VND05BSP Iso high side smart power solid state relay Features Type VDSS RDS(on) IOUT VCC VND05BSP 40 V 0.2 Ω 1.6A 26 V 10 1 ■ Output current (continuous): 9A @ Tc=85°C ■ 5V logic level compatible input ■ Thermal shutdown ■ Under voltage shutdown ■ Open drain diagnostic output ■ Inductive load fast demagnetization ■ Very low standby power dissipation PowerSO-10 Description The VND05BSP is a monolithic device made using STMicroelectronics VIPower Technology, intended for driving resistive or inductive loads with one side grounded. This device has two channels, and a common diagnostic. Built-in thermal shutdown protects the chip from over temperature and short circuit. The status output provides an indication of open load in on state, open load in off state, overtemperature conditions and stuck-on to VCC. Table 1. Device summary Order codes Package VND05BSP November 2008 Tube Tape & reel VND05BSP VND05BSP13TR Rev 3 1/16 www.st.com 16 Contents VND05BSP Contents 1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 4 5 2/16 2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 3.1 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 3.2 Protecting the device against reverse battery . . . . . . . . . . . . . . . . . . . . . 12 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4.1 ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 4.2 PowerSO-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 VND05BSP List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Switching (VCC=13V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Logic inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Protections and diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 PowerSO-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3/16 List of figures VND05BSP List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. 4/16 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 IL(off) circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 tpol/tpovl waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Switching time waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Typical application circuit with a schottky diode for reverse supply protection . . . . . . . . . . 11 Typical application circuit with separate signal ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 PowerSO-10 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 VND05BSP 1 Block diagram and pin description Block diagram and pin description Figure 1. Block diagram Figure 2. Configuration diagram (top view) 5/16 Electrical specifications 2 Electrical specifications Figure 3. 2.1 VND05BSP Current and voltage conventions Absolute maximum ratings Stressing the device above the rating listed in the “Absolute maximum ratings” table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to Absolute maximum rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics sure program and other relevant quality document. Table 2. Symbol Parameter Value Unit V(BR)DSS Drain-Source breakdown voltage 40 V IOUT Output current (cont.) at Tc=85°C 9 A RMS output current at Tc=85°C and f> 1Hz 9 A IR Reverse output current at Tc=85°C -9 A IIN Input current ±10 mA -4 V ±10 mA 2000 V IOUT (RMS) -VCC Reverse supply voltage ISTAT Status current VESD Electrostatic discharge (1.5 kΩ, 100 pF) Ptot Power dissipation at Tc = 25 °C 59 W Tj Junction operating temperature -40 to 150 °C Storage temperature -55 to 150 °C Tstg 6/16 Absolute maximum ratings VND05BSP 2.2 Electrical specifications Thermal data Table 3. 2.3 Thermal data Symbol Parameter Max. value Unit Rthj-case Thermal resistance junction-case 2.1 °C/W Rthj-amb Thermal resistance junction-ambient 50 °C/W Electrical characteristics Values specified in this section are for 8<VCC<16V; -40°C<Tj<125°C, unless otherwise stated. Table 4. Symbol Power Parameter Test conditions Min. Typ. Max. Unit 6 13 26 V VCC Supply voltage In(1) Nominal current TC=85°C VDS(on)<0.5 VCC=13V 1.6 2.6 A Ron On state resistance IOUT =In; VCC=13V Tj = 25°C 0.13 0.2 Ω Supply current Off state Tj = 25 °C VCC=13V 100 µA 2.3 V 20 KΩ IS VDS(MAX) Maximum voltage drop Output to GND internal impedance Ri IOUT =7.5 A; Tj = 85°C VCC=13V Tj = 25 °C 35 1.44 5 10 1. In= Nominal current according to ISO definition for high side automotive switch(Tc = 85 oC for battery voltage of 13V which produces a voltage drop of 0.5 V). Table 5. Switching (VCC=13V) Symbol Parameter Test conditions Min. Typ. Max. Unit td(on) Turn-on delay time of output current ROUT = 5.4 Ω (see 5 25 200 µs Rise time of output current ROUT = 5.4 Ω 10 50 180 µs Turn-off delay time of output current ROUT = 5.4 Ω 10 75 250 µs Fall time of output current ROUT = 5.4 Ω 10 35 180 µs dVOUT/dt(on) Turn-on current slope ROUT = 5.4 Ω 0.003 0.1 A/µs A/µs dVOUT/dt(off) Turn-off current slope ROUT = 5.4 Ω 0.005 0.1 A/µs A/µs tr td(off) tf 7/16 Electrical specifications Table 6. VND05BSP Logic inputs Symbol Parameter Test conditions Min. VIL Input low level voltage VIH(1) Input high level voltage 3.5 VI(hyst.) Input hysteresis voltage 0.2 IIN Max. Unit 1.5 Input current VIN = 5 V; Tj= 25°C 5 IIN = 10 mA IIN = -10 mA Input clamp voltage VICL Typ. V V 0.9 1.5 V 30 100 µA 6 -0.7 7 V V 1. The VIH is internally clamped at 6V about. It is possible to connect this pin to an higher voltage via an external resistor calculated to not exceed 10 mA at the input pin. Table 7. Protections and diagnostics Symbol Parameter VSTAT Status voltage output low VUSD Under voltage shutdown VSCL Status clamp voltage TTSD Thermal shutdown temperature TTSD(hyst) Thermal shutdown hysteresis TR Reset temperature ISTAT = 10 mA ISTAT = -10 mA Open voltage level IOL Open load current level On-state Status delay (2) Status delay 1. IOL(off) = (VCC -VOL)/ROL 2. ISO definition. Typ. Max. Unit 0.4 V 3.5 4.5 6 V 5 6 -0.7 7 V V 140 160 180 °C 50 °C 125 VOL tpovl(2) Min. ISTAT = 1.6 mA Off-state(1) tpol 8/16 Test conditions 2.5 5 °C 4 5 V 180 mA VND05BSP Electrical specifications Figure 4. IL(off) circuit Figure 5. tpol/tpovl waveforms Figure 6. Switching time waveforms 9/16 Electrical specifications Table 8. VND05BSP Truth table Conditions Input 1 Input 2 Output 1 Output 2 Diagnostic Normal operation L H L H L H L H H H Undervoltage X X L L H Channel 1 H X L X L Channel 2 X H X L L Channel 1 H L X L H L X L L L Channel 2 X L H L X L H L L L Channel 1 H L X L H H X L L L Channel 2 X L H L X L H H L L Thermal shutdown Openload Output shorted to VCC Figure 7. 10/16 Waveforms VND05BSP 3 Application information Application information Figure 8. Typical application circuit with a schottky diode for reverse supply protection Figure 9. Typical application circuit with separate signal ground 11/16 Application information 3.1 VND05BSP Functional description The device has a diagnostic output which indicates open load in on-state, open load in offstate, over temperature conditions and stuck-on to VCC. From the falling edge of the input signal, the status output, initially low to signal a fault condition (overtemperature or open load on-state), will go back to a high state with a different delay in case of overtemperature (tpovl) and in case of open open load (tpol) respectively. This feature allows to discriminate the nature of the detected fault. To protect the device against short circuit and over current condition, the thermal protection turns the integrated Power MOSFET off at a minimum junction temperature of 140°C. When this temperature returns to 125°C the switch is automatically turned on again. In short circuit the protection reacts with virtually no delay, the sensor being located inside the Power MOSFET area. An internal function of the devices ensures the fast demagnetization of inductive loads with a typical voltage (Vdemag) of -18V. This function allows to greatly reduces the power dissipation according to the formula: Pdem = 0.5 • Lload •(Ι load)2 • [(VCC+Vdemag)/Vdemag] • f where f = switching frequency and Vdemag = demagnetization voltage. The maximum inductance which causes the chip temperature to reach the shut-down temperature in a specified thermal environment is a function of the load current for a fixed VCC, Vdemag and f according to the above formula. In this device if the GND pin is disconnected, with VCC not exceeding 16V, it will switch off. 3.2 Protecting the device against reverse battery The simplest way to protect the device against a continuous reverse battery voltage (-26V) is to insert a Schottky diode between pin 1 (GND) and ground, as shown in the typical application circuit (Figure 8.). The consequences of the voltage drop across this diode are as follows: ● If the input is pulled to power GND, a negative voltage of -VF is seen by the device. (VIL, VIH thresholds and VSTAT are increased by VF with respect to power GND). ● The undervoltage shutdown level is increased by VF. If there is no need for the control unit to handle external analog signals referred to the power GND, the best approach is to connect the reference potential of the control unit to node [1] (see Figure 9.), which becomes the common signal GND for the whole control board. In this way no shift of VIH, VIL and VSTAT takes place and no negative voltage appears on the INPUT pin; this solution allows the use of a standard diode, with a breakdown voltage able to handle any ISO normalized negative pulses that occours in the automotive environment. 12/16 VND05BSP Package and packing information 4 Package and packing information 4.1 ECOPACK® packages In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. ECOPACK® packages are lead-free. The category of Second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. 4.2 PowerSO-10 mechanical data Figure 10. PowerSO-10 package dimensions B 0.10 A B 10 H E E E2 1 S EATING P LANE e B DETAIL "A" A C 0.25 h E4 D = D1 = = = S EATING PLANE A F A1 A1 L DETAIL "A" α 13/16 Package and packing information Table 9. VND05BSP PowerSO-10 mechanical data mm Dim. Min. Max. A 3.35 3.65 A(1) 3.4 3.6 A1 0 0.10 B 0.40 0.60 B(1) 0.37 0.53 C 0.35 0.55 C(1) 0.23 0.32 D 9.40 9.60 D1 7.40 7.60 E 9.30 9.50 E2 7.20 7.60 E2(1) 7.30 7.50 E4 5.90 6.10 E4(1) 5.90 6.30 e 1.27 F 1.25 1.35 F(1) 1.20 1.40 H 13.80 14.40 H(1) 13.85 14.35 h 0.50 L 1.20 1.80 L(1) 0.80 1.10 α 0° 8° α(1) 2° 8° 1. Muar only POA P013P. 14/16 Typ. VND05BSP 5 Revision history Revision history Table 10. Document revision history Date Revision Changes Apr-2001 1 Initial release. 03-May-2006 2 Added contents, list of tables and figures. Added Table 10.: Document revision history. 24-Nov-2008 3 Document reformatted and restructured. Added Table 1.: Device summary. Added ECOPACK® packages information. 15/16 VND05BSP Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. 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