FSK and OOK modulation of an
input data stream. The full application circuit is shown in Figure 9. The SX1240 is configured, by default, to operate without
a microcontroller with its pre-configured RF settings (see Section 3 for precise details of the default settings). Selection is
made between 434 MHz and 868 MHz band operation by setting the Control pin (6) either high or low at power-up. A full
description of this functionality is given in Section 3.1.
Where greater flexibility is required, many of the default communication parameters can be dynamically configured. This
includes the operating frequency, frequency deviation and modulation format. Upon the application of a serial clock to the
Control pin (6), the Data pin (2) can be used to load a single 13-bit control word. Accessing this functionality is subject to
the connection of the control pin at start-up. For full details of this, the configuration bits and the precise timing operations
of this functionality please consult Section 3.2.
The SX1240 is designed for use with a variety of low-cost antenna technologies. A reference design with PCB-trace
antenna is presented in Section 5.
Another key feature of the SX1240 is its low current consumption in transmit and sleep modes and its wide voltage
operating range from 1.8 V to 3.7 V. This makes the SX1240 suitable for low-cost battery chemistries or energy harvesting
applications.
The internal architecture of the SX1240 is shown in Figure 1. The SX1240 comprises a low-consumption PLL and power
amplifier. For frequency modulation the modulation is performed digitally within the PLL bandwidth. OOK Modulation is
performed via ramping of the PA reference DAC.
1.1. Pin Diagram
Figure 1. Pinouts, Top View
SX1240, Rev 1, Oct 2010
©2010 Semtech Corp.
Page 3
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Integrated Transmitter IC
DATASHEET
ADVANCED COMMUNICATIONS & SENSING
1.2. Marking Diagram
Figure 2. Marking Diagram
Notes yyww refers to the date code
xxxxx refers to the lot number
1.3. Pin Description
Table 1
Description of the SX1240 Pinouts
Number
Name
Type
Function in ‘Power & Go’ Mode
Function in ‘Advanced’ Mode
1
GND
I
2
DATA
I/O
3
GND
I
Ground
4
XTAL
I/O
Reference Crystal
5
VDD
I
Power Supply 1.8V to 3.7V
6
CTRL
I
7
GND
I
Ground
8
RFOUT
O
Transmitter RF Output
SX1240, Rev 1, Oct 2010
©2010 Semtech Corp.
Ground
Transmit Data
Transmit or Configuration Data
Config Selection
Page 4
Configuration Data Clock
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Integrated Transmitter IC
DATASHEET
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2. Electrical Characteristics
2.1. ESD Notice
The SX1240 is a high performance radio frequency device, and satisfies Class 2 of the JEDEC
standard JESD22-A114-B (human body model) on all pins.
It should thus be handled with all necessary ESD precautions to avoid any permanent damage.
2.2. Absolute Maximum Ratings
Stresses above the values listed below may cause permanent device failure. Exposure to absolute maximum ratings for
extended periods may affect device reliability.
Table 2
Absolute Maximum Ratings
Symbol
Description
Min
Max
Unit
VDDmr
Supply Voltage
-0.5
3.9
V
Tmr
Temperature
-55
+115
°C
Tjunc
Junction Temperature
-55
+125
°C
Tstor
Storage Temperature
-55
150
°C
2.3. Operating Range
Operating ranges define the limits for functional operation and the parametric characteristics of the device as described in
this section. Functionality outside these limits is not implied.
Table 3
Operating Range
Symbol
Description
Min
Max
Unit
VDDop
Supply voltage
1.8
3.7
V
Top
Operational temperature range
-40
85
°C
Clop
Load capacitance on digital ports
-
25
pF
SX1240, Rev 1, Oct 2010
©2010 Semtech Corp.
Page 5
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SX1240
Integrated Transmitter IC
DATASHEET
ADVANCED COMMUNICATIONS & SENSING
2.4. Electrical Specifications
The table below gives the electrical specifications of the transmitter under the following conditions: Supply voltage = 3.3 V,
temperature = 25 °C, fXOSC = 26 MHz, fRF = 433.93 MHz, 2-level FSK modulation Df = 20 kHz, bit rate = 10 kbit/s and
output power = +10 dBm terminated in a matched 50 ohm impedance, unless otherwise specified.
Table 4
Symbol
Transmitter Specifications
Description
Conditions
Min
Typ
Max
Unit
-
0.5
1
µA
RF Power o/p = +10 dBm
RF Power o/p = 0 dBm
-
16.5
9
-
mA
mA
Number of programmable values
-
8
-
10
-
100
kHz
Current Consumption
IDDSL
Supply current in sleep mode
IDDT
Supply current in transmit mode
with appropriate external matching.
RF and Baseband Specifications
FDA_D
Frequency deviation, FSK
FDA
Frequency deviation, FSK*
BRF
Bit rate, FSK
Permissible Range
0.5
-
100
kbps
BRO
Bit rate, OOK
Permissible Range
0.5
-
10
kbps
OOK_B
OOK Modulation Depth
-
50
-
dB
RFOP
RF output power in 50 ohms
High Power Setting
Low Power Setting**
7
-3
10
0
-
dBm
dBm
DRFOPV
Variation in RF output power with
supply voltage
2.5 V to 3.3 V
1.8 V to 3.7 V
-
-
3
7
dB
dB
PHN
Transmitter phase noise at
868.3 MHz
Offset from centre frequency:
100 kHz
350 kHz
550 kHz
1.15 MHz
-
-
-76
-81
-91
-101
-
8
-
26
26
26
MHz
-
3.174
1.587
-
kHz
kHz
-
-
+/-25
ppm
-
-
2
ms
Programmable
-
2
20
-
ms
ms
****
-
20
-
us
FR
Number of selectable Frequencies
FXOSC
Crystal Oscillator Frequency
STEP
RF Frequency Step
DFXOSC
Frequency Variation of the Oscillator Circuit
868 MHz
434 MHz
No crystal contribution
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
Timing Specifications
TS_TR
Time from Sleep to Tx mode
TOFFT
Timer from Tx data activity to
Sleep
RAMP
PA Ramp up and down time
SX1240, Rev 1, Oct 2010
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Symbol
Description
Conditions
T_START
Time before CTRL pin mode
selection.
Time from power on to sampling of
CTRL ***
Min
Typ
Max
-
200 us
+ TS_OSC
-
*
Frequency deviation is positive (+FDA) with DATA = ‘1’, negative (-FDA) with DATA = ‘0’
**
With two different matching networks
***
The oscillator startup time, TS_OSC, depends on the electrical characteristics of the crystal
Unit
ms
**** Ramp-up time of the internal regulator turning the PA on. The typical 10% - 90% power ramp-up time is 10us
2.5. Timing Characteristics
The following table gives the operating specifications for the TWI interface of the SX1240.
Table 5
Serial Interface Timing Specifications
Symbol
Description
fctrl
Min
Typ
Max
CTRL Clock Frequency
-
-
10
tch
CTRL Clock High time
45
-
-
ns
tcl
CTRL Clock Low time
45
-
-
ns
trise
CTRL Clock rise time
-
-
5
ns
tfall
CTRL Clock Fall time
-
-
5
ns
tsetup
DATA Setup time
From Data transition to CTRL rising
edge
45
-
-
ns
thold
DATA hold time
From CTRL rising edge to DATA
transition
45
-
-
ns
SX1240, Rev 1, Oct 2010
©2010 Semtech Corp.
Conditions
Page 7
Unit
MHz
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DATASHEET
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3. Application Modes
The SX1240 has two application modes. These are selected depending upon the load presented to the Control pin (6) at
power-on of the device, as shown on Figure 3. By connecting the Control pin to logical ‘0’ or ‘1’ the Power & Go mode is
selected. A full description of operation in this mode is given in Section 3.1. By presenting a logical zero to the Control
input, Advanced Mode can be accessed by subsequent clocking of the control pin, in conjunction with the Data pin (2)
permits programming of the SX1240 configuration register and manual control of the transmitter. For more information on
Advanced Mode operation please consult Section 3.2. The diagram below summarises the mode selection process.
Figure 3. SX1240 Mode Selection
Table 6
Control Pin Selection of the Application Mode
CTRL Pin (6)
Logic ‘1’ or ‘0’
Logic ‘0’ then Clock on CTRL
SX1240, Rev 1, Oct 2010
©2010 Semtech Corp.
Application Mode
Power & Go Mode (see Section 3.1)
Advanced Mode (see Section 3.2)
Page 8
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SX1240
Integrated Transmitter IC
DATASHEET
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3.1. Application Mode: Power & Go
3.1.1. ‘Power & Go’ Mode: Configuration
The default Power & Go application mode sees the SX1240 configured as detailed in the following table. By changing the
logical state of the control pin (6) at power-up, one of a pair of default configuration modes can be selected. The Power &
Go application mode hence permits microcontroller-less operation. By simply powering the transmitter application circuit,
the SX1240 is pre-configured as either a 434 MHz OOK transmitter or an 868 MHz FSK transmitter. For appropriate
matching circuits please see Section 5.
Table 7
Configuration and Band Selection in Power & Go Application Mode
CTRL (Pin 6)
Configuration
‘High’
OOK 433.92 MHz, 10 dBm
‘Low’
FSK 868.3 MHz, Fdev = 20 kHz, 10 dBm
3.1.2. Transmitter Operation in ‘Power & Go’ Mode
The timing of a typical transmit operation in Power & Go mode is shown in Figure 4. Here we see that a rising edge on the
DATA pin activates the transmitter start-up process. DATA must then be held high for the start-up time (TS_TR) of the
SX1240. During this time the SX1240 undergoes an optimized, self-calibrating, trajectory from sleep mode to transmit
mode. Once this time has elapsed, the SX1240 is ready to transmit. Any logical signal subsequently applied to the DATA
pin is then transmitted.
Figure 4. ‘Power & Go’ Mode: Transmitter Timing Operation
The transition back to sleep mode is managed automatically. In 868 MHz FSK modulation mode, after 2 ms of inactivity on
the DATA line, the SX1240 returns to sleep mode. If in 434 MHz, OOK modulation mode, the SX1240 waits for 20 ms of
inactivity before returning to sleep mode.
SX1240, Rev 1, Oct 2010
©2010 Semtech Corp.
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3.2. Application Mode: Advanced
3.2.1. Advanced Mode: Configuration
Advanced mode can be accessed as described on Figure 3. Programming is performed via a two wire interface (TWI)
formed by CTRL and DATA pins.
Programming of the configuration register is triggered by a rising edge on the CTRL line. Upon detection of this rising edge,
the data applied to the DATA pin is accepted as register configuration information, the data bits are clocked on subsequent
rising edges of the clocking signal applied to the CTRL pin. The first bit of serial data selects register read or write operation
(Read = ‘high’ and Write = ‘low’). The timing for SX1240 configuration register ‘write’ is shown in Figure 5. Note that, once
triggered, all 13 data bits must be written to the SX1240.
The contents of the configuration register and the role of each bit therein is described in Table 8 of Section 4.
CTRL
DATA
R/W ACC
‘0’
‘0’
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
‘0’
Figure 5. TWI Configuration Register ‘Write’.
Similarly, the configuration register may be read using the timing of Figure 6.
CTRL
DATA
R/W ACC
‘0’
‘1’
‘0’
‘0’
‘0’
‘0’
‘0’
D12
D11
D10
D1
D0
T42
T1
T41
T0
‘0’
DATA pin is an output
Figure 6. TWI Configuration Register ‘Read’.
Notes - Logic level ‘0’ on DATA during the first rising edge on CTRL is required to start the TWI access
- Reading only the 13 configuration bits D0 to D12 is not allowed on the SX1240. In Read access, 64 clock cycles
on CTRL pin must be issued, shifting out on pin DATA the 13 configuration bits (D0 to D12), plus 43 internal test
bits (T0 to T42). Read access should be used when developing the device firmware, but is not intended for use in
the normal operation mode.
- During the register ‘write’ or ‘read’ phases the SX1240 remains in sleep mode.
SX1240, Rev 1, Oct 2010
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When powering up the circuit (microcontroller and SX1240), the logic level of the CTRL pin is sampled after T_START, as
described on Figure 3. During T_START, the microcontroller IO driving the CTRL pin must be configured as an output,
driving the CTRL pin to the desired state.
Note
whilst the logic level of CTRL pin during T_START (initialization phase of the microcontroller) does not have any
effect on the device operation, the pin should not be connected to VDD through an impedance lower than 20 k
ohms or higher than 1 M ohms.
Figure 7. Power-up Timing
3.2.2. Transmitter Operation in Advanced Mode
When operating in advanced mode two possibilities exist for operation of the transmitter, these are dependent upon the
state of the Tx Mode bit (D12 of the register description in Table 8).
Tx Mode = ‘0’
When set to logical ‘0’ operation is identical to that of the Power & Go mode, following completion of the programming
phase, the SX1240 will be placed in transmit mode upon the next rising edge detected on the DATA pin. Transmit operation
will then be in accordance with that of Figure 4 with the time TOFFT corresponding to that programmed.
Note that prior to programming the default, logical ‘0’, configuration is loaded. Note also that subsequent programming
iterations can only be performed once the transmit cycle is finished - including the time required for switching off the PA
(TOFFT).
Tx Mode = ‘1’
With Tx Mode (D12) set to ‘1’ during the register programming cycle detailed in Figure 5, the SX1240 is placed directly in
transmit mode. It will then remain in transmit mode until a second TWI register write operation where, if reset to logical ‘0’,
the SX1240 returns to sleep mode. An illustration of this operation is shown in the following timing diagram.
Please also note that once in sleep mode, subsequent activity on the DATA pin (without clocking of the CTRL line) will
trigger transmission in accordance with Figure 4. Care must hence be taken to avoid inadvertent transmission due to such
activity.
SX1240, Rev 1, Oct 2010
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D12 = ’1'
Data
D12 = ’0'
TWI Config
TWI Config
Ctrl
TS_TR
RAMP
RF Out
Sleep
State
Tx
Tx Enable
Data Transmission
Sleep
Tx Off
Figure 8. Manual Control of Transmitter Enable via the TWI
SX1240, Rev 1, Oct 2010
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4. Configuration Register
Table 8
SX1240 TWI Register Description
Default
Bit
D12
D(11:9)
D8
D(7:5)
D4
D3
D(2:0)
T(42:0)
Name
Nbits
State
Setting
Tx Mode
1
0
1
Frequency
3
000
001
010
011
100
101
110
111
418.00 MHz
433.42 MHz
433.92 MHz
864.00 MHz
868.30 MHz
868.65 MHz
868.95 MHz
869.85 MHz
0
1
FSK
OOK
000
001
010
011
100
101
110
111
10 kHz
12.5 kHz
20 kHz
25 kHz
40 kHz
50 kHz
80 kHz
100 kHz
1
0
1
0 dBm
10 dBm
1
0
1
2 ms
20 ms
Modulation
Freq. Deviation
RF Power
Tx Timer
Fine Tuning
Test
SX1240, Rev 1, Oct 2010
©2010 Semtech Corp.
1
3
3
43
Power & Go
Forced Transmit
Notes
CTRL = ‘0’
CTRL = ‘1’
0
0
When set to ‘1’ SX1240 is in
continuous Tx until reset to ‘0’.
RF Operating centre frequency
010
100
0
Modulation format
1
FSK Frequency deviation (not
used in OOK mode).
010
010
1
1
Programmed RF output power.
0
Transmit power-off timer.
1
011
010
001
000
111
110
101
100
fc + 6 * PLL Step
fc + 4 * PLL Step
fc + 2 * PLL Step
fc + 0 * PLL Step
fc - 2 * PLL Step
fc - 4 * PLL Step
fc - 6 * PLL Step
fc - 8 * PLL Step
-
-
Page 13
Fine tuning from programmed
centre frequency.
000
000
-
-
Test registers
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5. Application Information
5.1. Crystal Specification
The SX1240 is designed to operate with a low-cost 26 MHz crystal.
Table 9
SX1240 Quartz Crystal Reference Oscillator Specification
Symbol
Description
Conditions
Min
Typ
Max
FXOSC
Crystal Frequency
LM
Unit
26
26
26
MHz
Crystal Motional Inductance
-
12.655
-
mH
CM
Crystal Motional Capacitance
-
2.962
-
fF
RS
Crystal Serial Resistance
-
20
100
Ohms
C0
Crystal Shunt Capacitance
-
1.0
7.0
pF
CL
Load Capacitance
-
15
-
pF
5.2. Reference Design Schematics
VCC
R1
C6
GND
C5
GND
U1
P1
1
GND
10
9
8
7
6
5
4
3
2
1
Data
R6
2
Ctrl
3
GND
Q1
R_VBAT
4
VBAT
GND
1
GND
RFOUT
DATA
GND
GND
SCK
XTAL
VBAT
GND
Q2
GND
SX1240
L2
8
7
GND
C7
C2
C3
RFIO1
L3
C8
C4
LM
C11
6
5
GND
GND
VCC
GND
GND
GND
2
XTAL
26 MHz
MHDR1X10
GND
Antenna1
C1
L1
1
3
xtal
26 MHz
2
R2
R3
NC
NC
VCC
R4
0R0
4
GND
Figure 9. Application Module Schematics (See BoM for Optional Components)
SX1240, Rev 1, Oct 2010
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5.3. Reference Design PCB Layout
With careful RF design practices, the SX1240 can be designed on a single-layer PCB, optimizing the cost of the
application. The single layer design below also features a spiral antenna and optional on-board regulation.
1
1
2
2
4
3
2
1
2
1
2
1
1
1
1
2
1
1
4
2
3
5
1
6
2
7
2
8
2
2
1
2
1
1
1
2
2
2
1
2
3
1
2
1
2
1
2
2
1
2
1
1
1
1
1
2
2
2
2
1
2
1
4
3
5
2
6
1
2
2
2
1
1
1
2
3
4
5
6
7
8
9
1
10
Figure 10. Reference Design PCB Layout
SX1240, Rev 1, Oct 2010
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5.4. Reference Design BOM
The following tables summarize the module BoM for 434 MHz and 868 MHz band operation.
Table 10 434 MHz Single Layer Reference Design BoM
Designator
Part
Number
U1
SX1240ISRT
Q1
Package
Value
Qty
Description
Manufacturer
SO8
SX1240
1
RF Transmitter IC
-
HC49
26 MHz
1
Crystal 26 MHz CL = 15 pF
-
C1
-
0402
NC
0
Capacitor NPO (+/-5%)
-
C2
-
0402
3.3 pF
1
Capacitor NPO (+/-0.25 pF)
-
C3
-
0402
S/C
0
C4
-
0402
8.2 pF
1
Capacitor NPO (+/-5%)
-
C5
-
0402
100 pF
1
Capacitor NPO (+/-5%)
-
C6
-
0402
100 nF
1
Capacitor X7R (+/-10%)
-
C7
-
0402
1 pF
1
Capacitor NPO (+/-0.25 pF)
-
C8
-
0402
8.2 pF
1
Capacitor NPO (+/-5%)
-
L1
LQG15
0402
120 nH
1
Multilayer chip inductor
Murata or equivalent
L2
LQG15
0402
22 nH
1
Multilayer chip inductor
Murata or equivalent
L3
LQG15
0402
15 nH
1
Multilayer chip inductor
Murata or equivalent
Q2
-
2.5 x 3.2 mm
26 MHz
-
Optional replacement of Q1
-
C11
-
0402
TBC
-
Antenna Matching Component
-
LM
-
0402
TBC
-
Antenna Matching Component
-
R1
-
0402
0R0
-
Optional PA Supply Isolation
-
R2
-
0402
0R0
-
Optional CTRL ‘hi’ Connection
-
R3
-
0402
0R0
-
Optional CTRL ‘lo’ Connection
-
R4
-
0402
0R0
-
Optional CTRL Isolation
-
R VBAT
-
0402
0R0
-
Optional Supply Isolation
-
R6
-
0402
0R0
-
Optional Data Connection to header
-
Semtech
-
-
Table 11 868 MHz Reference Design BoM
To be Confirmed
SX1240, Rev 1, Oct 2010
©2010 Semtech Corp.
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SX1240
Integrated Transmitter IC
ADVANCED COMMUNICATIONS & SENSING
DATASHEET
6. Packaging Information
6.1. Package Outline Drawing
Figure 11. Package Outline Drawing
6.2. Land Pattern
Figure 12. Land Pattern
SX1240, Rev 1, Oct 2010
©2010 Semtech Corp.
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SX1240
Integrated Transmitter IC
DATASHEET
ADVANCED COMMUNICATIONS & SENSING
6.3. Tape & Reel Specification
Carrier Tape
Tape
Width
(W)
12
+/-0.30
Pocket
Pitch
(P)
8
+/-0.10
Reel
Ao / Bo
Ko
Reel
Size
Reel
Width
Min.
Trailer
Length
Min.
Leader
Length
QTY
per
Unit
6.5 / 5.4
+/-0.30
2.00
+/-0.15
330.2
12.4
400
400
2500
mm
Figure 13. Tape & Reel Specification
Note
Single Sprocket Holes
SX1240, Rev 1, Oct 2010
©2010 Semtech Corp.
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SX1240
Integrated Transmitter IC
DATASHEET
ADVANCED COMMUNICATIONS & SENSING
7. Revision History
Revision History
Revision
Date
1
October 2010 First FINAL datasheet version
SX1240, Rev 1, Oct 2010
©2010 Semtech Corp.
Comment
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SX1240
ADVANCED COMMUNICATIONS & SENSING
DATASHEET
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