The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. NEW microSD™ Card Connectors DM3 Series ■Features ◆ Common to the entire Series 1. Extremely small size Small external dimensions and the above-the-board height make the connectors the smallest on the market. 2. Reverse card insertion protection Unique card slot design (patented) protects the connector from damage when the card is attempted to be inserted in reverse, allowing it to re-inserted correctly. 3. Effective ground and shield configuration ◆ DM3D (Push -Pull, manual, without ejection mechanism) · Partial card insertion hold Card will not fall-out even when it is not fully inserted. Full insertion and electrical / mechanical connection is confirmed with a distinct tactile feel. · Accessible termination areas An inner lead system that can be reworked is used in this design. Contact solder terminations may be inspected and reworked. 4-connection points of the metal cover to the printed circuit board assures secure connection of the ground circuit and provides EMI protection. 4. Rigid and strong construction Despite its small size, high-strengths materials used in the connectors produced a strong and rigid structure. 5. Card detection switch Card insertion-ejection Series Image Page The card detection switch is Normally Open ◆ DM3AT and DM3BT (Push - Push, with ejection mechanism) DM3AT 2~4 DM3BT 5~6 Hinge-manual insertion/ ejection DM3CS 7~8 Push-Pull manual insertion/ ejection DM3D 9~10 · Card fall-out prevention Built-in card tray and the unique push insertion-push ejection mechanism (patented) prevent accidental card ejection or fallout. Despite its small size the connectors will eject the card to a distance of 4.0 mm, allowing easy hold and removal of the card. Push-Push · Exposed termination leads Easy inspection and rework of the solder termination joints. ◆ DM3CS (Hinge, Push-Pull, manual, without ejection mechanism) · Simple and reliable card insertion Hinged metal cover provides location and guides the card during the insertion / removal. Closing of the cover confirms the electrical and mechanical connection with a tactile click sensation. · Reliable contact with the card contact pads Unique contact design and card slide action will clean the contact areas of the card. · Accessible termination areas Contact solder terminations may be inspected and reworked. 2010.6w 1 The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. DM3 Series●microSD™ Card Connectors ■Specifications(DM3 Series) Ratings Current rating: 0.5A Voltage rating: 125V AC Item Operating temperature range: -25ç to +85ç (Note 1) Operating humidity range: RH 95% max. Storage temperature range : -40ç to +85ç (Note 2) (No condensation) Specification Conditions 1. Insulation resistance 1000 Mø min. (Initial value) Measure at 500 V DC 2. Withstanding voltage No flashover or insulation breakdown 500 V AC / 1 minute 3. Contact resistance 100mø max. (Initial value) 1mA 4. Vibration No electrical discontinuity of 100 ns or longer No damage, cracks or parts dislocation. Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 3 directions for 2 hours Contact resistance: 40 mø max. (change from initial value) Insulation resistance: 100 Mø min. 5. Humidity 96 hours at of 40 ± 2ç, and humidity of 90 to 95% No damage, cracks or parts dislocation. Contact resistance: 40 mø max. (change from initial value) -55ç ➝ 5 to 35ç ➝85ç ➝ 5 to 35ç Insulation resistance: 100 Mø min. Times: 30 min. ➝ 5 min. ➝ 30 min. ➝ 5 min. No damage, cracks or parts dislocation. 5 cycles 7. Durability Contact resistance: 40 mø max. (change from initial value) 10,000 cycles, 400 to 600 cycles per hour (DM3AT, DM3B) 5,000 cycles, 400 to 600 cycles per hour (DM3C, DM3D) 8. Resistance to soldering heat No deformation of components affecting performance. Reflow : At the recommended temperature profile Manual soldering : 350ç for 3 seconds 6. Temperature cycle Note 1: Includes temperature rise caused by current flow. Note 2. The term "storage" refers to products stored for long period prior to mounting and use. ■Materials and Finishes DM3AT, DM3BT Part Material Finish Remarks Insulator LCP Color: Black UL94V-0 Contacts Copper alloy Contact area: Gold plated Lead area: Gold plated ------------------- Lead area: Gold plated ------------------- ------------------Nickel plated ------------------- Guide cover Other components Stainless steel (DM3AT) Copper alloy (DM3BT) Stainless steel (DM3AT, DM3BT) Piano wire (DM3BT) DM3CS, DM3D Part Material Finish Remarks Insulator LCP Color: Black UL94V-0 Contacts Copper alloy Contact area: Gold plated Lead area: Gold plated ------------------- Guide cover Stainless steel Tin plated ------------------- ■Ordering information DM3 AT – SF – PEJM5 1 2 3 1 Series name: DM3 2 Connector type : AT Push-Push (ejection mechanism), Top board mounting (Standard) BT Push-Push (ejection mechanism), Bottom board mounting (Reverse) 4 3 Termination type : SF Right-angle SMT(Standard) DSF Right-angle SMT(Reverse) 4 Card ejection code : PEJM5, PEJS CS Hinge, Push-Pull (no ejection mechanism), Top board mounting (Standard) D Push-Pull (no ejection mechanism), Top board mounting (Standard) Number of contacts : 8 2 (Push insert/push eject) None : Manual card insertion/ejection The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. DM3 Series●microSD™ Card Connectors ■DM3AT Push-Push (ejection mechanism), Top board mounting (Standard) #5(CLK) #6(VSS) #7(DAT0) #8(DAT1) #4(VDD) #3(CMD) #2(CD/DAT3) #1(DAT2) 13.85 (7.35) (3.2) (15) 15.95 (16.75):CARD OVER STROKE POSITION (17.55):CARD LOCK POSITION (21.55):CARD EJECT POSITION 1.68 15.95 2 CARD DETECTION SWITCH(B) Part number CL No. DM3AT-SF-PEJM5 609-0031-0 2 CARD DETECTION SWITCH(A) (0.8) microSD CARD (5.5) CL (11) 1 All dimensions: mm 2.9±0.15 ■Recommended PCB mounting pattern 10MIN 9.25MAX 8.65 7.7 1.2 Note 0.5 3 3 2.7 3.25 Card detection switch Open (A) 3 Closed (B) (A) (B) No conductive traces. 15 9.1 0.15 (3.2) CL indicates the center line of the microSD card slot. Without the card Card inserted 3 0. 1 Ｃ Ｌ 2 C 2.8 0.8 1 1 14.1MAX 14.5 15.1 8.9MIN 8.2MIN 1 1.9 14.05 13.3MIN 9.9 7.9MIN 5.7MAX 3.7 1.2 0.15MIN 1.55 P=1.1 0.7 4.4MAX 6MIN 0.7 All dimensions: mm 1.3 ● Example of applications DM3AT-SF-PEJM5 Portable device 3 The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. DM3 Series●microSD™ Card Connectors ■Packaging Specifications ● Embossed carrier tape dimensions (1,500 pieces per reel) UNREELING DIRECTION (3.2) 20 2 32 28.4 (16.35) 14.2 .5 Ø1 1.75 P=4 All dimensions: mm ● Reel Dimensions TRAILER 32.4 PORTION EQUIPPED WITH COMPONENTS Ø380 Ø80 END START OVAL EMPTY(160mm MIN) EMBOSSED CARRIER TAPE 4 LEADER(400mm MIN) CIRCLE EMPTY(100mm MIN) TOP COVER TAPE The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. DM3 Series●microSD™ Card Connectors ■DM3BT, Push-Push (ejection mechanism), Bottom board mounting (Reverse) #4(VDD) #3(CMD) #2(CD/DAT3) #1(DAT2) #5(CLK) #6(VSS) #7(DAT0) #8(DAT1) (3.2) 2.38MAX 1.83 Part number CL No. DM3BT-DSF-PEJS 609-0029-9 (0.55) CARD DETECTION SWITCH(B) 2.7MAX 6.7MAX (6.5) 3 3 CARD DETECTION SWITCH(A) 1 2 15.1 15.45 (21.55):CARD EJECT POSITION (17.55):CARD LOCK POSITION (16.75):CARD OVER STROKE POSITION 16.05 15.95 (15) 3 13.85 2 microSD CARD CL (5.5) (11) ■Recommended PCB mounting pattern All dimensions: mm 2.9±0.15 10MIN 9.25MAX 8.65 7.7 1.9 Note 4 1 2 1.2 3.5 7.7MIN 9.7 13.3 0.2 14.75 14.3 0.35MIN 1±0.05 1.4 0.7 P=1.1 0.7 CL indicates the center line of the microSD card slot. Card detection switch Without the card Card inserted Open (B) (A) (B) Ｃ 0. 15 (A) Closed 0.8 3.2 1.9 3 Ｃ Ｌ 1 0.5 4 (3.2) 1.5 3.05 8.9 Oblique-hatched area is projection of contact. No conductive traces. All dimensions: mm 1.2 ● Example of applications DM3BT-DSF-PEJS Portable device 5 The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. DM3 Series●microSD™ Card Connectors ■Packaging Specifications ● Embossed carrier tape dimensions (1,200pieces per reel) 20 UNREELING DIRECTION 2 (3.75) 32 28.4 (16.35) 14.2 .5 Ø1 1.75 P＝4 All dimensions: mm ● Reel Dimensions 32.4 Ø380 Ø80 CIRCLE TRAILER PORTION EQUIPPED WITH COMPONENTS END START OVAL EMPTY(160mm MIN) EMBOSSED CARRIER TAPE 6 LEADER(400mm MIN) EMPTY(100mm MIN) TOP COVER TAPE The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. DM3 Series●microSD™ Card Connectors ■DM3CS, Hinge, Push -Pull (no ejection mechanism), Top board mounting (Standard) CARD DETECTION SWITCH 2 13.8 (6.9) (0.2) Part number CL No. DM3CS-SF 609-0032-3 12 13.9 (15.45):LOCK POSITION 14.1 1.83 0.1 Ｃ Ｌ (5.5) 1 microSD CARD (0.93) (11) (1.78) ■Recommended PCB mounting pattern (13.8) 8.25MIN 6.3 1.4 2.7 1.2 4.1MIN 3.5MAX 3 1 CL indicates the center line of the microSD card slot. 2 3 2.6 2.6 3 1 Ｃ Ｌ 3 (3.2) １ Card detection switch Without the card Card inserted Open Closed GND(1) GND(1) GND(2) GND(2) GND(3) GND(3) GND(4) GND(4) 0.7 P＝1.1 7.7 9.3 All dimensions: mm 0.55MIN Note 10.1MIN 9.5MAX ＃1(DAT2) ＃2(CD/DAT3) ＃3(CMD) ＃4(VDD) 1.65 1.2 1.4 7.8MAX 12.4 12.9 (14.1) 14.4 12.9 7.8MAX 5.4MIN 2.9MAX 2.7 ＃8(DAT1) ＃7(DAT0) ＃6(VSS) ＃5(CLK) 1.5 No conductive traces. All dimensions: mm 2.8 ● Example of Use applications DM3CS-SF (shown open for card insertion) DM3CS-SF (shown closed, with card inserted) Portable device 7 The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. DM3 Series●microSD™ Card Connectors ■Packaging Specifications ● Embossed carrier tape dimensions (1,300pieces per reel) 20 UNREELING DIRECTION (3.4) 2 32 28.4 14.2 .5 Ø1 1.75 P＝4 All dimensions: mm ● Reel Dimensions 32.4 Ø80 Ø380 CIRCLE TRAILER PORTION EQUIPPED WITH COMPONENTS START END OVAL EMPTY(160mm MIN) EMBOSSED CARRIER TAPE 8 LEADER(400mm MIN) EMPTY(100mm MIN) TOP COVER TAPE The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. DM3 Series●microSD™ Card Connectors ■DM3D, Push-Pull (no ejection mechanism), Top board mounting (Standard) Card Detection Switch (B) 11.95 CL No. DM3D-SF 609-0025-8 2.7 Card Center (4.5) (5.5) (0.7) 2 (15) 11.45 (15.8):CARD FULLY INSERTED 11.45 9.65 3.35 1 Part number Card Detection Switch (A) (6) 1.55 0.9 2 microSD Card (11) ＃8(DAT1) ＃7(DAT0) ＃6(VSS) ＃5(CLK) ＃1(DAT2) ＃2(CD/DAT3) ＃3(CMD) ＃4(VDD) All dimensions: mm ■Recommended PCB mounting pattern 8.1MIN 5.05 MIN 2.55 MAX 1 3 1 0.4MIN 1.4 7.5 9.15 10.7 0.8 2 CL indicates the center line of the microSD card slot. Card detection switch Without the card Card inserted Open 1.5 0.8 ( 4.5 ) 1 Closed 1.5 10.2MIN 8.35 8.2MAX 6.85 1.5 6MIN 4MAX Note 1.85 1 (A) 1.75 0.55 CL 1.1 7.7 9.4 10.9 3 (B) (A) (B) No conductive traces. All dimensions: mm ● Example of applications DM3D-SF Portable device 9 The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. DM3 Series●microSD™ Card Connectors ■Packaging Specifications 2 P= 4 16 Unreeling direction 24 22.25 (11.85 ) 11.5 .5 Ø1 1.75 ● Embossed carrier tape dimensions (2,000pieces per reel) All dimensions: mm ● Reel Dimensions Lead section (400mm min.) End section 24.4 Blank section (160mm min.) Mounting section Embossed carrier tape 10 Blank section (100mm min.) Ø380 Ø80 Unreeling direction Top cover tape The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. DM3 Series●microSD™ Card Connectors ■Recommended temperature profile (ç) Peak:250ç MAX 250 230ç min. 50 seconds Temperature 200 200ç 150 Soldering 150ç 90 to 120 seconds Preheating 100 50 HRS test condition Solder method :Reflow, IR/hot air Environment :Room air Solder composition :Paste, 96.5%Sn/3.0%Ag/0.5%Cu (Senju Metal Industry, Co., Ltd.'s Part Number:M705-GRN360-K2-V) Test board :Glass epoxy 60mm∞100mm∞1.0mm thick Metal mask :0.12mm thick Number of reflow cycles : 2cycles max. The temperature profiles shown are based on the above conditions. In individual applications the actual temperature may vary, depending on solder paste type, volume / thickness and board size / thickness. Consult your solder paste and equipment manufacturer for specific recommendations. Time (Seconds) ■Precautions 1. Do not immerse or clean the entire connector with cleaning solutions as this may affect proper operation of the ejection mechanism and electrical performance of the connector 2. Do not apply excessive force to the connector when handling or after installation on the PC board. 3. The connectors will reliably connect and operate with the correctly inserted microSDTM cards. Follow the correct insertion / ejection procedure for the specific connector in use. Attempts of incorrect insertion of the card may cause damage to the connector or the card. 4. The connector must be correctly mounted on the PC board before the card can be inserted. Do not insert the card in the un-mounted connector. 5. Mounting on the Flexible Printed Circuit (FPC) To assure correct performance it is recommended that a flat reinforcement plate 0.3 mm min. thick be used under the FPC. 6. Small visible residual manufacturing fluids or tooling marks do not affect connector's performance. 7. Repeated insertions and removal of the cards may leave some marks on the card itself. This will have no affect on the connector performance. ● Refer to applicable Operation Manual listed below for additional precautions. Series Operation Manual Number DM3AT Series ETAD-F0345 DM3BT Series ETAD-F0324 DM3CS Series ETAD-F0335 DM3D Series ETAD-F0353 11