TL971, TL972, TL974 OUTPUT RAIL-TO-RAIL VERY-LOW-NOISE OPERATIONAL AMPLIFIERS www.ti.com FEATURES • • • • • • • Rail-to-Rail Output Voltage Swing: ±2.4 V at VCC = ±2.5 V Very Low Noise Level: 4 nV/√Hz Ultra-Low Distortion: 0.003% High Dynamic Features: 12 MHz, 4 V/µs Operating Range: 2.7 V to 15 V Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Performance Tested Per JESD 22 – 2000-V Human-Body Model (A114-B) – 200-V Machine Model (A115-A) – 1500-V Charged-Device Model (C101) SLOS467A – OCTOBER 2006 – REVISED OCTOBER 2006 TL971...DBV PACKAGE (TOP VIEW) OUT VCC– IN+ 1 5 VCC+ 4 IN– 2 3 TL971...D PACKAGE (TOP VIEW) NC IN– IN+ VCC– 1 8 2 7 3 6 4 5 NC VCC+ OUT NC NC – No internal connection APPLICATIONS • • • • Portable Equipment (CD Players, PDAs) Portable Communications (Cell Phones, Pagers) Instrumentation and Sensors Professional Audio Circuits DESCRIPTION/ORDERING INFORMATION The TL97x family of operational amplifiers operates at voltages as low as ±1.35 V and features output rail-to-rail signal swing. The TL97x boast characteristics that make them particularly well suited for portable and battery-supplied equipment. Very low noise and low distortion characteristics make them ideal for audio preamplification. The TL971 is housed in the space-saving 5-pin SOT-23 package, which simplifies board design because of the ability to be placed anywhere (outside dimensions are 2.8 mm × 2.9 mm). TL972...D, P, OR PW PACKAGE (TOP VIEW) OUT1 IN1– IN1+ VCC– 1 8 VCC+ 2 7 3 6 4 5 OUT2 IN2– IN2+ TL972...DRG PACKAGE (TOP VIEW) OUT1 1 IN1– 2 8 VCC+ 7 OUT2 IN1+ 3 6 IN2– VCC– 4 5 IN2+ TL974...D, N, OR PW PACKAGE (TOP VIEW) OUT1 IN1– IN1+ VCC+ 1 14 2 13 3 12 4 11 IN2+ IN2– OUT2 5 10 6 9 7 8 OUT4 IN4– IN4+ VCC– IN3+ IN3– OUT3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006, Texas Instruments Incorporated TL971, TL972, TL974 OUTPUT RAIL-TO-RAIL VERY-LOW-NOISE OPERATIONAL AMPLIFIERS www.ti.com SLOS467A – OCTOBER 2006 – REVISED OCTOBER 2006 ORDERING INFORMATION PACKAGE (1) TA Reel of 2500 TL971IDR Tube of 75 TL971ID Reel of 3000 TL971IDBVR Reel of 250 TL971IDBVT PDIP – P Tube of 50 TL972IP QFN – DRG Reel of 1000 TL972IDRGR Reel of 2500 TL972IDR Tube of 75 TL972ID Reel of 2000 TL972IPWR Tube of 150 TL972IPW Tube of 25 TL974IN Reel of 2500 TL974IDR Tube of 50 TL974ID Reel of 2000 TL974IPWR Tube of 90 TL974IPW SOIC – D Single SOT-23 – DBV –40°C to 125°C Dual SOIC – D TSSOP – PW PDIP – N Quad SOIC – D TSSOP – PW (1) 2 ORDERABLE PART NUMBER TOP-SIDE MARKING PREVIEW PREVIEW PREVIEW PREVIEW PREVIEW TL974IN SR974I SR974I Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Submit Documentation Feedback TL971, TL972, TL974 OUTPUT RAIL-TO-RAIL VERY-LOW-NOISE OPERATIONAL AMPLIFIERS www.ti.com SLOS467A – OCTOBER 2006 – REVISED OCTOBER 2006 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) VCC Supply voltage range (2) VID Differential input voltage (3) VIN Input voltage (4) MAX 2.7 17 V ±1 V VCC+ + 0.3 V VCC– – 0.3 D package (5) Package thermal impedance, junction to free air 8 pin 97 14 pin 86 package (5) 206 DRG package (6) 44 N package (5) 80 DBV θJA MIN P package (5) PW package (5) TJ Maximum junction temperature Tlead Maximum lead temperature Tstg Storage temperature range (1) (2) (3) (4) (5) (6) °C/W 85 8 pin 149 14 pin 113 Soldering, 10 s –65 Human-Body Model (HBM) ESD UNIT 150 °C 260 °C 150 °C 2 kV Machine Model (MM) 200 V Charged-Device Model (CDM) 1.5 kV Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values, except differential voltages, are with respect to network ground terminal. Differential voltages for the noninverting input terminal are with respect to the inverting input terminal. The input and output voltages must never exceed VCC + 0.3 V. Package thermal impedance is calculated in accordance with JESD 51-7. Package thermal impedance is calculated in accordance with JESD 51-5. Recommended Operating Conditions VCC Supply voltage VICM Common-mode input voltage TA Operating free-air temperature MIN MAX 2.7 15 VCC– + 1.15 VCC+ – 1.15 –40 Submit Documentation Feedback 125 UNIT V V °C 3 TL971, TL972, TL974 OUTPUT RAIL-TO-RAIL VERY-LOW-NOISE OPERATIONAL AMPLIFIERS www.ti.com SLOS467A – OCTOBER 2006 – REVISED OCTOBER 2006 Electrical Characteristics VCC+ = 2.5 V, VCC– = –2.5 V, full-range TA = –40°C to 125°C (unless otherwise noted) PARAMETER 4 TEST CONDITIONS TA MIN 25°C TYP MAX 1 4 VIO Input offset voltage αVIO Input offset voltage drift VICM = 0 V, VO = 0 V 25°C 5 IIO Input offset current VICM = 0 V, VO = 0 V 25°C 10 150 25°C 200 750 Full range VICM = 0 V, VO = 0 V 6 UNIT mV µV/°C nA IIB Input bias current VICM Common-mode input voltage 25°C –1.35 CMRR Common-mode rejection ratio VICM = ±1.35 V 25°C 60 85 dB SVR Supply-voltage rejection ratio VCC = ±2 V to ±3 V 25°C 60 70 dB AVD Large-signal voltage gain RL = 2 kΩ 25°C 70 80 dB VOH High-level output voltage RL = 2 kΩ 25°C 2 2.4 VOL Low-level output voltage RL = 2 kΩ 25°C Isource Output source current Isink Output sink current ICC Supply current (per amplifier) Unity gain, No load GBWP Gain bandwidth product f = 100 kHz, RL = 2 kΩ, CL = 100 pF Full range 25°C VCC = 2.5 V VCC = 2.5 V 1000 1.35 –2.4 1.3 Full range 1 25°C 50 Full range 25 25°C mA 2.8 3.2 25°C 8.5 12 25°C 3.5 5 V mA 80 2 V V –2 1.5 Full range nA mA MHz SR Slew rate AV = 1, VIN = ±1 V Φm Phase margin at unity gain RL = 2kΩ, CL =100 pF 25°C 60 Gm Gain margin RL = 2kΩ, CL =100 pF 25°C 10 dB en Equivalent input noise voltage f = 100 kHz 25°C 4 nV/√Hz THD Total harmonic distortion f = 1 kHz, Av = –1, RL = 10 kΩ 25°C 0.003 Submit Documentation Feedback Full range 3 V/µs ° % TL971, TL972, TL974 OUTPUT RAIL-TO-RAIL VERY-LOW-NOISE OPERATIONAL AMPLIFIERS www.ti.com SLOS467A – OCTOBER 2006 – REVISED OCTOBER 2006 TYPICAL CHARACTERISTICS 160 50 40 120 40 120 30 80 30 80 20 40 20 40 10 0 10 0 50 f O = 8.4 MHz 0 -40 -10 -20 -30 Gain – dB 60 ΦMM = 63.7° Phase – ° 200 60 Gain – dB GAIN AND PHASE vs FREQUENCY -40 1k 1.E+03 10k 1.E+04 100k 1.E+05 1M 1.E+06 10M 1.E+07 -40 -80 VCC = 5 V -160 CL = 100 pF -40 1k 1.E+03 -200 100M 1.E+08 -120 RL = 10 k© kΩ -30 -160 CL = 100 pF 0 -20 -120 k© RL = 10 kΩ 160 f O = 17.3 MHz -10 -80 VCC = 2.7 V 200 Φ M = 64.4° Phase – ° GAIN AND PHASE vs FREQUENCY 10k 1.E+04 100k 1.E+05 1M 1.E+06 10M 1.E+07 -200 100M 1.E+08 f – Frequency – Hz f – Frequency – Hz TOTAL HARMONIC DISTORTION vs FREQUENCY TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT VOLTAGE 1 1 VCC = 2.7 V f = 1 kHz Gain = -1 V/V VCC = 5 V VIN = 1 Vrms Gain = -1 V/V THD + Noise – % THD – % 0.1 0.01 RL = 2 kΩ k◊ 0.1 RL = 10 kΩ kΩ RL = 2 k 0.01 0.001 RL = 10 kΩ k◊ 0.0001 10 1.E+01 0.001 100 1.E+02 1.E+03 1k 10k 1.E+04 1.E+05 100k 0 Frequency – Hz 0.25 0.5 0.75 1 1.25 1.5 Output Voltage – Vrms Submit Documentation Feedback 5 TL971, TL972, TL974 OUTPUT RAIL-TO-RAIL VERY-LOW-NOISE OPERATIONAL AMPLIFIERS www.ti.com SLOS467A – OCTOBER 2006 – REVISED OCTOBER 2006 TYPICAL CHARACTERISTICS (continued) TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT VOLTAGE INPUT VOLTAGE NOISE vs FREQUENCY 100 1 nV/√Hz Input Voltage Noise – nV/sqrt(Hz) VCC = 5 V f = 1 kHz Gain = -1 V/V THD + Noise – % 0.1 0.01 kΩ RL = 2 k 0.001 RL = 10 kΩ k 0.25 0.5 0.75 1 1.25 1.5 1.75 VCC = 10 V RS = 100 Ω © AV = 40 dB 1 10 100 1.E+01 1.E+02 0.0001 0 10 2 1k 1.E+03 10k 1.E+04 100k 1.E+05 f – Frequency – Hz Output Voltage – Vrms GAIN BANDWIDTH PRODUCT vs OUTPUT CURRENT GAIN BANDWIDTH PRODUCT vs SUPPLY VOLTAGE 20 32 CL = 250 pF Gain Bandwidth Product – MHz Gain Bandwidth Product – MHz 28 16 12 8 4 CL = 130 pF 24 CL = 30 pF 20 16 12 8 4 0 0 -2 -1.5 -1 -0.5 0 0.5 1 1.5 2 2 6 8 10 Supply Voltage – V Output Current – mA 6 4 Submit Documentation Feedback 12 14 TL971, TL972, TL974 OUTPUT RAIL-TO-RAIL VERY-LOW-NOISE OPERATIONAL AMPLIFIERS www.ti.com SLOS467A – OCTOBER 2006 – REVISED OCTOBER 2006 TYPICAL CHARACTERISTICS (continued) PHASE MARGIN vs SUPPLY VOLTAGE 100 100 90 90 80 80 70 70 Phase Margin – ° Phase Margin – ° PHASE MARGIN vs OUTPUT CURRENT 60 50 40 CL = 30 pF CL = 130 pF 60 50 CL = 250 pF 40 30 30 20 20 10 10 0 0 -2 -1.5 -1 -0.5 0 0.5 1 1.5 2 2 4 6 8 10 12 14 Supply Voltage – V Output Current – mA GAIN MARGIN vs SUPPLY VOLTAGE INPUT RESPONSE 20 18 CL = 30 pF CL = 130 pF 14 CL = 250 pF 12 0.25 V/div Gain Margin – dB 16 10 8 6 4 2 0 2 4 6 8 10 12 14 1 µs/div Supply Voltage – V Submit Documentation Feedback 7 TL971, TL972, TL974 OUTPUT RAIL-TO-RAIL VERY-LOW-NOISE OPERATIONAL AMPLIFIERS www.ti.com SLOS467A – OCTOBER 2006 – REVISED OCTOBER 2006 TYPICAL CHARACTERISTICS (continued) POWER-SUPPLY RIPPLE REJECTION vs FREQUENCY OUTPUT VOLTAGE vs OUTPUT CURRENT 10 100 VIN- = -0.2 V Output Voltage to Supply Voltage – V 90 80 PSRR – dB 70 60 50 40 30 20 VIN+ = 0 V 1 VCC = 2.7 V VCC = 5 V 0.1 0.01 10 0 1k 1.E+03 0.001 0.01 1.E-02 10k 1.E+04 100k 1.E+05 0.1 1.E-01 1M 1.E+06 10 1.E+01 1 1.E+00 Output Current – mA Frequency – Hz OUTPUT IMPEDANCE vs FREQUENCY SLEW RATE vs SUPPLY VOLTAGE 100 12 11 Fall 9 Slew Rate – V/µs ℵ Output Impedance – Ω 10 10 1 VCC = 2.7 V Rise 8 7 6 5 4 0.1 3 2 VCC = 5 V 0.01 100 1.E+02 1.E+03 1k 10k 1.E+04 Frequency – Hz 1 100k 1.E+05 1.E+06 1M 0 2 4 6 8 10 Supply Voltage – V 8 Submit Documentation Feedback 12 14 16 PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty TL974ID ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL974IDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL974IDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL974IDRG4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL974IN ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL974INE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type TL974IPW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL974IPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL974IPWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TL974IPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 1 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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