[ /Title (CD74 HC4059 ) /Subject (HighSpeed CMOS Logic CMOS Pro- CD54HC4059, CD74HC4059 Data sheet acquired from Harris Semiconductor SCHS206B High-Speed CMOS Logic CMOS Programmable Divide-by-N Counter February 1998 - Revised May 2003 Features Description • Synchronous Programmable ÷N Counter N = 3 to 9999 or 15999 The ’HC4059 are high-speed silicon-gate devices that are pin-compatible with the CD4059A devices of the CD4000B series. These devices are divide-by-N down-counters that can be programmed to divide an input frequency by any number “N” from 3 to 15,999. The output signal is a pulse one clock cycle wide occurring at a rate equal to the input frequency divide by N. The down-counter is preset by means of 16 jam inputs. • Presettable Down-Counter • Fully Static Operation • Mode-Select Control of Initial Decade Counting Function (÷10, 8, 5, 4, 2) • Master Preset Initialization The three Mode-Select Inputs Ka, Kb and Kc determine the modulus (“divide-by” number) of the first and last counting sections in accordance with the truth table. Every time the first (fastest) counting section goes through one cycle, it reduces by 1 the number that has been preset (jammed) into the three decades of the intermediate counting section an the last counting section, which consists of flip-flops that are not needed for opening the first counting section. For example, in the ÷2 mode, only one flip-flop is needed in the first counting section. Therefore the last counting section has three flip-flops that can be preset to a maximum count of seven with a place value of thousands. If ÷10 is desired for the first section, Ka is set “high”, Kb “high” and Kc “low”. Jam inputs J1, J2, J3, and J4 are used to preset the first counting section and there is no last counting section. The intermediate counting section consists of three cascaded BCD decade (÷10) counters presettable by means of Jam Inputs J5 through J16. • Latchable ÷N Output • Fanout (Over Temperature Range) - Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads - Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads • Wide Operating Temperature Range . . . -55oC to 125oC • Balanced Propagation Delay and Transition Times • Significant Power Reduction Compared to LSTTL Logic ICs • HC Types - 2V to 6V Operation - High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V The Mode-Select Inputs permit frequency-synthesizer channel separations of 10, 12.5, 20, 25 or 50 parts. These inputs set the maximum value of N at 9999 (when the first counting section divides by 5 or 10) or 15,999 (when the first counting section divides by 8, 4, or 2). Applications • Communications Digital Frequency Synthesizers; VHF, UHF, FM, AM, etc. • Fixed or Programmable Frequency Division The three decades of the intermediate counter can be preset to a binary 15 instead of a binary 9, while their place values are still 1, 10, and 100, multiplied by the number of the ÷N mode. For example, in the ÷8 mode, the number from which counting down begins can be preset to: 3rd Decade 1500 2nd Decade 150 1st Decade 15 Last Counting Section 1000 • “Time Out” Timer for Consumer-Application Industrial Controls Ordering Information PART NUMBER TEMP. RANGE (oC) PACKAGE CD54HC4059F3A -55 to 125 24 Ld CERDIP CD74HC4059E -55 to 125 24 Ld PDIP CD74HC4059M96 -55 to 125 24 Ld SOIC The total of these numbers (2665) times 8 equals 12,320. The first counting section can be preset to 7. Therefore, 21,327 is the maximum possible count in the ÷8 mode. NOTE: When ordering, use the entire part number. The suffix 96 denotes tape and reel. The highest count of the various modes is shown in the Extended Counter Range column. Control inputs Kb and Kc can be used to initiate and lock the counter in the “master preset” state. In this condition the flip-flops in the counter are preset in accordance with the jam inputs and the counter remains in that state as long as Kb and Kc both remain low. The counter begins to count down from the preset state when a counting mode other than the master preset mode is selected. CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright © 2003, Texas Instruments Incorporated 1 CD54HC4059, CD74HC4059 Pinout The counter should always be put in the master preset mode before the ÷5 mode is selected. Whenever the master preset mode is used, control signals Kb = “low” and Kc = “low” must be applied for at least 3 full clock pulses. CD54HC4059 (CERDIP) CD74HC4059 (PDIP, SOIC) TOP VIEW After Preset Mode inputs have been changed to one of the ÷ modes, the next positive-going clock transition changes an internal flip-flop so that the countdown can begin at the second positive-going clock transition. Thus, after an MP (Master Preset) mode, there is always one extra count before the output goes high. Figure 1 illustrates a total count of 3 (÷8 mode). If the Master Preset mode is started two clock cycles or less before an output pulse, the output pulse will appear at the time due. If the Master Preset Mode is not used, the counter jumps back to the “Jam” count when the output pulse appears. A “high” on the Latch Enable input will cause the counter output to remain high once an output pulse occurs, and to remain in the high state until the latch input returns to “low”. If the Latch Enable is “low”, the output pulse will remain high for only one cycle of the clock-input signal. CP 1 24 VCC LE 2 23 Q J1 3 22 J5 J2 4 21 J6 J3 5 20 J7 J4 6 19 J8 J16 7 18 J9 J15 8 17 J10 J14 9 16 J11 J13 10 15 J12 Kc 11 14 Ka GND 12 13 Kb Functional Diagram J1 - J16 CP Ka f IN Q = ------- N Kb Kc LE TRUTH TABLE COUNTER RANGE MODE SELECT INPUT FIRST COUNTING SECTION CAN BE PRESET MODE TO A MAX DIVIDES-BY OF: (NOTE 1) JAM INPUTS USED: LAST COUNTING SECTION CAN BE PRESET MODE TO A MAX DIVIDES-BY OF: DESIGN EXTENDED (NOTE 1) JAM INPUTS USED: MAX MAX Ka Kb Kc H H H 2 1 J1 8 7 J2, J3, J4 15,999 17,331 L H H 4 3 J1, J2 4 3 J3, J4 15,999 18,663 H L H 5 (Note 2) 4 J1, J2, J3 2 1 J4 9,999 13,329 L L H 8 7 J1, J2, J3 2 1 J4 15,999 21,327 H H L 10 9 J1, J2, J3, J4 1 0 - 9,999 16,659 X L L - - Master Preset Master Preset X = Don’t care NOTES: 1. J1 = Least Significant Bit. J4 = Most Significant Bit. 2. Operation in the 5mode (1st counting section) requires going through the Master Preset mode prior to going into the 5mode. At power turn-on, Kc must be “low” for a period of 3 input clock pulses after VCC reaches a minimum of 3V. 2 CD54HC4059, CD74HC4059 How to Preset the HC/HCT4059 to Desired ÷N The value N is determined as follows: N Preset Value = Mode (EQ. 1) N = (MODE†) (1000 x Decade 5 Preset + 100 x Decade 4 Preset + 10 x Decade 3 Preset + 1 x Decade 2 Preset) + Decade 1 Preset Example: N = 8479, Mode = 5 † MODE = First counting section divider (10, 8, 5, 4 or 2) To calculate preset values for any N count, divide the N count by the Mode. The resultant is the corresponding preset values of the 5th through 2nd decade with the remainder being equal to the 1st decade value. (EQ. 2) Mode Select = 5 Ka Kb Kc H L H 1695 + 4 (Preset Values) 5 | 8479 Mode N Program Jam Inputs (BCD) 4 J1 L 1 J2 J3 L 9 5 J4 J5 J6 J7 H H H L J9 J10 J8 H H L 6 J11 J12 J13 J14 J15 J16 L H L H H L L NOTE: To verify the results, use Equation 1: N = 5 (1000 x 1 + 100 x 6 + 10 x 9 + 1 x 5) + 4 N = 8479 PROGRAM JAM INPUTS (BCD) J1 J2 J3 3 12 4 J4 5 J5 6 J6 22 J7 21 J8 20 J9 J10 J11 J12 19 18 17 16 J13 J14 J15 J16 15 10 9 8 7 P.E. GND PRESETTABLE LOGIC 24 VCC CLOCK INPUT FIRST COUNTING SECTION ÷10, 8, 5, 4, 2 1 LAST COUNTING SECTION ÷1, 2, 2, 4, 8 INTERMEDIATE COUNTING SECTION ÷10 ÷10 ÷10 RECOGNITION GATING 14 Ka MODE SELECT INPUTS 13 Kb 11 MODE CONTROL PRESET ENABLE Kc 23 2 OUTPUT STAGE LATCH ENABLE FIGURE 1. FUNCTIONAL BLOCK DIAGRAM 3 DIVIDE-BY-N OUTPUT CD54HC4059, CD74HC4059 Absolute Maximum Ratings Thermal Information DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA DC Output Source or Sink Current per Output Pin, IO For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±50mA Thermal Resistance (Typical) θJA (oC/W) E (PDIP) Package (Note 3) . . . . . . . . . . . . . . . . . . . 67 M (SOIC) Package (Note 4). . . . . . . . . . . . . . . . . . . 46 Maximum Junction Temperature (Hermetic Package or Die) . . . 175oC Maximum Junction Temperature (Plastic Package) . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC Operating Conditions Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Time 2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max) 4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max) 6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 3. The package thermal impedance is calculated in accordance with JESD 51-3. 4. The package thermal impedance is calculated in accordance with JESD 51-7. DC Electrical Specifications TEST CONDITIONS PARAMETER High Level Input Voltage Low Level Input Voltage High Level Output Voltage CMOS Loads Quiescent Device Current -55oC TO 125oC VI (V) IO (mA) VIH - - 2 1.5 - - 1.5 4.5 3.15 - - 3.15 - 3.15 - V 6 4.2 - - 4.2 - 4.2 - V 2 - - 0.5 - 0.5 - 0.5 V 4.5 - - 1.35 - 1.35 - 1.35 V 6 - - 1.8 - 1.8 - 1.8 V -0.02 2 1.9 - - 1.9 - 1.9 - V -0.02 4.5 4.4 - - 4.4 - 4.4 - V -0.02 6 5.9 - - 5.9 - 5.9 - V VIL VOH - VIH or VIL VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current -40oC TO 85oC SYMBOL High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads 25oC VCC (V) - MIN TYP MAX MIN MAX MIN MAX UNITS - 1.5 - V - - - - - - - - - V -4 4.5 3.98 - - 3.84 - 3.7 - V -5.2 6 5.48 - - 5.34 - 5.2 - V 0.02 2 - - 0.1 - 0.1 - 0.1 V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 0.02 6 - - 0.1 - 0.1 - 0.1 V - - - - - - - - - V 4 4.5 - - 0.26 - 0.33 - 0.4 V 5.2 6 - - 0.26 - 0.33 - 0.4 V II VCC or GND - 6 - - ±0.1 - ±1 - ±1 µA ICC VCC or GND 0 6 - - 8 - 80 - 160 µA 4 CD54HC4059, CD74HC4059 Prerequisite for Switching Specifications 25oC PARAMETER Pulse Width CP Setup Time Kb, Kc to CP CP Frequency -40oC TO 85oC -55oC TO 125oC SYMBOL VCC (V) MIN TYP MAX MIN TYP MAX MIN TYP MAX UNITS tW 2 90 - - 115 - - 135 - - ns 4.5 18 - - 23 - - 27 - - ns 6 15 - - 20 - - 23 - - ns 2 75 - - 95 - - 110 - - ns 4.5 15 - - 19 - - 22 - - ns 6 13 - - 16 - - 19 - - ns 2 5 - - 4 - - 4 - - MHz 4.5 27 - - 22 - - 18 - - MHz 6 32 - - 26 - - 21 - - MHz tSU fMAX Switching Specifications Input tr, tf = 6ns PARAMETER Propagation Delay, CP to Q Propagation Delay, LE to Q Output Transition Time CP Frequency Input Capacitance Power Dissipation Capacitance (Notes 5, 6) 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL TEST CONDITIONS VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS tPLH, tPHL CL = 50pF 2 - - 200 - 250 - 300 ns 4.5 - - 40 - 50 - 60 ns 6 - - 34 - 43 - 51 ns CL = 15pF 5 - 17 - - - - - ns CL = 50pF 2 - - 175 - 220 - 265 ns 4.5 - - 35 - 44 - 53 ns 6 - - 30 - 37 - 45 ns CL = 15pF 5 - 14 - - - - - ns CL = 50pF 2 - - 75 - 95 - 110 ns 4.5 - - 15 - 19 - 22 ns 6 - - 13 - 16 - 19 ns tPLH, tPHL tTHL, tTLH fMAX CL = 15pF 5 - 54 - - - - - MHz CI - - - - 10 - 10 - 10 pF CPD - 5 - 36 - - - - - pF NOTES: 5. CPD is used to determine the dynamic power consumption, per package. 6. PD = CPD VCC2 fi + Σ CL VCC2 fo where fi = input frequency, fo = output frequency, CL = output load capacitance, VCC = supply voltage. 5 CD54HC4059, CD74HC4059 Test Circuits and Waveforms tr = 6ns tfCL trCL CLOCK 90% 10% I tWL + tWH = fCL tf = 6ns VCC 50% 10% tWL 50% VCC 90% 50% 10% INPUT GND 50% tTHL GND tTLH 90% 50% 10% tWH INVERTING OUTPUT NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with device truth table. For fMAX, input duty cycle = 50%. tPHL FIGURE 2. HC CLOCK PULSE RISE AND FALL TIMES AND PULSE WIDTH FIGURE 3. HC TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC tfCL trCL CLOCK INPUT VCC 90% 50% 10% GND tH(H) tH(L) VCC DATA INPUT 50% GND tSU(H) tSU(L) tTLH 90% tTHL 90% 50% 10% tPLH tPHL OUTPUT tREM VCC SET, RESET OR PRESET tPLH 50% GND IC CL 50pF FIGURE 4. HC SETUP TIMES, HOLD TIMES, REMOVAL TIME, AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS 6 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) 5962-8944501JA ACTIVE CDIP J 24 1 TBD A42 SNPB N / A for Pkg Type CD54HC4059F3A ACTIVE CDIP J 24 1 TBD A42 SNPB N / A for Pkg Type CD74HC4059E ACTIVE PDIP N 24 15 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC4059EE4 ACTIVE PDIP N 24 15 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC4059M96 ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4059M96E4 ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4059M96G4 ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device CD74HC4059M96 Package Package Pins Type Drawing SOIC DW 24 SPQ Reel Reel Diameter Width (mm) W1 (mm) 2000 330.0 24.4 Pack Materials-Page 1 A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 10.75 15.7 2.7 12.0 24.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD74HC4059M96 SOIC DW 24 2000 346.0 346.0 41.0 Pack Materials-Page 2 MECHANICAL DATA MPDI006B – SEPTEMBER 2001 – REVISED APRIL 2002 N (R–PDIP–T24) PLASTIC DUAL–IN–LINE 1.222 (31,04) MAX 24 13 0.360 (9,14) MAX 1 12 0.070 (1,78) MAX 0.200 (5,08) MAX 0.425 (10,80) MAX 0.020 (0,51) MIN Seating Plane 0.125 (3,18) MIN 0.100 (2,54) 0’–15’ 0.021 (0,53) 0.015 (0,38) 0.010 (0,25) 0.010 (0,25) NOM 4040051–3/D 09/01 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS–010 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MCDI004A – JANUARY 1995 – REVISED NOVEMBER 1997 J (R-GDIP-T**) CERAMIC DUAL-IN-LINE PACKAGE 24 PINS SHOWN B 13 24 C 1 12 0.065 (1,65) 0.045 (1,14) Lens Protrusion (Lens Optional) 0.010 (0.25) MAX 0.175 (4,45) 0.140 (3,56) 0.090 (2,29) 0.060 (1,53) A Seating Plane 0.018 (0,46) MIN 24 PINS ** DIM ”A” ”B” ”C” NARR 0.125 (3,18) MIN 0.022 (0,56) 0.014 (0,36) 0.100 (2,54) 0.012 (0,30) 0.008 (0,20) 28 WIDE NARR 40 32 WIDE NARR WIDE NARR WIDE MAX 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) 0.624(15,85) MIN 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) 0.590(14,99) MAX 1.265(32,13) 1.265(32,13) 1.465(37,21) 1.465(37,21) 1.668(42,37) 1.668(42,37) 2.068(52,53) 2.068(52,53) MIN 1.235(31,37) 1.235(31,37) 1.435(36,45) 1.435(36,45) 1.632(41,45) 1.632(41,45) 2.032(51,61) 2.032(51,61) MAX 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) 0.541(13,74) 0.598(15,19) MIN 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 0.514(13,06) 0.571(14,50) 4040084/C 10/97 NOTES: A. B. C. D. E. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Window (lens) added to this group of packages (24-, 28-, 32-, 40-pin). This package can be hermetically sealed with a ceramic lid using glass frit. Index point is provided on cap for terminal identification. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MPDI008 – OCTOBER 1994 N (R-PDIP-T**) PLASTIC DUAL-IN-LINE PACKAGE 24 PIN SHOWN A 24 13 0.560 (14,22) 0.520 (13,21) 1 12 0.060 (1,52) TYP 0.200 (5,08) MAX 0.610 (15,49) 0.590 (14,99) 0.020 (0,51) MIN Seating Plane 0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0.125 (3,18) MIN 0.010 (0,25) M PINS ** 0°– 15° 0.010 (0,25) NOM 24 28 32 40 48 52 A MAX 1.270 (32,26) 1.450 (36,83) 1.650 (41,91) 2.090 (53,09) 2.450 (62,23) 2.650 (67,31) A MIN 1.230 (31,24) 1.410 (35,81) 1.610 (40,89) 2.040 (51,82) 2.390 (60,71) 2.590 (65,79) DIM 4040053 / B 04/95 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). 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