TI SN74CBT16210CDGVR

SCDS115C − JANUARY 2003 − REVISED OCTOBER 2003
D Member of the Texas Instruments
D
D
D
D
D
D
D
D
D
D
D
D
D
DGG, DGV, OR DL PACKAGE
(TOP VIEW)
Widebus Family
Undershoot Protection for Off-Isolation on
A and B Ports Up To −2 V
Bidirectional Data Flow, With Near-Zero
Propagation Delay
Low ON-State Resistance (ron)
Characteristics (ron = 3 Ω Typical)
Low Input/Output Capacitance Minimizes
Loading and Signal Distortion
(Cio(OFF) = 5.5 pF Typical)
Data and Control Inputs Provide
Undershoot Clamp Diodes
Low Power Consumption
(ICC = 3 µA Max)
VCC Operating Range From 4 V to 5.5 V
Data I/Os Support 0 to 5-V Signaling Levels
(0.8-V, 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, 5-V)
Control Inputs Can Be Driven by TTL or
5-V/3.3-V CMOS Outputs
Ioff Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Performance Tested Per JESD 22
− 2000-V Human-Body Model
(A114-B, Class II)
− 1000-V Charged-Device Model (C101)
Supports Both Digital and Analog
Applications: PCI Interface, Memory
Interleaving, Bus Isolation, Low-Distortion
Signal Gating
NC
1A1
1A2
1A3
1A4
1A5
1A6
GND
1A7
1A8
1A9
1A10
2A1
2A2
VCC
2A3
GND
2A4
2A5
2A6
2A7
2A8
2A9
2A10
1
48
2
47
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17
32
18
31
19
30
20
29
21
28
22
27
23
26
24
25
1OE
2OE
1B1
1B2
1B3
1B4
1B5
GND
1B6
1B7
1B8
1B9
1B10
2B1
2B2
2B3
GND
2B4
2B5
2B6
2B7
2B8
2B9
2B10
NC − No internal connection
description/ordering information
ORDERING INFORMATION
SSOP − DL
−40°C
−40
C to 85
85°C
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
TSSOP − DGG
TOP-SIDE
MARKING
Tube
SN74CBT16210CDL
Tape and reel
SN74CBT16210CDLR
Tube
SN74CBT16210CDGG
Tape and reel
SN74CBT16210CDGGR
CBT16210C
CBT16210C
TVSOP − DGV
Tape and reel
SN74CBT16210CDGVR
CY210C
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
Copyright  2003, Texas Instruments Incorporated
!"# $ %&'# "$ (&)*%"# +"#',
+&%#$ %! # $('%%"#$ (' #-' #'!$ '."$ $#&!'#$
$#"+"+ /""#0, +&%# (%'$$1 +'$ # '%'$$"*0 %*&+'
#'$#1 "** (""!'#'$,
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCDS115C − JANUARY 2003 − REVISED OCTOBER 2003
description/ordering information (continued)
The SN74CBT16210C is a high-speed TTL-compatible FET bus switch with low ON-state resistance (ron),
allowing for minimal propagation delay. Active Undershoot-Protection Circuitry on the A and B ports of the
SN74CBT16210C provides protection for undershoot up to −2 V by sensing an undershoot event and ensuring
that the switch remains in the proper OFF state.
The SN74CBT16210C is organized as two 10-bit bus switches with separate output-enable (1OE, 2OE) inputs.
It can be used as two 10-bit bus switches or as one 20-bit bus switch. When OE is low, the associated 10-bit
bus switch is ON, and the A port is connected to the B port, allowing bidirectional data flow between ports. When
OE is high, the associated 10-bit bus switch is OFF, and the high-impedance state exists between the A and
B ports.
This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that
damaging current will not backflow through the device when it is powered down. The device has isolation during
power off.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
FUNCTION TABLE
(each 10-bit bus switch)
INPUT
OE
INPUT/OUTPUT
A
FUNCTION
L
B
A port = B port
H
Z
Disconnect
logic diagram (positive logic)
46
2
1A1
1B1
SW
36
12
1A10
1B10
SW
48
1OE
13
2A1
35
2B1
SW
24
2A10
25
SW
47
2OE
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
2B10
SCDS115C − JANUARY 2003 − REVISED OCTOBER 2003
simplified schematic, each FET switch (SW)
A
B
Undershoot
Protection Circuit
EN†
† EN is the internal enable signal applied to the switch.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Control input voltage range, VIN (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Switch I/O voltage range, VI/O (see Notes 1, 2, and 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Control input clamp current, IIK (VIN < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
I/O port clamp current, II/OK (VI/O < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
ON-state switch current, II/O (see Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±128 mA
Continuous current through VCC or GND terminals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±100 mA
Package thermal impedance, θJA (see Note 5): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W
DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to ground unless otherwise specified.
2. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
3. VI and VO are used to denote specific conditions for VI/O.
4. II and IO are used to denote specific conditions for II/O.
5. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 6)
MIN
MAX
VCC
VIH
Supply voltage
4
5.5
UNIT
V
High-level control input voltage
2
5.5
V
VIL
VI/O
Low-level control input voltage
0
0.8
V
Data input/output voltage
0
5.5
V
TA
Operating free-air temperature
−40
85
°C
NOTE 6: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
POST OFFICE BOX 655303
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3
SCDS115C − JANUARY 2003 − REVISED OCTOBER 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VIK
Control inputs
VCC = 4.5 V,
VIKU
Data inputs
VCC = 5 V,
IIN
Control inputs
VCC = 5.5 V,
IOZ‡
VCC = 5.5 V,
Ioff
VCC = 0,
ICC
VCC = 5.5 V,
IIN = −18 mA
0 mA > II ≥ −50 mA,
VIN = VCC or GND,
VIN = VCC or GND
VO = 0 to 5.5 V,
VI = 0,
MIN
Switch OFF
Switch OFF,
VIN = VCC or GND
VO = 0 to 5.5 V,
II/O = 0,
VIN = VCC or GND,
VI = 0
VCC = 5.5 V,
VIN = 3 V or 0
One input at 3.4 V,
Other inputs at VCC or GND
Cio(OFF)
VI/O = 3 V or 0,
Switch OFF,
Cio(ON)
VI/O = 3 V or 0,
VCC = 4 V,
TYP at VCC = 4 V
∆ICC§
Cin
Control inputs
Control inputs
ron¶
VCC = 4.5 V
TYP†
MAX
UNIT
−1.8
V
−2
V
±1
µA
±10
µA
10
µA
3
µA
2.5
mA
Switch ON or OFF
4.5
pF
VIN = VCC or GND
5.5
pF
Switch ON,
VIN = VCC or GND
14.5
pF
VI = 2.4 V,
IO = −15 mA
8
12
IO = 64 mA
IO = 30 mA
3
6
VI = 0
3
6
Ω
VI = 2.4 V,
IO = −15 mA
5
10
VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins.
† All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C.
‡ For I/O ports, the parameter IOZ includes the input leakage current.
§ This is the increase in supply current for each input that is at the specified voltage level, rather than VCC or GND.
¶ Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is determined by
the lower of the voltages of the two (A or B) terminals.
switching characteristics over recommended operating free-air temperature range (unless
otherwise noted) (see Figure 3)
VCC = 4 V
VCC = 5 V
± 0.5 V
MIN
MIN
FROM
(INPUT)
TO
(OUTPUT)
tpd#
A or B
B or A
0.24
ten
OE
A or B
6.5
PARAMETER
MAX
1.5
UNIT
MAX
0.15
ns
6
ns
tdis
A or B
6.5
1.5
6
ns
OE
# The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load capacitance,
when driven by an ideal voltage source (zero output impedance).
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCDS115C − JANUARY 2003 − REVISED OCTOBER 2003
undershoot characteristics (see Figures 1 and 2)
PARAMETER
TEST CONDITIONS
VOUTU
VCC = 5.5 V,
Switch OFF,
† All typical values are at VCC = 5 V (unless otherwise noted), TA = 25°C.
VCC
Input
Generator
Ax
VS
DUT
TYP†
2
VOH−0.3
VIN = VCC or GND
MAX
UNIT
V
11 V
Input
(Open
Socket)
100 kΩ
50 Ω
MIN
Bx
100 kΩ
90 %
2 ns
10 %
−2 V
20 ns
Output
(VOUTU)
POST OFFICE BOX 655303
5.5 V
2 ns
10 %
10 pF
Figure 1. Device Test Setup
90 %
VOH
VOH − 0.3
Figure 2. Transient Input Voltage (VI) and Output
Voltage (VOUTU) Waveforms
(Switch OFF)
• DALLAS, TEXAS 75265
5
SCDS115C − JANUARY 2003 − REVISED OCTOBER 2003
PARAMETER MEASUREMENT INFORMATION
VCC
Input Generator
VIN
50 Ω
50 Ω
VG1
TEST CIRCUIT
DUT
7V
Input Generator
VI
S1
RL
VO
GND
50 Ω
50 Ω
VG2
CL
(see Note A)
RL
TEST
VCC
S1
RL
VI
CL
tpd(s)
5 V ± 0.5 V
4V
Open
Open
500 Ω
500 Ω
VCC or GND
VCC or GND
50 pF
50 pF
tPLZ/tPZL
5 V ± 0.5 V
4V
7V
7V
500 Ω
500 Ω
GND
GND
50 pF
50 pF
0.3 V
0.3 V
tPHZ/tPZH
5 V ± 0.5 V
4V
Open
Open
500 Ω
500 Ω
VCC
VCC
50 pF
50 pF
0.3 V
0.3 V
Output
Control
(VIN)
V∆
3V
1.5 V
3V
1.5 V
1.5 V
0V
tPLH
VOH
Output
1.5 V
Output
Waveform 1
S1 at 7 V
(see Note B)
tPLZ
3.5 V
1.5 V
tPZH
tPHL
1.5 V
VOL
Output
Waveform 2
S1 at Open
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES (tpd(s))
1.5 V
0V
tPZL
Output
Control
(VIN)
Open
VOL + V∆
VOL
tPHZ
1.5 V
VOH − V∆
VOH
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd(s). The tpd propagation delay is the calculated RC time constant of the typical ON-state
resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance).
H. All parameters and waveforms are not applicable to all devices.
Figure 3. Test Circuit and Voltage Waveforms
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
27-Sep-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
74CBT16210CDGGRE4
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74CBT16210CDGGRG4
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74CBT16210CDGVRE4
ACTIVE
TVSOP
DGV
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74CBT16210CDGVRG4
ACTIVE
TVSOP
DGV
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT16210CDGGR
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT16210CDGVR
ACTIVE
TVSOP
DGV
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT16210CDL
ACTIVE
SSOP
DL
48
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT16210CDLG4
ACTIVE
SSOP
DL
48
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT16210CDLR
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBT16210CDLRG4
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
8.6
15.8
1.8
12.0
24.0
Q1
SN74CBT16210CDGGR
TSSOP
DGG
48
2000
330.0
24.4
SN74CBT16210CDGVR
TVSOP
DGV
48
2000
330.0
24.4
6.8
10.1
1.6
12.0
24.0
Q1
SN74CBT16210CDLR
SSOP
DL
48
1000
330.0
32.4
11.35
16.2
3.1
16.0
32.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74CBT16210CDGGR
TSSOP
DGG
48
2000
346.0
346.0
41.0
SN74CBT16210CDGVR
TVSOP
DGV
48
2000
346.0
346.0
41.0
SN74CBT16210CDLR
SSOP
DL
48
1000
346.0
346.0
49.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
0.0135 (0,343)
0.008 (0,203)
48
0.005 (0,13) M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
1
0°–ā8°
24
0.040 (1,02)
A
0.020 (0,51)
Seating Plane
0.110 (2,79) MAX
0.004 (0,10)
0.008 (0,20) MIN
PINS **
28
48
56
A MAX
0.380
(9,65)
0.630
(16,00)
0.730
(18,54)
A MIN
0.370
(9,40)
0.620
(15,75)
0.720
(18,29)
DIM
4040048 / E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
Falls within JEDEC MO-118
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
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