SM6T Transil™ Features ■ Peak pulse power: – 600 W (10/1000 µs) – 4 kW (8/20 µs) ■ Breakdown voltage range: from 6.8 V to 220 V ■ Unidirectional and bidirectional types ■ Low leakage current: – 0.2 µA at 25 °C – 1 µA at 85 °C K ■ Operating Tj max: 150 °C Unidirectional ■ High power capability at Tjmax: – 515 W (10/1000 µs) ■ JEDEC registered package outline A Bidirectional SMB (JEDEC DO-214AA) Complies with the following standards ■ IEC 61000-4-2 level 4: – 15 kV (air discharge) – 8 kV (contact discharge) ■ IEC 61000-4-5 Description ■ MIL STD 883G, method 3015-7: class 3B: – 25 kV HBM (human body model) ■ UL 497B, file number: QVGQ2.E136224 ■ Resin meets UL 94, V0 ■ MIL-STD-750, method 2026 soldererability ■ EIA STD RS-481 and IEC 60286-3 packing The SM6T Transil series has been designed to protect sensitive equipment against electrostatic discharges according to IEC 61000-4-2 and MIL STD 883, method 3015, and electrical overstress according to IEC 61000-4-4 and 5. These devices are more generally used against surges below 600 W (10/1000 µs). ■ IPC 7531 footprint Planar technology makes these devices suitable for high-end equipment and SMPS where low leakage current and high junction temperature are required to provide reliability and stability over time. SM6T are packaged in SMB (SMB footprint in accordance with IPC 7531 standard). TM: Transil is a trademark of STMicroelectronics October 2010 Doc ID 3082 Rev 9 1/10 www.st.com 10 Characteristics SM6T 1 Characteristics Table 1. Absolute maximum ratings Symbol Parameter Value Unit 600 W PPP Peak pulse power dissipation(1) Tstg Storage temperature range -65 to 150 Tj Operating junction temperature range -55 to 150 TL Maximum lead temperature for soldering during 10 s. Tj initial = Tamb °C 260 1. For a surge greater than the maximum values, the diode will fail in short-circuit. Table 2. Thermal resistance Symbol Parameter Value Unit Rth(j-l) Junction to leads 20 °C/W Rth(j-a) Junction to ambient on printed circuit on recommended pad layout 100 °C/W Figure 1. Electrical characteristics - definitions Symbol VRM VBR VCL IRM IPP αT VF RD Figure 2. Parameter Stand-off voltage Breakdown voltage Clamping voltage Leakage current @ VRM Peak pulse current Voltage temperature coefficient Forward voltage drop Dynamic resistance Unidirectional I I IF IPP VF VCL VBR VRM V V IRM IR IPP IPP Repetitive pulse current tr = rise time (µs) tp = pulse duration time (µs) 2/10 IR IRM IRM IR Pulse definition for electrical characteristics tr VCLVBR VRM tp Doc ID 3082 Rev 9 VRMVBR VCL Bidirectional SM6T Table 3. Characteristics Electrical characteristics, parameter values (Tamb = 25 °C) Order code 25 °C 85 °C µA VCL @IPP RD VCL @IPP RD αT (2) 10/1000 µs 10/1000 µs 8/20 µs 8/20 µs VBR @IR (1) IRM max@VRM min V typ max max max max V mA V(3) A(4) Ω V(3) A(4) Ω 10-4/ °C SM6T6V8A/CA 20 50 5.8 6.45 6.8 7.14 10 10.5 57 0.059 13.4 298 0.021 5.7 SM6T7V5A/CA 20 50 6.4 7.13 7.5 7.88 10 11.3 53 0.065 14.5 276 0.024 6.1 SM6T10A/CA 20 50 8.55 9.5 10 10.5 1 14.5 41 0.098 18.6 215 0.038 7.3 SM6T12A/CA 0.2 1 10.2 11.4 12 12.6 1 16.7 36 0.114 21.7 184 0.049 7.8 SM6T15A/CA 0.2 1 12.8 14.3 15 15.8 1 21.2 28 0.193 27.2 147 0.078 8.4 SM6T18A/CA 0.2 1 15.3 17.1 18 18.9 1 25.2 24 0.263 32.5 123 0.111 8.8 SM6T22A/CA 0.2 1 18.8 20.9 22 23.1 1 30.6 20 0.375 39.3 102 0.159 9.2 SM6T24A/CA 0.2 1 20.5 22.8 24 25.2 1 33.2 18 0.444 42.8 93 0.189 9.4 SM6T27A/CA 0.2 1 23.1 25.7 27 28.4 1 37.5 16 0.569 48.3 83 0.240 9.6 SM6T30A/CA 0.2 1 25.6 28.5 30 31.5 1 41.5 14.5 0.690 53.5 75 0.293 9.7 SM6T33A/CA 0.2 1 28.2 31.4 33 34.7 1 45.7 13.1 0.840 59.0 68 0.357 9.8 SM6T36A/CA 0.2 1 30.8 34.2 36 37.8 1 49.9 12 1.01 64.3 62 0.427 9.9 SM6T39A/CA 0.2 1 33.3 37.1 39 41.0 1 53.9 11.1 1.16 69.7 57 0.504 10.0 SM6T56A/CA 0.2 1 47.6 53.2 56 58.8 1 76.6 7.8 2.28 100 40 1.030 10.0 SM6T68A/CA 0.2 1 58.1 64.6 68 71.4 1 92 6.5 3.17 121 33 1.503 10.4 SM6T75A/CA 0.2 1 64.1 71.3 75 78.8 1 103 5.8 4.17 134 30 1.84 10.5 SM6T100A/CA 0.2 1 85.5 95.0 100 105 1 137 4.4 7.27 178 22.5 3.24 10.6 SM6T150A/CA 0.2 1 128 143 150 158 1 207 2.9 16.9 265 7.13 10.8 SM6T200A/CA 0.2 1 171 190 200 210 1 274 2.2 29.1 353 11.3 12.7 10.8 SM6T220A/CA 0.2 1 188 209 220 231 1 328 2 48.5 388 10.3 15.2 10.8 15 1. Pulse test : tp < 50 ms 2. To calculate VBR versus junction temperature, use the following formula: VBR @ TJ = VBR @ 25°C x (1 + αT x (TJ – 25)). 3. To calculate maximum clamping voltage at other surge level, use the following formula: VCL = RD x IPP + VBRmax. 4. Surge capability given for both directions for unidirectional and bidirectional types. Doc ID 3082 Rev 9 3/10 Characteristics Figure 3. SM6T Peak power dissipation versus initial junction temperature Figure 4. Ppp (W) Peak pulse power versus exponential pulse duration PPP(kW) 700 100.0 Tj initial = 25 °C 600 500 10.0 400 300 1.0 200 100 Tj(°C) tP(ms) 0.1 0 0 25 Figure 5. 50 75 100 125 150 1.0E-03 175 1.0E-02 1.0E-01 1.0E+00 1.0E+01 Clamping voltage versus peak pulse current (maximum values) I PP( A ) 1000.0 T j initial=25 °C 100.0 8/20 µs 10.0 10/1000 µs 1 4/10 10 100 Doc ID 3082 Rev 9 SM6T220A SM6T100A 0.1 SM6T68A SM6T30A SM6T15A SM6T6V8A 1.0 10 ms V CL(V) 1000 SM6T Characteristics Figure 6. 10000 Capacitance versus reverse applied voltage for unidirectional types (typical values) Figure 7. Capacitance versus reverse applied voltage for bidirectional types (typical values) C (pF) C (pF) 10000 F=1 MHz Vosc=30 mVRMS Tj=25 °C F=1 MHz Vosc=30 mVRMS Tj=25 °C SM6T6V8CA SM6T6V8A 1000 1000 SM6T15CA SM6T15A SM6T30CA SM6T30A SM6T68CA 100 100 SM6T68A SM6T100CA SM6T100A V R (V) 10 1 1.0E+02 V R (V) SM6T220A 10 10 Figure 8. SM6T220CA 100 1 1000 Peak forward voltage drop versus peak forward current (typical values) IFM(A) 10 Figure 9. 1.00 100 1000 Relative variation of thermal impedance junction to ambient versus pulse duration Zth (j-a)/Rth (j-a) Recommended pad layout Printed circuit board FR4, copper thickness = 35 µm 1.0E+01 Tj =125 °C Tj =25 °C 1.0E+00 0.10 1.0E-01 tp s VFM(V) 1.0E-02 0.01 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Figure 10. Thermal resistance junction to ambient versus copper surface under each lead 1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03 Figure 11. Leakage current versus junction temperature (typical values) Rth(j-a) (°C/W) IR (nA) 110 1.E+03 100 (printed circuit board FR4, copper thickness = 35 µm) 90 VR=VRM VRM < 10 V 1.E+02 80 70 60 1.E+01 50 40 30 VR=VRM VRM ≥ 10 V 1.E+00 20 10 Tj (° C) SCu(cm²) 1.E-01 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 25 Doc ID 3082 Rev 9 50 75 100 125 150 5/10 Ordering information scheme 2 SM6T Ordering information scheme Figure 12. Ordering information scheme SM Surface mount Peak pulse power 6 = 600 W Transil in SMB Breakdown voltage 100 = 100 V Types CA = Bidirectional A = Unidirectional 6/10 Doc ID 3082 Rev 9 6 T 100 CA SM6T 3 Packaging information Packaging information ● Case: JEDEC DO-214AA molded plastic over planar junction ● Terminals: solder plated, solderable as per MIL-STD-750, Method 2026 ● Polarity: for unidirectional types the band indicates cathode ● Flammability: epoxy meets UL 94, V0 ● RoHS package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 4. SMB dimensions Dimensions E1 Ref. D Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 L 0.75 1.50 0.030 0.059 E A1 A2 C L b Figure 13. SMB footprint dimensions in mm (inches) 1.62 2.60 (0.064) (0.102) Figure 14. Marking layout(1) 1.62 (0.064) Cathode bar (unidirectional devices only ) 2.18 (0.086) 5.84 (0.23) e x x x z y ww e: ECOPACK compliance XXX: Marking Z: Manufacturing location Y: Year WW: Week 1. Marking layout can vary according to assembly location. Doc ID 3082 Rev 9 7/10 Packaging information Table 5. 8/10 SM6T Marking Order code Marking Order code Marking SM6T6V8A DE SM6T6V8CA LE SM6T7V5A DG SM6T7V5CA LG SM6T10A DP SM6T10CA LP SM6T12A DT SM6T12CA LT SM6T15A DX SM6T15CA LX SM6T18A EE SM6T18CA ME SM6T22A EK SM6T22CA MK SM6T24A EM SM6T24CA MM SM6T27A EP SM6T27CA MP SM6T30A ER SM6T30CA MR SM6T33A ET SM6T33CA MT SM6T36A EV SM6T36CA MV SM6T39A EX SM6T39CA MX SM6T56A FL SM6T56CA NL SM6T68A FQ SM6T68CA NQ SM6T75A FS SM6T75CA NS SM6T100A FY SM6T100CA NY SM6T150A GL SM6T150CA OL SM6T200A GU SM6T200CA OU SM6T220A GW SM6T220CA OW Doc ID 3082 Rev 9 SM6T 4 Ordering information Ordering information Table 6. Ordering information Order code Marking Package Weight Base qty Delivery mode SM6TxxxA/CA(1) See Table 5 on page 8 SMB 0.11 g 2500 Tape and reel 1. Where xxx is nominal value of VBR and A or CA indicates unidirectional or bidirectional version. See Table 3 for list of available devices and their order codes 5 Revision history Table 7. Document revision history Date Revision Changes August-2001 4A 15-Sep-2004 5 1. Types table parameters on page 2: IRM @ Tj = 85 °C condition added 2. IRM max values changed 26-Mar-2008 6 Reformatted to current standard. SMB dimensions and footprint updated. Maximum junction temperature replaced with operating junction temperature range in Table 1. 25-May-2009 7 Reformatted to current standard. Added standards compliance information on page 1. Added device SM6T56 to Table 3. Updated all characteristic curves. 17-Sep-2009 8 Document updated for low leakage current. 20-Oct-2010 9 Updated Figure 13. Previous update. Doc ID 3082 Rev 9 9/10 SM6T Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. 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