STIEC45-XXAS Transil™ for IEC 61000-4-5 compliance Features ■ Peak pulse current: 500 A (8/20 μs, 1.2/50 µs) ■ Stand off voltage range: from 24 V to 33 V ■ Unidirectional types ■ Low leakage current – 0.2 µA at 25 °C – 1 µA at 85 °C ■ Operating Tj max: 150 °C ■ High peak current capability at Tj max : 410 A 8/20 µs ■ JEDEC registered package outline A K SMC (JEDEC DO-214AB) Complies with the following standards ■ IEC 61000-4-2 level 4 – 15 kV (air discharge) – 8 kV (contact discharge) ■ MIL STD 883G - Method 3015-7 Class 3B – 25 kV HBM (human body model) ■ IEC 61000-4-5 – Level 4 4 kV with R = 12 Ω (334 A) common mode – Level 2 1 kV with R = 2 Ω (500 A) differential mode ■ MIL STD 883G, method 3015-7 Class 3B -25 kV HBM (human body model) ■ Resin meets UL 94, V0 ■ MIL-STD-750, method 2026 soldererabilty ■ EIA STD RS-481 and IEC 60286-3 packing ■ IPC 7531 footprint Description The STIEC45 Transil series has been designed to protect DC power supply lines according to IEC 61000-4-5. This device protects circuits against electrical fast transients (EFT) according to IEC 61000-4-4 and ETS EN 300 386. Protection against electrostatic discharges is provided according to IEC 61000-4-2 and MIL STD 883 Method 3015. Planar technology makes these devices suitable for high-end equipment and SMPS where low leakage current and high junction temperature are required to provide reliability and stability over time. The STIEC45 device is packaged in SMC (SMC footprint in accordance with IPC 7351 standard). TM: Transil is a trademark of STMicroelectronics December 2009 Doc ID 16871 Rev 1 1/9 www.st.com 9 Characteristics 1 STIEC45-XXAS Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Value Unit 500 A IPP Peak pulse current(1) (8/20 µs, 1.2/50 µs) Tstg Storage temperature range -65 to +150 °C Tj Operating junction temperature range -55 to +150 °C TL Maximum lead temperature for soldering during 10 s. 260 °C Value Unit Tj initial = Tamb 1. For a surge greater than the maximum values, the diode will fail in short-circuit. Table 2. Thermal resistances Symbol Parameter Rth(j-l) Junction to leads 15 °C/W Rth(j-a) Junction to ambient on printed circuit on recommended pad layout 90 °C/W Figure 1. Electrical characteristics - parameters I Symbol VBR VCL IRM VRM IF IPP IR VF Rd 2/9 = = = = = = = = = Parameter Breakdown voltage Clamping voltage Leakage current @ VRM Stand-off voltage Forward current Peak pulse current Breakdown current Forward voltage drop Dynamic impedance Doc ID 16871 Rev 1 IF VF VCL VBR VRM IRM IR IPP V STIEC45-XXAS Table 3. Characteristics Electrical characteristics - parameter values (Tamb = 25 °C) Order code 25 °C 85 °C µA RD(2) VCL @IPP 8/20 µs, 1.2/50 µs 8/20 µs VBR @IR(1) IRM @VRM Min. Typ. V Max. V Max. αT (3) Typ. max mA V A Ω 10-4/ °C STIEC45-24AS 0.2 1 24 26.7 28.2 29.5 1 42 500 0.025 9.6 STIEC45-26AS 0.2 1 26 28.9 30.3 31.9 1 45 500 0.026 9.7 STIEC45-27AS 0.2 1 27 30 31.6 33.2 1 47 500 0.028 9.7 STIEC45-28AS 0.2 1 28 31.1 32.6 34.3 1 49 500 0.029 9.8 STIEC45-30AS 0.2 1 30 33.3 35 36.8 1 55 500 0.036 9.9 STIEC45-33AS 0.2 1 33 36.7 38.6 40.6 1 59 500 0.036 10 1. Pulse test: tp < 50 ms 2. To calculate maximum clamping voltage at other surge levels: VCLmax = RD x IPP + VBRmax 3. To calculate VBR versus junction temperature: VBR @ Tj = VBR @ 25°C x (1 + αT x (Tj – 25)) Note: Surge capability given for both directions for unidirectional and bidirectional types. Figure 2. Pulse form % Ipp 100 Figure 3. 600 Repetitive pulse current tr = rise time (µs) tp = pulse duration time (µs) Peak pulse current versus initial junction temperature IPP(A) 8/20 µs, 1.2/50 µs 500 400 300 50 200 0 t tr tp 100 Tj(°C) 0 0 Doc ID 16871 Rev 1 25 50 75 100 125 150 175 3/9 Characteristics Figure 4. STIEC45-XXAS Clamping voltage at 500 A (1.2/50 µs - 8/20 µs) 100 A/div Surge current Remaining voltage - STIEC45-24AS 10 V/div 5 µs/div Remaining voltage - STIEC45-26AS 10 V/div 5 µs/div Remaining voltage - STIEC45-28AS 10 V/div 5 µs/div Remaining voltage - STIEC45-30AS 5 µs/div Remaining voltage- STIEC45-33AS 10 V/div 10 V/div 5 µs/div Figure 5. 10000 Junction capacitance versus reverse applied voltage (typical values) 5 µs/div Figure 6. C (pF) 1.E+03 F=1 MHz Vosc=30 mVRMS Tj=25 °C Peak forward voltage drop versus peak forward current (typical values) IFM(A) 1.E+02 1.E+01 STIEC45-24AS Tj = 25 °C 1000 STIEC45-33AS 1.E+00 Tj = 150 °C 1.E- 01 VR(V) 100 1 4/9 10 100 1.E- 02 0.0 Doc ID 16871 Rev 1 VFM(V) 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 STIEC45-XXAS Figure 7. Characteristics Relative variation of thermal impedance, junction to ambient, versus pulse duration Figure 8. Zth(j a) / Rth(j a) 1.0 0.9 100 Recommended pad layout PCB FR4, copper thickness = 35 µm Rth(j-a)(°C/W) 90 0.8 80 0.7 70 0.6 60 0.5 50 PCB FR4, copper thickness = 35 µm 40 0.4 0.3 Thermal resistance junction to ambient versus copper surface under each lead 30 Single pulse 20 0.2 10 0.1 tP(s) 0.0 1.E-01 Figure 9. 1.E+00 1.E+01 1.E+02 SCU(cm²) 0 1.E+03 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Leakage current versus junction temperature (typical values) 1.E+03 IR (nA) VR=VRM 1.E+02 1.E+01 Tj(°C) 1.E+00 25 50 75 100 Doc ID 16871 Rev 1 125 150 5/9 Ordering information scheme 2 STIEC45-XXAS Ordering information scheme Figure 10. Ordering information scheme STIEC45 - XX A S IEC 61000-4-5 Stand off voltage 27 = 27 V Current capability code A = 500 A, 8/20 µs, 1.2/50 µs Package S = SMC package (JEDEC DO-214AB) 6/9 Doc ID 16871 Rev 1 STIEC45-XXAS 3 Package information Package information ● Case: JEDEC DO-214AB molded plastic over planar junction ● Terminals: solder plated, solderable per MIL-STD-750, Method 2026 ● Polarity: for unidirectional types the band indicates cathode ● Flammability: epoxy is rated UL94V-0 ● RoHS package In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 4. SMC dimensions Dimensions Ref. E1 D A2 C E2 L b Figure 11. Footprint dimensions in mm (inches) 1.54 (0.061) 5.11 (0.201) Inches Min. Max. Min. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 2.90 3.2 0.114 0.126 c 0.15 0.41 0.006 0.016 E 7.75 8.15 0.305 0.321 E1 6.60 7.15 0.260 0.281 E2 4.40 4.70 0.173 0.185 D 5.55 6.25 0.218 0.246 L 0.75 1.60 0.030 0.063 E A1 Millimeters Figure 12. Marking layout 1.54 (0.061) Cathode bar 3.14 (0.124) E x x x x z y ww E: ECOPACK environmental status XXXX: Marking Z: Manufacturing location Y: Year WW: week 8.19 (0.322) Note: Marking layout can vary according to assembly location. Doc ID 16871 Rev 1 7/9 Ordering information 4 STIEC45-XXAS Ordering information Table 5. Ordering information Order code 5 STIEC45-24AS 4524A STIEC45-26AS 4526A STIEC45-27AS 4527A STIEC45-28AS 4528A STIEC45-30AS 4530A STIEC45-33AS 4533A Package Weight Base qty Delivery mode SMC 0.25 g 2500 Tape and reel Revision history Table 6. 8/9 Marking Document revision history Date Revision 07-Dec-2009 1 Changes First issue. 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