TI SN74LV4046APWR

SN74LV4046A
HIGH-SPEED CMOS LOGIC PHASE-LOCKED LOOP
WITH VCO
www.ti.com
SCES656C – FEBRUARY 2006 – REVISED APRIL 2007
FEATURES
•
•
•
•
•
•
Choice of Three Phase Comparators
– Exclusive OR
– Edge-Triggered J-K Flip-Flop
– Edge-Triggered RS Flip-Flop
Excellent VCO Frequency Linearity
VCO-Inhibit Control for ON/OFF Keying and
for Low Standby Power Consumption
Optimized Power-Supply Voltage Range From
3 V to 5.5 V
Wide Operating Temperature Range . . . –40°C
to 125°C
Latch-Up Performance Exceeds 250 mA Per
JESD 17
•
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
D, DGV, NS, OR PW PACKAGE
(TOP VIEW)
PCPOUT
PC1OUT
COMPIN
VCOOUT
INH
C1A
C1B
GND
1
16
2
15
3
14
4
13
5
12
6
11
7
10
8
9
VCC
PC3OUT
SIGIN
PC2OUT
R2
R1
DEMOUT
VCOIN
DESCRIPTION/ORDERING INFORMATION
The SN74LV4046A is a high-speed silicon-gate CMOS device that is pin compatible with the CD4046B and the
CD74HC4046. The device is specified in compliance with JEDEC Std 7.
The SN74LV4046A is a phase-locked loop (PLL) circuit that contains a linear voltage-controlled oscillator (VCO)
and three different phase comparators (PC1, PC2, and PC3). A signal input and a comparator input are common
to each comparator.
The signal input can be directly coupled to large voltage signals, or indirectly coupled (with a series capacitor) to
small voltage signals. A self-bias input circuit keeps small voltage signals within the linear region of the input
amplifiers. With a passive low-pass filter, the SN74LV4046A forms a second-order loop PLL. The excellent VCO
linearity is achieved by the use of linear operational amplifier techniques.
ORDERING INFORMATION (1)
TA
PACKAGE
SOP – NS
–40°C to 125°C
SOIC – D
TSSOP – PW
TVSOP – DGV
(1)
ORDERABLE PART NUMBER
Tube of 50
SN74LV4046ANS
Reel of 2000
SN74LV4046ANSR
Tube of 40
SN74LV4046AD
Reel of 2500
SN74LV4046ADR
Tube of 90
SN74LV4046APW
Reel of 2000
SN74LV4046APWR
Reel of 2000
SN74LV4046ADGVR
TOP-SIDE MARKING
74LV4046A
LV4046A
LW046A
LW046A
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006–2007, Texas Instruments Incorporated
SN74LV4046A
HIGH-SPEED CMOS LOGIC PHASE-LOCKED LOOP
WITH VCO
www.ti.com
SCES656C – FEBRUARY 2006 – REVISED APRIL 2007
PIN DESCRIPTION
PIN NO.
SYMBOL
NAME AND FUNCTION
1
PCPOUT
Phase comparator pulse output
2
PC1OUT
Phase comparator 1 output
3
COMPIN
Comparator input
4
VCOOUT
VCO output
5
INH
Inhibit input
6
C1A
Capacitor C1 connection A
7
C1B
Capacitor C1 connection B
8
GND
Ground (0 V)
9
VCOIN
10
DEMOUT
11
R1
Resistor R1 connection
12
R2
Resistor R2 connection
13
PC2OUT
14
SIGIN
15
PC3OUT
16
VCC
VCO input
Demodulator output
Phase comparator 2 output
Signal input
Phase comparator 3 output
Positive supply voltage
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
DC supply voltage range
–0.5
7
V
VI
Input voltage range
–0.5
VCC + 0.5
V
VO
Output voltage range
–0.5
VCC + 0.5
IIK
Input clamp current
VI < 0
–20
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output curent
VO = 0 to VCC
±35
mA
ICC
DC VCC or ground current
±70
mA
D package
θJA
Package thermal impedance (2)
Tstg
(1)
(2)
V
73
DGV package
120
NS package
64
PW package
108
Storage temperature range
UNIT
–65
°C/W
°C
150
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions
PARAMETER
2
TA
Operating free-air temperature
VCC
Supply voltage
VI, VO
DC input or output voltage
Submit Documentation Feedback
MIN
MAX
UNIT
–40
125
°C
3
5.5
V
0
VCC
V
SN74LV4046A
HIGH-SPEED CMOS LOGIC PHASE-LOCKED LOOP
WITH VCO
www.ti.com
SCES656C – FEBRUARY 2006 – REVISED APRIL 2007
Electrical Specifications
TEST CONDITIONS
PARAMETER
VI (V)
IO (mA)
VCC (V)
MIN
3 to 3.6
VCC × 0.7
4.5 to 5.5
VCC × 0.7
TYP
MAX
UNIT
VCO
VIH
High-level input voltage INH
VIL
Low-level input voltage
INH
VOH
High-level
output voltage
VCOOUT
Low-level
output voltage
VOL
VCOOUT
CMOS
VIL or VIH
TTL
–12
CMOS
0.05
VIL or VIH
TTL
C1A, C1B
(test purposes only)
II
Input leakage current
–0.05
INH, VCOIN
3 to 5.5
VCC × 0.3
4.5 to 5.5
VCC × 0.3
3 to 3.6
VCC – 0.1
4.5 to 5.5
VCC – 0.1
4.5 to 5.5
3.8
4.5 to 5.5
0.1
4.5 to 5.5
0.55
12
4.5 to 5.5
0.65
±1
µA
50
kΩ
3 to 5.5
3
50
kΩ
3 to 3.6
40
4.5 to 5.5
40
No Limit
pF
3 to 3.6
1.1
1.9
4.5 to 5.5
1.1
3.2
R2 range (1)
C1 capacitance range
Over the range specified
for R1 for linearity (2)
V
3
5.5
3 to 5.5
VCOIN
0.1
12
VCC or GND
V
V
3 to 3.6
R1 range (1)
Operating voltage
range
V
V
Phase Comparator
DC-coupled high-level
input voltage
SIGIN,
COMPIN
VIL
DC-coupled low-level input voltage
SIGIN,
COMPIN
VOH
High-level
output voltage
VIH
Low-level
output voltage
VOL
4.5 to 5.5
VCC × 0.7
3 to 3.6
VCC × 0.3
4.5 to 5.5
VCC × 0.3
3 to 5.5
VCC – 0.1
–6
3 to 3.6
2.48
TTL
–12
4.5 to 5.5
3.8
CMOS
0.02
CMOS
PCPOUT,
PCNOUT
VIL or VIH
VIL or VIH
4
II
Input leakage current
SIGIN,
COMPIN
VCC or GND
IOZ
3-state off-state current
PC2OUT
VIL or VIH
Input resistance
VCC × 0.7
–0.05
PCPOUT,
PCNOUT
TTL
RI
3 to 3.6
SIGIN,
COMPIN
VI at self-bias operating
point, VI = 0.5 V
V
V
3 to 3.6
0.1
4.5 to 5.5
0.1
4.5 to 5.5
0.4
3 to 3.6
±11
4.5 to 5.5
±29
±5
3 to 5.5
3
800
4.5
250
V
µA
µA
kΩ
Demodulator
RS
Resistor range
RS > 300 kΩ, Leakage
current can influence
VDEMOUT
VOFF
Offset voltage VCOIN to VDEM
VI = VVCOIN = VCC/2,
Values taken over RS
range
ICC
Quiescent device current
(1)
(2)
Pins 3, 5, and 14 at VCC,
Pin 9 at GND, II at pins 3
and 14 to be excluded
3 to 3.6
50
300
4.5 to 5.5
50
300
3 to 3.6
±30
4.5 to 5.5
±20
5.5
kΩ
mV
50
µA
The value for R1 and R2 in parallel should exceed 2.7 kΩ.
The maximum operating voltage can be as high as VCC – 0.9 V; however, this may result in an increased offset voltage.
Submit Documentation Feedback
3
SN74LV4046A
HIGH-SPEED CMOS LOGIC PHASE-LOCKED LOOP
WITH VCO
www.ti.com
SCES656C – FEBRUARY 2006 – REVISED APRIL 2007
Switching Specifications
CL = 50 pF, Input tr, tf = 6 ns
PARAMETER
TEST CONDITIONS
VCC
(V)
MIN
TYP
MAX
UNIT
Phase Comparator
3 to 3.6
135
4.5 to 5.5
50
3 to 3.6
300
4.5 to 5.5
60
3 to 3.6
200
4.5 to 5.5
50
tPLH, tPHL
Propagation delay
SIGIN, COMPIN to
PC1OUT
tPLH, tPHL
Propagation delay
SIGIN, COMPIN to
PCPOUT
tPLH, tPHL
Propagation delay
SIGIN, COMPIN to
PC3OUT
tTHL, tTLH
Output transition time
3 to 3.6
75
4.5 to 5.5
15
tPZH, tPZL
3-state output enable time
SIGIN, COMPIN to
PC2OUT
3 to 3.6
270
4.5 to 5.5
54
tPHZ, tPLZ
3-state output disable time
SIGIN, COMPIN to
PC2OUT
3 to 3.6
320
4.5 to 5.5
65
AC-coupled input sensitivity
(P-P) at SIGIN or
COMPIN
VI(P-P)
3 to 3.6
11
4.5 to 5.5
15
ns
ns
ns
ns
ns
ns
mV
VCO
∆f/∆T
fMAX
Frequency stability with temperature change
Maximum frequency
Center frequency (duty 50%)
∆fVCO
VI = VCOIN = 1/2 VCC,
R1 = 100 kΩ,
R2 = ∞,
C1 = 100 pF
C1 = 50 pF,
R1 = 3.5 kΩ,
R2 = ∞
C1 = 0 pF,
R1 = 9.1 kΩ,
R2 = ∞
C1 = 40 pF,
R1 = 3 kΩ,
R2 = ∞,
VCOIN = VCC/2
3 to 3.6
0.11
4.5 to 5.5
0.11
3 to 3.6
24
4.5 to 5.5
24
3 to 3.6
38
4.5 to 5.5
38
3 to 3.6
7
10
4.5 to 5.5
12
17
4.5 (1)
15 (1)
%/°C
MHz
MHz
17.5 (1)
C1 = 100 pF,
R1 = 100 kΩ,
R2 = ∞
3 to 3.6
0.4
Frequency linearity
4.5 to 5.5
0.4
Offset frequency
C1 = 1 nF,
R2 = 220 kΩ
3 to 3.6
400
4.5 to 5.5
400
%
kHz
Demodulator
VOUT vs fIN
(1)
4
C1 = 100 pF,
C2 = 100 pF,
R1 = 100 kΩ,
R2 = ∞,
R3 = 100 kΩ
Data is specified at 25°C
Submit Documentation Feedback
3
4.5
8
330
mV/kHz
SN74LV4046A
HIGH-SPEED CMOS LOGIC PHASE-LOCKED LOOP
WITH VCO
www.ti.com
SCES656C – FEBRUARY 2006 – REVISED APRIL 2007
APPLICATION INFORMATION
AVERAGE OUTPUT VOLTAGE
vs
INPUT PHASE DIFFERENCE
AVERAGE OUTPUT VOLTAGE
vs
INPUT PHASE DIFFERENCE
V CC
VCC
V DEMOUT (AV)
VDEMOUT (AV)
1/2 V CC
1/2 V CC
0
–3605
0
05
905
φDEMOUT
1805
Figure 1. Phase Comparator 1:
VDEMOUT = VPC1OUT = (VCC/π) (SIGIN – COMPIN);
DEMOUT = (SIGIN – COMPIN)
φ DEMOUT
3605
Figure 2. Phase Comparator 2:
VDEMOUT = VPC2OUT = (VCC/4) (SIGIN – COMPIN);
DEMOUT = (SIGIN – COMPIN)
SIGIN
SIGIN
COMPIN
COMPIN
VCOOUT
VCOOUT
05
VCC
GND
PC2 OUT
PC1OUT
High-Impedance Off State
VCC
VCO IN
VCOIN
GND
PCPOUT
Figure 3. Typical Waveforms for PLL Using
Phase Comparator 1, Loop Locked at fo
Figure 4. Typical Waveforms for PLL Using
Phase Comparator 2, Loop Locked at fo
AVERAGE OUTPUT VOLTAGE
vs
INPUT PHASE DIFFERENCE
VCC
SIGIN
VDEMOUT(AV)
COMPIN
VCOOUT
1/2 VCC
PC3OUT
VCC
VCOIN
GND
0
05
1805
fDEMOUT
3605
Figure 5. Phase Comparator 3:
VDEMOUT = VPC3OUT = (VCC/2π) (SIGIN – COMPIN);
DEMOUT = (SIGIN – COMPIN)
Figure 6. Typical Waveforms for PLL Using
Phase Comparator 3, Loop Locked at fo
Submit Documentation Feedback
5
SN74LV4046A
HIGH-SPEED CMOS LOGIC PHASE-LOCKED LOOP
WITH VCO
www.ti.com
SCES656C – FEBRUARY 2006 – REVISED APRIL 2007
APPLICATION INFORMATION (continued)
SIGIN, COMPIN
Inputs
SIGIN
Inputs
VS
tPHL
tPLH
PCPOUT, PC1OUT,
PC3OUT
Outputs
VS
COMPIN
Inputs
VS
tPHZ
VS
tPZL
tPZH
tTHL
PC2OUT
Output
tTLH
tPLZ
90%
VS
10%
Figure 7. Input-to-Output Propagation Delays and
Output Transition Times
Figure 8. 3-State Enable and Disable Times for PC2OUT
CPD (1)
CHIP SECTION
120
VCO
120
(1)
6
CPD
Comparator 1
R1 between 3 kΩ and 50 kΩ
R2 between 3 kΩ and 50 kΩ
R1 + R2 parallel value > 2.7 kΩ
C1 > 40 pF
Submit Documentation Feedback
UNIT
pF
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LV4046AD
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4046ADG4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4046ADGVR
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4046ADGVRG4
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4046ADR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4046ADRG4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4046AN
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LV4046ANE4
ACTIVE
PDIP
N
16
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
SN74LV4046ANS
ACTIVE
SO
NS
16
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4046ANSG4
ACTIVE
SO
NS
16
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4046ANSR
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4046ANSRG4
ACTIVE
SO
NS
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4046APW
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4046APWG4
ACTIVE
TSSOP
PW
16
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4046APWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV4046APWRG4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2007
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SN74LV4046ADGVR
TVSOP
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
8.0
12.0
Q1
DGV
16
2000
330.0
12.4
6.8
4.0
1.6
W
Pin1
(mm) Quadrant
SN74LV4046ADR
SOIC
D
16
2500
330.0
16.4
6.5
10.3
2.1
8.0
16.0
Q1
SN74LV4046ANSR
SO
NS
16
2000
330.0
16.4
8.2
10.5
2.5
12.0
16.0
Q1
SN74LV4046APWR
TSSOP
PW
16
2000
330.0
12.4
7.0
5.6
1.6
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74LV4046ADGVR
TVSOP
DGV
16
2000
346.0
346.0
29.0
SN74LV4046ADR
SOIC
D
16
2500
333.2
345.9
28.6
SN74LV4046ANSR
SO
NS
16
2000
346.0
346.0
33.0
SN74LV4046APWR
TSSOP
PW
16
2000
346.0
346.0
29.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
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Clocks and Timers
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amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
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Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
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