VNI4140K-32
Quad high side smart power solid state relay
Datasheet −production data
Features
Type
Vdemag(1)
RDSon(1)
Iout(1)
VCC
VNI4140K-32
VCC-41 V
0.08 Ω
1A
41 V
1. Per channel
Description
■
Output current: 1 A per channel
■
Shorted load protections
■
Junction overtemperature protection
■
Case overtemperature protection for thermal
independence of the channels
■
Thermal case shutdown restart not
simultaneous for the various channels
■
Protection against loss of ground
■
Current limitation
■
Undervoltage shutdown
■
Open drain diagnostic outputs
■
3.3 V CMOS/TTL compatible inputs
■
Fast demagnetization of inductive loads
■
Conforms to IEC 61131-2
■
ESD according to IEC 61000-4-2 up to +/25 KV
Figure 1.
PowerSSO-24
The VNI4140K-32 is a monolithic device made
using STMicroelectronics VIPower technology,
intended for driving four independent resistive,
capacitive or inductive loads with one side
connected to ground. Active current limitation
avoids the system power supply dropping in the
case of shorted load. Built-in thermal shutdown
protects the chip from overtemperature and shortcircuit. In overload condition, the channel turns
OFF and back ON automatically so as to maintain
junction temperature between TTSD and TR. If this
condition causes case temperature to reach
TCSD, the overloaded channel is turned OFF and
restarts only when case temperature has
decreased down to TCR. In the case of more than
one channel in overload, re-start of the
overloaded channels is not simultaneous, in order
to avoid high peak current from the supply. Nonoverloaded channels continue to operate
normally. The open drain diagnostic outputs
indicate overtemperature conditions.
Block diagram
March 2012
This is information on a product in full production.
Doc ID022576 Rev 3
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www.st.com
26
Contents
VNI4140K-32
Contents
1
Pin connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1
Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3
Recommended . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5
Truth table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
6
Thermal management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
7
Switching waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
8
Pin functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
9
Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
9.1
VNI4140K-32 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
10
Reverse polarity protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
11
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
12
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
13
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
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VNI4140K-32
1
Pin connection
Pin connection
Figure 2.
Pin connection (top view)
OUT1
OUT1
OUT1
OUT2
OUT2
OUT2
OUT3
OUT3
OUT3
OUT4
OUT4
OUT4
VCC
IN1
STAT1
IN2
STAT2
GND
STAT3
IN3
STAT4
IN4
NC
NC
Table 1.
Pin description
Pin
Name
Description
Tab
TAB
Exposed tab internally connected to Vcc
1
Vcc
Supply voltage
2
IN1
Channel 1 input 3.3 V CMOS/TTL compatible
3
STAT1
Channel 1 status in open drain configuration
4
IN2
Channel 2 input 3.3 V CMOS/TTL compatible
5
STA2
Channel 2 status in open drain configuration
6
GND
Device ground connection
7
STAT3
Channel 3 status in open drain configuration
8
IN3
Channel 3 input 3.3 V CMOS/TTL compatible
9
STAT4
Channel 4 status in open drain configuration
10
IN4
Channel 4 input 3.3 V CMOS/TTL compatible
11
NC
12
NC
13
OUT4
Channel 4 power stage output, internally protected
14
OUT4
Channel 4 power stage output, internally protected
15
OUT4
Channel 4 power stage output, internally protected
16
OUT3
Channel 3 power stage output, internally protected
17
OUT3
Channel 3 power stage output, internally protected
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Pin connection
Table 1.
4/26
VNI4140K-32
Pin description (continued)
Pin
Name
Description
18
OUT3
Channel 3 power stage output, internally protected
19
OUT2
Channel 2 power stage output, internally protected
20
OUT2
Channel 2 power stage output, internally protected
21
OUT2
Channel 2 power stage output, internally protected
22
OUT1
Channel 1 power stage output, internally protected
23
OUT1
Channel 1 power stage output, internally protected
24
OUT1
Channel 1 power stage output, internally protected
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VNI4140K-32
2
Maximum ratings
Maximum ratings
Table 2.
Absolute maximum rating
Symbol
Value
Unit
41
V
VCC
Power supply voltage
-VCC
Reverse supply voltage
-0.3
V
IGND
DC ground reverse current
-250
mA
IOUT
Output current (continuos)
Internally limited
A
-5
A
IR
Reverse output current (per channel)
IIN
Input current (per channel)
± 10
mA
VIN
Input voltage
+VCC
V
VSTAT
Status pin voltage
+VCC
V
ISTAT
Status pin current
± 10
mA
VESD
Electrostatic discharge (R = 1.5 kΩ; C = 100 pF)
2000
V
EAS
Single pulse avalanche energy per channel not
simultaneous
300
mJ
PTOT
Power dissipation at Tc = 25 °C
Internally limited
W
TJ
Junction operating temperature
Internally limited
°C
-55 to 150
°C
Value
Unit
TSTG
2.1
Parameter
Storage temperature
Thermal data
Table 3.
Thermal data
Symbol
Parameter
Rth(JC)
Thermal resistance junction-case (1)
Max.
2
°C/W
Rth(JA)
Thermal resistance junction-ambient
Max.
see Figure 11
°C/W
Value
Unit
10
kHz
1. Per channel.
3
Recommended
Table 4.
Symbol
fVin MAX
Input switching limits
Parameter
Maximum input switching frequency
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Electrical characteristics
4
VNI4140K-32
Electrical characteristics
10.5 V < VCC < 36 V; -40 °C < TJ < 125 °C; unless otherwise specified.
Table 5.
Symbol
Vcc
RDS(ON)
Power section
Parameter
Test condition
Supply voltage
IOUT = 0.7 A at TJ = 25 °C
IOUT = 0.7 A
ON state resistance
Is = 20 mA
Supply current
All channels in OFF state,
ON state with VIN = 5 V
VOUT(OFF)
OFF state output
voltage
VIN = 0 V and IOUT = 0 A
IOUT(OFF)
OFF state output
current
VIN = VOUT = 0 V
Output current in
ground disconnection
Vcc= VIN = GND = 24 V;
TJ = 125 °C
Charge pump
frequency
Channel in ON state (1)
ILGND
FCP
Typ.
10.5
Vclamp
IS
Min.
41
45
250
2.4
0
Max.
Unit
36
V
0.080
0.140
Ω
Ω
52
V
4
µA
mA
1
V
5
µA
500
µA
1450
kHz
1. To cover EN55022 class A and class B normative.
VCC = 24 V; -25 °C < TJ < 125 °C, RL = 48 Ω, input rise time < 0.1 µs)
Table 6.
Symbol
Switching
Parameter
Test condition
Typ.
Max.
Unit
Turn ON delay
6
µS
tr
Rise time
5
µS
td(OFF)
Turn OFF
12
µS
tf
Fall time
5
µS
4
V/µS
4
V/µS
td(ON)
dV/dt(ON) Turn ON voltage slope
dV/dt(off)
6/26
Min.
Turn OFF voltage
slope
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VNI4140K-32
Figure 3.
Electrical characteristics
Switching parameter conventions
6OUT
D6D4
n
TRISE
TFALL
D6/&&
D6/.
TR
6IN
T
TF
TD/.
TD/&&
T
6OUT
TD/.
TD/&&
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T
7/26
Electrical characteristics
Table 7.
Logical input
Symbol
Parameter
VIL
Input low level voltage
VIH
Input high level voltage
VI(HYST)
IIN
Table 8.
Symbol
Test conditions
Min.
Input hysteresis
voltage
Input current
Max.
Unit
0.8
V
V
0.15
V
VIN = 15 V
10
VIN = 36 V
210
µΑ
Protection and diagnostic
Parameter
Test conditions
Min.
Status voltage
output low
VUSD
Undervoltage
protection
7
VUSDHYS
Undervoltage
hysteresis
0.4
Typ.
ISTAT = 1.6 mA
DC short-circuit
current
VCC = 24 V; RLOAD < 10 mΩ
IPEAK
Maximum DC output
current
Dynamic load
ILSTAT
Status leakage current VCC = VSTAT = 36 V
TTSD
Junction shutdown
temperature
150
Junction reset
temperature
135
TR
Typ.
2.20
vSTAT
ILIM
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VNI4140K-32
Max.
Unit
0.6
V
10.5
V
0.5
1.01
V
2.6
1.6
A
30
µΑ
170
190
Junction thermal
hysteresis
7
15
TCSD
Case shutdown
temperature
125
130
TCR
Case reset
temperature
TCHYST
Case thermal
hysteresis
Vdemag
Output voltage at
turn-OFF
°C
135
110
Doc ID022576 Rev 3
°C
°C
THIST
IOUT = 0.5 A; LLOAD >= 1 mH
A
°C
°C
7
15
VCC41
VCC45
°C
VCC52
V
VNI4140K-32
Figure 4.
Electrical characteristics
Current and voltage conventions
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Truth table
5
VNI4140K-32
Truth table
Table 9.
10/26
Truth table
Conditions
INPUTn
OUTPUTn
STATUSn
Normal operation
L
H
L
H
H
H
Overtemperature
L
H
L
L
H
L
Undervoltage
L
H
L
L
X
X
Shorted load
(Current limitation before thermal shutdown)
L
H
L
X
H
H
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VNI4140K-32
6
Thermal management
Thermal management
The power dissipation in the IC is the main factor that sets the safe operating condition of
the device in the application. Therefore, it must be very carefully considered. Furthermore,
the available space on the PCB should be chosen considering the power dissipation.
Heatsinking can be achieved using copper on the PCB with proper area and thickness. Two
different protections have been implemented to guarantee safety of the device if it overheats
due to an overloaded condition or high environment temperature. The following flowchart
explains in detail this protection functionality.
Figure 5.
Thermal behavior
Vin(i) = H
OUT(i) On
STAT(i) Off (H)
1)
NO
YES
Tj(i) > Ttsd
OUT(i) Off
STAT(i) On (L)
YES
4)
YES
NO
Tc > Tcsd
NO
Tc > Tcr
2)
NO
YES
Tj(i) > Tjr
3)
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Switching waveforms
7
Switching waveforms
Figure 6.
12/26
VNI4140K-32
Switching waveforms
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VNI4140K-32
8
Pin functions
Pin functions
Figure 7.
Input circuit
Figure 8.
Status circuit
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Pin functions
VNI4140K-32
Figure 9.
Charge pump switching frequency (typical) vs. temperature
Freq_CP
2000
CP_frequency (KHz)
1800
1600
Freq_CP
1400
1200
1000
800
-50
0
50
100
temperature("C)
14/26
Doc ID022576 Rev 3
150
200
VNI4140K-32
Package and PCB thermal data
9
Package and PCB thermal data
9.1
VNI4140K-32 thermal data
Figure 10. VNI4140K-32 PCB
Note:
Layout condition of Rth and Zth measurements (PCB: Double layer, Thermal Vias,
FR4 area = 77 mm x 86 mm, PCB thickness=1.6 mm, Cu thickness = 70 mm (front and back
side), Copper areas: from minimum pad layout to 8 cm2).
Figure 11. RthJA vs. PCB copper area in open box free air condition (one channel ON)
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Package and PCB thermal data
VNI4140K-32
Figure 12. VNI4140K-32 thermal impedance junction ambient single pulse
(one channel ON)
16/26
Doc ID022576 Rev 3
VNI4140K-32
10
Reverse polarity protection
Reverse polarity protection
This schematic can be used with any type of load.
The following is an indication on how to dimension the RGND resistor.
RGND = (-VCC) / (-IGND)
where -IGND is the DC reverse ground pin current and can be found in the absolute
maximum rating section of the device datasheet.
Power dissipation in RGND (when VCC < 0: during reverse polarity situations) is:
PD = (-VCC)2/RGND
Note:
In normal conditions (no reverse polarity) due to the diode there is a voltage drop between
GND of the device and GND of the system.
Figure 13. Reverse polarity protection
+ Vcc
Inputi
Outputi
Statusi
GND
Load
RGND
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Diode
17/26
Package mechanical data
11
VNI4140K-32
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at:www.st.com.
ECOPACK® is an ST trademark.
18/26
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VNI4140K-32
Package mechanical data
Table 10.
PowerSSO-24 mechanical data
mm
Symbol
Min.
Typ.
Max.
A
2.15
2.47
A2
2.15
2.40
a1
0
0.075
b
0.33
0.51
c
0.23
0.32
D
10.10
10.50
E
7.4
7.6
e
0.8
e3
8.8
G
0.1
G1
0.06
H
10.1
h
L
10.5
0.4
0.55
N
0.85
10deg
X
4.1
4.7
Y
6.5
7.1
Figure 14. PowerSSO-24 package dimensions
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Package mechanical data
VNI4140K-32
Figure 15. PowerSSO-24 tube shipment (no suffix)
Table 11.
Note:
20/26
PowerSSO-24 tube shipment
Base Q.ty
49
Bulk Q.ty
1225
Tube length (± 0.5)
532
A
3.5
B
13.8
C (± 0.1)
0.6
All dimensions are in mm.
Doc ID022576 Rev 3
VNI4140K-32
Package mechanical data
Figure 16. PowerSSO-24 reel shipment (suffix “TR”)
Table 12.
PowerSSO-24 reel dimensions
Base Q.ty
1000
Bulk Q.ty
1000
A (max.)
330
B (min.)
1.5
C (± 0.2)
13
F
20.2
G (2 ± 0)
24.4
N (min.)
100
T (max.)
30.4
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Package mechanical data
VNI4140K-32
Figure 17. PowerSSO-24 tape dimensions
Table 13.
Note:
22/26
PowerSSO-24 tape dimensions
Tape width
W
24
Tape Hole Spacing
P0 (± 0.1)
4
Component Spacing
P
12
Hole Diameter
D (± 0.05)
1.55
Hole Diameter
D1 (min)
1.5
Hole Position
F (± 0.1)
11.5
Compartment Depth
K (max)
2.85
Hole Spacing
P1 (± 0.1)
2
According to the electronic industries association (EIA) standard 481 rev. A, Feb 1986.
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VNI4140K-32
Package mechanical data
Figure 18. VNI4140K-32 suggested footprint
2
n Note:
3OLDER-ASK/PENING
STMicroelectronics is not responsible for any PCB related issues. The footprint shown in the
above figure is a suggestion which might not be in line to the customer PCB supplier design
rules.
All dimensions are in mm.
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Ordering information
12
Ordering information
Table 14.
24/26
VNI4140K-32
Ordering information
Order codes
Package
Packaging
VNI4140K-32
PowerSSO-24
Tube
VNI4140KTR-32
PowerSSO-24
Tape and reel
Doc ID022576 Rev 3
VNI4140K-32
13
Revision history
Revision history
Table 15.
Document revision history
Date
Revision
Changes
12-Dec-2011
1
Initial release.
06-Feb-2012
2
Updated Ilim minimum value in Table 8: Protection and
diagnostic.
Inserted new feature: ESD according to IEC 61000-4-2 up
to +/-25 KV, in cover page.
07-Mar-2012
3
Suggested footprint inserted.
In Table 5. parameter ILGND has been added.
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VNI4140K-32
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