TI SN74LV245APWRG4

SN54LV245A, SN74LV245A
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCLS382N − SEPTEMBER 1997 − REVISED APRIL 2005
D 2-V to 5.5-V VCC Operation
D Max tpd of 6.5 ns at 5 V
D Typical VOLP (Output Ground Bounce)
SN54LV245A . . . J OR W PACKAGE
SN74LV245A . . . DB, DGV, DW, NS,
OR PW PACKAGE
(TOP VIEW)
19
3
18
4
17
5
VCC
OE
B1
B2
B3
B4
B5
B6
B7
B8
16
6
15
7
14
8
13
9
12
10
11
A1
A2
A3
A4
A5
A6
A7
A8
20
A2
A1
DIR
VCC
OE
1
2
19 OE
3
18 B1
4
17 B2
5
16 B3
15 B4
6
SN54LV245A . . . FK PACKAGE
(TOP VIEW)
A3
A4
A5
A6
A7
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
14 B5
13 B6
7
8
12 B7
9
10
11
B1
B2
B3
B4
B5
A8
GND
B8
B7
B6
20
2
VCC
1
Operation
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
SN74LV245A . . . RGY PACKAGE
(TOP VIEW)
B8
DIR
A1
A2
A3
A4
A5
A6
A7
A8
GND
D
DIR
D
D
<0.8 V at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot)
>2.3 V at VCC = 3.3 V, TA = 25°C
Support Mixed-Mode Voltage Operation on
All Ports
GND
D
D Ioff Supports Partial-Power-Down Mode
description/ordering information
These octal bus transceivers are designed for 2-V to 5.5-V VCC operation.
ORDERING INFORMATION
QFN − RGY
SN74LV245ARGYR
Tube of 25
SN74LV245ADW
Reel of 2000
SN74LV245ADWR
SOP − NS
Reel of 2000
SN74LV245ANSR
74LV245A
SSOP − DB
Reel of 2000
SN74LV245ADBR
LV245A
Tube of 70
SN74LV245APW
Reel of 2000
SN74LV245APWR
Reel of 250
SN74LV245APWT
TVSOP − DGV
Reel of 2000
SN74LV245ADGVR
LV245A
VFBGA − GQN
Reel of 1000
SN74LV245AGQNR
LV245A
CDIP − J
Tube of 20
SNJ54LV245AJ
SNJ54LV245AJ
CFP − W
Tube of 85
SNJ54LV245AW
SNJ54LV245AW
LCCC − FK
Tube of 55
SNJ54LV245AFK
SNJ54LV245AFK
−40°C
40°C to 85°C
TSSOP − PW
†
TOP-SIDE
MARKING
Reel of 1000
SOIC − DW
−55°C to 125°C
ORDERABLE
PART NUMBER
PACKAGE†
TA
LV245A
LV245A
LV245A
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright © 2005, Texas Instruments Incorporated
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SN54LV245A, SN74LV245A
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCLS382N − SEPTEMBER 1997 − REVISED APRIL 2005
description/ordering information (continued)
The ’LV245A devices are designed for asynchronous communication between data buses. The device
transmits data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the
direction-control (DIR) input. The output-enable (OE) input can be used to disable the device so the buses are
effectively isolated.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the
outputs, preventing damaging current backflow through the devices when they are powered down.
GQN PACKAGE
(TOP VIEW)
1
2
3
terminal assignments
4
1
2
3
4
A
A
A1
DIR
VCC
OE
B
B
A3
B2
A2
B1
C
C
A5
A4
B4
B3
D
D
A7
B6
A6
B5
E
E
GND
A8
B8
B7
FUNCTION TABLE
INPUTS
OE
DIR
OPERATION
L
L
B data to A bus
L
H
A data to B bus
H
X
Isolation
logic diagram (positive logic)
DIR
1
19
A1
2
18
To Seven Other Channels
Pin numbers shown are for the DB, DGV, DW, FK, J, NS, PW, RGY, and W packages.
2
OE
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
B1
SN54LV245A, SN74LV245A
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCLS382N − SEPTEMBER 1997 − REVISED APRIL 2005
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI: Except I/O ports (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
I/O ports (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high-impedance or
power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Output voltage range applied in the high or low state, VO (see Notes 1 and 2) . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±35 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±70 mA
Package thermal impedance, θJA (see Note 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
(see Note 3): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92°C/W
(see Note 3): DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
(see Note 3): GQN package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78°C/W
(see Note 3): NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60°C/W
(see Note 3): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83°C/W
(see Note 4): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
2. This value is limited to 5.5 V maximum.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
4. The package thermal impedance is calculated in accordance with JESD 51-5.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SN54LV245A, SN74LV245A
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCLS382N − SEPTEMBER 1997 − REVISED APRIL 2005
recommended operating conditions (see Note 5)
SN54LV245A
VCC
Supply voltage
VCC = 2 V
VIH
High level input voltage
High-level
MIN
MAX
2
5.5
1.5
Low level input voltage
Low-level
VI
Input voltage
VO
Output voltage
VCC × 0.7
VCC × 0.7
VCC = 4.5 V to 5.5 V
VCC × 0.7
VCC × 0.7
Δt/Δv
Input transition rise or fall rate
0.5
TA
0.5
VCC × 0.3
VCC × 0.3
VCC = 3 V to 3.6 V
VCC × 0.3
VCC × 0.3
VCC × 0.3
5.5
0
5.5
High or low state
0
VCC
0
VCC
3-state
0
5.5
0
5.5
−50
−50
VCC = 2.3 V to 2.7 V
−2
−2
VCC = 3 V to 3.6 V
−8
−8
−16
−16
50
50
VCC = 2.3 V to 2.7 V
2
2
VCC = 3 V to 3.6 V
8
8
VCC = 4.5 V to 5.5 V
16
16
VCC = 2.3 V to 2.7 V
200
200
VCC = 3 V to 3.6 V
100
100
20
20
Operating free-air temperature
−55
125
V
VCC × 0.3
0
VCC = 4.5 V to 5.5 V
V
V
VCC = 2.3 V to 2.7 V
VCC = 2 V
Low level output current
Low-level
5.5
VCC × 0.7
VCC = 4.5 V to 5.5 V
IOL
2
UNIT
1.5
VCC × 0.7
VCC = 2 V
High level output current
High-level
MAX
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
IOH
MIN
VCC = 2.3 V to 2.7 V
VCC = 2 V
VIL
SN74LV245A
−40
85
V
V
μA
mA
μA
mA
ns/V
°C
NOTE 5: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SN54LV245A, SN74LV245A
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCLS382N − SEPTEMBER 1997 − REVISED APRIL 2005
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
SN54LV245A
PARAMETER
TEST CONDITIONS
VOH
MIN
SN74LV245A
TYP
MAX
MIN
IOH = −50 μA
2 V to 5.5 V
IOH = −2 mA
2.3 V
2
2
IOH = −8 mA
3V
2.48
2.48
4.5 V
3.8
IOH = −16 mA
VOL
VCC
VCC−0.1
TYP
MAX
VCC−0.1
V
3.8
IOL = 50 μA
2 V to 5.5 V
0.1
0.1
IOL = 2 mA
2.3 V
0.4
0.4
IOL = 8 mA
3V
0.44
0.44
4.5 V
0.55
0.55
IOL = 16 mA
UNIT
V
II
Control inputs
VI = 5.5 V or GND
0 to 5.5 V
±1
±1
μA
IOZ
A or B port
VO = VCC or GND
5.5 V
±5
±5
μA
5.5 V
20
20
μA
5
μA
ICC
VI = VCC or GND,
Ioff
VI or VO = 0 to 5.5 V
Ci
Control inputs
VI = VCC or GND
Cio
A or B port
VO = VCC or GND
IO = 0
0
5
3.3 V
3
3
5V
3
3
3.3 V
5.5
5.5
5V
5.5
5.5
switching characteristics over recommended operating
VCC = 2.5 V ± 0.2 V (unless otherwise noted) (see Figure 1)
FROM
(INPUT)
TO
(OUTPUT)
tpd
A or B
B or A
ten
OE
A or B
tdis
OE
tpd
A or B
ten
OE
A or B
tdis
OE
A or B
PARAMETER
LOAD
CAPACITANCE
free-air
TA = 25°C
MIN
TYP
pF
pF
temperature
SN54LV245A
range,
SN74LV245A
MAX
MIN
MAX
MIN
MAX
8.3*
13*
1*
15*
1
15
11.8*
19.9*
1*
22*
1
22
A or B
11.8*
18.1*
1*
20*
1
20
B or A
11.2
15.9
1
18
1
18
14.1
22.7
1
26
1
26
17.6
23.1
1
25
1
25
CL = 15 pF
CL = 50 pF
tsk(o)
2
UNIT
ns
ns
2
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
switching characteristics over recommended operating
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
FROM
(INPUT)
TO
(OUTPUT)
tpd
A or B
B or A
ten
OE
A or B
tdis
OE
A or B
tpd
A or B
B or A
ten
OE
A or B
tdis
OE
PARAMETER
A or B
LOAD
CAPACITANCE
free-air
TA = 25°C
MIN
CL = 15 pF
CL = 50 pF
temperature
SN54LV245A
SN74LV245A
TYP
MAX
MIN
MAX
MIN
MAX
5.9*
8.4*
1*
10*
1
10
8.2*
13.2*
1*
15.5*
1
15.5
9.6*
16.5*
1*
19.5*
1
19.5
7.9
11.9
1
13.5
1
13.5
9.9
16.7
1
19
1
19
13.9
19.8
1
22
1
22
tsk(o)
1.5
range,
UNIT
ns
ns
1.5
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
SN54LV245A, SN74LV245A
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCLS382N − SEPTEMBER 1997 − REVISED APRIL 2005
switching characteristics over recommended operating
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
FROM
(INPUT)
TO
(OUTPUT)
tpd
A or B
B or A
ten
OE
A or B
tdis
OE
tpd
A or B
ten
OE
A or B
tdis
OE
A or B
PARAMETER
LOAD
CAPACITANCE
free-air
TA = 25°C
MIN
SN54LV245A
TYP
MAX
MIN
4.3*
5.5*
5.7*
8.5*
A or B
7.8*
B or A
5.6
CL = 15 pF
CL = 50 pF
temperature
range,
SN74LV245A
MAX
MIN
MAX
1*
6.5*
1
6.5
1*
10.6*
1
10
12.8*
1*
14.7*
1
14.2
7.5
1
8.5
1
8.5
7
10.6
1
12
1
12
10.9
14.7
1
16
1
16
tsk(o)
1
UNIT
ns
ns
1
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
noise characteristics, VCC = 3.3 V, CL = 50 pF, TA = 25°C (see Note 6)
SN74LV245A
PARAMETER
MIN
TYP
MAX
UNIT
VOL(P)
Quiet output, maximum dynamic VOL
0.5
0.8
V
VOL(V)
Quiet output, minimum dynamic VOL
−0.4
−0.8
V
VOH(V)
Quiet output, minimum dynamic VOH
2.9
VIH(D)
High-level dynamic input voltage
VIL(D)
Low-level dynamic input voltage
V
2.31
V
0.99
V
UNIT
NOTE 6: Characteristics are for surface-mount packages only.
operating characteristics, TA = 25°C
PARAMETER
Cpd
Power dissipation capacitance
TEST CONDITIONS
Outputs enabled
CL = 50 pF,
pF
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
f = 10 MHz
VCC
TYP
3.3 V
20
5V
25
pF
SN54LV245A, SN74LV245A
OCTAL BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCLS382N − SEPTEMBER 1997 − REVISED APRIL 2005
PARAMETER MEASUREMENT INFORMATION
VCC
From Output
Under Test
Test
Point
RL = 1 kΩ
From Output
Under Test
CL
(see Note A)
S1
Open
TEST
GND
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
CL
(see Note A)
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
VCC
50% VCC
Timing Input
tw
tsu
VCC
50% VCC
50% VCC
Input
0V
th
VCC
50% VCC
Data Input
50% VCC
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VCC
50% VCC
Input
50% VCC
tPLH
tPHL
VOH
In-Phase
Output
50% VCC
tPHL
Out-of-Phase
Output
0V
50% VCC
VOL
Output
Waveform 1
S1 at VCC
(see Note B)
50% VCC
VOH
50% VCC
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
50% VCC
0V
tPZL
tPLZ
≈VCC
50% VCC
tPZH
tPLH
50% VCC
VCC
Output
Control
Output
Waveform 2
S1 at GND
(see Note B)
VOL + 0.3 V
VOL
tPHZ
50% VCC
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time, with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPHL and tPLH are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
PACKAGE OPTION ADDENDUM
www.ti.com
14-May-2010
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
SN74LV245ADBLE
OBSOLETE
SSOP
DB
20
SN74LV245ADBR
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV245ADBRE4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV245ADBRG4
ACTIVE
SSOP
DB
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV245ADGVR
ACTIVE
TVSOP
DGV
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV245ADGVRE4
ACTIVE
TVSOP
DGV
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV245ADGVRG4
ACTIVE
TVSOP
DGV
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV245ADW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV245ADWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV245ADWG4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV245ADWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV245ADWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV245ADWRG4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV245AGQNR
NRND
GQN
20
1000
SNPB
Level-1-240C-UNLIM
SN74LV245ANSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV245ANSRG4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV245APW
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV245APWE4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV245APWG4
ACTIVE
TSSOP
PW
20
70
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV245APWLE
OBSOLETE
TSSOP
PW
20
SN74LV245APWR
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV245APWRE4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV245APWRG3
PREVIEW
TSSOP
PW
20
2000
SN74LV245APWRG4
ACTIVE
TSSOP
PW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV245APWT
ACTIVE
TSSOP
PW
20
250
CU NIPDAU
Level-1-260C-UNLIM
BGA MI
CROSTA
R JUNI
OR
Pins Package Eco Plan (2)
Qty
TBD
TBD
TBD
Addendum-Page 1
TBD
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
Call TI
Call TI
Call TI
MSL Peak Temp (3)
Call TI
Call TI
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
14-May-2010
Orderable Device
Status (1)
Package
Type
Package
Drawing
SN74LV245APWTE4
ACTIVE
TSSOP
PW
20
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV245APWTG4
ACTIVE
TSSOP
PW
20
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV245ARGYR
ACTIVE
VQFN
RGY
20
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN74LV245ARGYRG4
ACTIVE
VQFN
RGY
20
3000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
SN74LV245AZQNR
ACTIVE
ZQN
20
1000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
BGA MI
CROSTA
R JUNI
OR
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
21-Dec-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
8.2
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
7.5
2.5
12.0
16.0
Q1
SN74LV245ADBR
SSOP
DB
20
2000
330.0
16.4
SN74LV245ADGVR
TVSOP
DGV
20
2000
330.0
12.4
7.0
5.6
1.6
8.0
12.0
Q1
SN74LV245ADWR
SOIC
DW
20
2000
330.0
24.4
10.8
13.0
2.7
12.0
24.0
Q1
SN74LV245AGQNR
BGA MI
CROSTA
R JUNI
OR
GQN
20
1000
330.0
12.4
3.3
4.3
1.6
8.0
12.0
Q1
SN74LV245AGQNR
BGA MI
CROSTA
R JUNI
OR
GQN
20
1000
330.0
12.4
3.3
4.3
1.5
8.0
12.0
Q1
SN74LV245ANSR
SO
NS
20
2000
330.0
24.4
8.2
13.0
2.5
12.0
24.0
Q1
SN74LV245APWR
TSSOP
PW
20
2000
330.0
16.4
6.95
7.1
1.6
8.0
16.0
Q1
SN74LV245ARGYR
VQFN
RGY
20
3000
180.0
12.4
3.8
4.8
1.6
8.0
12.0
Q1
SN74LV245AZQNR
BGA MI
CROSTA
R JUNI
OR
ZQN
20
1000
330.0
12.4
3.3
4.3
1.5
8.0
12.0
Q1
SN74LV245AZQNR
BGA MI
CROSTA
R JUNI
ZQN
20
1000
330.0
12.4
3.3
4.3
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
21-Dec-2009
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
OR
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74LV245ADBR
SSOP
DB
20
2000
346.0
346.0
33.0
SN74LV245ADGVR
TVSOP
DGV
20
2000
346.0
346.0
29.0
SN74LV245ADWR
SOIC
DW
20
2000
346.0
346.0
41.0
SN74LV245AGQNR
BGA MICROSTAR
JUNIOR
GQN
20
1000
340.5
338.1
20.6
SN74LV245AGQNR
BGA MICROSTAR
JUNIOR
GQN
20
1000
346.0
346.0
29.0
SN74LV245ANSR
SO
NS
20
2000
346.0
346.0
41.0
SN74LV245APWR
TSSOP
PW
20
2000
346.0
346.0
33.0
SN74LV245ARGYR
VQFN
RGY
20
3000
190.5
212.7
31.8
SN74LV245AZQNR
BGA MICROSTAR
JUNIOR
ZQN
20
1000
346.0
346.0
29.0
SN74LV245AZQNR
BGA MICROSTAR
JUNIOR
ZQN
20
1000
340.5
338.1
20.6
Pack Materials-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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