TI DAC8562

DAC8562, DAC8563
DAC8162, DAC8163
DAC7562, DAC7563
SLAS719C – AUGUST 2010 – REVISED JUNE 2011
www.ti.com
DUAL 16-/14-/12-BIT, ULTRALOW-GLITCH, LOW-POWER, BUFFERED, VOLTAGE-OUTPUT
DAC WITH 2.5-V, 4-PPM/°C INTERNAL REFERENCE IN SMALL 3-MM × 3-MM QFN
Check for Samples: DAC8562, DAC8563, DAC8162, DAC8163, DAC7562, DAC7563
FEATURES
DESCRIPTION
•
The DAC856x, DAC816x, and DAC756x are
low-power, voltage-output, dual-channel, 16-, 14-,
and 12-bit digital-to-analog converters (DACs),
respectively. These devices include a 2.5-V,
4-ppm/°C internal reference, giving a full-scale output
voltage range of 2.5 V or 5 V. The internal reference
has an initial accuracy of ±5 mV and can source or
sink up to 20 mA at the VREFIN/VREFOUT pin.
1
23
•
•
•
•
•
•
•
•
•
•
Relative Accuracy:
– DAC856x (16-Bit): 4 LSB INL
– DAC816x (14-Bit): 1 LSB INL
– DAC756x (12-Bit): 0.3 LSB INL
Glitch Energy: 0.1 nV-s
Bidirectional Reference: Input or 2.5-V Output
– Output Disabled by Default
– ±5-mV Initial Accuracy (Max)
– 4-ppm/°C Temperature Drift (Typ)
– 10-ppm/°C Temperature Drift (Max)
– 20-mA Sink/Source Capability
Power-On Reset to Zero Scale or Mid-Scale
Low-Power: 4 mW (Typ, 5-V AVDD, Including
Internal Reference Current)
Wide Power-Supply Range: 2.7 V to 5.5 V
50-MHz SPI With Schmitt-Triggered Inputs
LDAC and CLR Functions
Output Buffer With Rail-to-Rail Operation
Packages: QFN-10 (3x3 mm), MSOP-10
Temperature Range: –40°C to 125°C
These devices are monotonic, providing excellent
linearity and minimizing undesired code-to-code
transient voltages (glitch). They use a versatile
three-wire serial interface that operates at clock rates
up to 50 MHz. The interface is compatible with
standard SPI™, QSPI™, Microwire™, and digital
signal processor (DSP) interfaces. The DACxx62
devices incorporate a power-on-reset circuit that
ensures the DAC output powers up at zero scale until
a valid code is written to the device, whereas the
DACxx63s similarly power up at mid-scale. These
devices contain a power-down feature that reduces
current consumption to typically 10 nA at 5 V. The
low power consumption, internal reference, and small
footprint make these devices ideal for portable,
battery-operated equipment.
APPLICATIONS
•
•
•
•
•
•
•
Portable Instrumentation
Bipolar Outputs (reference design)
PLC Analog Output Module (reference design)
Closed-Loop Servo Control
Voltage Controlled Oscillator Tuning
Data Acquisition Systems
Programmable Gain and Offset Adjustment
GND
AVDD
DIN
SCLK
SYNC
The
DACxx62
devices
are
drop-in
and
function-compatible with each other, as are the
DACxx63s. The entire family is available in MSOP-10
and QFN-10 packages.
Table 1. RELATED DEVICES
16-BIT
14-BIT
12-BIT
Reset to zero
DAC8562
DAC8162
DAC7562
Reset to mid-scale
DAC8563
DAC8163
DAC7563
LDAC
CLR
Buffer Control
Register Control
Input Control Logic
Control Logic
DAC756x (12-Bit)
DAC816x (14-Bit)
DAC856x (16-Bit)
VREFIN/VREFOUT
2.5-V
Reference
PowerDown
Control
Logic
Data Buffer B
DAC Register B
DAC
VOUTB
Data Buffer A
DAC Register A
DAC
VOUTA
1
2
3
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SPI, QSPI are trademarks of Motorola, Inc.
Microwire is a trademark of National Semiconductor.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010–2011, Texas Instruments Incorporated
DAC8562, DAC8563
DAC8162, DAC8163
DAC7562, DAC7563
SLAS719C – AUGUST 2010 – REVISED JUNE 2011
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
DEVICE INFORMATION (1)
PRODUCT
MAXIMUM
RELATIVE
ACCURACY
(LSB)
MAXIMUM
DIFFERENTIAL
NONLINEARITY
(LSB)
MAXIMUM
REFERENCE
DRIFT
(ppm/°C)
DAC8562
Zero
±12
10
Mid-scale
DAC8162
Zero
±0.5
10
DAC8163
Mid-scale
DAC7562
Zero
±0.75
DAC7563
2
±1
DAC8563
±3
(1)
RESET
TO
±0.25
10
Mid-scale
PACKAGELEAD
PACKAGE
DESIGNATOR
QFN-10
DSC
MSOP-10
DGS
QFN-10
DSC
MSOP-10
DGS
QFN-10
DSC
MSOP-10
DGS
QFN-10
DSC
MSOP-10
DGS
QFN-10
DSC
MSOP-10
DGS
QFN-10
DSC
MSOP-10
DGS
SPECIFIED
TEMPERATURE RANGE
PACKAGE
MARKING
8562
–40°C to 125°C
8563
8162
–40°C to 125°C
8163
7562
–40°C to 125°C
7563
For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see the TI
Web site at www.ti.com.
Copyright © 2010–2011, Texas Instruments Incorporated
DAC8562, DAC8563
DAC8162, DAC8163
DAC7562, DAC7563
SLAS719C – AUGUST 2010 – REVISED JUNE 2011
www.ti.com
ABSOLUTE MAXIMUM RATINGS (1)
Over operating free-air temperature range (unless otherwise noted).
VALUE
UNIT
–0.3 to 6
V
CLR, DIN, LDAC, SCLK and SYNC input voltage to GND
–0.3 to AVDD + 0.3
V
VOUT to GND
–0.3 to AVDD + 0.3
V
VREFIN/VREFOUT to GND
–0.3 to AVDD + 0.3
V
–40 to 125
°C
150
°C
AVDD to GND
Operating temperature range
Junction temperature, maximum (TJ max)
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION
DAC856x, DAC816x, DAC756x
THERMAL METRIC
DSC
DGS
10 PINS
10 PINS
UNIT
θJA
Junction-to-ambient thermal resistance (1)
62.8
173.8
°C/W
θJCtop
Junction-to-case (top) thermal resistance (2)
44.3
48.5
°C/W
(3)
θJB
Junction-to-board thermal resistance
26.5
79.9
°C/W
ψJT
Junction-to-top characterization parameter (4)
0.4
1.7
°C/W
ψJB
Junction-to-board characterization parameter (5)
25.5
68.4
°C/W
(6)
46.2
N/A
°C/W
θJCbot
(1)
(2)
(3)
(4)
(5)
(6)
Junction-to-case (bottom) thermal resistance
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific
JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).
The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).
The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
Copyright © 2010–2011, Texas Instruments Incorporated
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ELECTRICAL CHARACTERISTICS
At AVDD = 2.7 V to 5.5 V and TA = –40°C to 125°C (unless otherwise noted).
PARAMETER
STATIC PERFORMANCE
TEST CONDITIONS
MIN
Resolution
DAC856x
Using line passing through codes 512 and 65,024
Differential nonlinearity
16-bit monotonic
UNIT
±4
±12
LSB
±0.2
±1
LSB
±1
±3
LSB
±0.1
±0.5
LSB
±0.3
±0.75
LSB
±0.05
±0.25
LSB
±1
±4
Bits
14
Relative accuracy
Using line passing through codes 128 and 16,256
Differential nonlinearity
14-bit monotonic
Resolution
DAC756x
MAX
16
Relative accuracy
Resolution
DAC816x
TYP
(1)
Bits
12
Relative accuracy
Using line passing through codes 32 and 4,064
Differential nonlinearity
12-bit monotonic
Offset error
Extrapolated from two-point line
(1)
, unloaded
Bits
±2
Offset error drift
Full-scale error
DAC register loaded with all 1s
±0.03
±0.2
Zero-code error
DAC register loaded with all 0s
1
4
±2
Zero-code error drift
Extrapolated from two-point line (1), unloaded
Gain error
±0.01
% FSR
mV
µV/°C
±0.15
% FSR
ppm
FSR/°C
±1
Gain temperature coefficient
mV
µV/°C
OUTPUT CHARACTERISTICS (2)
Output voltage range
0
Output voltage settling time (3)
Slew rate
7
RL = 1 MΩ
0.75
RL = ∞
1
RL = 2 kΩ
3
V
µs
10
Measured between 20% - 80% of a full-scale transition
Capacitive load stability
AVDD
DACs unloaded
V/µs
nF
Code-change glitch impulse
1-LSB change around major carry
0.1
nV-s
Digital feedthrough
SCLK toggling, SYNC high
0.1
nV-s
Power-on glitch impulse
RL = 2 kΩ, CL = 470 pF, AVDD = 5.5 V
40
mV
Full-scale swing on adjacent channel,
External reference
5
Full-scale swing on adjacent channel,
Internal reference
15
Channel-to-channel dc crosstalk
µV
DC output impedance
At mid-scale input
5
Ω
Short-circuit current
DAC outputs at full-scale, DAC outputs shorted to
GND
40
mA
Power-up time, including settling time
Coming out of power-down mode
50
µs
DAC output noise density
TA = 25°C, at mid-scale input, fOUT = 1 kHz
90
nV/√Hz
DAC output noise
TA = 25°C, at mid-scale input, 0.1 Hz to 10 Hz
2.6
µVPP
AC PERFORMANCE (2)
LOGIC INPUTS (2)
–1
Input pin Leakage current
Logic input LOW voltage VINL
Logic input HIGH voltage VINH
±0.1
1
µA
0
0.8
V
0.7 ×
AVDD
AVDD
V
3
pF
Pin capacitance
(1)
(2)
(3)
4
16-bit: codes 512 and 65,024; 14-bit: codes 128 and 16,256; 12-bit: codes 32 and 4,064
Specified by design or characterization
Transition time between 1/4 scale and 3/4 scale including settling to within ±0.024% FSR
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SLAS719C – AUGUST 2010 – REVISED JUNE 2011
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ELECTRICAL CHARACTERISTICS (continued)
At AVDD = 2.7 V to 5.5 V and TA = –40°C to 125°C (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
REFERENCE
External VREF = 2.5 V (when internal reference is
disabled), all channels active using gain = 1
External reference current
VREFIN reference input range
Reference input impedance
µA
15
0
AVDD
Internal reference disabled, gain = 1
170
Internal reference disabled, gain = 2
85
V
kΩ
REFERENCE OUTPUT
Output voltage
TA = 25°C
2.495
2.5
2.505
Initial accuracy
TA = 25°C
–5
±0.1
5
mV
4
10
ppm/°C
Output voltage temperature drift (4)
Output voltage noise
f = 0.1 Hz to 10 Hz
Output voltage noise density
(high-frequency noise)
µVPP
12
TA = 25°C, f = 1 kHz, CL = 0 µF
250
TA = 25°C, f = 1 MHz, CL = 0 µF
30
TA = 25°C, f = 1 MHz, CL = 4.7 µF
10
V
nV/√Hz
Load regulation, sourcing (5)
TA = 25°C
20
µV/mA
Load regulation, sinking (5)
TA = 25°C
185
µV/mA
±20
mA
Output current load capability (6)
Line regulation
TA = 25°C
50
µV/V
Long-term stability/drift (aging) (5)
TA = 25°C, time = 0 to 1900 hours
100
ppm
First cycle
200
Thermal hysteresis (5)
Additional cycles
ppm
50
POWER REQUIREMENTS (7)
Power supply voltage
2.7
AVDD = 3.6 V to 5.5 V
IDD
AVDD = 2.7 V to 3.6 V
AVDD = 3.6 V to 5.5 V
0.25
0.5
Normal mode, internal reference on
0.8
1.3
Power-down modes (8)
0.01
1
Power-down modes (9)
0.01
3
Normal mode, internal reference off
0.2
0.4
Normal mode, internal reference on
0.73
1.3
Power-down modes (8)
0.008
1
Power-down modes (9)
0.008
3
Normal mode, internal reference off
0.9
2.75
Normal mode, internal reference on
2.9
7.15
Power-down modes (8)
0.04
5.5
(9)
0.04
16.5
Normal mode, internal reference off
0.54
1.44
Normal mode, internal reference on
1.97
4.68
Power-down modes (8)
0.02
3.6
Power-down modes (9)
0.02
10.8
Power-down modes
Power
dissipation
AVDD = 2.7 V to 3.6 V
5.5
Normal mode, internal reference off
V
mA
µA
mA
µA
mW
µW
mW
µW
TEMPERATURE RANGE
–40
Specified performance
(4)
(5)
(6)
(7)
(8)
(9)
125
°C
Internal reference output voltage temperature drift is characterized from –40°C to 125°C.
Explained in more detail in the Application Information section of this data sheet.
Specified by design or characterization
Input code = mid-scale, no load, VINH = AVDD, and VINL = GND
Temperature range –40°C to 105°C
Temperature range –40°C to 125°C
Copyright © 2010–2011, Texas Instruments Incorporated
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PIN CONFIGURATIONS
DGS
(Top View)
DSC
(Top View)
VREFIN/VREFOUT
VOUTA
1
10
9
AVDD
VOUTB
2
9
AVDD
3
8
DIN
GND
3
8
DIN
4
7
SCLK
LDAC
4
7
SCLK
6
SYNC
VOUTA
1
10
VOUTB
2
GND
LDAC
CLR
5
6
SYNC
CLR
5
MSOP Package
(1)
Thermal Pad
(1)
VREFIN/VREFOUT
QFN Package
It is recommended to connect the thermal pad to the ground plane for better thermal dissipation.
Table 2. PIN DESCRIPTIONS
PIN
NAME
DESCRIPTION
NO.
AVDD
9
Power-supply input, 2.7 V to 5.5 V
CLR
5
Asynchronous clear input. The CLR input is falling-edge sensitive. When CLR is activated, zero scale
(DACxx62) or mid-scale (DACxx63) is loaded to all input and DAC registers. This sets the DAC output
voltages accordingly. The part exits clear code mode on the 24th falling edge of the next write to the part. If
CLR is activated during a write sequence, the write is aborted.
DIN
8
Serial data input. Data are clocked into the 24-bit input shift register on each falling edge of the serial clock
input. Schmitt-trigger logic input
GND
3
Ground reference point for all circuitry on the device
LDAC
4
In synchronous mode, data are updated with the falling edge of the 24th SCLK cycle, which follows a falling
edge of SYNC. For such synchronous updates, the LDAC pin is not required, and it must be connected to
GND permanently or asserted and held low before sending commands to the device.
In asynchronous mode, the LDAC pin is used as a negative edge-triggered timing signal for simultaneous
DAC updates. Multiple single-channel commands can be written in order to set different channel buffers to
desired values and then make a falling edge on LDAC pin to simultaneously update the DAC output
registers.
SCLK
7
Serial clock input. Data can be transferred at rates up to 50 MHz. Schmitt-trigger logic input
SYNC
6
Level-triggered control input (active-low). This input is the frame synchronization signal for the input data.
When SYNC goes low, it enables the input shift register, and data are sampled on subsequent falling clock
edges. The DAC output updates following the 24th clock falling edge. If SYNC is taken high before the 23rd
clock edge, the rising edge of SYNC acts as an interrupt, and the write sequence is ignored by the
DAC756x/DAC816x/DAC856x. Schmitt-trigger logic input
VOUTA
1
Analog output voltage from DAC-A
VOUTB
2
Analog output voltage from DAC-B
VREFIN / VREFOUT
10
Bidirectional voltage reference pin. If internal reference is used, 2.5-V output.
6
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TIMING DIAGRAM
t2
t1
SCLK
t6
t4
t5
t3
t7
t8
SYNC
t10
t9
DB23
DIN
DB0
t12
t11
LDAC(1)
LDAC(2)
t13
CLR
t14
VOUT
(1)
Asynchronous LDAC update mode. For more information, see the LDAC Functionality section.
(2)
Synchronous LDAC update mode; LDAC remains low. For more information, see the LDAC Functionality section.
Figure 1. Serial Write Operation
TIMING REQUIREMENTS (1) (2)
At AVDD = 2.7 V to 5.5 V and over –40°C to 125°C (unless otherwise noted).
PARAMETER
DAC756x/DAC816x/DAC856x
MIN
TYP
MAX
UNIT
t1
SCLK falling edge to SYNC falling edge (for successful write operation)
10
ns
t2 (3)
SCLK cycle time
20
ns
rd
t3
SYNC rising edge to 23 SCLK falling edge (for successful SYNC interrupt)
13
ns
t4
Minimum SYNC HIGH time
80
ns
t5
SYNC to SCLK falling edge setup time
13
ns
t6
SCLK LOW time
8
ns
t7
SCLK HIGH time
8
ns
t8
SCLK falling edge to SYNC rising edge
10
ns
t9
Data setup time
6
ns
t10
Data hold time
5
ns
t11
SCLK falling edge to LDAC falling edge for asynchronous LDAC update mode
5
ns
t12
LDAC pulse duration, LOW time
10
ns
t13
CLR pulse duration, LOW time
80
t14
CLR falling edge to start of VOUT transition
(1)
(2)
(3)
ns
100
ns
All input signals are specified with tR = tF = 3 ns (10% to 90% of AVDD) and timed from a voltage level of (VINL + VINH)/2.
See the Serial Write Operation timing diagram (Figure 1).
Maximum SCLK frequency is 50 MHz at AVDD = 2.7 V to 5.5 V.
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TABLES OF GRAPHS
Table 3. Typical Characteristics: Internal Reference Performance
POWER-SUPPLY
VOLTAGE
MEASUREMENT
FIGURE NUMBER
Internal Reference Voltage vs Temperature
Figure 2
Internal Reference Voltage Temperature Drift Histogram
Figure 3
Internal Reference Voltage vs Load Current
5.5 V
Internal Reference Voltage vs Time
Figure 4
Figure 5
Internal Reference Noise Density vs Frequency
Figure 6
2.7 V – 5.5 V
Internal Reference Voltage vs Supply Voltage
Figure 7
Table 4. Typical Characteristics: DAC Static Performance
POWER-SUPPLY
VOLTAGE
MEASUREMENT
FIGURE NUMBER
FULL-SCALE, GAIN, OFFSET AND ZERO-CODE ERRORS
Full-Scale Error vs Temperature
Figure 16
Gain Error vs Temperature
5.5 V
Offset Error vs Temperature
Figure 17
Figure 18
Zero-Code Error vs Temperature
Figure 19
Full-Scale Error vs Temperature
Figure 63
Gain Error vs Temperature
2.7 V
Offset Error vs Temperature
Zero-Code Error vs Temperature
Figure 64
Figure 65
Figure 66
LOAD REGULATION
DAC Output Voltage vs Load Current
5.5 V
Figure 30
2.7 V
Figure 74
DIFFERENTIAL NONLINEARITY ERROR
T = –40°C
Differential Linearity Error vs Digital Input Code
T = 25°C
T = 125°C
Figure 9
5.5 V
Differential Linearity Error vs Temperature
Figure 13
Figure 15
T = –40°C
Differential Linearity Error vs Digital Input Code
Figure 11
T = 25°C
T = 125°C
Figure 56
2.7 V
Differential Linearity Error vs Temperature
Figure 58
Figure 60
Figure 62
INTEGRAL NONLINEARITY ERROR (RELATIVE ACCURACY)
Linearity Error vs Digital Input Code
T = –40°C
Figure 8
T = 25°C
Figure 10
T = 125°C
5.5 V
Linearity Error vs Temperature
Figure 14
T = –40°C
Linearity Error vs Digital Input Code
T = 25°C
T = 125°C
Figure 55
2.7 V
Linearity Error vs Temperature
8
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Figure 12
Figure 57
Figure 59
Figure 61
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DAC8162, DAC8163
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Table 4. Typical Characteristics: DAC Static Performance (continued)
MEASUREMENT
POWER-SUPPLY
VOLTAGE
FIGURE NUMBER
POWER-DOWN CURRENT
Power-Down Current vs Temperature
Power-Down Current vs Power-Supply Voltage
Power-Down Current vs Temperature
5.5 V
Figure 28
2.7 V – 5.5 V
Figure 29
2.7 V
Figure 73
POWER-SUPPLY CURRENT
Power-Supply Current vs Temperature
Power-Supply Current vs Digital Input Code
Power-Supply Current Histogram
Power-Supply Current vs Power-Supply Voltage
Power-Supply Current vs Temperature
Power-Supply Current vs Digital Input Code
Power-Supply Current Histogram
Power-Supply Current vs Temperature
Power-Supply Current vs Digital Input Code
Power-Supply Current Histogram
Copyright © 2010–2011, Texas Instruments Incorporated
External VREF
Figure 20
Internal VREF
Figure 21
External VREF
Internal VREF
5.5 V
Figure 22
Figure 23
External VREF
Figure 24
Internal VREF
Figure 25
External VREF
Internal VREF
2.7 V – 5.5 V
Figure 26
Figure 27
External VREF
Figure 49
Internal VREF
Figure 50
External VREF
Internal VREF
3.6 V
Figure 51
Figure 52
External VREF
Figure 53
Internal VREF
Figure 54
External VREF
Figure 67
Internal VREF
Figure 68
External VREF
Internal VREF
2.7 V
Figure 69
Figure 70
External VREF
Figure 71
Internal VREF
Figure 72
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SLAS719C – AUGUST 2010 – REVISED JUNE 2011
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Table 5. Typical Characteristics: DAC Dynamic Performance
MEASUREMENT
POWER-SUPPLY
VOLTAGE
FIGURE NUMBER
CHANNEL-TO-CHANNEL CROSSTALK
Channel-to-Channel Crosstalk
5-V Rising Edge
5-V Falling Edge
5.5 V
Figure 43
Figure 44
CLOCK FEEDTHROUGH
Clock Feedthrough
500 kHz, Midscale
5.5 V
Figure 48
2.7 V
Figure 87
GLITCH ENERGY
Glitch Energy, 1-LSB Step
Glitch Energy, 4-LSB Step
Glitch Energy, 16-LSB Step
Glitch Energy, 1-LSB Step
Glitch Energy, 4-LSB Step
Rising Edge, Code 7FFFh to 8000h
Figure 37
Falling Edge, Code 8000h to 7FFFh
Figure 38
Rising Edge, Code 7FFCh to 8000h
Falling Edge, Code 8000h to 7FFCh
5.5 V
Figure 39
Figure 40
Rising Edge, Code 7FF0h to 8000h
Figure 41
Falling Edge, Code 8000h to 7FF0h
Figure 42
Rising Edge, Code 7FFFh to 8000h
Figure 79
Falling Edge, Code 8000h to 7FFFh
Figure 80
Rising Edge, Code 7FFCh to 8000h
Falling Edge, Code 8000h to 7FFCh
2.7 V
Figure 81
Figure 82
Rising Edge, Code 7FF0h to 8000h
Figure 83
Falling Edge, Code 8000h to 7FF0h
Figure 84
DAC Output Noise Density vs
Frequency
External VREF
Figure 45
DAC Output Noise 0.1 Hz to 10 Hz
External VREF
Glitch Energy, 16-LSB Step
NOISE
Internal VREF
5.5 V
Figure 46
Figure 47
POWER-ON GLITCH
Reset to Zero Scale
Power-on Glitch
Reset to Midscale
Reset to Zero Scale
Reset to Midscale
5.5 V
2.7 V
Figure 35
Figure 36
Figure 85
Figure 86
SETTLING TIME
Full-Scale Settling Time
Half-Scale Settling Time
Full-Scale Settling Time
Half-Scale Settling Time
10
Rising Edge, Code 0h to FFFFh
Falling Edge, Code FFFFh to 0h
Rising Edge, Code 4000h to C000h
Figure 31
5.5 V
Figure 32
Figure 33
Falling Edge, Code C000h to 4000h
Figure 34
Rising Edge, Code 0h to FFFFh
Figure 75
Falling Edge, Code FFFFh to 0h
Rising Edge, Code 4000h to C000h
2.7 V
Falling Edge, Code C000h to 4000h
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Figure 76
Figure 77
Figure 78
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TYPICAL CHARACTERISTICS: Internal Reference
At TA = 25°C, AVDD = 5.5 V, gain = 2 and VREFOUT, unloaded unless otherwise noted.
INTERNAL REFERENCE VOLTAGE
vs TEMPERATURE
INTERNAL REFERENCE VOLTAGE
TEMPERATURE DRIFT HISTOGRAM
30
2.505
2.504
25
2.503
Population (%)
2.501
2.500
2.499
2.498
2.497
10
5
0
2.495
−40 −25 −10
5
20 35 50 65
Temperature (°C)
80
95
110 125
Temperature Drift (ppm/ °C)
Figure 2.
Figure 3.
INTERNAL REFERENCE VOLTAGE
vs LOAD CURRENT
INTERNAL REFERENCE VOLTAGE
vs TIME
400
Internal Reference Voltage Shift (ppm)
2.510
2.505
VREFOUT (V)
15
60 units shown
(30 MSOP, 30 QFN−10)
2.496
2.500
2.495
2.490
−20
−15
−10
−5
0
5
Load Current (mA)
10
15
300
200
100
0
−100
−200
−300
−400
20
16 units shown (8 MSOP, 8 QFN−10)
Average shown in dashed line
0
250
500
750
1000
Elapsed Time (Hours)
1250
Figure 4.
Figure 5.
INTERNAL REFERENCE NOISE DENSITY
vs FREQUENCY
INTERNAL REFERENCE VOLTAGE
vs SUPPLY VOLTAGE
400
1500
2.505
No Load
4.7 µF Load
350
−40°C
+25°C
+125°C
2.504
2.503
300
2.502
250
VREFOUT (V)
Voltage Noise (nV/rt−Hz)
20
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
7.5
8.0
8.5
9.0
9.5
10.0
VREFOUT (V)
2.502
200
150
2.501
2.500
2.499
2.498
100
2.497
50
0
2.496
10
100
1k
10k
Frequency (Hz)
Figure 6.
Copyright © 2010–2011, Texas Instruments Incorporated
100k
1M
2.495
2.7
3.1
3.5
3.9
4.3
4.7
5.1
5.5
AVDD (V)
Figure 7.
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TYPICAL CHARACTERISTICS: DAC at AVDD = 5.5 V
At TA = 25°C, 5-V external reference used, gain = 1 and DAC output not loaded, unless otherwise noted.
LINEARITY ERROR
vs DIGITAL INPUT CODE (–40°C)
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (–40°C)
12
1.0
9
0.8
0.6
DNL Error (LSB)
INL Error (LSB)
6
3
0
−3
0.4
0.2
0.0
−0.2
−0.4
−6
−0.6
−9
−12
Typical channel shown
−40°C
0
Typical channel shown
−40°C
−0.8
−1.0
8192 16384 24576 32768 40960 49152 57344 65536
Digital Input Code
0
8192 16384 24576 32768 40960 49152 57344 65536
Digital Input Code
Figure 8.
Figure 9.
LINEARITY ERROR
vs DIGITAL INPUT CODE (25°C)
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (25°C)
12
1.0
9
0.8
0.6
DNL Error (LSB)
INL Error (LSB)
6
3
0
−3
0.4
0.2
0.0
−0.2
−0.4
−6
−0.6
−9
−12
Typical channel shown
25°C
0
Typical channel shown
25°C
−0.8
−1.0
8192 16384 24576 32768 40960 49152 57344 65536
Digital Input Code
0
8192 16384 24576 32768 40960 49152 57344 65536
Digital Input Code
Figure 10.
Figure 11.
LINEARITY ERROR
vs DIGITAL INPUT CODE (125°C)
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (125°C)
12
1.0
9
0.8
0.6
DNL Error (LSB)
INL Error (LSB)
6
3
0
−3
0.4
0.2
0.0
−0.2
−0.4
−6
−0.6
−9
−12
Typical channel shown
125°C
0
8192 16384 24576 32768 40960 49152 57344 65536
Digital Input Code
Figure 12.
12
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Typical channel shown
125°C
−0.8
−1.0
0
8192 16384 24576 32768 40960 49152 57344 65536
Digital Input Code
Figure 13.
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TYPICAL CHARACTERISTICS: DAC at AVDD = 5.5 V (continued)
At TA = 25°C, 5-V external reference used, gain = 1 and DAC output not loaded, unless otherwise noted.
LINEARITY ERROR
vs TEMPERATURE
DIFFERENTIAL LINEARITY ERROR
vs TEMPERATURE
12
1.0
INL Max
INL Min
9
DNL Max
DNL Min
0.8
0.6
DNL Error (LSB)
INL Error (LSB)
6
3
0
−3
0.4
0.2
0.0
−0.2
−0.4
−6
−0.6
−9
−0.8
Typical channel shown
−12
−40 −25 −10
5
20 35 50 65
Temperature (°C)
80
95
Typical channel shown
−1.0
−40 −25 −10 5
20 35 50 65
Temperature (°C)
110 125
Figure 14.
Figure 15.
FULL-SCALE ERROR
vs TEMPERATURE
GAIN ERROR
vs TEMPERATURE
0.20
95
110 125
0.15
Ch A
Ch B
0.15
Ch A
Ch B
0.10
0.10
Gain Error (%FSR)
Full−Scale Error (%FSR)
80
0.05
0.00
−0.05
0.05
0.00
−0.05
−0.10
−0.10
−0.15
−0.20
−40 −25 −10
5
20 35 50 65
Temperature (°C)
80
95
−0.15
−40 −25 −10
110 125
Figure 17.
OFFSET ERROR
vs TEMPERATURE
ZERO-CODE ERROR
vs TEMPERATURE
80
95
110 125
4.0
Ch A
Ch B
3
1
0
−1
−2
−3
Ch A
Ch B
3.5
Zero−Code Error (mV)
2
Offset Error (mV)
20 35 50 65
Temperature (°C)
Figure 16.
4
−4
−40 −25 −10
5
3.0
2.5
2.0
1.5
1.0
0.5
5
20 35 50 65
Temperature (°C)
Figure 18.
Copyright © 2010–2011, Texas Instruments Incorporated
80
95
110 125
0.0
−40 −25 −10
5
20 35 50 65
Temperature (°C)
80
95
110 125
Figure 19.
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TYPICAL CHARACTERISTICS: DAC at AVDD = 5.5 V (continued)
At TA = 25°C, 5-V external reference used, gain = 1 and DAC output not loaded, unless otherwise noted.
1.2
Power−Supply Current (mA)
1.3
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.9
0.8
0.7
5
20 35 50 65
Temperature (°C)
80
95
Internal reference enabled
DACs at midscale code, Gain = 2
0.5
−40 −25 −10
110 125
5
20 35 50 65
Temperature (°C)
80
Figure 20.
Figure 21.
POWER-SUPPLY CURRENT
vs DIGITAL INPUT CODE
POWER-SUPPLY CURRENT
vs DIGITAL INPUT CODE
1.3
0.45
1.2
Power−Supply Current (mA)
0.50
0.40
0.35
0.30
0.25
0.20
0.15
0.10
95
110 125
1.1
1.0
0.9
0.8
0.7
0.05
0.6
0.00
0.5
Internal reference enabled, Gain = 2
8192 16384 24576 32768 40960 49152 57344 65536
Digital Input Code
Figure 23.
POWER-SUPPLY CURRENT
HISTOGRAM
POWER-SUPPLY CURRENT
HISTOGRAM
25
25
20
20
Population (%)
30
15
10
10
0.45
0.43
0.41
0.39
0.37
0.35
0.33
0.31
0.29
0
0.27
0
0.25
5
0.21
Internal reference enabled
Gain = 2
15
5
0.19
8192 16384 24576 32768 40960 49152 57344 65536
Digital Input Code
Figure 22.
30
0.17
0
0.30
0.35
0.40
0.45
0.50
0.55
0.60
0.65
0.70
0.75
0.80
0.85
0.90
0.95
1.00
1.05
1.10
1.15
1.20
1.25
1.30
0
0.15
Power−Supply Current (mA)
1.0
DACs at midscale code
0.00
−40 −25 −10
Population (%)
1.1
0.6
0.05
14
POWER-SUPPLY CURRENT
vs TEMPERATURE
0.50
0.23
Power−Supply Current (mA)
POWER-SUPPLY CURRENT
vs TEMPERATURE
Power Supply Current (mA)
Power Supply Current (mA)
Figure 24.
Figure 25.
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TYPICAL CHARACTERISTICS: DAC at AVDD = 5.5 V (continued)
At TA = 25°C, 5-V external reference used, gain = 1 and DAC output not loaded, unless otherwise noted.
POWER-SUPPLY CURRENT
vs POWER-SUPPLY VOLTAGE
POWER-SUPPLY CURRENT
vs POWER-SUPPLY VOLTAGE
0.50
1.3
VREFIN = 2.5 V
DACs at midscale code, Gain = 1
1.2
Power−Supply Current (mA)
Power−Supply Current (mA)
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
1.1
1.0
0.9
0.8
0.7
0.6
0.05
0.00
2.7
3.1
3.5
3.9
4.3
4.7
5.1
0.5
2.7
5.5
3.1
3.5
3.9
4.3
4.7
AVDD (V)
AVDD (V)
Figure 26.
Figure 27.
POWER-DOWN CURRENT
vs TEMPERATURE
POWER-DOWN CURRENT
vs POWER-SUPPLY VOLTAGE
3.0
0.035
2.5
2.0
1.5
1.0
0.5
0.0
−40 −25 −10
5.1
5.5
0.040
Power−Down Current (µA)
Power−Down Current (µA)
Internal reference enabled
DACs at midscale code, Gain = 1
IDD (µA)
IREFIN (µA)
Both channels and internal reference
in power−down mode; VREFIN = AVDD
0.030
0.025
0.020
0.015
0.010
0.005
5
20 35 50 65
Temperature (°C)
80
95
0.000
2.7
110 125
3.1
3.5
3.9
4.3
4.7
5.1
5.5
AVDD (V)
Figure 28.
Figure 29.
DAC OUTPUT VOLTAGE
vs LOAD CURRENT
7.0
Typical channel shown
Full scale
Mid scale
Zero scale
6.0
Output Voltage (V)
5.0
4.0
3.0
2.0
1.0
0.0
−1.0
−20
−15
−10
−5
0
5
10
15
20
ILOAD (mA)
Figure 30.
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TYPICAL CHARACTERISTICS: DAC at AVDD = 5.5 V (continued)
At TA = 25°C, 5-V external reference used, gain = 1 and DAC output not loaded, unless otherwise noted.
FULL-SCALE SETTLING TIME:
RISING EDGE
FULL-SCALE SETTLING TIME:
FALLING EDGE
LDAC Trigger (5 V/div)
LDAC Trigger (5 V/div)
Large Signal VOUT (2 V/div)
Large Signal VOUT (2 V/div)
Small Signal Settling
(1.22 mV/div = 0.024% FSR)
Small Signal Settling (1.22 mV/div = 0.024% FSR)
From Code: FFFFh
To Code: 0h
From Code: 0h
To Code: FFFFh
Time (5 μs/div)
Time (5 μs/div)
Figure 31.
Figure 32.
HALF-SCALE SETTLING TIME:
RISING EDGE
HALF-SCALE SETTLING TIME:
FALLING EDGE
LDAC Trigger (5 V/div)
LDAC Trigger (5 V/div)
Large Signal VOUT (2 V/div)
Large Signal VOUT (2 V/div)
Small Signal Settling (1.22 mV/div = 0.024% FSR)
Small Signal Settling (1.22 mV/div = 0.024% FSR)
From Code: 4000h
To Code: C000h
Time (5 μs/div)
From Code: C000h
To Code: 4000h
Time (5 μs/div)
Figure 33.
Figure 34.
POWER-ON GLITCH
RESET TO ZERO SCALE
POWER-ON GLITCH
RESET TO MIDSCALE
AVDD (2 V/div)
AVDD (2 V/div)
VOUTA (1 V/div)
VOUTB (1 V/div)
VOUTA (50 mV/div)
VOUTB (50 mV/div)
VREFIN shorted to AVDD
VREFIN shorted to AVDD
Time (1 ms/div)
Figure 35.
16
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Time (1 ms/div)
Figure 36.
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TYPICAL CHARACTERISTICS: DAC at AVDD = 5.5 V (continued)
At TA = 25°C, 5-V external reference used, gain = 1 and DAC output not loaded, unless otherwise noted.
GLITCH ENERGY
RISING EDGE, 1-LSB STEP
GLITCH ENERGY
FALLING EDGE, 1-LSB STEP
LDAC Trigger (5 V/div)
LDAC Trigger (5 V/div)
LDAC Feedthrough
Glitch Impulse » 0.1 nV-s
VOUT (100 μV/div)
VOUT (100 μV/div)
LDAC Feedthrough
Glitch Impulse » 0.12 nV-s
From Code: 7FFFh
To Code: 8000h
Time (5 μs/div)
From Code: 8000h
To Code: 7FFFh
Time (5 μs/div)
Figure 37.
Figure 38.
GLITCH ENERGY
RISING EDGE, 4-LSB STEP
GLITCH ENERGY
FALLING EDGE, 4-LSB STEP
LDAC Trigger (5 V/div)
LDAC Trigger (5 V/div)
Glitch Impulse » 0.1 nV-s
LDAC Feedthrough
VOUT (100 μV/div)
VOUT (100 μV/div)
LDAC Feedthrough
Glitch Impulse » 0.14 nV-s
From Code: 8000h
To Code: 7FFCh
From Code: 7FFCh
To Code: 8000h
Time (5 μs/div)
Time (5 μs/div)
Figure 39.
Figure 40.
GLITCH ENERGY
RISING EDGE, 16-LSB STEP
GLITCH ENERGY
FALLING EDGE, 16-LSB STEP
LDAC Trigger (5 V/div)
LDAC Trigger (5 V/div)
Glitch Impulse » 0.1 nV-s
VOUT (500 μV/div)
LDAC Feedthrough
LDAC Feedthrough
VOUT (500 μV/div)
Glitch Impulse » 0.1 nV-s
From Code: 7FF0h
To Code: 8000h
Time (5 μs/div)
Figure 41.
Copyright © 2010–2011, Texas Instruments Incorporated
From Code: 8000h
To Code: 7FF0h
Time (5 μs/div)
Figure 42.
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TYPICAL CHARACTERISTICS: DAC at AVDD = 5.5 V (continued)
At TA = 25°C, 5-V external reference used, gain = 1 and DAC output not loaded, unless otherwise noted.
CHANNEL-TO-CHANNEL CROSSTALK
5-V RISING EDGE
CHANNEL-TO-CHANNEL CROSSTALK
5-V FALLING EDGE
LDAC Trigger (5 V/div)
LDAC Trigger (5 V/div)
VOUTB (1 V/div)
6.4 μs
Glitch Area (Between Cursors) = 2 nV-s
VOUTA (500 μV/div)
VOUTA (500 μV/div)
VOUTA at Midscale Code
Internal Reference Enabled
Gain = 2
Glitch Area (Between Cursors) = 1.6 nV-s
7.3 μs
VOUTB (1 V/div)
VOUTA at Midscale Code
Internal Reference Enabled
Gain = 2
Time (5 μs/div)
Time (5 μs/div)
Figure 43.
Figure 44.
DAC OUTPUT NOISE DENSITY
vs FREQUENCY
DAC OUTPUT NOISE DENSITY
vs FREQUENCY
1400
1400
Voltage Noise (nV/rt−Hz)
1200
Full Scale
Mid Scale
Zero Scale
1000
800
600
400
200
0
Internal reference enabled
Gain = 2
1200
Voltage Noise (nV/rt−Hz)
Internal reference disabled
VREFIN = 5 V, Gain = 1
Full Scale
Mid Scale
Zero Scale
1000
800
600
400
200
10
100
1k
Frequency (Hz)
10k
100k
0
10
100
1k
Frequency (Hz)
10k
Figure 45.
Figure 46.
DAC OUTPUT NOISE
0.1 Hz TO 10 Hz
CLOCK FEEDTHROUGH
500 kHz, MIDSCALE
100k
VNOISE (1 μV/div)
SCLK (5 V/div)
VOUT (500 μV/div)
» 2.5 μVPP
Clock Feedthrough Impulse » 0.06 nV-s
DAC = Midscale
Time (500 ns/div)
Figure 47.
18
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Figure 48.
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TYPICAL CHARACTERISTICS: DAC at AVDD = 3.6 V
At TA = 25°C, 3.3-V external reference used, gain = 1 and DAC output not loaded, unless otherwise noted.
0.50
1.3
0.45
1.2
0.40
0.35
0.30
0.25
0.20
0.15
0.10
1.0
0.9
0.8
0.7
5
20 35 50 65
Temperature (°C)
80
95
0.5
−40 −25 −10
110 125
5
20 35 50 65
Temperature (°C)
80
Figure 49.
Figure 50.
POWER-SUPPLY CURRENT
vs DIGITAL INPUT CODE
POWER-SUPPLY CURRENT
vs DIGITAL INPUT CODE
1.3
0.45
1.2
Power−Supply Current (mA)
0.50
0.40
0.35
0.30
0.25
0.20
0.15
0.10
95
110 125
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.05
Internal reference enabled, Gain = 1
0
0.4
8192 16384 24576 32768 40960 49152 57344 65536
Digital Input Code
Figure 52.
POWER-SUPPLY CURRENT
HISTOGRAM
POWER-SUPPLY CURRENT
HISTOGRAM
25
25
20
20
Population (%)
30
15
10
10
0.40
0.38
0.36
0.34
0.32
0.30
0.28
0.26
0.24
0.22
0.20
0
0.18
0
0.16
5
0.14
Internal reference enabled
Gain = 1
15
5
0.12
8192 16384 24576 32768 40960 49152 57344 65536
Digital Input Code
Figure 51.
30
0.10
0
0.30
0.35
0.40
0.45
0.50
0.55
0.60
0.65
0.70
0.75
0.80
0.85
0.90
0.95
1.00
1.05
1.10
1.15
1.20
1.25
1.30
0.00
Internal reference enabled
DACs at midscale code, Gain = 1
DACs at midscale code
0.00
−40 −25 −10
Population (%)
1.1
0.6
0.05
Power−Supply Current (mA)
POWER-SUPPLY CURRENT
vs TEMPERATURE
Power−Supply Current (mA)
Power−Supply Current (mA)
POWER-SUPPLY CURRENT
vs TEMPERATURE
Power Supply Current (mA)
Power Supply Current (mA)
Figure 53.
Figure 54.
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TYPICAL CHARACTERISTICS: DAC at AVDD = 2.7 V
At TA = 25°C, 2.5-V external reference used, gain = 1 and DAC output not loaded, unless otherwise noted.
LINEARITY ERROR
vs DIGITAL INPUT CODE (–40°C)
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (–40°C)
12
1.0
9
0.8
0.6
DNL Error (LSB)
INL Error (LSB)
6
3
0
−3
0.4
0.2
0.0
−0.2
−0.4
−6
−0.6
−9
−12
Typical channel shown
−40°C
0
Typical channel shown
−40°C
−0.8
−1.0
8192 16384 24576 32768 40960 49152 57344 65536
Digital Input Code
0
8192 16384 24576 32768 40960 49152 57344 65536
Digital Input Code
Figure 55.
Figure 56.
LINEARITY ERROR
vs DIGITAL INPUT CODE (25°C)
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (25°C)
12
1.0
9
0.8
0.6
DNL Error (LSB)
INL Error (LSB)
6
3
0
−3
0.4
0.2
0.0
−0.2
−0.4
−6
−0.6
−9
−12
Typical channel shown
25°C
0
Typical channel shown
25°C
−0.8
−1.0
8192 16384 24576 32768 40960 49152 57344 65536
Digital Input Code
0
8192 16384 24576 32768 40960 49152 57344 65536
Digital Input Code
Figure 57.
Figure 58.
LINEARITY ERROR
vs DIGITAL INPUT CODE (125°C)
DIFFERENTIAL LINEARITY ERROR
vs DIGITAL INPUT CODE (125°C)
12
1.0
9
0.8
0.6
DNL Error (LSB)
INL Error (LSB)
6
3
0
−3
0.4
0.2
0.0
−0.2
−0.4
−6
−0.6
−9
−12
Typical channel shown
125°C
0
8192 16384 24576 32768 40960 49152 57344 65536
Digital Input Code
Figure 59.
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Typical channel shown
125°C
−0.8
−1.0
0
8192 16384 24576 32768 40960 49152 57344 65536
Digital Input Code
Figure 60.
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TYPICAL CHARACTERISTICS: DAC at AVDD = 2.7 V (continued)
At TA = 25°C, 2.5-V external reference used, gain = 1 and DAC output not loaded, unless otherwise noted.
LINEARITY ERROR
vs TEMPERATURE
DIFFERENTIAL LINEARITY ERROR
vs TEMPERATURE
12
1.0
INL Max
INL Min
9
DNL Max
DNL Min
0.8
0.6
DNL Error (LSB)
INL Error (LSB)
6
3
0
−3
0.4
0.2
0.0
−0.2
−0.4
−6
−0.6
−9
−0.8
Typical channel shown
−12
−40 −25 −10
5
20 35 50 65
Temperature (°C)
80
95
Typical channel shown
−1.0
−40 −25 −10 5
20 35 50 65
Temperature (°C)
110 125
Figure 61.
Figure 62.
FULL-SCALE ERROR
vs TEMPERATURE
GAIN ERROR
vs TEMPERATURE
0.20
95
110 125
0.15
Ch A
Ch B
0.15
Ch A
Ch B
0.10
0.10
Gain Error (%FSR)
Full−Scale Error (%FSR)
80
0.05
0.00
−0.05
0.05
0.00
−0.05
−0.10
−0.10
−0.15
−0.20
−40 −25 −10
5
20 35 50 65
Temperature (°C)
80
95
−0.15
−40 −25 −10
110 125
Figure 64.
OFFSET ERROR
vs TEMPERATURE
ZERO-CODE ERROR
vs TEMPERATURE
80
95
110 125
4.0
Ch A
Ch B
3
1
0
−1
−2
−3
Ch A
Ch B
3.5
Zero−Code Error (mV)
2
Offset Error (mV)
20 35 50 65
Temperature (°C)
Figure 63.
4
−4
−40 −25 −10
5
3.0
2.5
2.0
1.5
1.0
0.5
5
20 35 50 65
Temperature (°C)
Figure 65.
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80
95
110 125
0.0
−40 −25 −10
5
20 35 50 65
Temperature (°C)
80
95
110 125
Figure 66.
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TYPICAL CHARACTERISTICS: DAC at AVDD = 2.7 V (continued)
At TA = 25°C, 2.5-V external reference used, gain = 1 and DAC output not loaded, unless otherwise noted.
POWER-SUPPLY CURRENT
vs TEMPERATURE
0.40
1.3
0.35
1.2
Power−Supply Current (mA)
Power−Supply Current (mA)
POWER-SUPPLY CURRENT
vs TEMPERATURE
0.30
0.25
0.20
0.15
0.10
0.05
1.1
1.0
0.9
0.8
0.7
0.6
Internal reference enabled
DACs at midscale code, Gain = 1
DACs at midscale code
5
20 35 50 65
Temperature (°C)
80
95
0.5
−40 −25 −10
110 125
5
20 35 50 65
Temperature (°C)
80
Figure 67.
Figure 68.
POWER-SUPPLY CURRENT
vs DIGITAL INPUT CODE
POWER-SUPPLY CURRENT
vs DIGITAL INPUT CODE
0.40
1.3
0.35
1.2
Power−Supply Current (mA)
Power−Supply Current (mA)
0.00
−40 −25 −10
0.30
0.25
0.20
0.15
0.10
95
110 125
1.1
1.0
0.9
0.8
0.7
0.6
0.05
0.5
0.00
0.4
22
8192 16384 24576 32768 40960 49152 57344 65536
Digital Input Code
Figure 70.
POWER-SUPPLY CURRENT
HISTOGRAM
POWER-SUPPLY CURRENT
HISTOGRAM
25
25
20
20
Population (%)
30
15
10
10
0.40
0.38
0.36
0.34
0.32
0.30
0.28
0.26
0.24
0.22
0
0.20
0
0.18
5
0.16
Internal reference enabled
Gain = 1
15
5
0.14
8192 16384 24576 32768 40960 49152 57344 65536
Digital Input Code
Figure 69.
30
0.12
0
0.30
0.35
0.40
0.45
0.50
0.55
0.60
0.65
0.70
0.75
0.80
0.85
0.90
0.95
1.00
1.05
1.10
1.15
1.20
1.25
1.30
0
0.10
Population (%)
Internal reference enabled, Gain = 1
Power Supply Current (mA)
Power Supply Current (mA)
Figure 71.
Figure 72.
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TYPICAL CHARACTERISTICS: DAC at AVDD = 2.7 V (continued)
At TA = 25°C, 2.5-V external reference used, gain = 1 and DAC output not loaded, unless otherwise noted.
POWER-DOWN CURRENT
vs TEMPERATURE
DAC OUTPUT VOLTAGE
vs LOAD CURRENT
3.0
4
Full scale
Mid scale
Zero scale
3
Output Voltage (V)
Power−Down Current (µA)
Typical channel shown
2.5
2.0
1.5
1.0
2
1
0
0.5
0.0
−40 −25 −10
5
20 35 50 65
Temperature (°C)
80
95
110 125
−1
−20
−15
−10
−5
0
5
10
15
20
ILOAD (mA)
Figure 73.
Figure 74.
FULL-SCALE SETTLING TIME:
RISING EDGE
FULL-SCALE SETTLING TIME:
FALLING EDGE
LDAC Trigger (5 V/div)
LDAC Trigger (5 V/div)
Large Signal VOUT (1 V/div)
Large Signal VOUT (1 V/div)
Small Signal Settling (0.61 mV/div = 0.024% FSR)
Small Signal Settling (0.61 mV/div = 0.024% FSR)
From Code: FFFFh
To Code: 0h
From Code: 0h
To Code: FFFFh
Time (5 μs/div)
Time (5 μs/div)
Figure 75.
Figure 76.
HALF-SCALE SETTLING TIME:
RISING EDGE
HALF-SCALE SETTLING TIME:
FALLING EDGE
LDAC Trigger (5 V/div)
LDAC Trigger (5 V/div)
Large Signal VOUT (1 V/div)
Large Signal VOUT (1 V/div)
Small Signal Settling (0.61 mV/div = 0.024% FSR)
Small Signal Settling (0.61 mV/div = 0.024% FSR)
From Code: 4000h
To Code: C000h
Time (5 μs/div)
Figure 77.
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From Code: C000h
To Code: 4000h
Time (5 μs/div)
Figure 78.
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TYPICAL CHARACTERISTICS: DAC at AVDD = 2.7 V (continued)
At TA = 25°C, 2.5-V external reference used, gain = 1 and DAC output not loaded, unless otherwise noted.
GLITCH ENERGY
RISING EDGE, 1-LSB STEP
GLITCH ENERGY
FALLING EDGE, 1-LSB STEP
LDAC Trigger (5 V/div)
LDAC Trigger (5 V/div)
LDAC Feedthrough
Glitch Impulse » 0.1 nV-s
VOUT (100 μV/div)
VOUT (100 μV/div)
LDAC Feedthrough
Glitch Impulse » 0.1 nV-s
From Code: 7FFFh
To Code: 8000h
From Code: 8000h
To Code: 7FFFh
Time (5 μs/div)
Time (5 μs/div)
Figure 79.
Figure 80.
GLITCH ENERGY
RISING EDGE, 4-LSB STEP
GLITCH ENERGY
FALLING EDGE, 4-LSB STEP
LDAC Trigger (5 V/div)
LDAC Trigger (5 V/div)
Glitch Impulse » 0.1 nV-s
LDAC Feedthrough
VOUT (100 μV/div)
VOUT (100 μV/div)
LDAC Feedthrough
Glitch Impulse » 0.1 nV-s
From Code: 7FFCh
To Code: 8000h
From Code: 8000h
To Code: 7FFCh
Time (5 μs/div)
Time (5 μs/div)
Figure 81.
Figure 82.
GLITCH ENERGY
RISING EDGE, 16-LSB STEP
GLITCH ENERGY
FALLING EDGE, 16-LSB STEP
LDAC Trigger (5 V/div)
Glitch Impulse » 0.1 nV-s
VOUT (200 μV/div)
LDAC Trigger (5 V/div)
LDAC Feedthrough
LDAC Feedthrough
VOUT (200 μV/div)
Glitch Impulse » 0.1 nV-s
From Code: 7FF0h
To Code: 8000h
Time (5 μs/div)
Figure 83.
24
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From Code: 8000h
To Code: 7FF0h
Time (5 μs/div)
Figure 84.
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TYPICAL CHARACTERISTICS: DAC at AVDD = 2.7 V (continued)
At TA = 25°C, 2.5-V external reference used, gain = 1 and DAC output not loaded, unless otherwise noted.
POWER-ON GLITCH
RESET TO ZERO SCALE
POWER-ON GLITCH
RESET TO MIDSCALE
AVDD (2 V/div)
AVDD (2 V/div)
VOUTA (500 mV/div)
VOUTB (500 mV/div)
VOUTA (50 mV/div)
VOUTB (50 mV/div)
VREFIN shorted to AVDD
VREFIN shorted to AVDD
Time (1 ms/div)
Time (1 ms/div)
Figure 85.
Figure 86.
CLOCK FEEDTHROUGH
500 kHz, MIDSCALE
SCLK (2 V/div)
Clock Feedthrough Impulse » 0.02 nV-s
VOUT (500 μV/div)
Time (500 ns/div)
Figure 87.
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THEORY OF OPERATION
DIGITAL-TO-ANALOG CONVERTER (DAC)
The DAC756x, DAC816x, and DAC856x architecture consists of two string DACs, each followed by an output
buffer amplifier. The devices include an internal 2.5-V reference with 4-ppm/°C temperature drift performance.
Figure 88 shows a principal block diagram of the DAC architecture.
Gain
Register
DIN
n
DAC
Register
VREFIN/
VREFOUT
150 kW
REF(+)
Resistor String
REF(-)
150 kW
VOUT
GND
Figure 88. DAC Architecture
The input coding to the DAC756x, DAC816x, and DAC856x is straight binary, so the ideal output voltage is given
by Equation 1:
æD ö
VO UT = ç IN
´ VREF ´ Gain
n ÷
è 2 ø
(1)
where:
n = resolution in bits; either 12 (DAC756x), 14 (DAC816x) or 16 (DAC856x)
DIN = decimal equivalent of the binary code that is loaded to the DAC register. DIN ranges from 0 to 2n – 1.
VREF = DAC reference voltage; either VREFOUT from the internal 2.5-V reference or VREFIN from an
aaa external reference.
Gain = 1 by default when internal reference is disabled (using external reference), and gain = 2 by default
aaa when using internal reference. Gain can also be manually set to either 1 or 2 using the gain register.
aaa See the GAIN REGISTERS section for more information.
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Resistor String
The resistor string section is shown in Figure 89. It is simply a string of resistors, each of value R. The code
loaded into the DAC register determines at which node on the string the voltage is tapped off to be fed into the
output amplifier by closing one of the switches connecting the string to the amplifier. The resistor string
architecture guarantees monotonicity. The RDIVIDER switch is controlled by the gain registers (see the GAIN
REGISTERS section). Because the output amplifier has a gain of two, RDIVIDER is not shorted when the DAC-n
gain is set to one (default if internal reference is disabled), and is shorted when the DAC-n gain is set to two
(default if internal reference is enabled).
VREFIN/VREFOUT
RDIVIDER
VREF
2
R
R
To Output Amplifier
R
R
Figure 89. Resistor String
Output Amplifier
The output buffer amplifier is capable of generating rail-to-rail voltages on its output, giving a maximum output
range of 0 V to AVDD. It is capable of driving a load of 2 kΩ in parallel with 3 nF to GND. The typical slew rate is
0.75 V/µs, with a typical full-scale settling time of 14 µs as shown in Figure 31, Figure 32, Figure 75 and
Figure 76.
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INTERNAL REFERENCE
The DAC756x, DAC816x, and DAC856x include a 2.5-V internal reference that is disabled by default. The
internal reference is externally available at the VREFIN/VREFOUT pin. The internal reference output voltage is 2.5 V
and can sink and source up to 20 mA.
A minimum 150-nF capacitor is recommended between the reference output and GND for noise filtering.
The internal reference of the DAC756x, DAC816x, and DAC856x is a bipolar transistor based precision bandgap
voltage reference. Figure 90 shows the basic bandgap topology. Transistors Q1 and Q2 are biased such that the
current density of Q1 is greater than that of Q2. The difference of the two base-emitter voltages (VBE1 – VBE2) has
a positive temperature coefficient and is forced across resistor R1. This voltage is amplified and added to the
base-emitter voltage of Q2, which has a negative temperature coefficient. The resulting output voltage is virtually
independent of temperature. The short-circuit current is limited by design to approximately 100 mA.
VREFIN/VREFOUT
Reference
Enable
Q1
Q2
R1
R2
Figure 90. Bandgap Reference Simplified Schematic
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POWER-ON RESET
Power-On Reset to Zero-scale
The DAC7562, DAC8162, and DAC8562 contain a power-on-reset circuit that controls the output voltage during
power up. All device registers are reset as shown in Table 6. At power up all DAC registers are filled with zeros
and the output voltages of all DAC channels are set to zero volts. Each DAC channel remains that way until a
valid load command is written to it. The power-on reset is useful in applications where it is important to know the
state of the output of each DAC while the device is in the process of powering up. No device pin should be
brought high before power is applied to the device. The internal reference is disabled by default and remains that
way until a valid reference-change command is executed.
Power-On Reset to Mid-scale
The DAC7563, DAC8163, and DAC8563 contain a power-on reset circuit that controls the output voltage during
power up. At power up, all DAC registers are reset to mid-scale code and the output voltages of all DAC
channels are set to VREFIN/2 volts. Each DAC channel remains that way until a valid load command is written to
it. The power-on reset is useful in applications where it is important to know the state of the output of each DAC
while the device is in the process of powering up. No device pin should be brought high before power is applied
to the device. The internal reference is powered off/down by default and remains that way until a valid
reference-change command is executed. If using an external reference, it is acceptable to power on the VREFIN
either at the same time as or after AVDD is applied.
Table 6. DACxx62 and DACxx63 Power-On Reset Values
REGISTER
DEFAULT SETTING
DAC and Input registers
DACxx62
Zero-scale
DACxx63
Mid-scale
LDAC registers
LDAC pin enabled for both channels
Power-down registers
DACs powered up
Internal reference register
Internal reference disabled
Gain registers
Gain = 1 for both channels
CLR FUNCTIONALITY
The edge-triggered CLR pin can be used to set the input and DAC registers immediately according to Table 7.
When the CLR pin receives a falling edge signal the clear mode is activated and changes the DAC output
voltages accordingly. The part exits clear mode on the 24th falling edge of the next write to the part. If the CLR
pin receives a falling edge signal during a write sequence in normal operation, the clear mode is activated and
changes the input and DAC registers immediately according to Table 7.
Table 7. Clear Mode Reset Values
DEVICE
DAC Output Entering Clear Mode
DAC8562, DAC8162, DAC7562
Zero-scale
DAC8563, DAC8163, DAC7563
Mid-scale
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SERIAL INTERFACE
The DAC756x, DAC816x, and DAC856x have a 3-wire serial interface (SYNC, SCLK, and DIN; see the Pin
Descriptions) compatible with SPI, QSPI, and Microwire interface standards, as well as most DSPs. See the
Serial Write Operation timing diagram (Figure 1) for an example of a typical write sequence.
The DAC756x, DAC816x, or DAC856x input shift register is 24-bits wide, consisting of two don’t care bits (DB23
to DB22), three command bits (DB21 to DB19), three address bits (DB18 to DB16), and 16 data bits (DB15 to
DB0). The 16 data bits comprise the 16-, 14-, or 12-bit input code. All 24 bits of data are loaded into the DAC
under the control of the serial clock input, SCLK. DB23 (MSB) is the first bit that is loaded into the DAC shift
register. It is followed by the rest of the 24-bit word pattern, left-aligned. This configuration means that the first 24
bits of data are latched into the shift register, and any further clocking of data is ignored. When the DAC registers
are being written to, the DAC756x, DAC816x, and DAC856x receive all 24 bits of data, ignore DB23 and DB22,
and decode the next three bits (DB21 to DB19) in order to determine the DAC operating/control mode (see
Table 8 through Table 10). Bits DB18 to DB16 are used to address DAC channels. The next 16/14/12 bits of
data that follow are decoded by the DAC to determine the equivalent analog output. For more details on these
and other commands (such as write to LDAC register, power down DACs, etc.), see their respective sections.
The data format is straight binary, with all 0s corresponding to 0-V output and all 1s corresponding to full-scale
output. For all documentation purposes, the data format and representation used here is a true 16-bit pattern
(that is, FFFFh data word for full scale) that the DAC756x, DAC816x, and DAC856x require.
The write sequence begins by bringing the SYNC line low. Data from the DIN line are clocked into the 24-bit shift
register on each falling edge of SCLK. The serial clock frequency can be as high as 50 MHz, making the
DAC756x, DAC816x, and DAC856x compatible with high-speed DSPs. On the 24th falling edge of the serial
clock, the last data bit is clocked into the shift register and the shift register locks. Further clocking does not
change the shift register data.
After receiving the 24th falling clock edge, the DAC756x, DAC816x, and DAC856x decode the three command
bits and three address bits and 16/14/12 data bits to perform the required function, without waiting for a SYNC
rising edge. After the 24th falling edge of SCLK is received, the SYNC line may be kept low or brought high. In
either case, the minimum delay time from the 24th falling SCLK edge to the next falling SYNC edge must be met
in order to begin the next cycle properly; see the Serial Write Operation timing diagram (Figure 1).
A rising edge of SYNC before the 24-bit sequence is complete resets the SPI interface; no data transfer occurs.
A new write sequence starts at the next falling edge of SYNC. To assure the lowest power consumption of the
device, care should be taken that the levels are as close to each rail as possible.
SYNC Interrupt
In a normal write sequence, the SYNC line stays low for at least 24 falling edges of SCLK and the addressed
DAC register updates on the 24th falling edge. However, if SYNC is brought high before the 23rd falling edge, it
acts as an interrupt to the write sequence; the shift register resets and the write sequence is discarded. Neither
an update of the data buffer contents, DAC register contents, nor a change in the operating mode occurs (as
shown in Figure 91).
24th Falling Edge
24th Falling Edge
CLK
SYNC
DIN
DB23
DB23
DB0
Invalid/Interrupted Write Sequence:
Output/Mode Does Not Update on the Falling Edge
DB0
Valid Write Sequence:
Output/Mode Updates on the Falling Edge
Figure 91. SYNC Interrupt Facility
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Input Shift Register
The input shift register (SR) of the DAC856x, DAC816x, and DAC756x is 24 bits wide (as shown in Table 8,
Table 9, and Table 10, respectively), and consists of two don’t care bits (DB23 to DB22), three command bits
(DB21 to DB19), three address bits (DB18 to DB16), and 16 data bits (DB15 to DB0). The 16 data bits comprise
the 16-, 14-, or 12-bit input code.
Table 8. DAC856x Data Input Register Format
Command
X (1)
X
C2
C1
Address
C0
A2
A1
Data
A0
D15 D14 D13 D12 D11 D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
DB23
(1)
D0
DB0
X' denotes don't care bits.
Table 9. DAC816x Data Input Register Format
Command
X
X
C2
C1
Address
C0
A2
A1
Data
A0
D13 D12 D11 D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
X
DB23
X
DB0
Table 10. DAC756x Data Input Register Format
Command
X
X
C2
C1
Address
C0
A2
A1
Data
A0
D11 D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
X
X
X
DB23
X
DB0
The DAC856x, DAC816x, and DAC756x support a number of different load commands. The load commands are
summarized in Table 11 and Table 12, and fully exhausted in Table 13.
Table 11. Commands for the DAC856x, DAC816x, and DAC756x
C2
(DB21)
C1
(DB20)
C0
(DB19)
0
0
0
Write to input register n (Table 12)
0
0
1
Software LDAC, update DAC register n (Table 12)
0
1
0
Write to input register n (Table 12) and update all DAC registers
0
1
1
Write to input register n and update DAC register n (Table 12)
1
0
0
Set DAC power up/down mode
1
0
1
Software reset
1
1
0
Set LDAC registers
1
1
1
Enable/disable internal reference
Command
Table 12. Address Select for the DAC856x, DAC816x, and DAC756x
A2
(DB18)
A1
(DB17)
A0
(DB16)
0
0
0
DAC-A
0
0
1
DAC-B
0
1
0
Gain (only use with command 000)
0
1
1
Reserved
1
0
0
Reserved
1
0
1
Reserved
1
1
0
Reserved
1
1
1
DAC-A and DAC-B
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Channel (n)
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Table 13. Command Matrix for the DAC856x, DAC816x, and DAC756x
Command
Address
DB23DB22
C2
C1
C0
X (1)
0
0
0
X
X
X
X
X
X
X
X
X
X
X
(1)
32
0
0
0
0
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
1
1
0
1
1
0
Data
DB15DB6
A0
0
0
0
16/14/12 bit DAC data
Write to DAC-A input register
0
0
1
16/14/12 bit DAC data
Write to DAC-B input register
1
1
1
16/14/12 bit DAC data
Write to DAC-A and DAC-B input registers
0
0
0
16/14/12 bit DAC data
Write to DAC-A input register and update all DACs
0
0
1
16/14/12 bit DAC data
Write to DAC-B input register and update all DACs
1
1
1
16/14/12 bit DAC data
Write to DAC-A and DAC-B input register and update all DACs
0
0
0
16/14/12 bit DAC data
Write to DAC-A input register and update DAC-A
0
0
1
16/14/12 bit DAC data
Write to DAC-B input register and update DAC-B
1
1
1
16/14/12 bit DAC data
Write to DAC-A and DAC-B input register and update all DACs
0
0
0
X
Update DAC-A
0
0
1
X
Update DAC-B
1
1
1
X
0
1
X
0
X
0
X
0
X
1
X
0
X
1
X
0
DB4
DESCRIPTION
A1
0
DB5
DB3DB2
A2
DB1
DB0
Update all DACs
0
0
Gain: DAC-B gain = 2, DAC-A gain = 2 (default with internal VREF)
0
1
Gain: DAC-B gain = 2, DAC-A gain = 1
1
0
Gain: DAC-B gain = 1, DAC-A gain = 2
1
1
Gain: DAC-B gain = 1, DAC-A gain = 1 (power-on default)
0
1
Power up DAC-A
1
0
Power up DAC-B
1
1
Power up DAC-A and DAC-B
0
1
Power down DAC-A; 1 kΩ to GND
1
0
Power down DAC-B; 1 kΩ to GND
1
1
Power down DAC-A and DAC-B; 1 kΩ to GND
0
1
Power down DAC-A; 100 kΩ to GND
1
0
Power down DAC-B; 100 kΩ to GND
1
1
Power down DAC-A and DAC-B; 100 kΩ to GND
0
1
Power down DAC-A; Hi-Z
1
0
Power down DAC-B; Hi-Z
1
1
Power down DAC-A and DAC-B; Hi-Z
X
0
Reset DAC-A and DAC-B input register and update all DACs
X
1
Reset all registers and update all DACs (Power-on-reset update)
0
0
LDAC pin active for DAC-B and DAC-A
0
1
LDAC pin active for DAC-B; inactive for DAC-A
1
0
LDAC pin inactive for DAC-B; active for DAC-A
1
1
LDAC pin inactive for DAC-B and DAC-A
X
0
Disable internal reference and reset DACs to gain = 1
X
1
Enable Internal Reference & reset DACs to gain = 2
X
X
X
X
X
0
0
0
1
1
0
1
1
X
X
X
X
X
X
X
X' denotes don't care bits.
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GAIN REGISTERS
The gain register controls the GAIN setting in the DAC transfer function:
æD ö
VO UT = ç IN
´ VREF ´ Gain
n ÷
è 2 ø
(2)
The DAC756x, DAC816x, and DAC856x have a gain register for each channel. The gain for each channel, in
Equation 2, is either 1 or 2. This gain is automatically set to 2 when using the internal reference, and is
automatically set to 1 when the internal reference is disabled (default). However, each channel can have either
gain by setting the registers appropriately. The gain registers are accessible by using command bits = 000 and
address bits = 010, and using DB1 for DAC-B and DB0 for DAC-A. See Table 13 or Table 14 and Table 15 for
the full command structure. The gain registers are automatically reset to provide either gain of 1 or 2 when the
internal reference is powered off or on, respectively. After the reference is powered off or on, the gain register is
again accessible to change the gain.
Table 14. Gain Register Command Structure
Command
X
X
0
0
Address
0
0
1
Data
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
DAC-B
DAC-A
DB23
DB0
Table 15. DAC-n Selection for Gain Register Command
DB1/DB0
Value
DB0
0
DAC-A uses gain = 2 (default with internal reference)
1
DAC-A uses gain = 1 (default with external reference)
0
DAC-B uses gain = 2 (default with internal reference)
1
DAC-B uses gain = 1 (default with external reference)
DB1
Gain
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POWER-DOWN MODES
The DAC756x, DAC816x, and DAC856x have two separate sets of power-down commands. One set is for the
DAC channels and the other set is for the internal reference. The internal reference is forced to a powered down
state while both DAC channels are powered down, and is only enabled if any DAC channel is also in normal
mode of operation. For more information on the internal reference control, see the INTERNAL REFERENCE
ENABLE REGISTER section.
DAC Power-Down Commands
The DAC756x, DAC816x, and DAC856x DACs use four modes of operation. These modes are accessed by
setting command bits C2, C1, and C0, and power-down register bits DB5 and DB4. The command bits must be
set to 100. Once the command bits are set correctly, the four different power down modes are software
programmable by setting bits DB5 and DB4 in the shift register. Table 13 or Table 16 through Table 18 shows
how to control the operating mode with data bits PD1 (DB5), PD0 (DB4), DB1, and DB0.
Table 16. DAC Power Mode Register Command Structure
Command
X
X
1
0
0
Address
X
X
Data
X
X
X
X
X
X
X
X
X
X
X
PD1
PD0
X
DB23
X
DAC-B
DAC-A
DB0
Table 17. DAC-n Operating Modes
PD1 (DB5)
PD0 (DB4)
0
0
Power up selected DACs (normal mode, default)
DAC OPERATING MODES
0
1
Power down selected DACs 1 kΩ to GND
1
0
Power down selected DACs 100 kΩ to GND
1
1
Power down selected DACs Hi-Z to GND
Table 18. DAC-n Selection for Operating Modes
DB1/DB0
Operating Mode
0
DAC-n does not change operating mode
1
DAC-n operating mode set to value on PD1 and PD0
It is possible to write to the DAC register/buffer of the DAC channel that is powered down. When the DAC
channel is then powered up, it powers up to this new value.
The advantage of the available power-down modes is that the output impedance of the device is known while it is
in power-down mode. As described in Table 17, there are three different power-down options. VOUT can be
connected internally to GND through a 1-kΩ resistor, a 100-kΩ resistor, or open-circuited (Hi-Z). The DAC
powerdown circuitry is shown in Figure 92.
Resistor
String
DAC
Amplifier
Power-Down
Circuitry
VOUTX
Resistor
Network
Figure 92. Output Stage
34
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SOFTWARE RESET FUNCTION
The DAC756x, DAC816x, and DAC856x contain a software reset feature. The software reset function uses
command 101. The software reset command contains two reset modes which are software-programmable by
setting bit DB0 in the shift register. Table 13 and/or Table 19 and Table 20 show the available software reset
commands.
Table 19. Software Reset Command Structure
Command
X
X
1
0
Address
1
X
X
Data
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
DB23
RST
DB0
Table 20. Software Reset
RST (DB0)
Registers Reset to Default Values
0
DAC registers
Input registers
1
DAC registers
Input registers
LDAC registers
Power-down registers
Internal reference register
Gain registers
LDAC FUNCTIONALITY
The DAC756x, DAC816x, and DAC856x offer both a software and hardware simultaneous update and control
function. The DAC double-buffered architecture has been designed so that new data can be entered for each
DAC without disturbing the analog outputs.
DAC756x, DAC816x, and DAC856x data updates can be performed either in synchronous or in asynchronous
mode.
In asynchronous mode, the LDAC pin is used as a negative edge-triggered timing signal for simultaneous DAC
updates. Multiple single-channel writes can be done in order to set different channel buffers to desired values
and then make a falling edge on LDAC pin to simultaneously update the DAC output registers. Data buffers of all
channels must be loaded with desired data before an LDAC falling edge. After a high-to-low LDAC transition, all
DACs are simultaneously updated with the last contents of the corresponding data buffers. If the content of a
data buffer is not changed, the corresponding DAC output remains unchanged after the LDAC pin is triggered.
LDAC must be returned high before the next serial command is initiated.
In synchronous mode, data are updated with the falling edge of the 24th SCLK cycle, which follows a falling edge
of SYNC. For such synchronous updates, the LDAC pin is not required, and it must be connected to GND
permanently or asserted and held low before sending commands to the device.
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Alternatively, all DAC outputs can be updated simultaneously using the built-in software function of LDAC. The
LDAC register offers additional flexibility and control by allowing the selection of which DAC channel(s) should be
updated simultaneously when the LDAC pin is being brought low. The LDAC register is loaded with a 2-bit word
(DB1 and DB0) using command bits C2, C1, and C0 (see Table 13 or Table 21). The default value for each bit,
and therefore for each DAC channel, is zero. If the LDAC register bit is set to 1, it overrides the LDAC pin (the
LDAC pin is internally tied low for that particular DAC channel) and this DAC channel updates synchronously
after the falling edge of the 24th SCLK cycle. However, if the LDAC register bit is set to 0, the DAC channel is
controlled by the LDAC pin.
The combination of software and hardware simultaneous update functions is particularly useful in applications
when updating a DAC channel, while keeping the other channel unaffected; see Table 13 or Table 21 and
Table 22 for more information.
Table 21. LDAC Register Command Structure
Command
X
X
1
1
Address
0
X
X
Data
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
DAC-B
DAC-A
DB23
DB0
Table 22. DAC-n Selection for LDAC Register Command
DB1/DB0
Value
DB0
0
DAC-A uses LDAC pin
1
DAC-A operates in synchronous mode
0
DAC-B uses LDAC pin
1
DAC-B operates in synchronous mode
DB1
LDAC Pin Functionality
INTERNAL REFERENCE ENABLE REGISTER
The internal reference in the DAC756x, DAC816x, and DAC856x is disabled by default for debugging, evaluation
purposes, or when using an external reference. The internal reference can be powered up and powered down
using a serial command that requires a 24-bit write sequence, as shown in Table 23 and Table 24. The internal
reference is forced to a powered down state while both DAC channels are powered down, and is only enabled if
any DAC channel is in normal mode of operation in addition to using the command in Table 23. During the time
that the internal reference is disabled, the DAC functions normally using an external reference. At this point, the
internal reference is disconnected from the VREFIN/VREFOUT pin (Hi-Z output).
Enabling Internal Reference
To enable the internal reference, write the 24-bit serial command shown in Table 23. When performing a power
cycle to reset the device, the internal reference is switched off (default mode). In the default mode, the internal
reference is powered down until a valid write sequence is applied to power up the internal reference. However,
the internal reference is forced to a disabled state while both DAC channels are powered down, and remains
disabled until either DAC channel is returned to the normal mode of operation. See DAC Power-Down
Commands for more information on DAC channel modes of operation.
Table 23. Write Sequence for Enabling Internal Reference
Command
X
X
1
1
Address
1
X
X
Data
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
DB23
1
DB0
Disabling Internal Reference
To disable the internal reference, write the 24-bit serial command shown in Table 24. When performing a power
cycle to reset the device, the internal reference is disabled (default mode).
Table 24. Write Sequence for Disabling Internal Reference
Command
X
X
1
1
Address
1
X
X
Data
X
X
X
X
X
X
X
X
X
X
X
X
X
DB23
36
X
X
X
0
DB0
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APPLICATION INFORMATION
INTERNAL REFERENCE
The internal reference of the DAC756x, DAC816x, and DAC856x does not require an external load capacitor for
stability because it is stable without any capacitive load. However, for improved noise performance, an external
load capacitor of 150 nF or larger connected to the VREFIN/VREFOUT output is recommended. Figure 93 shows the
typical connections required for operation of the DAC756x, DAC816x, and DAC856x internal reference. A supply
bypass capacitor at the AVDD input is also recommended.
DSC
DGS
150 nF
1
VOUTA
VREFIN/
10
VREFOUT
2
VOUTB
AVDD
9
3
GND
DIN
8
7
4
LDAC
SCLK
7
6
5
CLR
SYNC
6
1
VOUTA
VREFIN/VREFOUT
10
2
VOUTB
AVDD
9
3
GND
DIN
8
4
LDAC
SCLK
5
CLR
SYNC
AVDD
1 mF
150 nF
AVDD
1 mF
Figure 93. Typical Connections for Operating the DAC756x/DAC816x/DAC856x Internal Reference
Supply Voltage
The internal reference features an extremely low dropout voltage. It can be operated with a supply of only 5 mV
above the reference output voltage in an unloaded condition. For loaded conditions, refer to the Load Regulation
section. The stability of the internal reference with variations in supply voltage (line regulation, DC PSRR) is also
exceptional. Within the specified supply voltage range of 2.7 V to 5.5 V, the variation at VREFIN/VREFOUT is
typically 50 µV/V; see Figure 7.
Temperature Drift
The internal reference is designed to exhibit minimal drift error, defined as the change in reference output voltage
over varying temperature. The drift is calculated using the box method described by Equation 3:
æ VREF _ MAX - VREF _ MIN ö
6
Drift Error = çç
÷÷ ´ 10 (ppm / °C )
´
V
T
REF
RANGE
è
ø
(3)
where:
VREF_MAX = maximum reference voltage observed within temperature range TRANGE.
VREF_MIN = minimum reference voltage observed within temperature range TRANGE.
VREF = 2.5 V, target value for reference output voltage.
TRANGE = the characterized range from –40°C to 125°C (165°C range)
The internal reference features an exceptional typical drift coefficient of 4 ppm/°C from –40°C to 125°C.
Characterizing a large number of units, a maximum drift coefficient of 10 ppm/°C is observed. Temperature drift
results are summarized in Figure 3.
Noise Performance
Typical 0.1-Hz to 10-Hz voltage noise and noise spectral density performance are listed in the Electrical
Characteristics. Additional filtering can be used to improve output noise levels, although care should be taken to
ensure the output impedance does not degrade the AC performance. The output noise spectrum at the
VREFIN/VREFOUT pin, both unloaded and with an external 4.7-µF load capacitor, is shown in Figure 6. Internal
reference noise impacts the DAC output noise when the internal reference is used.
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Load Regulation
Load regulation is defined as the change in reference output voltage as a result of changes in load current. The
load regulation of the internal reference is measured using force and sense contacts as shown in Figure 94. The
force and sense lines reduce the impact of contact and trace resistance, resulting in accurate measurement of
the load regulation contributed solely by the internal reference. Measurement results are shown in Figure 4.
Force and sense lines should be used for applications that require improved load regulation.
Output Pin
Contact and
Trace Resistance
VOUT
Force Line
IL
Sense Line
Meter
Load
Figure 94. Accurate Load Regulation of the DAC756x/DAC816x/DAC856x Internal Reference
Long-Term Stability
Long-term stability/aging refers to the change of the output voltage of a reference over a period of months or
years. This effect lessens as time progresses. The typical drift value for the internal reference is listed in the
Electrical Charateristics and measurement results are shown in Figure 5. This parameter is characterized by
powering up multiple devices and measuring them at regular intervals.
Thermal Hysteresis
Thermal hysteresis for a reference is defined as the change in output voltage after operating the device at 25°C,
cycling the device through the operating temperature range, and returning to 25°C. Hysteresis is expressed by
Equation 4:
é VREF_PRE - VREF_POST ù
6
VHYST = ê
ú ´ 10 (ppm/°C)
V
REF_NOM
ëê
ûú
(4)
Where:
VHYST = thermal hysteresis.
VREF_PRE = output voltage measured at 25°C pre-temperature cycling.
VREF_POST = output voltage measured after the device cycles through the temperature range of –40°C to
aaa 125°C, and returns to 25°C.
VREF_NOM = 2.5 V, target value for reference output voltage.
DAC NOISE PERFORMANCE
Output noise spectral density at the VOUT-n pin versus frequency is depicted in Figure 45 and Figure 46 for
full-scale, mid-scale, and zero-scale input codes. The typical noise density for mid-scale code is 90 nV/√Hz at
1 kHz. High-frequency noise can be improved by filtering the reference noise. Integrated output noise between
0.1 Hz and 10 Hz is close to 2.5 µVPP (mid-scale), as shown in Figure 47.
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UP TO ±15-V BIPOLAR OUTPUT USING THE DAC8562
The DAC8562 is designed to be operate from a single power supply providing a maximum output range of AVDD
volts. However, the DAC can be placed in the configuration shown in Figure 95 in order to be designed into
bipolar systems. Depending on the ratio of the resistor values, the output of the circuit can range anywhere from
±5 V to ±15 V. The design example below shows that the DAC is configured to have its internal reference
enabled and the DAC8562 internal gain set to two, however, an external 2.5-V reference could also be used
(with DAC8562 internal gain set to two).
G´R
R
5.5 V
VREFOUT
18 V
R
VOUT
–
+
OPA140
G´R
DAC8562
–18 V
Figure 95. Bipolar Output Range Circuit Using DAC8562
The transfer function shown in Equation 5 can be used to calculate the output voltage as a function of the DAC
code, reference voltage and resistor ratio:
DIN
æ
ö
- 1÷
VOUT = G × VREFOUT ç 2 ×
65,536
è
ø
(5)
where:
DIN = decimal equivalent of the binary code that is loaded to the DAC register, ranging from 0 to 65,535 for
aaa DAC8562 (16 bit).
VREFOUT = reference output voltage with the internal reference enabled from the DAC VREFIN/VREFOUT pin
G = ratio of the resistors
An example configuration to generate a ±10-V output range is shown below in Equation 6 with G = 4 and
VREFOUT = 2.5 V:
DIN
VOUT = 20 ×
- 10 V
65,536
(6)
In this example, the range is set to ±10 V by using a resistor ratio of four, VREFOUT of 2.5 V, and DAC8562
internal gain of two. The resistor sizes must be selected keeping in mind the current sink/source capability of the
DAC8562 internal reference. Using larger resistor values, for example R = 10 kΩ or larger is recommended. The
op amp is selectable depending on the requirements of the system.
The DAC8562EVM and DAC7562EVM boards have the option to evaluate the bipolar output application by
installing the components on the pre-placed footprints. For more information see either the DAC8562EVM or
DAC7562EVM product folder.
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PLC ANALOG OUTPUT MODULE USING THE DAC8562
The DAC8562 can be mated with one of TI's 0- to 20-mA voltage-to-current transmitters to create a low-cost,
programmable current source for use in PLC applications. One specific example includes combining the
DAC8562 with the XTR111 to create a voltage-to-current solution. The DAC output voltage generates a current,
ISET, which is determined by the value of the external resistor, RSET. This current is internally amplified by 10 and
output at the IS node. A p-channel MOSFET Q1 can be added in an application where a wide compliance
voltage is required, for example, when using a high impedance load. The optional PNP transistor, Q2, along with
the R4 resistor provides external current limiting in a case where the external FET is forced to low impedance.
Additionally, resistors R2 and R3 can be used to scale the 3-V internal regulator to a desired voltage to power
the DAC. Figure 96 shows a working 0- to 20-mA solution using one DAC8562 channel and a ±10-V voltage
output using the other DAC8562 channel. For more information on the ±10-V voltage output circuit see the UP
TO ±15-V BIPOLAR OUTPUT USING THE DAC8562 application.
24 V
5.5 V
C1
470 nF
REGF
VOUTA
0 to 5 V
IS
R2
2.5 kΩ
Q2
REGS
AVDD
VSP
R1
2.5 kΩ
XTR111
R3
3 kΩ
VG
VIN
VREFOUT
Q1
R5
15 Ω
SET
DAC8562
VOUTB
R4
15 Ω
C2
10 nF
RSET
2.5 kΩ
0 to 5 V
GND
IOUT
0- to 20-mA Output
18 V
R6
10 kΩ
R7
40 kΩ
+
OPA140
–
VOUT
±10-V Output
–18 V
R8
10 kΩ
R9
40 kΩ
Figure 96. 0- to 20-mA and ±10-V Outputs Using DAC8562
40
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DAC8162, DAC8163
DAC7562, DAC7563
SLAS719C – AUGUST 2010 – REVISED JUNE 2011
www.ti.com
MICROPROCESSOR INTERFACING
DAC756x/DAC816x/DAC856x to an MSP430 USI Interface
Figure 97 shows a serial interface between the DAC756x, DAC816x, or DAC856x and a typical MSP430 USI port
such as the one found on the MSP430F2013. The port is configured in SPI master mode by setting bits 3, 5, 6,
and 7 in USICTL0. The USI counter interrupt is set in USICTL1 to provide an efficient means of SPI
communication with minimal software overhead. The serial clock polarity, source, and speed are controlled by
settings in the USI clock control register (USICKCTL). The SYNC signal is derived from a bit-programmable pin
on port 1; in this case, port line P1.4 is used. When data are to be transmitted to the DAC756x, DAC816x, or
DAC856x, P1.4 is taken low. The USI transmits data in 8-bit bytes; thus, only eight falling clock edges occur in
the transmit cycle. To load data to the DAC, P1.4 is left low after the first eight bits are transmitted; then, a
second write cycle is initiated to transmit the second byte of data. P1.4 is taken high following the completion of
the third write cycle.
MSP430F2013
DAC
P1.4/GPIO
SYNC
P1.5/SCLK
SCLK
P1.6/SDO
DIN
NOTE: Additional pins omitted for clarity.
Figure 97. DAC756x/DAC816x/DAC856x to MSP430 Interface
DAC756x/DAC816x/DAC856x to a TMS320 McBSP Interface
Figure 98 shows an interface between the DAC756x, DAC816x, or DAC856x and any TMS320 series DSP from
Texas Instruments with a multi-channel buffered serial port (McBSP). Serial data are shifted out on the rising
edge of the serial clock and are clocked into the DAC756x, DAC816x, or DAC856x on the falling edge of the
SCLK signal.
TMS320F28062
DAC
MFSxA
SYNC
MCLKxA
SCLK
MDxA
DIN
NOTE: Additional pins omitted for clarity.
Figure 98. DAC756x/DAC816x/DAC856x to TMS320 McBSP Interface
DAC756x/DAC816x/DAC856x to an OMAP-L1x Processor
Figure 99 shows a serial interface between the DAC756x/DAC816x/DAC856x and the OMAP-L138. The transmit
clock CLKx0 of the L138 drives SCLK of the DAC756x, DAC816x, or DAC856x, and the data transmit (Dx0)
output drives the serial data line of the DAC. The SYNC signal is derived from the frame sync transmit (FSx0)
line, similar to the TMS320 interface.
DAC
OMAP-L138
FSx0
SYNC
CLKx0
SCLK
Dx0
DIN
NOTE: Additional pins omitted for clarity.
Figure 99. DAC756x/DAC816x/DAC856x to OMAP-L1x Processor
Copyright © 2010–2011, Texas Instruments Incorporated
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41
DAC8562, DAC8563
DAC8162, DAC8163
DAC7562, DAC7563
SLAS719C – AUGUST 2010 – REVISED JUNE 2011
www.ti.com
LAYOUT
A precision analog component requires careful layout, adequate bypassing, and clean, well-regulated power
supplies. The DAC756x, DAC816x, and DAC856x offer single-supply operation, and are often used in close
proximity with digital logic, microcontrollers, microprocessors, and digital signal processors. The more digital logic
present in the design and the higher the switching speed, the more difficult it is to keep digital noise from
appearing at the output. As a result of the single ground pin of the DAC756x, DAC816x, and DAC856x, all return
currents (including digital and analog return currents for the DAC) must flow through a single point. Ideally, GND
would be connected directly to an analog ground plane. This plane would be separate from the ground
connection for the digital components until they were connected at the power-entry point of the system. The
power applied to AVDD should be well-regulated and low noise. Switching power supplies and dc/dc converters
often have high-frequency glitches or spikes riding on the output voltage. In addition, digital components can
create similar high-frequency spikes as their internal logic switches states. This noise can easily couple into the
DAC output voltage through various paths between the power connections and analog output. As with the GND
connection, AVDD should be connected to a power-supply plane or trace that is separate from the connection for
digital logic until they are connected at the power-entry point. In addition, a 1-µF to 10-µF capacitor and 0.1-µF
bypass capacitor are strongly recommended. In some situations, additional bypassing may be required, such as
a 100-µF electrolytic capacitor or even a pi filter made up of inductors and capacitors – all designed to essentially
low-pass filter the supply and remove the high-frequency noise.
42
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DAC8162, DAC8163
DAC7562, DAC7563
SLAS719C – AUGUST 2010 – REVISED JUNE 2011
www.ti.com
PARAMETER DEFINITIONS
With the increased complexity of many different specifications listed in product data sheets, this section
summarizes selected specifications related to digital-to-analog converters.
STATIC PERFORMANCE
Static performance parameters are specifications such as differential nonlinearity (DNL) or integral nonlinearity
(INL). These are dc specifications and provide information on the accuracy of the DAC. They are most important
in applications where the signal changes slowly and accuracy is required.
Differential Nonlinearity (DNL)
Differential nonlinearity (DNL) is defined as the maximum deviation of the real LSB step from the ideal 1 LSB
step. Ideally, any two adjacent digital codes correspond to output analog voltages that are exactly one LSB apart.
If the DNL is less than 1 LSB, the DAC is said to be monotonic.
Full-Scale Error
Full-scale error is defined as the deviation of the real full-scale output voltage from the ideal output voltage while
the DAC register is loaded with the full-scale code (0xFFFF). Ideally, the output should be VREF – 1 LSB or
2 × VREF – 1 LSB, depending on the DAC voltage gain. The full-scale error is expressed in percent of full-scale
range (% FSR).
Full-Scale Error Drift
Full-scale error drift is defined as the change in full-scale error with a change in temperature. Full-scale error drift
is expressed in units of ppm of FSR/°C.
Full-Scale Range (FSR)
Full-scale range (FSR) is the difference between the maximum and minimum analog output values that the DAC
is specified to provide; typically, the maximum and minimum values are also specified. For an n-bit DAC, these
values are usually given as the values matching with code 0 and 2n – 1.
Gain Error
Gain error is defined as the deviation in the slope of the real DAC transfer characteristic from the ideal transfer
function. Gain error is expressed as a percentage of full-scale range (% FSR).
Gain Temperature Coefficient
The gain temperature coefficient is defined as the change in gain error with changes in temperature. The gain
temperature coefficient is expressed in ppm of FSR/°C.
Least-Significant Bit (LSB)
The least significant bit (LSB) is defined as the smallest value in a binary coded system. The value of the LSB
can be calculated by dividing the full-scale output voltage by 2n, where n is the resolution of the converter.
Monotonicity
Monotonicity is defined as a slope whose sign does not change. If a DAC is monotonic, the output changes in
the same direction or remains constant for each step increase (or decrease) in the input code.
Most-Significant Bit (MSB)
The most significant bit (MSB) is defined as the largest value in a binary coded system. The value of the MSB
can be calculated by dividing the full-scale output voltage by 2. Its value is one-half of full-scale.
Offset Error
The offset error is defined as the difference between actual output voltage and the ideal output voltage in the
linear region of the transfer function. This difference is calculated by using a straight line defined by two codes
(code 512 and code 65,024). Because the offset error is defined by a straight line, it can have a negative or
positive value. Offset error is measured in mV.
Offset Error Drift
Offset error drift is defined as the change in offset error with a change in temperature. Offset error drift is
expressed in µV/°C.
Power-Supply Rejection Ratio (PSRR)
Power-supply rejection ratio (PSRR) is defined as the ratio of change in output voltage to a change in supply
voltage for a full-scale output of the DAC. The PSRR of a device indicates how the output of the DAC is affected
by changes in the supply voltage. PSRR is measured in decibels (dB).
Copyright © 2010–2011, Texas Instruments Incorporated
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DAC8562, DAC8563
DAC8162, DAC8163
DAC7562, DAC7563
SLAS719C – AUGUST 2010 – REVISED JUNE 2011
www.ti.com
Relative Accuracy or Integral Nonlinearity (INL)
Relative accuracy or integral nonlinearity (INL) is defined as the maximum deviation between the real transfer
function and a straight line passing through the endpoints of the ideal DAC transfer function. INL is measured in
LSBs.
Resolution
Generally, the DAC resolution can be expressed in different forms. Specifications such as IEC 60748-4
recognize the numerical, analog, and relative resolution. The numerical resolution is defined as the number of
digits in the chosen numbering system necessary to express the total number of steps of the transfer
characteristic, where a step represents both a digital input code and the corresponding discrete analogue output
value. The most commonly-used definition of resolution provided in data sheets is the numerical resolution
expressed in bits.
Zero-Code Error
The zero-code error is defined as the DAC output voltage, when all 0s are loaded into the DAC register.
Zero-code error is a measure of the difference between actual output voltage and ideal output voltage (0 V). It is
expressed in mV. It is primarily caused by offsets in the output amplifier.
Zero-Code Error Drift
Zero-code error drift is defined as the change in zero-code error with a change in temperature. Zero-code error
drift is expressed in µV/°C.
44
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DAC8162, DAC8163
DAC7562, DAC7563
SLAS719C – AUGUST 2010 – REVISED JUNE 2011
www.ti.com
DYNAMIC PERFORMANCE
Dynamic performance parameters are specifications such as settling time or slew rate, which are important in
applications where the signal rapidly changes and/or high frequency signals are present.
Channel-to-Channel Crosstalk
Crosstalk in a multi-channel DAC is defined as a glitch coupled onto the output of a channel (victim) when the
output of an adjacent channel (agressor) has a full-scale transition. It is calculated as the total area under the
measured glitch on the victim channel at mid-scale code. It is expressed in nV-s.
Channel-to-Channel DC Crosstalk
Channel-to-channel dc crosstalk is defined as the dc change in the output level of one DAC channel in response
to a change in the output of another DAC channel. It is measured with a full-scale output change on one DAC
channel while monitoring another DAC channel at mid-scale. It is expressed in LSB.
Code Change/Digital-to-Analog Glitch Impulse
Digital-to-analog glitch impulse is the impulse injected into the analog output when the input code in the DAC
register changes state. It is normally specified as the area of the glitch in nanovolt-seconds (nV-s), and is
measured when the digital input code is changed by 1 LSB at the major carry transition.
DAC Output Noise
DAC output noise is defined as any voltage deviation of DAC output from the desired value (within a particular
frequency band). It is measured with a DAC channel kept at mid-scale while filtering the output voltage within a
band of 0.1 Hz to 10 Hz and measuring its amplitude peaks. It is expressed in terms of peak-to-peak voltage
(VPP).
DAC Output Noise Density
Output noise density is defined as internally-generated random noise. Random noise is characterized as a
spectral density (nV/√Hz). It is measured by setting the DAC to mid-scale and measuring noise at the output.
Digital Feedthrough
Digital feedthrough is defined as the impulse seen at the output of the DAC from the digital inputs of the DAC. It
is measured when the DAC output is not updated. It is specified in nV-s, and measured with a full-scale code
change on the data bus; that is, from all 0s to all 1s and vice versa.
Output Voltage Settling Time
Settling time is the total time (including slew time) for the DAC output to settle within an error band around its
final value after a change in input. Settling times are specified to within ±0.024% FSR (or whatever value is
stated) of full-scale range.
Slew Rate
The output slew rate (SR) of an amplifier or other electronic circuit is defined as the maximum rate of change of
the output voltage for all possible input signals.
SR = max
DVOUT(t)
Dt
(7)
Where ΔVOUT(t) is the output produced by the amplifier as a function of time t.
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45
PACKAGE OPTION ADDENDUM
www.ti.com
1-Jul-2011
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
2500
DAC7562SDGSR
ACTIVE
MSOP
DGS
10
Eco Plan
(2)
Green (RoHS
& no Sb/Br)
Lead/
Ball Finish
MSL Peak Temp
(3)
(Requires Login)
CU NIPDAU Level-1-260C-UNLIM
DAC7562SDGST
ACTIVE
MSOP
DGS
10
250
TBD
DAC7562SDSCR
ACTIVE
SON
DSC
10
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
DAC7562SDSCT
ACTIVE
SON
DSC
10
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
DAC7563SDGSR
ACTIVE
MSOP
DGS
10
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
DAC7563SDGST
ACTIVE
MSOP
DGS
10
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
DAC7563SDSCR
ACTIVE
SON
DSC
10
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
DAC7563SDSCT
ACTIVE
SON
DSC
10
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
DAC8162SDGSR
ACTIVE
MSOP
DGS
10
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
DAC8162SDGST
ACTIVE
MSOP
DGS
10
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
DAC8162SDSCR
ACTIVE
SON
DSC
10
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
DAC8162SDSCT
ACTIVE
SON
DSC
10
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
DAC8163SDGSR
ACTIVE
MSOP
DGS
10
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
DAC8163SDGST
ACTIVE
MSOP
DGS
10
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
DAC8163SDSCR
ACTIVE
SON
DSC
10
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
DAC8163SDSCT
ACTIVE
SON
DSC
10
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
DAC8562SDGSR
ACTIVE
MSOP
DGS
10
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Addendum-Page 1
Call TI
Samples
Call TI
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
1-Jul-2011
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
DAC8562SDGST
ACTIVE
MSOP
DGS
10
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
DAC8562SDSCR
ACTIVE
SON
DSC
10
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
DAC8562SDSCT
ACTIVE
SON
DSC
10
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
DAC8563SDGSR
ACTIVE
MSOP
DGS
10
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
DAC8563SDGST
ACTIVE
MSOP
DGS
10
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
DAC8563SDSCR
ACTIVE
SON
DSC
10
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
DAC8563SDSCT
ACTIVE
SON
DSC
10
250
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
Samples
(Requires Login)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
1-Jul-2011
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jun-2011
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
DAC7562SDGSR
Package Package Pins
Type Drawing
MSOP
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
DGS
10
2500
330.0
12.4
5.3
3.3
1.3
8.0
12.0
Q1
DAC7562SDSCR
SON
DSC
10
3000
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
DAC7563SDGSR
MSOP
DGS
10
2500
330.0
12.4
5.3
3.3
1.3
8.0
12.0
Q1
DAC7563SDGST
MSOP
DGS
10
250
180.0
12.4
5.3
3.3
1.3
8.0
12.0
Q1
DAC7563SDSCR
SON
DSC
10
3000
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
DAC8162SDGSR
MSOP
DGS
10
2500
330.0
12.4
5.3
3.3
1.3
8.0
12.0
Q1
DAC8162SDGST
MSOP
DGS
10
250
180.0
12.4
5.3
3.3
1.3
8.0
12.0
Q1
DAC8162SDSCR
SON
DSC
10
3000
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
DAC8162SDSCT
SON
DSC
10
250
180.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
DAC8163SDGSR
MSOP
DGS
10
2500
330.0
12.4
5.3
3.3
1.3
8.0
12.0
Q1
DAC8163SDSCR
SON
DSC
10
3000
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
DAC8163SDSCT
SON
DSC
10
250
180.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
DAC8562SDGSR
MSOP
DGS
10
2500
330.0
12.4
5.3
3.3
1.3
8.0
12.0
Q1
DAC8562SDGST
MSOP
DGS
10
250
180.0
12.4
5.3
3.3
1.3
8.0
12.0
Q1
DAC8562SDSCR
SON
DSC
10
3000
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
DAC8562SDSCT
SON
DSC
10
250
180.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
DAC8563SDGSR
MSOP
DGS
10
2500
330.0
12.4
5.3
3.3
1.3
8.0
12.0
Q1
DAC8563SDSCR
SON
DSC
10
3000
330.0
12.4
3.3
3.3
1.1
8.0
12.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jun-2011
Device
DAC8563SDSCT
Package Package Pins
Type Drawing
SON
DSC
10
SPQ
250
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
180.0
12.4
3.3
B0
(mm)
K0
(mm)
P1
(mm)
3.3
1.1
8.0
W
Pin1
(mm) Quadrant
12.0
Q2
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DAC7562SDGSR
MSOP
DGS
10
2500
346.0
346.0
35.0
DAC7562SDSCR
SON
DSC
10
3000
346.0
346.0
29.0
DAC7563SDGSR
MSOP
DGS
10
2500
346.0
346.0
35.0
DAC7563SDGST
MSOP
DGS
10
250
203.0
203.0
35.0
DAC7563SDSCR
SON
DSC
10
3000
346.0
346.0
29.0
DAC8162SDGSR
MSOP
DGS
10
2500
346.0
346.0
35.0
DAC8162SDGST
MSOP
DGS
10
250
203.0
203.0
35.0
DAC8162SDSCR
SON
DSC
10
3000
346.0
346.0
29.0
DAC8162SDSCT
SON
DSC
10
250
190.5
212.7
31.8
DAC8163SDGSR
MSOP
DGS
10
2500
346.0
346.0
35.0
DAC8163SDSCR
SON
DSC
10
3000
346.0
346.0
29.0
DAC8163SDSCT
SON
DSC
10
250
190.5
212.7
31.8
DAC8562SDGSR
MSOP
DGS
10
2500
346.0
346.0
35.0
DAC8562SDGST
MSOP
DGS
10
250
203.0
203.0
35.0
DAC8562SDSCR
SON
DSC
10
3000
346.0
346.0
29.0
DAC8562SDSCT
SON
DSC
10
250
190.5
212.7
31.8
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
30-Jun-2011
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
DAC8563SDGSR
MSOP
DGS
10
2500
346.0
346.0
35.0
DAC8563SDSCR
SON
DSC
10
3000
346.0
346.0
29.0
DAC8563SDSCT
SON
DSC
10
250
190.5
212.7
31.8
Pack Materials-Page 3
IMPORTANT NOTICE
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