TDA7479 Single chip RDS demodulator + filter Features ■ Very high RDS demodulation quality with improved digital signal processing ■ High performance, 57 kHz bandpass filter (8th order) ■ FIlter adjustment free and without external components ■ Purely digitaL RDS Demodulation without external components ■ ARI (SK indication) and RDS signal quality output ■ 4.332 MHz crystal oscillator (8.664 and 17.328 MHz optional) ■ Low noise CMOS technology ■ Low radiation SO16 TSSOP16 Description The TDA7479 recovers the additional inaudible RDS information which is transmitted by FM radio broadcasting stations and operates in accordance with the EBU (European Broadcasting Union) specifications. Table 1. The device is made up of two sections: a cascaded antialiasing + switched capacitors 8th bandpass filter for precise RDS band selection and a demodulating section that performs the extraction od RDS data stream (RDDA) and clock (RDCL), to be further processed by a suitable RDS decoder. Outputs for RDS signal quality and ARI indication are also present. Device summary Order code Package Packing E-TDA7479D(1) SO16 Tube E-TDA7479AD(1) TSSOP16 Tube 1. Device in ECOPACK® package (see Section 5: Package information on page 9). November 2008 Rev 7 1/12 www.st.com 12 Contents TDA7479 Contents 1 2 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3 Output timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4 Oscillator controls (FSEL, OSEL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 5 Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2/12 TDA7479 Block diagram and pin description 1 Block diagram and pin description 1.1 Block diagram Figure 1. Block diagram C1 27pF T57 4.332MHz C2 47pF OSCIN OSCOUT 13 15 14 4 MPX 2nd ORDER ANTIALIASING FILTER 270pF 5 OSCILLATOR & DIVIDER 9 16 FILOUT 8th ORDER SC-BANDPASS FILTER 8 1187.5Hz PLL 57KHz PLL 7 1 FAST ARI INDICATOR 12 VS QUAL DET. OSEL FSEL RDCL ARI QUAL 100nF VREF - 3 POLARITY BIPHASE DEC. + 0 1 10μF MUX DIFF. DECODER 10 INTEGRAL BIPHASE DEC. TEST LOGIC 6 RDDA TM 11 GND 1.2 2 EXTRES D97AU751A Pin description Figure 2. Pin connection (top view) QUAL 1 16 RDCL RDDA 2 15 T57 VREF 3 14 OSCOUT MPX 4 13 OSCIN OSEL 5 12 VS GND 6 11 EXTRES ARI 7 10 TM FILOUT 8 9 FSEL D97AU752 3/12 Block diagram and pin description Table 2. Pin description No pin Name 1 QUAL Output for signal quality indication (High = good) 2 RDDA RDS data output 3 VREF Reference voltage 4 MPX RDS input signal 5 OSEL Oscillator selector pin: – open, closed to VS = quartz oscillator – closed to GND = external driven 6 GND Ground 7 ARI Output for ARI indication: – high when RDS+ARI are present – high when only ARI is present – low when only RDS is present – undefined when nos signal is present 8 FILOUT 9 10 11 FSEL TM Description Filter output Frequency selector pin: – 100 kHz to VS = 17.328 MHz – open = 4.332MHz – closed to VS = 8.664 MHz Test mode pin: – open = normal operation – closed to VS = test mode Reset pin: EXTRES – open = run mode – -closed to VS = reset condition 12 VS Supply voltage 13 OSCIN Oscillator input 14 4/12 TDA7479 OSCOUT Oscillator output 15 T57 16 RDCL Testing output pin: 57 kHz clock output RDS clock output 1187.5 Hz TDA7479 Electrical specification 2 Electrical specification 2.1 Thermal data Table 3. Thermal data Symbol Rth j-case 2.2 Parameter Thermal resistance junction to case SO16 TSSOP16 Unit 200 160 °C/W Max. Absolute maximum ratings Table 4. Absolute maximum ratings Symbol Parameter Unit VS Supply voltage -0.3 to 7 V Top Operating temperature range -40 to 85 °C Tstg Storage temperature -55 to 150 °C 2.3 Electrical characteristics Table 5. Electrical characteristics (Tamb = 25°C, VS = 5V, unless otherwise specified) Symbol Value Parameter VS Supply voltage IS Supply current Test condition Min. Typ. Max. Unit 4.5 5 5.5 V 7.5 11.0 mA Filter fC BW G A Center frequency 56.5 57 57.5 kHz 3dB Bandwidth 2.5 3 3.5 kHz f = 57 kHz 18 20 22 dB Δf ± 4 kHz 18 22 dB f = 38 kHz 50 60 dB f = 67 kHz 35 45 dB 120 Gain Attenuation RI Input impedance of MPX 80 RL Load impedance on FILOUT 1 S/N Signal to noise ratio VIN = 3 mVrms MPX input signal f = 19 kHz; T3 ≤ 40 f = 57 kHz (RDS+ ARI) VIN 30 dB(1) 150 KΩ MΩ 40 dB 1000 50 mVRMS mVRMS SRDS RDS detection sensitivity 1 mVrms SARI ARI Detection Sensitivity 3 mVrms 5/12 Electrical specification Table 5. TDA7479 Electrical characteristics (continued) (Tamb = 25°C, VS = 5V, unless otherwise specified) Symbol Parameter VREF Test condition Min. Reference Typ. Max. VS/2 Unit V Demodulator Input pins (EXTRES, FSEL, TM:) Input pin (OSEL): all with internal pull down resistor with internal pull up resistor IPD Input current VIN = 5 V (pull-down input) 15 30 μA IPU Input current VIN = 0 V (pull-up input) -25 -10 μA VIH Input voltage high VIL Input voltage low 0.7 · VS 0.8 · VS V 0.2 · VS 0.3 · VS V Output pins (RDCL, RDDA, ARI, QUAL, T57) VOH Output voltage high IL = 0.5mA 4 4.6 VOL Output voltage low IL = 0.5mA Input level OSCIN pin OSEL = open circuit Input level OSCIN pin OSEL = open circuit Amplitude OSCOUT OSEL = open circuit 4.5 V OSEL = GND, f = 4.332 MHz OSEL = GND, f = 8.664 MHz 100 120 mVpp mVpp OSEL = GND, f = 17.328 MHz 150 mVpp 0.4 V 1 V 1 V Oscillator VCLL VCLH Amplitude OSCIN (for external drive) VPP 1. The 6/12 3rd 4 harmonic (57 kHz) must be less than -40 dB with respect to the input signal plus gain. V TDA7479 3 Output timing Output timing The RDS (1187.5Hz) output clock on RDCL line is synchronized to the incoming data. According to the internal PLL lock condition data change can result on the falling or on the rising clock edge (see Figure 3). Whichever clock edge is used by the decoder (rising or falling edge) the data will remain valid for 416.7 µs after the clock transition. Figure 3. RDS timing diagram RDCL CLOCK LINE DATA LINE RDDA 4.3µs td 837.7µs 421µs 421µs 4.3µs 7/12 Oscillator controls (FSEL, OSEL) 4 TDA7479 Oscillator controls (FSEL, OSEL) Three different crystal frequencies can be used. The adoption of the internal clock divider to the external crystal is achieved via the input pin FSEL. See the following table for reference: Table 6. Crystal frequencies Crystal 4.332MHz 8.664MHz 17.328MHz FSEL (pin configuration) connected to GND or open connected to Vs external resistor of 100K to Vs A special mode is introduced to reduce EMI. With pin OSEL connected to GND the internal oscillator is switched off and an external sinusoidal frequency could be applied on OSCIN. The peak to peak voltage of this signal can be reduced down to 60mV. In this mode the frequency selection via FSEL is still active. Suggested values of C1 and C2 are shown in the following table: Table 7. 8/12 C1 and C2 value Crystal C1 C2 4.332MHz 8.664MHz 17.328MHz 27pF 27pF 27pF 47pF - TDA7479 5 Package information Package information In order to meet environmental requirements, ST (also) offers these devices in ECOPACK® packages. ECOPACK® packages are lead-free. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Figure 4. SO16 mechanical data and package dimensions mm inch DIM. MIN. TYP. MAX. MIN. TYP. MAX. A 2.35 2.65 0.093 0.104 A1 0.10 0.30 0.004 0.012 B 0.33 0.51 0.013 0.200 C 0.23 0.32 0.009 0.013 D (1) 10.10 10.50 0.398 0.413 E 7.40 7.60 0.291 0.299 e 1.27 0.050 H 10.0 10.65 0.394 0.419 h 0.25 0.75 0.010 0.030 L 0.40 1.27 0.016 0.050 k ddd OUTLINE AND MECHANICAL DATA 0˚ (min.), 8˚ (max.) 0.10 0.004 (1) “D” dimension does not include mold flash, protusions or gate burrs. Mold flash, protusions or gate burrs shall not exceed 0.15mm per side. SO16 (Wide) 0016021 C 9/12 Package information Figure 5. TDA7479 TSSOP16 mechanical data and package dimensions mm inch DIM. MIN. TYP. A MAX. MIN. TYP. 1.200 A1 0.050 A2 0.800 b 0.190 1.000 MAX. 0.047 0.150 0.002 1.050 0.031 0.300 0.007 0.200 0.005 5.100 0.114 0.006 0.039 0.041 0.012 c 0.090 D (1) 4.900 E 6.200 6.400 6.600 0.244 0.252 0.260 E1 (1) 4.300 4.400 4.500 0.170 0.173 0.177 e L L1 k aaa 5.000 0.650 0.450 0.600 OUTLINE AND MECHANICAL DATA 0.009 0.118 0.122 0.026 0.750 0.018 1.000 0.024 0.030 0.039 0˚ (min.) 8˚ (max.) 0.100 0.004 Note: 1. D and E1 does not include mold flash or protrusions. Mold flash or potrusions shall not exceed 0.15mm (.006inch) per side. TSSOP16 (Body 4.4mm) 0080338 (Jedec MO-153-AB) 10/12 TDA7479 6 Revision history Revision history Table 8. Document revision history Date Revision 10-Sep-2004 4 Initial release. 20-Nov-2004 5 Add in Table 5: Electrical characteristics on page 5 the “RDS and ARI Detection Sensitivity” parameters. 02-Dec-2004 6 Modified the order codes table. 7 Document reformatted. Updated Table 1: Device summary on page 1. Updated Section 5: Package information on page 9. 04-Nov-2008 Changes 11/12 TDA7479 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. © 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 12/12