STMICROELECTRONICS VND05BSP_05

VND05BSP
Iso high side smart power solid state relay
Features
Type
VDSS
RDS(on)
IOUT
VCC
VND05BSP
40 V
0.2 Ω
1.6A
26 V
10
1
■
Output current (continuous): 9A @ Tc=85°C
■
5V logic level compatible input
■
Thermal shutdown
■
Under voltage shutdown
■
Open drain diagnostic output
■
Inductive load fast demagnetization
■
Very low standby power dissipation
PowerSO-10
Description
The VND05BSP is a monolithic device made
using STMicroelectronics VIPower Technology,
intended for driving resistive or inductive loads
with one side grounded.
This device has two channels, and a common
diagnostic. Built-in thermal shutdown protects the
chip from over temperature and short circuit.
The status output provides an indication of open
load in on state, open load in off state,
overtemperature conditions and stuck-on to VCC.
Table 1.
Device summary
Order codes
Package
VND05BSP
November 2008
Tube
Tape & reel
VND05BSP
VND05BSP13TR
Rev 3
1/16
www.st.com
16
Contents
VND05BSP
Contents
1
Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2
Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3
4
5
2/16
2.1
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.1
Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.2
Protecting the device against reverse battery . . . . . . . . . . . . . . . . . . . . . 12
Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.1
ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
4.2
PowerSO-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
VND05BSP
List of tables
List of tables
Table 1.
Table 2.
Table 3.
Table 4.
Table 5.
Table 6.
Table 7.
Table 8.
Table 9.
Table 10.
Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Switching (VCC=13V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Logic inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Protections and diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
PowerSO-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3/16
List of figures
VND05BSP
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
4/16
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
IL(off) circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
tpol/tpovl waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Switching time waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Typical application circuit with a schottky diode for reverse supply protection . . . . . . . . . . 11
Typical application circuit with separate signal ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
PowerSO-10 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
VND05BSP
1
Block diagram and pin description
Block diagram and pin description
Figure 1.
Block diagram
Figure 2.
Configuration diagram (top view)
5/16
Electrical specifications
2
Electrical specifications
Figure 3.
2.1
VND05BSP
Current and voltage conventions
Absolute maximum ratings
Stressing the device above the rating listed in the “Absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to Absolute maximum rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics sure
program and other relevant quality document.
Table 2.
Symbol
Parameter
Value
Unit
V(BR)DSS
Drain-Source breakdown voltage
40
V
IOUT
Output current (cont.) at Tc=85°C
9
A
RMS output current at Tc=85°C and f> 1Hz
9
A
IR
Reverse output current at Tc=85°C
-9
A
IIN
Input current
±10
mA
-4
V
±10
mA
2000
V
IOUT (RMS)
-VCC
Reverse supply voltage
ISTAT
Status current
VESD
Electrostatic discharge (1.5 kΩ, 100 pF)
Ptot
Power dissipation at Tc = 25 °C
59
W
Tj
Junction operating temperature
-40 to 150
°C
Storage temperature
-55 to 150
°C
Tstg
6/16
Absolute maximum ratings
VND05BSP
2.2
Electrical specifications
Thermal data
Table 3.
2.3
Thermal data
Symbol
Parameter
Max. value
Unit
Rthj-case
Thermal resistance junction-case
2.1
°C/W
Rthj-amb
Thermal resistance junction-ambient
50
°C/W
Electrical characteristics
Values specified in this section are for 8<VCC<16V; -40°C<Tj<125°C, unless otherwise
stated.
Table 4.
Symbol
Power
Parameter
Test conditions
Min.
Typ.
Max.
Unit
6
13
26
V
VCC
Supply voltage
In(1)
Nominal current
TC=85°C VDS(on)<0.5
VCC=13V
1.6
2.6
A
Ron
On state resistance
IOUT =In; VCC=13V
Tj = 25°C
0.13
0.2
Ω
Supply current
Off state Tj = 25 °C
VCC=13V
100
µA
2.3
V
20
KΩ
IS
VDS(MAX) Maximum voltage drop
Output to GND internal
impedance
Ri
IOUT =7.5 A; Tj = 85°C
VCC=13V
Tj = 25 °C
35
1.44
5
10
1. In= Nominal current according to ISO definition for high side automotive switch(Tc = 85 oC for battery voltage of 13V which
produces a voltage drop of 0.5 V).
Table 5.
Switching (VCC=13V)
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
td(on)
Turn-on delay time of
output current
ROUT = 5.4 Ω
(see
5
25
200
µs
Rise time of output
current
ROUT = 5.4 Ω
10
50
180
µs
Turn-off delay time of
output current
ROUT = 5.4 Ω
10
75
250
µs
Fall time of output
current
ROUT = 5.4 Ω
10
35
180
µs
dVOUT/dt(on) Turn-on current slope
ROUT = 5.4 Ω
0.003
0.1
A/µs
A/µs
dVOUT/dt(off) Turn-off current slope
ROUT = 5.4 Ω
0.005
0.1
A/µs
A/µs
tr
td(off)
tf
7/16
Electrical specifications
Table 6.
VND05BSP
Logic inputs
Symbol
Parameter
Test conditions
Min.
VIL
Input low level voltage
VIH(1)
Input high level voltage
3.5
VI(hyst.)
Input hysteresis voltage
0.2
IIN
Max. Unit
1.5
Input current
VIN = 5 V; Tj= 25°C
5
IIN = 10 mA
IIN = -10 mA
Input clamp voltage
VICL
Typ.
V
V
0.9
1.5
V
30
100
µA
6
-0.7
7
V
V
1. The VIH is internally clamped at 6V about. It is possible to connect this pin to an higher voltage via an external resistor
calculated to not exceed 10 mA at the input pin.
Table 7.
Protections and diagnostics
Symbol
Parameter
VSTAT
Status voltage output low
VUSD
Under voltage shutdown
VSCL
Status clamp voltage
TTSD
Thermal shutdown
temperature
TTSD(hyst)
Thermal shutdown
hysteresis
TR
Reset temperature
ISTAT = 10 mA
ISTAT = -10 mA
Open voltage level
IOL
Open load current
level
On-state
Status delay
(2)
Status delay
1. IOL(off) = (VCC -VOL)/ROL
2. ISO definition.
Typ.
Max.
Unit
0.4
V
3.5
4.5
6
V
5
6
-0.7
7
V
V
140
160
180
°C
50
°C
125
VOL
tpovl(2)
Min.
ISTAT = 1.6 mA
Off-state(1)
tpol
8/16
Test conditions
2.5
5
°C
4
5
V
180
mA
VND05BSP
Electrical specifications
Figure 4.
IL(off) circuit
Figure 5.
tpol/tpovl waveforms
Figure 6.
Switching time waveforms
9/16
Electrical specifications
Table 8.
VND05BSP
Truth table
Conditions
Input 1
Input 2
Output 1
Output 2
Diagnostic
Normal operation
L
H
L
H
L
H
L
H
H
H
Undervoltage
X
X
L
L
H
Channel 1
H
X
L
X
L
Channel 2
X
H
X
L
L
Channel 1
H
L
X
L
H
L
X
L
L
L
Channel 2
X
L
H
L
X
L
H
L
L
L
Channel 1
H
L
X
L
H
H
X
L
L
L
Channel 2
X
L
H
L
X
L
H
H
L
L
Thermal shutdown
Openload
Output shorted to VCC
Figure 7.
10/16
Waveforms
VND05BSP
3
Application information
Application information
Figure 8.
Typical application circuit with a schottky diode for reverse supply protection
Figure 9.
Typical application circuit with separate signal ground
11/16
Application information
3.1
VND05BSP
Functional description
The device has a diagnostic output which indicates open load in on-state, open load in offstate, over temperature conditions and stuck-on to VCC.
From the falling edge of the input signal, the status output, initially low to signal a fault
condition (overtemperature or open load on-state), will go back to a high state with a
different delay in case of overtemperature (tpovl) and in case of open open load (tpol)
respectively.
This feature allows to discriminate the nature of the detected fault. To protect the device
against short circuit and over current condition, the thermal protection turns the integrated
Power MOSFET off at a minimum junction temperature of 140°C. When this temperature
returns to 125°C the switch is automatically turned on again. In short circuit the protection
reacts with virtually no delay, the sensor being located inside the Power MOSFET area. An
internal function of the devices ensures the fast demagnetization of inductive loads with a
typical voltage (Vdemag) of -18V. This function allows to greatly reduces the power dissipation
according to the formula:
Pdem = 0.5 • Lload •(Ι load)2 • [(VCC+Vdemag)/Vdemag] • f
where f = switching frequency and Vdemag = demagnetization voltage.
The maximum inductance which causes the chip temperature to reach the shut-down
temperature in a specified thermal environment is a function of the load current for a fixed
VCC, Vdemag and f according to the above formula. In this device if the GND pin is
disconnected, with VCC not exceeding 16V, it will switch off.
3.2
Protecting the device against reverse battery
The simplest way to protect the device against a continuous reverse battery voltage (-26V)
is to insert a Schottky diode between pin 1 (GND) and ground, as shown in the typical
application circuit (Figure 8.).
The consequences of the voltage drop across this diode are as follows:
●
If the input is pulled to power GND, a negative voltage of -VF is seen by the device. (VIL,
VIH thresholds and VSTAT are increased by VF with respect to power GND).
●
The undervoltage shutdown level is increased by VF.
If there is no need for the control unit to handle external analog signals referred to the power
GND, the best approach is to connect the reference potential of the control unit to node [1]
(see Figure 9.), which becomes the common signal GND for the whole control board. In this
way no shift of VIH, VIL and VSTAT takes place and no negative voltage appears on the INPUT
pin; this solution allows the use of a standard diode, with a breakdown voltage able to
handle any ISO normalized negative pulses that occours in the automotive environment.
12/16
VND05BSP
Package and packing information
4
Package and packing information
4.1
ECOPACK® packages
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. ECOPACK® packages are lead-free. The category of Second Level Interconnect
is marked on the package and on the inner box label, in compliance with JEDEC Standard
JESD97. The maximum ratings related to soldering conditions are also marked on the inner
box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com.
4.2
PowerSO-10 mechanical data
Figure 10. PowerSO-10 package dimensions
B
0.10 A B
10
H
E
E
E2
1
S EATING
P LANE
e
B
DETAIL "A"
A
C
0.25
h
E4
D
= D1 =
=
=
S EATING
PLANE
A
F
A1
A1
L
DETAIL "A"
α
13/16
Package and packing information
Table 9.
VND05BSP
PowerSO-10 mechanical data
mm
Dim.
Min.
Max.
A
3.35
3.65
A(1)
3.4
3.6
A1
0
0.10
B
0.40
0.60
B(1)
0.37
0.53
C
0.35
0.55
C(1)
0.23
0.32
D
9.40
9.60
D1
7.40
7.60
E
9.30
9.50
E2
7.20
7.60
E2(1)
7.30
7.50
E4
5.90
6.10
E4(1)
5.90
6.30
e
1.27
F
1.25
1.35
F(1)
1.20
1.40
H
13.80
14.40
H(1)
13.85
14.35
h
0.50
L
1.20
1.80
L(1)
0.80
1.10
α
0°
8°
α(1)
2°
8°
1. Muar only POA P013P.
14/16
Typ.
VND05BSP
5
Revision history
Revision history
Table 10.
Document revision history
Date
Revision
Changes
Apr-2001
1
Initial release.
03-May-2006
2
Added contents, list of tables and figures.
Added Table 10.: Document revision history.
24-Nov-2008
3
Document reformatted and restructured.
Added Table 1.: Device summary.
Added ECOPACK® packages information.
15/16
VND05BSP
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