SMCJ Transil™ Features ■ Peak pulse power: – 1500 W (10/1000 μs) – 10 kW (8/20 μs) A ■ Stand off voltage range: from 5 V to 188 V ■ Unidirectional and bidirectional types K ■ Low leakage current: – 0.2 μA at 25 °C – 1 μA at 85 °C Unidirectional ■ Operating Tj max: 150 °C ■ High power capability at Tj max: – 1250 W (10/1000 µs) ■ JEDEC registered package outline Bidirectional SMC (JEDEC DO-214AB) Description Complies with the following standards ■ IEC 61000-4-2 level 4 – 15 kV (air discharge) – 8 kV (contact discharge) ■ IEC 61000-4-5 ■ MIL STD 883G, method 3015-7 Class 3B – 25 kV HBM (human body model) ■ Resin meets UL 94, V0 ■ MIL-STD-750, method 2026 solderability ■ EIA STD RS-481 and IEC 60286-3 packing ■ IPC 7531 footprint The SMCJ Transil series has been designed to protect sensitive equipment against electrostatic discharges according to IEC 61000-4-2, and MIL STD 883, method 3015, and electrical over stress according to IEC 61000-4-4 and 5. These devices are more generally used against surges below 1500 W (10/1000 μs). The Planar technology makes it compatible with high-end equipment and SMPS where low leakage current and high junction temperature are required to provide reliability and stability over time. SMCJ are packaged in SMC (SMC footprint in accordance with IPC 7531 standard). TM: Transil is a trademark of STMicroelectroniocs July 2010 Doc ID 5617 Rev 8 1/10 www.st.com 10 Characteristics SMCJ 1 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value Unit 1500 W PPP Peak pulse power dissipation (1) Tstg Storage temperature range -65 to +150 °C Tj Operating junction temperature range -55 to +150 °C TL Maximum lead temperature for soldering during 10 s. 260 °C Value Unit Tj initial = Tamb 1. For a surge greater than the maximum values, the diode will fail in short-circuit. Table 2. Thermal resistances Symbol Parameter Rth(j-l) Junction to leads 15 ° C/W Rth(j-a) Junction to ambient on printed circuit on recommended pad layout 90 ° C/W Figure 1. Electrical characteristics - definitions Symbol VRM VBR VCL IRM IPP αT VF RD Figure 2. Parameter Stand-off voltage Breakdown voltage Clamping voltage Leakage current @ VRM Peak pulse current Voltage temperature coefficient Forward voltage drop Dynamic resistance Unidirectional I I IF IPP VF VCL VBR VRM V V IRM IR IPP IPP Repetitive pulse current tr = rise time (µs) tp = pulse duration time (µs) 2/10 IR IRM IRM IR Pulse definition for electrical characteristics tr VCLVBR VRM tp Doc ID 5617 Rev 8 VRMVBR VCL Bidirectional SMCJ Table 3. Characteristics Electrical characteristics - parameter values (Tamb = 25 °C) IRM max@VRM Order code 25 °C 85 °C µA VBR @IR(1) min typ V V VCL @IPP RD (2) VCL @IPP 10/1000 µs 10/1000 µs 8/20 µs max mA RD (2) 8/20 µs max V A(4) Ω V αT (3) max A(4) mΩ 10-4/ °C SMCJ5.0A/CA 500 2000 5.0 6.4 6.74 10 9.2 171 0.012 13.4 746 8.5 5.7 SMCJ6.0A/CA 500 2000 6.0 6.7 7.05 10 10.3 152 0.019 13.7 730 8.6 5.9 SMCJ6.5A/CA 250 1000 6.5 7.2 7.58 10 11.2 140 0.023 14.5 690 9.5 6.1 SMCJ8.5A/CA 10 50 8.5 9.4 9.9 1 14.4 105 0.038 19.5 512 18 7.3 SMCJ10A/CA 0.2 1 10 11.1 11.7 1 17 92 0.051 21.7 461 20 7.8 SMCJ12A/CA 0.2 1 12 13.3 14 1 19.9 79 0.066 25.3 394 27 8.3 SMCJ13A/CA 0.2 1 13 14.4 15.2 1 21.5 73 0.076 27.2 368 31 8.4 SMCJ15A/CA 0.2 1 15 16.7 17.6 1 24.4 64 0.092 32.5 308 46 8.8 SMCJ18A/CA 0.2 1 18 20.0 21.1 1 29.2 53 0.133 39.3 254 68 9.2 SMCJ20A/CA 0.2 1 20 22.2 23.4 1 32.4 48 0.163 42.8 234 78 9.4 SMCJ22A/CA 0.2 1 22 24.4 25.7 1 35.5 44 0.194 48.3 207 103 9.6 SMCJ24A/CA 0.2 1 24 26.7 28.1 1 38.9 40 0.235 SMCJ26A/CA 0.2 1 26 28.9 30.4 1 42.1 37 0.275 200 102 9.6 53.5 187 SMCJ28A/CA 0.2 1 28 31.1 32.7 1 45.4 34 0.325 SMCJ30A/CA 0.2 1 30 33.3 35.1 1 48.4 32 SMCJ33A/CA 0.2 1 33 36.7 38.6 1 53.3 SMCJ40A/CA 0.2 1 40 44.4 46.7 1 64.5 SMCJ48A/CA 0.2 1 48 53.3 56.1 1 SMCJ58A/CA 0.2 1 58 64.4 67.8 77.8 81.9 50 115 9.7 169 146 9.8 0.361 64.3 156 176 9.9 29 0.440 69.7 143 204 10.0 24 0.644 84 119 294 10.1 77.4 20 0.925 100 100 411 10.3 1 93.6 16 1.40 121 83 600 10.4 59 SMCJ70A/CA 0.2 1 70 1 113 13.9 1.94 146 69 870 10.5 SMCJ85A/CA 0.2 1 85 99 1 137 11.5 2.87 178 56 1322 10.6 SMCJ100A/CA 0.2 1 100 111 117 1 162 9.7 4.04 212 47 1897 10.7 SMCJ130A/CA 0.2 1 130 144 152 1 209 7.5 6.59 265 38 2774 10.8 94 SMCJ154A/CA 0.2 1 154 171 180 1 246 6.1 9.34 317 31.5 4063 10.8 SMCJ170A/CA 0.2 1 170 189 199 1 275 5.7 11.6 353 28 5145 10.8 SMCJ188A/CA 0.2 1 188 209 220 1 328 4.6 21.1 388 26 6038 10.8 1. Pulse test : tp < 50 ms 2. To calculate maximum clamping voltage at other surge level,use the following formula: VCLmax = VCL - RD x (IPP - IPPappli) where IPPappli is the surge current in the application 3. To calculate VBR or VCL versus junction temperature, use the following formulas: VBR @ TJ = VBR @ 25°C x (1 + αT x (TJ – 25)) VCL @ TJ = VCL @ 25°C x (1 + αT x (TJ – 25)) 4. Surge capability given for both directions for unidirectional and bidirectional types. Doc ID 5617 Rev 8 3/10 Characteristics Figure 3. SMCJ Peak pulse power dissipation versus initial junction temperature Figure 4. Ppp (W) 100.0 2000 Peak pulse power versus exponential pulse duration (Tj initial = 25 °C) PPP(kW) Tj initial = 25 °C 1500 10.0 1000 1.0 500 Tj(°C) tP(ms) 0 0.1 0 25 Figure 5. 50 75 100 125 150 175 1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 Clamping voltage versus peak pulse current (exponential waveform, maximum values) I PP(A ) 1000.0 T j initial=25 °C 100.0 8/20 µs 10.0 10/1000 µs SMCJ188A SMCJ85A SMCJ40A SMCJ24A SMCJ12A SMCJ5.0A 1.0 10 ms VCL(V) 0.1 1 4/10 10 100 Doc ID 5617 Rev 8 1000 SMCJ Characteristics Figure 6. Junction capacitance versus Figure 7. reverse applied voltage for unidirectional types (typical values) Junction capacitance versus reverse applied voltage for bidirectional types (typical values) C(nF) C(nF) 10.00 10.00 F=1 MHz VOSC=30 mVRMS Tj=25 °C SMCJ5.0A F=1 MHz VOSC=30 mVRMS Tj=25 °C SMCJ5.0CA SMCJ12A SMCJ12CA 1.00 1.00 SMCJ24A SMCJ24CA SMCJ40CA SMCJ40A SMCJ85A 0.10 SMCJ85CA 0.10 SMCJ188CA SMCJ188A VR(V) VR(V) 0.01 0.01 1 10 Figure 8. 1.0E+02 100 1 1000 Peak forward voltage drop versus peak forward current (typical values) 10 Figure 9. 100 1000 Relative variation of thermal impedance, junction to ambient, versus pulse duration Zth(j-a) / Rth(j-a) IFM(A) 1.00 Recommended pad layout PCB FR4, copper thickness = 35 µm 1.0E+01 Tj =125 °C 0.10 Tj =25 °C 1.0E+00 VFM(V) 1.0E-01 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Figure 10. Thermal resistance junction to ambient versus copper surface under each lead tP(s) 0.01 1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03 Figure 11. Leakage current versus junction temperature (typical values) Rth(j-a) (°C/W) IR (nA) 100 1.0E+04 PCB FR4, copper thickness = 35 µm 90 80 1.0E+03 70 VR=VRM VRM < 10 V 60 50 1.0E+02 40 30 1.0E+01 20 10 VR=VRM VRM ≥ 10 V SCU(cm²) Tj(°C) 1.0E+00 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 25 Doc ID 5617 Rev 8 50 75 100 125 150 5/10 Ordering information scheme 2 SMCJ Ordering information scheme Figure 12. Ordering information scheme SM Surface mount Peak pulse power C = 1500 W Transil in SMC Stand off voltage 85 = 85 V Type A = Unidirectinal CA = Bidirectional Delivery mode TR = Tape and reel 6/10 Doc ID 5617 Rev 8 C J 85 CA - TR SMCJ 3 Package information Package information ● Case: JEDEC DO-214AB molded plastic over planar junction ● Terminals: solder plated, solderable per MIL-STD-750, Method 2026 ● Polarity: for unidirectional types the band indicates cathode ● Flammability: epoxy is rated UL94V-0 ● RoHS package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 4. SMC dimensions dimensions Ref. E1 D E A1 A2 C E2 L b Figure 13. Footprint dimensions mm (inches) 1.54 (0.061) 5.11 (0.201) Millimeters Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 2.90 3.2 0.114 0.126 c 0.15 0.41 0.006 0.016 E 7.75 8.15 0.305 0.321 E1 6.60 7.15 0.260 0.281 E2 4.40 4.70 0.173 0.185 D 5.55 6.25 0.218 0.246 L 0.75 1.60 0.030 0.063 Figure 14. Marking layout(1) 1.54 (0.061) Cathode bar ( unidirectional devices only ) 3.14 (0.124) e x x x z y ww e: ECOPACK compliance XXX: Marking Z: Manufacturing location Y: Year WW: week 8.19 (0.322) 1. Marking layout can vary according to assembly location. Doc ID 5617 Rev 8 7/10 Package information Table 5. SMCJ Marking Order code 8/10 Marking Order code Marking SMCJ5.0A-TR FUA SMCJ5.0CA-TR FBA SMCJ6.0A-TR FUB SMCJ6.0CA-TR FBB SMCJ6.5A-TR FUC SMCJ6.5CA-TR FBC SMCJ8.5A-TR FUD SMCJ8.5CA-TR FBD SMCJ10A-TR FUF SMCJ10CA-TR FBF SMCJ12A-TR FUH SMCJ12CA-TR FBH SMCJ13A-TR FUI SMCJ13CA-TR FBI SMCJ15A-TR FUJ SMCJ15CA-TR FBJ SMCJ18A-TR FUL SMCJ18CA-TR FBL SMCJ20A-TR FUM SMCJ20CA-TR FBM SMCJ22A-TR FUN SMCJ22CA-TR FBN SMCJ24A-TR FUO SMCJ24CA-TR FBO SMCJ26A-TR FUP SMCJ26CA-TR FBP SMCJ28A-TR FUQ SMCJ28CA-TR FBQ SMCJ30A-TR FUR SMCJ30CA-TR FBR SMCJ33A-TR FUS SMCJ33CA-TR FBS SMCJ40A-TR FUU SMCJ40CA-TR FBU SMCJ48A-TR FUW SMCJ48CA-TR FBW SMCJ58A-TR FUZ SMCJ58CA-TR FBZ SMCJ70A-TR GUB SMCJ70CA-TR GBB SMCJ85A-TR GUE SMCJ85CA-TR GBE SMCJ100A-TR GUG SMCJ100CA-TR GBG SMCJ130A-TR GUI SMCJ130CA-TR GBI SMCJ154A-TR GUL SMCJ154CA-TR GBL SMCJ170A-TR GUM SMCJ170CA-TR GBM SMCJ188A-TR GUN SMCJ188CA-TR GBN Doc ID 5617 Rev 8 SMCJ 4 Ordering information Ordering information Table 6. Ordering information Order code Marking Package Weight Base qty Delivery mode SMCJxxxA/CA-TR(1) See Table 5 on page 8 SMC 0.25 g 2500 Tape and reel 1. Where xxx is nominal value of VBR and A or CA indicates unidirectional or bidirectional version. See Table 3 for list of available devices and their order codes 5 Revision history 02-Jul Table 7. Document revision history Date Revision Changes August-1999 5A 14-May-2009 6 Reformatted to current standards. Updated ECOPACK statement. 17-Sep-2009 7 Document updated for low leakage current. 12-Jul-2010 8 Changed timescale in Figure 9. Previous update. Doc ID 5617 Rev 8 9/10 SMCJ Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. 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