TI SN74CBT3125DBQR

SN74CBT3125
QUADRUPLE FET BUS SWITCH
SCDS021I − MAY 1995 − REVISED SEPTEMBER 2002
D Standard ’125-Type Pinout (D, DB, DGV,
D 5-Ω Switch Connection Between Two Ports
D TTL-Compatible Input Levels
and PW Packages)
D, DB, DGV, OR PW PACKAGE
(TOP VIEW)
3
12
4
11
5
10
6
9
8
7
VCC
4OE
4A
4B
3OE
3A
3B
VCC
13
1
1A
1B
2OE
2A
2B
NC
1OE
1A
1B
2OE
2A
2B
GND
14
2
13 4OE
3
12 4A
4
11 4B
5
10 3OE
9 3A
6
7
8
3B
14
2
1OE
1
GND
1OE
1A
1B
2OE
2A
2B
GND
DBQ PACKAGE
(TOP VIEW)
RGY PACKAGE
(TOP VIEW)
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
4OE
4A
4B
3OE
3A
3B
NC
NC − No internal connection
description/ordering information
The SN74CBT3125 quadruple FET bus switch features independent line switches. Each switch is disabled
when the associated output-enable (OE) input is high.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
QFN − RGY
†
TOP-SIDE
MARKING
Tape and reel
SN74CBT3125RGYR
Tube
SN74CBT3125D
Tape and reel
SN74CBT3125DR
SSOP − DB
Tape and reel
SN74CBT3125DBR
CU125
SSOP (QSOP) − DBQ
Tape and reel
SN74CBT3125DBQR
CU125
TSSOP − PW
Tape and reel
SN74CBT3125PWR
CU125
TVSOP − DGV
Tape and reel
SN74CBT3125DGVR
CU125
SOIC − D
−40°C
40 C to 85°C
85 C
ORDERABLE
PART NUMBER
PACKAGE†
TA
CU125
CBT3125
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
FUNCTION TABLE
(each bus switch)
INPUT
OE
FUNCTION
L
A port = B port
H
Disconnect
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright © 2002, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
POST OFFICE BOX 655303
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1
SN74CBT3125
QUADRUPLE FET BUS SWITCH
SCDS021I − MAY 1995 − REVISED SEPTEMBER 2002
logic diagram (positive logic)
3
2
1A
1B
1
1OE
2A
6
5
2B
4
2OE
8
9
3B
3A
3OE
4A
4OE
10
11
12
4B
13
Pin numbers shown are for the D, DB, DGV, PW, and RGY packages.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Continuous channel current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Input clamp current, IK (VI/O < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
(see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W
(see Note 2): DBQ package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90°C/W
(see Note 2): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127°C/W
(see Note 2): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W
(see Note 3): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
3. The package thermal impedance is calculated in accordance with JESD 51-5.
recommended operating conditions (see Note 4)
MIN
MAX
VCC
Supply voltage
4
5.5
VIH
High-level control input voltage
2
VIL
Low-level control input voltage
TA
Operating free-air temperature
−40
UNIT
V
V
0.8
V
85
°C
NOTE 4: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
2
POST OFFICE BOX 655303
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SN74CBT3125
QUADRUPLE FET BUS SWITCH
SCDS021I − MAY 1995 − REVISED SEPTEMBER 2002
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
VIK
VCC = 4 V,
II = −18 mA
II
VCC = 5.5 V,
VI = 5.5 V or GND
ICC
VCC = 5.5 V,
IO = 0,
VI = VCC or GND
One input at 3.4 V,
Other inputs at VCC or GND
ΔICC‡
Control inputs
VCC = 5.5 V,
Ci
Control inputs
VI = 3 V or 0
Cio(OFF)
VO = 3 V or 0,
OE = VCC
VCC = 4 V,
TYP at VCC = 4 V
VI = 2.4 V,
ron§
VI = 0
VCC = 4.5 V
VI = 2.4 V,
TYP†
MAX
UNIT
−1.2
V
±1
μA
3
μA
2.5
mA
3
pF
4
pF
II = 15 mA
16
22
II = 64 mA
5
7
II = 30 mA
5
7
II = 15 mA
10
15
Ω
†
All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C.
This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
§ Measured by the voltage drop between the A and the B terminals at the indicated current through the switch. On-state resistance is determined
by the lower voltage of the two (A or B) terminals.
‡
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
¶
VCC = 4 V
VCC = 5 V
± 0.5 V
MIN
MIN
FROM
(INPUT)
TO
(OUTPUT)
tpd¶
A or B
B or A
0.35
ten
OE
A or B
6
tdis
OE
A or B
5.1
PARAMETER
MAX
UNIT
MAX
0.25
ns
1.6
5.4
ns
1
4.7
ns
The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance,
when driven by an ideal voltage source (zero output impedance).
POST OFFICE BOX 655303
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3
SN74CBT3125
QUADRUPLE FET BUS SWITCH
SCDS021I − MAY 1995 − REVISED SEPTEMBER 2002
PARAMETER MEASUREMENT INFORMATION
7V
500 Ω
From Output
Under Test
S1
Open
GND
CL = 50 pF
(see Note A)
500 Ω
TEST
S1
tpd
tPLZ/tPZL
tPHZ/tPZH
Open
7V
Open
3V
Output
Control
LOAD CIRCUIT
1.5 V
1.5 V
0V
tPZL
3V
Input
1.5 V
1.5 V
0V
tPLH
1.5 V
3.5 V
1.5 V
1.5 V
VOL
Output
Waveform 2
S1 at Open
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOL + 0.3 V
VOL
tPZH
tPHL
VOH
Output
Output
Waveform 1
S1 at 7 V
(see Note B)
tPLZ
tPHZ
1.5 V
VOH
VOH − 0.3 V
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
4
POST OFFICE BOX 655303
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PACKAGE OPTION ADDENDUM
www.ti.com
21-Dec-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74CBT3125D
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
TBD
Lead/Ball Finish
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT3125DBLE
OBSOLETE
SSOP
DB
14
SN74CBT3125DBQR
ACTIVE
SSOP/
QSOP
DBQ
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN74CBT3125DBQRE4
ACTIVE
SSOP/
QSOP
DBQ
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN74CBT3125DBQRG4
ACTIVE
SSOP/
QSOP
DBQ
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN74CBT3125DBR
ACTIVE
SSOP
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT3125DBRE4
ACTIVE
SSOP
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT3125DBRG4
ACTIVE
SSOP
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT3125DE4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT3125DG4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT3125DGVR
ACTIVE
TVSOP
DGV
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT3125DGVRE4
ACTIVE
TVSOP
DGV
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT3125DGVRG4
ACTIVE
TVSOP
DGV
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT3125DR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT3125DRE4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT3125DRG4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT3125PW
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT3125PWE4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT3125PWG4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT3125PWLE
OBSOLETE
TSSOP
PW
14
SN74CBT3125PWR
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT3125PWRE4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT3125PWRG4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT3125RGYR
ACTIVE
VQFN
RGY
14
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN74CBT3125RGYRG4
ACTIVE
VQFN
RGY
14
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
TBD
Addendum-Page 1
Call TI
MSL Peak Temp (3)
Call TI
Call TI
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
21-Dec-2009
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74CBT3125DBR
SSOP
DB
14
2000
330.0
16.4
8.2
6.6
2.5
12.0
16.0
Q1
SN74CBT3125DGVR
TVSOP
DGV
14
2000
330.0
12.4
6.8
4.0
1.6
8.0
12.0
Q1
SN74CBT3125DR
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
SN74CBT3125PWR
TSSOP
PW
14
2000
330.0
12.4
6.9
5.6
1.6
8.0
12.0
Q1
SN74CBT3125RGYR
VQFN
RGY
14
3000
330.0
12.4
3.75
3.75
1.15
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jul-2010
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74CBT3125DBR
SSOP
DB
14
2000
346.0
346.0
33.0
SN74CBT3125DGVR
TVSOP
DGV
14
2000
346.0
346.0
29.0
SN74CBT3125DR
SOIC
D
14
2500
346.0
346.0
33.0
SN74CBT3125PWR
TSSOP
PW
14
2000
346.0
346.0
29.0
SN74CBT3125RGYR
VQFN
RGY
14
3000
346.0
346.0
29.0
Pack Materials-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
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MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DLP® Products
www.dlp.com
Communications and
Telecom
www.ti.com/communications
DSP
dsp.ti.com
Computers and
Peripherals
www.ti.com/computers
Clocks and Timers
www.ti.com/clocks
Consumer Electronics
www.ti.com/consumer-apps
Interface
interface.ti.com
Energy
www.ti.com/energy
Logic
logic.ti.com
Industrial
www.ti.com/industrial
Power Mgmt
power.ti.com
Medical
www.ti.com/medical
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Space, Avionics &
Defense
www.ti.com/space-avionics-defense
RF/IF and ZigBee® Solutions www.ti.com/lprf
Video and Imaging
www.ti.com/video
Wireless
www.ti.com/wireless-apps
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