FREESCALE MCIMX27MOP4A

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Freescale Semiconductor
Data Sheet, Technical Data
Document Number: MCIMX27EC
Rev. 1.3, 12/2008
i.MX27 and i.MX27L
Package Information
Plastic Package
Case 1816-01
(MAPBGA–404)
Case 1931-04
(MAPBGA-473)
i.MX27 and i.MX27L
Data Sheet
Multimedia Applications
Processor
1
Introduction
The i.MX27 and i.MX27L (MCIMX27/MX27L)
Multimedia Applications Processors represents the next
step in low-power, high-performance application
processors. Unless otherwise specified, the material in
this data sheet is applicable to both the i.MX27 and
i.MX27L processors and referred to singularly
throughout this document as i.MX27.
The i.MX27L does not include the following features:
ATA-6 HDD Interface, Memory Stick Pro, VPU:
MPEG-4/ H.263/H.264 HW encoder/decoder, and
eMMA (PrP processing, CSC, deblock, dering).
Based on an ARM926EJ-S™ microprocessor core, the
i.MX27/27L processor provides the performance with
low-power consumption required by modern digital
devices such as the following:
• Feature-rich cellular phones
• Portable media players and mobile gaming
machines
• Personal digital assistants (PDAs) and wireless
PDAs
Ordering Information
See Table 1 on page 4 for ordering information.
1.
2.
3.
5.
6.
7.
This document contains information on a new product. Specifications and information herein
are subject to change without notice.
© Freescale Semiconductor, Inc., 2007, 2008. All rights reserved.
Contents
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3. Ordering Information . . . . . . . . . . . . . . . . . . . . . . 4
Functional Description and Application Information . . . . 4
2.1. ARM926 Microprocessor Core Platform . . . . . . . . 4
2.2. Module Inventory . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.3. Module Descriptions . . . . . . . . . . . . . . . . . . . . . . . 9
Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.1. Power-Up Sequence . . . . . . . . . . . . . . . . . . . . . . 35
3.2. EMI Pins Multiplexing . . . . . . . . . . . . . . . . . . . . . 36
4. Electrical Characteristics . . . . . . . . . . . . . . . . . . 40
4.1. i.MX27/iMX27L Chip-Level Conditions . . . . . . . . 40
4.2. Module-Level Electrical Specifications . . . . . . . . 43
4.3. Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . 54
Package Information and Pinout . . . . . . . . . . . . . . . . 105
5.1. Full Package Outline Drawing (17 mm × 17 mm) 105
5.2. Pin Assignments (17 mm × 17 mm) . . . . . . . . . 106
5.3. Full Package Outline Drawing (19 mm × 19 mm) 124
5.4. Pin Assignments (19 mm × 19 mm) . . . . . . . . . 125
Product Documentation . . . . . . . . . . . . . . . . . . . . . . . 144
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144
Introduction
•
•
Portable DVD players
Digital cameras
The i.MX27/MX27L processor features the advanced and power-efficient ARM926EJ-S core operating at
speeds up to 400 MHz, and is optimized for minimal power consumption using the most advanced
techniques for power saving (for example, DPTC, power gating, and clock gating). With 90 nm technology
and dual Vt, the i.MX27/MX27L device provides the optimal performance vs. leakage current balance.
The performance of the i.MX27/MX27L processors are both boosted by an on-chip cache system, and
features peripheral devices, such as an MPEG-4, H.263, an H.264 video codec (up to D1—720 x 486—@
30 FPS), LCD, eMMA_lt, and CMOS Sensor Interface controllers.
The i.MX27/MX27L processors supports connections to various types of external memories, such as
266-MHz DDR, NAND Flash, NOR Flash, SDRAM, and SRAM. The i.MX27/MX27L devices can be
connected to a variety of external devices using technology, such as high-speed USBOTG 2.0, the
Advanced Technology Attachment (ATA), Multimedia/Secure Data (MMC/SDIO), and CompactFlash.
NOTE
The i.MX27L does not support the ATA-6 HDD interface.
1.1
Features
The MX27/MX27L processors are targeted for video and voice over-IP (V2IP) and smart remote
controllers. It also provides low-power solutions for any high-performance and demanding multimedia
and graphics applications.
The systems include the following features:
• Multi-standard video codec (i.MX27 only)
— MPEG-4 part-II simple profile encoding/decoding
— H.264/AVC baseline profile encoding/decoding
— H.263 P3 encoding/decoding
— Multi-party call: one stream encoding and two streams decoding simultaneously
— Multi-format: encodes MPEG-4 bitstream, and decodes H.264 bitstream simultaneously
— On-the-fly video processing that reduces system memory load (for example, the
power-efficient viewfinder application with no involvement of either the memory system or the
ARM CPU)
• Advanced power management (i.MX27/27L)
— Dynamic process and temperature compensation
— Multiple clock and power domains
— Independent gating of power domains
• Multiple communication and expansion ports
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
2
Freescale Semiconductor
Introduction
1.2
Block Diagram
Figure 1 shows the i.MX27 simplified interface block diagram.
DDR/
SDRAM
NOR/NAND
Flash
LCD Display
LCDC
SLCDC
M3IF
SDRAMC
NFC
WEIM
PCMCIA/CF
iROM
10/100
ETH XVR
Security
AP Peripherals
AUDMUX
CSI
SSI (2)
CSPI (3)
AHB Switch Fabric
VRAM
Camera
ARM926
Platform
I2C (2)
UART (6)
ARM926EJ-S
L1 I/D cache
USBOTG HS
1-Wire
AITC
FEC
ETM9
ATA
SDHC (3)
eMMA-lt
MSHC
GPIO
JTAG
Audio/Power
Management
SAHARA2
RTIC
SCC
Video Codec
CRM
PWM
DMA
KPP
IIM
Application Processor Domain (AP)
JTAG
Timers
WDOG
GPT (6)
RTC
IrDA
XVR
Bluetooth
WLAN
USBOTG
XVR
MMC/SDIO
Keypad
Access
Conn.
Note: The i.MX27L does not support the following:
• ATA-6 HDD Interface
• Memory Stick Pro
• VPU: MPEG-4/.263/H.264 HW encoder/decoder
• eMMA (PrP processing, CSC, deblock, dering)
Figure 1. i.MX27/MX27L Simplified Interface Block Diagram
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
3
Functional Description and Application Information
1.3
Ordering Information
Table 1 provides ordering information for the MAPBGA, lead-free packages.
Table 1. Ordering Information
2
2.1
Device
Temperature
Package
MCIMX27VOP4A
–20° C to +85° C
1816-01
MCIMX27LVOP4A
–20° C to +85° C
1816-01
MCIMX27MOP4A
–40° C to +85° C
1931-04
MCIMX27LMOP4A
–40° C to +85° C
1931-04
Functional Description and Application Information
ARM926 Microprocessor Core Platform
The ARM926 Platform consists of the ARM926EJ-S processor, ETM9, ETB9, a 6 × 3 Multi-Layer AHB
crossbar switch (MAX), and a “primary AHB” complex.
• The instruction bus (I-AHB) of the ARM926EJ-S processor is connected directly to MAX Master
Port 0.
• The data bus (D-AHB) of the ARM926EJ-S processor is connected directly to MAX Master Port 1.
Four alternate bus master interfaces are connected to MAX Master Ports 2–5. Three slave ports of the
MAX are AHB-Lite compliant buses. Slave Port 0 is designated as the “primary” AHB. The primary AHB
is internal to the platform and has five slaves connected to it: the AITC interrupt module, the MCTL
memory controller, and two AIPI peripheral interface gaskets. Slave Ports 1 and 2 of the MAX are referred
to as “secondary” AHBs. Each of the secondary AHB interfaces is only accessible off platform.
The ARM926EJ-S processor supports the 32-bit and 16-bit ARM Thumb instruction sets, enabling the
user to trade off between high performance and high-code density. The ARM926EJ-S processor includes
features for efficient execution of Java byte codes, providing Java performance similar to the just-in-time
(JIT) compiler—which is a type of Java compiler—but without the associated code overhead.
The ARM926EJ-S processor supports the ARM debug architecture and includes logic to assist in both
hardware and software debugging. The ARM926EJ-S processor has a Harvard cached architecture and
provides a complete high-performance processor subsystem, including the following:
• An ARM9EJ-S integer core
• A Memory Management Unit (MMU)
• Separate instruction and data AMBA AHB bus interfaces
• ETM and JTAG-based debug support
The ARM926EJ-S processor provides support for external coprocessors enabling floating-point or other
application-specific hardware acceleration to be added. The ARM926EJ-S processor implements ARM
architecture version 5TEJ.
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
4
Freescale Semiconductor
Functional Description and Application Information
The four alternate bus master ports on the ARM926 Platform, which are connected directly to master ports
of the MAX, are designed to support connections to multiple AHB masters external to the platform. An
external arbitration AHB control module is needed if multiple external masters are desired to share an
ARM926 Platform alternate bus master port. However, the alternate bus master ports on the platform
support seamless connection to a single master with no external interface logic required.
A primary AHB MUX (PAHBMUX) module performs address decoding, read data muxing, bus
watchdog, and other miscellaneous functions for the primary AHB within the platform. A clock control
module (CLKCTL) is provided to support a power-conscious design methodology, as well as
implementation of several clock synchronization circuits.
2.1.1
Memory System
The ARM926EJ-S complex includes 16-Kbyte Instruction and 16-Kbyte Data caches. The embedded
45-Kbyte SRAM (VRAM) can be used to avoid external memory accesses or it can be used for
applications. There is also a 24-Kbyte ROM for bootstrap code.
2.2
Module Inventory
Table 2 shows an alphabetical listing of the modules in the i.MX27/MX27L multimedia applications
processors. A cross-reference to each module’s section and page number goes directly to a more detailed
module description for additional information.
Table 2. Digital and Analog Modules
Functional
Grouping
Brief Description
Section/
Page
Block Mnemonic
Block Name
1-Wire®
1-Wire Interface
Connectivity
Peripheral
The 1-Wire module provides bi-directional communication
between the ARM926EJ-S and the Add-Only-Memory EPROM
(DS2502). The 1-Kbit EPROM is used to hold information
about battery and communicates with the ARM926 Platform
using the IP interface.
2.3.1/9
AIPI
AHB-Lite IP
Interface
Module
Bus Control
The AIPI acts as an interface between the ARM Advanced
High-performance Bus Lite. (AHB-Lite) and lower bandwidth
peripherals that conforms to the IP Bus specification, Rev 2.0.
2.3.2/10
AITC
ARM9EJ-S
Interrupt
Controller
Bus Control
AITC is connected to the primary AHB as a slave device. It
generates the normal and fast interrupts to the ARM926EJ-S
processor.
2.3.3/10
ARM926EJS
ARM926EJ-S
CPU
The ARM926EJ-S (ARM926) is a member of the ARM9 family
of general-purpose microprocessors targeted at multi-tasking
applications.
2.3.4/10
ATA
Advanced
Technology(AT)
Attachment
Connectivity
Peripheral
The ATA block is an AT attachment host interface. It interfaces
with IDE hard disc drives and ATAPI optical disc drives.
2.3.5/11
AUDMUX
Digital Audio
Multiplexer
Multimedia
Peripheral
The AUDMUX interconnections allow multiple, simultaneous
audio/voice/data flows between the ports in point-to-point or
point-to-multipoint configurations.
2.3.6/11
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
5
Functional Description and Application Information
Table 2. Digital and Analog Modules (continued)
Functional
Grouping
Section/
Page
Block Mnemonic
Block Name
Brief Description
CRM
Clock and
Reset Module
CSI
CMOS Sensor
Interface
Multimedia
Interface
The CSI is a logic interface which enables the i.MX27/MX27L
processors to connect directly to external CMOS sensors and
a CCIR656 video source.
2.3.8/12
CSPI
Configurable
Serial Peripheral
Interface (x3)
Connectivity
Peripheral
The i.MX27/MX27L processors have three CSPI modules.
CSPI is equipped with two data FIFOs and is a master/slave
configurable serial peripheral interface module, allowing the
i.MX27/MX27L processors to interface with both external SPI
master and slave devices.
2.3.9/13
DMAC
Direct Memory
Access
Controller
Standard
System
Resource
eMMA_lt
eMMA_lt
H/W
Accelerator
Functions
eMMA_lt consists of a PreProcessor and PostProcessor, and
provides video acceleration. The PrP and PP can be used for
generic video pre and post processing such as scaling,
resizing, and color space conversions.
2.3.11/13
EMI
External
Memory
Interface
Memory
Interface
(EMI)
The EMI includes
• Multi-Master Memory Interface (M3IF)
• Enhanced SDRAM/MDDR memory controller (ESDRAMC)
• PCMCIA memory controller (PCMCIA)
• NAND Flash Controller (NFC)
• Wireless External Interface Module (WEIM)
—
ESDRAMC
Enhanced
SDRAM
Controller
External
Memory
Interface
The ESDRAMC provides interface and control for synchronous 2.3.12/15
DRAM memories for the system.
FEC
Fast Ethernet
Controller
Connectivity
Peripheral
The FEC performs the full set of IEEE 802.3/Ethernet
CSMA/CD media access control and channel interface
functions. The FEC supports connection and functionality for
the 10/100 Mbps 802.3 media independent interface (MII). It
requires an external transceiver (PHY) to complete the
interface to the media.
2.3.13/15
GPIO
General
Purpose I/O
Module
Pins
The GPIO provides 32 bits of bidirectional, general purpose
I/O. This peripheral provides dedicated general-purpose pins
that can be configured as either inputs or outputs.
2.3.14/16
GPT
General
Purpose Timer
Timer
Peripheral
The GPT is a multipurpose module used to measure intervals 2.3.15/16
or generate periodic output.
I2C
Inter IC
Communication
Connectivity
Peripheral
The I2C provides serial interface to control the sensor interface 2.3.16/17
and other external devices. Data rates of up to 100 Kbits/s are
supported.
Clock and
The CRM generates clock and reset signals used throughout
Reset Control the i.MX27/MX27L processors and also for external
peripherals.
2.3.7/12
2.3.10/13
The DMAC of the i.MX27/MX27L processors provides 16
channels supporting linear memory, 2D memory, FIFO and
end-of-burst enable FIFO transfers to support a wide variety of
DMA operations.
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
6
Freescale Semiconductor
Functional Description and Application Information
Table 2. Digital and Analog Modules (continued)
Functional
Grouping
Block Mnemonic
Block Name
IIM
IC Identification
Module
Security
JTAGC
JTAG Controller
Debug
KPP
Keypad Port
LCDC
Brief Description
Section/
Page
The IIM provides an interface for reading—and in some cases, 2.3.17/17
programming, and overriding identification and control
information stored in on-chip fuse elements.
Contact your Freescale Semiconductor sales office or
distributor for additional information on SCC, RTIC, IIM,
SAHARA2
The JTAGC provides debug access to the ARM926 core,
built-in self-test (BIST), and boundary scan test control.
2.3.18/17
Connectivity
Peripheral
The KPP is used for key pad matrix scanning or as a general
purpose I/O. This peripheral simplifies the software task of
scanning a keypad matrix.
2.3.19/17
Liquid Crystal
Display
Controller
Multimedia
Interface
The LCDC provides display data for external gray-scale or
color LCD panels.
2.3.20/17
M3IF
Multi-Master
Memory
Interface
External
Memory
Interface
The M3IF controls memory accesses from one or more
masters through different port interfaces to different external
memory controllers ESDCTL/MDDRC, PCMCIA, NFC, and
WEIM.
2.3.21/18
MAX
Multi-layer AHB
Crossbar Switch
Bus Control
The ARM926EJ-S processor’s instruction and data buses and 2.3.22/18
all alternate bus master interfaces arbitrate for resources via a
6 × 3 MAX. There are six fully functional master ports (M0–M5)
and three fully functional slave ports (S0–S2). The MAX is
uni-directional. All master and slave ports are AHB-Lite
compliant.
MSHC
Memory Stick
Host Controller
Connectivity
Peripheral
The MSHC is placed in between the AIPI and the customer
memory stick to support data transfer from the i.MX27 device
to the customer memory stick.
Note: The i.MX27L does not support the MSHC feature
2.3.23/19
NFC
NAND Flash
Controller
External
Memory
Interface
The NFC is a submodule of EMI. The NFC implements the
interface to standard NAND Flash memory devices.
2.3.24/19
PCMCIA
Personal
Computer
Memory Card
International
Association
External
Memory
Interface
The PCMCIA host adapter module provides the control logic
for PCMCIA socket interfaces, and requires some additional
external analog power switching logic and buffering.
2.3.25/20
PLL
Phase Lock
Loop
PWM
Pulse-Width
Modulator
Clock and
The two DPLLs provide clock generation in digital and mixed
Reset Control analog/digital chips designed for wireless communication and
other applications.
Timer
Peripheral
The PWM has a 16-bit counter and is optimized to generate
sound from stored sample audio images. It can also generate
tones.
2.3.26/20
2.3.27/20
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
7
Functional Description and Application Information
Table 2. Digital and Analog Modules (continued)
Functional
Grouping
Section/
Page
Block Mnemonic
Block Name
Brief Description
RTC
Real Time Clock
Timer
Peripheral
RTIC
Run-Time
Integrity
Checkers
Security
The RTIC ensures the integrity of the contents of the peripheral 2.3.29/21
memory and assists with boot authentication.
Contact your Freescale Semiconductor sales office or
distributor for additional information on SCC, RTIC, IIM,
SAHARA2
SAHARA2
Symmetric/
Asymmetric
Hashing and
Random
Accelerator
Security
SAHARA2 is a security co-processor which forms part of the 2.3.30/21
Platform Independent Security Architecture (PISA), and can be
used on cell phone baseband processors or wireless PDAs.
Contact your Freescale Semiconductor sales office or
distributor for additional information on SCC, RTIC, IIM,
SAHARA2
SCC
Security
Controller
Module
Security
The SCC is a hardware component composed of two
blocks—the Secure RAM module, and the Security Monitor.
The Secure RAM provides a way of securely storing sensitive
information. The Security Monitor implements the security
policy, checking algorithm sequencing, and controlling the
Secure State.
Contact your Freescale Semiconductor sales office or
distributor for additional information on SCC, RTIC, IIM,
SAHARA2
SDHC
Secured Digital
Host Controller
Connectivity
Peripheral
The SDHC controls the MMC (MultiMediaCard), SD (Secure 2.3.32/21
Digital) memory, and I/O cards by sending commands to cards
and performing data accesses to and from the cards.
SLCDC
Smart Liquid
Crystal Display
Controller
Multimedia
Interface
The SLCDC module transfers data from the display memory
buffer to the external display device.
SSI
Synchronous
Serial Interface
Multimedia
Peripheral
The SSI is a full-duplex, serial port that allows the chip to
2.3.34/22
communicate with a variety of serial devices, such as standard
codecs, digital signal processors (DSPs), microprocessors,
peripherals, and popular industry audio codecs that implement
the inter-IC sound bus standard (I2S) and Intel AC97 standard.
UART
Universal
Asynchronous
Receiver/
Transmitter
Connectivity
Peripheral
2.3.35/23
The UART provides serial communication capability with
external devices through an RS-232 cable or through use of
external circuitry that converts infrared signals to electrical
signals (for reception) or transforms electrical signals to signals
that drive an infrared LED (for transmission) to provide low
speed IrDA compatibility.
The RTC module provides a current stamp of seconds,
minutes, hours, and days. Alarm and timer functions are also
available for programming. The RTC supports dates from the
year 1980 to 2050.
2.3.28/20
2.3.31/21
2.3.33/22
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
8
Freescale Semiconductor
Functional Description and Application Information
Table 2. Digital and Analog Modules (continued)
Functional
Grouping
Block Name
USB
Universal Serial
Bus–2 Host
Controllers and
1 OTG
(On-The-Go)
Connectivity
Peripherals
2.3.36/23
The i.MX27/MX27L processors provide two USB Host
controllers and one USBOTG of which:
• USB Host 1 is designed to support transceiverless
connection to the on-board peripherals in Low Speed and
Full Speed mode, and connection to the ULPI
(UTMI+Low-Pin Court) and Legacy Full Speed transceivers
• USB Host 2 is designed to support transceiverless
connection to the Cellular Modem Baseband Processor
• The USBOTG controller offers HS/FS/LS capabilities in
Host mode and HS/FS in device mode. In Host mode, the
controller supports direct connection of a FS/LS device
(without external hub). In device (bypass) mode, the OTG
port functions as gateway between the Host 1 Port and the
OTG transceiver.
Video Codec
Video Codec
Hardware
Acceleration
Video Codec module supports full duplex video codec with 25 2.3.39/25
fps VGA image resolution, integrates H.264 BP, MPEG-4 SP
and H.263 P3 video processing standard together.
WDOG
Watchdog Timer
Module
Timer
Peripheral
2.3.37/24
The WDOG module protects against system failures by
providing a method for the system to recover from unexpected
events or programming errors.
WEIM
Wireless
External
Interface
Module
External
Memory
Interface
The Wireless External Module (WEIM) handles the interface to 2.3.38/25
devices external to chip, including generation of chip selects,
clock and control for external peripherals and memory. It
provides asynchronous and synchronous access to devices
with SRAM-like interface.
2.3
Brief Description
Section/
Page
Block Mnemonic
Module Descriptions
This section provides a brief text description of all the modules included in the i.MX27/MX27L devices,
arranged in alphabetical order.
2.3.1
1-Wire Module
The 1-Wire module provides bi-directional communication between the ARM926 core and the Add-Only
Memory EPROM, DS2502. The 1-Kbit EPROM holds information about the battery and communicates
with the ARM926 Platform using the IP interface. Through the 1-Wire interface, the ARM926 acts as the
bus master while the DS2502 device is the slave. The 1-Wire peripheral does not trigger interrupts; hence
it is necessary for the ARM926 to poll the 1-Wire to manage the module. The 1-Wire uses an external pin
to connect to the DS2502. Timing requirements are met in hardware with the help of a 1 MHz clock. The
clock divider generates a 1 MHz clock that is used as a time reference by the state machine. Timing
requirements are crucial for proper operation, and the 1-Wire state machine and the internal clock provide
the necessary signal. The clock must be configured to approximately 1 MHz. You can then set the 1-Wire
register to send and receive bits over the 1-Wire bus.
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
9
Functional Description and Application Information
2.3.2
AHB-Lite IP Interface Module (AIPI)
The AIPI acts as an interface between the ARM Advanced High-performance Bus Lite. (AHB-Lite) and
lower bandwidth peripherals conforming to the IP bus specification Rev 2.0. There are two AIPI modules
in i.MX27/MX27L processors.
The following list summarizes the key features of the AIPI:
• All peripheral read transactions require a minimum of two system clocks (R-AHB side) and all
write transactions require a minimum of three system clocks (R-AHB side).
• The AIPI supports 8-bit, 16-bit, and 32-bit IP bus peripherals. Byte, half word, and full word reads
and writes are supported.
• The AIPI supports multi-cycle accesses by providing 16-bit to 8-bit peripherals operations and
32-bit to both 16-bit and 8-bit peripherals operations.
• The AIPI supports 31 external IP bus peripherals each with a 4-Kbyte memory map (a slot).
2.3.3
ARM926EJ-S Interrupt Controller (AITC)
The ARM926EJ-S Interrupt Controller (AITC) is a 32-bit peripheral that collects interrupt requests from
up to 64 sources and provides an interface to the ARM926EJ-S core. The AITC includes software
controlled priority levels for normal interrupts.
The AITC performs the following functions:
• Supports up to 64 interrupt sources
• Supports fast and normal interrupts
• Selects normal or fast interrupt request for any interrupt source
• Indicates pending interrupt sources via a register for normal and fast interrupts
• Indicates highest priority interrupt number via register. (Can be used as a table index.)
• Independently can enable or disable any interrupt source
• Provides a mechanism for software to schedule an interrupt
• Supports up to 16 software controlled priority levels for normal interrupts and priority masking
• Can single-bit disable all normal interrupts and all fast interrupts. (Used in enabling of secure
operations.)
2.3.4
ARM926EJ-S Platform
The ARM926EJ-S (ARM926) is a member of the ARM9 family of general-purpose microprocessors
targeted at multi-tasking applications. The ARM926 supports the 32-bit ARM and 16-bit Thumb
instructions sets. The ARM926 includes features for efficient execution of Java byte codes. A JTAG port
is provided to support the ARM Debug Architecture, along with associated signals to support the ETM9
real-time trace module. The ARM926EJ-S is a Harvard cached architecture including an ARM9EJ-S
integer core, a Memory Management Unit (MMU), separate instruction and data AMBA AHB interfaces,
separate instruction and data caches, and separate instruction and data tightly coupled memory (TCM)
interfaces. The ARM926 co-processor, instruction TCM, and data TCM interfaces will be tied off within
the ARM926 Platform and will not be available for external connection.
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
10
Freescale Semiconductor
Functional Description and Application Information
The ARM926EJ-S processor is a fully synthesizable macrocell, with a configurable memory system. Both
instruction and data caches will be 16 kbytes on the platform. The cache is virtually accessed and virtually
tagged. The data cached has physical tags as well. The MMU provides virtual memory facilities which are
required to support various platform operating systems such as Symbian OS, Windows CE, and Linux. The
MMU contains eight fully associative TLB entries for lockdown and 64 set associative entries. Refer to
the ARM926EJ-S Technical Reference Manual for more information.
2.3.5
Advanced Technology Attachment (ATA)
The Advanced Technology Attachment (ATA) host controller complies with the ATA/ATAPI-6
specification. The primary use of the ATA host controller is to interface with IDE hard disc drives and
Advanced Technology Attachment Packet Interface (ATAPI) optical disc drives. It interfaces with the ATA
device over a number of ATA signals.
This host controller supports interface protocols as specified in ATA/ATAPI-6 standard, as follows:
• PIO mode 0, 1, 2, 3, and 4
• Multiword DMA mode 0, 1, and 2
• Ultra DMA modes 0, 1, 2, 3, and 4 with bus clock of 50 MHz or higher
• Ultra DMA mode 5 with bus clock of 80 MHz or higher
Before accessing the ATA bus, the host must program the timing parameters to be used on the ATA bus.
The timing parameters control the timing on the ATA bus. Most timing parameters are programmable as a
number of clock cycles (1 to 255). Some are implied. All of the ATA device-internal registers are visible
to users, and they are defined as mirror registers in ATA host controller. As specified in ATA/ATAPI-6
standard, all the features/functions are implemented by reading/writing to the device’s internal registers.
There are basically two protocols that can be active at the same time on the ATA bus, as follows:
• The first and simplest protocol (PIO mode access) can be started at any time by the ARM926 to
the ATA bus. The PIO mode is a slow protocol, mainly intended to be used to program an ATA disc
drive, but also can be used to transfer data to/from the disc drive.
• The second protocol is the DMA mode access. DMA mode is started by the ATA interface after
receiving a DMA request from the drive, and only if the ATA interface has been programmed to
accept the DMA request. In DMA mode, either multiword-DMA or ultra-DMA protocol is used
on the ATA bus. All transfers between FIFO and the host IP or DMA IP bus are zero wait states
transfer, so a high-speed transfer between FIFO and DMA/host bus is possible.
2.3.6
Digital Audio MUX (AUDMUX)
The Digital Audio MUX (AUDMUX) provides programmable interconnecting for voice, audio, and
synchronous data routing between host serial interfaces—for example, SSI, SAP, and peripheral serial
interfaces—such as, audio and voice codecs. The AUDMUX allows audio system connectivity to be
modified through programming, as opposed to altering the design of the system into which the chip is
designed. The design of the AUDMUX allows multiple simultaneous audio/voice/data flows between the
ports in point-to-point or point-to-multipoint configurations.
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
11
Functional Description and Application Information
Included in the AUDMUX are two types of interfaces. The internal ports connect to the processor serial
interfaces, and the external ports connect to off-chip audio devices and serial interfaces of other processors.
A desired connectivity is achieved by configuring the appropriate internal and external ports.
The module includes full 6-wire SSI interfaces for asynchronous receive and transmit, as well as a
configurable 4-wire (synchronous) or 6-wire (asynchronous) peripheral interface. The AUDMUX allows
each host interface to be connected to any other host or peripheral interface in a point-to-point or
point-to-multipoint (network mode).
2.3.7
Clock and Reset Module (CRM)
The Clock and Reset Module (CRM) generates clock and reset signals used throughout the
i.MX27/MX27L processor and for external peripherals. It also enables system software to control,
customize, or read the status of the following functions:
• Chip ID
• Multiplexing of I/O signals
• I/O Driving Strength
• I/O Pull Enable Control
• Well-Bias Control
• System boot mode selection
• DPTC Control
2.3.8
CMOS Sensor Interface (CSI)
The CMOS Sensor Interface (CSI) is a logic interface that enables the i.MX27/MX27L processors to
connect directly to external CMOS sensors and CCIR656 video source.
The capabilities of the CSI include the following:
• Configurable interface logic to support popular CMOS sensors in the market
• Support traditional sensor timing interface
• Support CCIR656 video interface, progressive mode for smart sensor, interlace mode for PAL and
NTSC input
• 8-bit input port for YCC, YUV, Bayer, or RGB data
• 32 × 32 FIFO storing image data supporting Core data read and DMA data burst transfer to system
memory
• Full control of 8-bit and 16-bit data to 32-bit FIFO packing
• Direct interface to eMMA-lt Pre-Processing block (PrP) - Not available on the i.MX27L
• Single interrupt source to interrupt controller from maskable sensor interrupt sources: Start of
Frame, End of Frame, Change of Field, FIFO full
• Configurable master clock frequency output to sensor
• Asynchronous input logic design. Sensor master clock can be driven by either the i.MX27/MX27L
processor or by external clock source.
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
12
Freescale Semiconductor
Functional Description and Application Information
•
Statistic data generation for Auto Exposure (AE) and Auto White Balance (AWB) control of the
camera (for Bayer data only)
2.3.9
Configurable Serial Peripheral Interface (CSPI)
The Configurable Serial Peripheral Interface (CSPI) is used for fast data communication with fewer
software interrupts. There are three CSPI modules in the i.MX27/MX27L processors, which provide a
full-duplex synchronous serial interface, capable of interfacing to the SPI master and slave devices. CSPI1
and CSPI2 are master/slave configurable and include three chip selects to support multiple peripherals.
CSPI3 is only a master and has one chip-select signal. The transfer continuation function of the CSPI
enables unlimited length data transfers using 32-bit wide by 8-entry FIFO for both TX and RX data DMA
support.
The CSPI Ready (SPI_RDY) and Chip Select (SS) control signals enable fast data communication with
fewer software interrupts. When the CSPI module is configured as a master, it uses a serial link to transfer
data between the CSPI and an external device. A chip-enable signal and a clock signal are used to transfer
data between these two devices. When the CSPI module is configured as a slave, the user can configure
the CSPI Control register to match the external SPI master’s timing.
2.3.10
Direct Memory Access Controller (DMAC)
The Direct Memory Access Controller (DMAC) provides 16 channels to support linear memory, 2D
memory, FIFO, and end-of-burst enable FIFO transfers to support a wide variety of DMA operations.
Features include the following:
• Support of 16 channels linear memory, 2D memory, and FIFO for both source and destination
• Support of 8-bit, 16-bit, or 32-bit FIFO port size and memory port size data transfer
• Configurability of DMA burst length of up to a maximum of 16 words, 32 half-words, or 64 bytes
for each channel
• Bus utilization control for a channel that is not triggered by DMA request
• Interrupts that are provided to interrupt handler on bulk data transfer complete or transfer error
• DMA burst time-out error to terminate DMA cycle when the burst cannot be completed in a
programmed timing period
• Dedicated external DMA request and grant signal
• Support of increment, decrement, and no increment for source and destination addressing
• Support of DMA chaining
2.3.11
enhanced MultiMedia Accelerator Light (eMMA_lt)
The enhanced MultiMedia Accelerator Light (eMMA_lt) consists of the video pre-processor (PrP) and
post-processor (PP). In contrast with i.MX21 processor’s components, this eMMA does not include the
video codec. A more powerful video codec is included as a separate module.
NOTE
The i.MX27L does not have a eMMA_lt module.
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
13
Functional Description and Application Information
Each module has individual control and configuration registers that are accessed via the IP interface, and
are capable of bus mastering the AMBA bus to independently access system memory without any CPU
intervention. This enables each module to be used independently of each other, and enables the
pre-processor and post-processor modules to provide acceleration features for other software codec
implementations and image processing software. These blocks work together to provide video
acceleration, and to off-load the CPU from computation intensive tasks. The PrP and PP can be used for
generic video pre- and post-processing, such as scaling, resizing, and color space conversions. A
32-bit-to-64-bit AHB gasket is used to convert a PrP AHB bus from a 32-bit to 64-bit protocol. A bypass
function is implemented to bypass this 64-bit gasket if it is not needed.
eMMA_lt supports the following image/video processing features:
• Pre-processor:
— Data input:
– System memory
– Private DMA between CMOS Sensor Interface module and pre-processor
— Data input formats:
– Arbitrarily formatted RGB pixels (16 or 32 bits)
– YUV 4:2:2 (Pixel interleaved)
– YUV 4:2:0 (IYUV, YV12)
— Input image size: 32 × 32 to 2044 × 2044
— Image scaling:
– Programmable independent CH-1 and CH-2 resizer. Can program to be in cascade or
parallel.
– Each resizer supports downscaling ratios from 1:1 to 8:1 in fractional steps.
— Channel-1 output data format
– Channel 1
– RGB 16 and 32 bpp
– YUV 4:2:2 (YUYV, YVYU, UYVY, VYUY)
— Channel-2 output data format
– YUV 4:2:2 (YUYV)
– YUV 4:4:4
– YUV 4:2:0 (IYUV, YV12)
– RGB data and YUV data format can be generated concurrently
— 32/64-bit AHB bus
• Post-processor
— Input data:
– From system memory
— Input format:
– YUV 4:2:0 (IYUV, YV12)
— Image Size: 32 × 32 to 2044 × 2044
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
14
Freescale Semiconductor
Functional Description and Application Information
— Output format:
– YUV 4:2:2 (YUYV)
– RGB16 and RGB32 bpp
— Image Resize
– Upscaling ratios ranging from 1:1 to 1:4 in fractional steps
– Downscaling ratios ranging from 1:1 to 2:1 in fractional steps and a fixed 4:1
– Ratios provide scaling between QCIF, CIF, QVGA (320 × 240, 240 × 320)
2.3.12
Enhanced Synchronous Dynamic RAM Controller (ESDRAMC)
The Enhanced Synchronous Dynamic RAM Controller (ESDRAMC) provides an interface and control for
synchronous DRAM memories for the system. SDRAM memories use a synchronous interface with all
signals registered on a clock edge. A command protocol is used for initialization, read, write, and refresh
operations to the SDRAM, and is generated on the signals by the controller (when required due to external
or internal requests). It has support for both single data rate RAMs and double data rate SDRAMs. It
supports 64 Mbits, 128 Mbits, 256 Mbits, and 512 Mbits, 1 Gbit, 2 Gbits, four bank synchronous DRAM
by two independent chip selects and with up to 256 Mbytes addressable memory per chip select.
2.3.13
Fast Ethernet Controller (FEC)
The Fast Ethernet Controller (FEC) is designed to support both 10 and 100 Mbps
Ethernet/IEEE Std 802.3™ networks. An external transceiver interface and transceiver function are
required to complete the interface to the media. The FEC supports the 10/100 Mbps MII and the 10
Mbps-only 7-wire interface, which uses a subset of the MII pins for connection to an external Ethernet
transceiver.
The FEC incorporates the following features:
• Support for three different Ethernet physical interfaces:
— 100-Mbps IEEE 802.3 MII
— 10-Mbps IEEE 802.3 MII
— 10-Mbps 7-wire interface (industry standard)
• IEEE 802.3 full duplex flow control
• Programmable max frame length supports IEEE Std 802.1™ VLAN tags and priority
• Support for full-duplex operation (200 Mbps throughput) with a minimum system clock rate of
50 MHz
• Support for half-duplex operation (100 Mbps throughput) with a minimum system clock rate of
25 MHz
• Retransmission from transmit FIFO following a collision (no processor bus utilization)
• Automatic internal flushing of the receive FIFO for runts (collision fragments) and address
recognition rejects (no processor bus utilization)
• Address recognition
— Frames with broadcast address may be always accepted or always rejected
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
15
Functional Description and Application Information
•
•
•
— Exact match for single 48-bit individual (unicast) address
— Hash (64-bit hash) check of individual (unicast) addresses
— Hash (64-bit hash) check of group (multicast) addresses
— Promiscuous mode
Independent DMA engine with multiple channels allowing transmit data, transmit descriptor,
receive data, and receive descriptor accesses to provide high performance
Independent RISC-based controller that provides the following functions in the FEC:
— Initialization (those internal registers not initialized by the user or hardware)
— High level control of the DMA channels (initiating DMA transfers)
— Interpreting buffer descriptors
— Address recognition for receive frames
— Random number generation for transmit collision backoff timer
The Message Information Block (MIB) in FEC maintains counters for a variety of network events
and statistics. The counters supported are the RMON (RFC 1757) Ethernet Statistics group and
some of the IEEE 802.3 counters.
2.3.14
General Purpose I/O Module (GPIO)
The general-purpose input/output (GPIO) module provides dedicated general-purpose pins that can be
configured as either inputs or outputs. When it is configured as an output, you can write to an internal
register to control the state driven on the output pin. When configured as an input, you can detect the state
of the input by reading the state of an internal register. The GPIO includes all of the general purpose
input/output logic necessary to drive a specific data to the pad and control the direction of the pad using
registers in the GPIO module. The ARM926 is able to sample the status of the corresponding pads by
reading the appropriate status register. The GPIO supports up to 32 interrupts and has the ability to identify
interrupt edges as well as generate three active high interrupts.
2.3.15
General Purpose Timer (GPT)
The i.MX27/MX27L processors contains six identical 32-bit General Purpose Timers (GPT) with
programmable prescalers and compare and capture registers. Each timer’s counter value can be captured
using an external event, and can be configured to trigger a capture event on the rising or/and falling edges
of an input pulse. Each GPT can also generate an event on the TOUT pin, and an interrupt when the timer
reaches a programmed value. Each GPT has an 11-bit prescaler that provides a programmable clock
frequency derived from multiple clock sources, including ipg_clk_32k, ipg_clk_perclk, ipg_clk_perclk/4,
and external clock from the TIN pin. The counter has two operation modes: free-run and restart mode. The
GPT can work in low-power mode.
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
16
Freescale Semiconductor
Functional Description and Application Information
2.3.16
Inter IC Communication (I2C)
Inter IC Communication (I2C) is a two-wire, bidirectional serial bus that provides a simple, efficient
method of data exchange, minimizing the interconnection between devices. This bus is suitable for
applications requiring occasional communications over a short distance between many devices. The
flexible I2C enables additional devices to be connected to the bus for expansion and system development.
The I2C operates up to 400 kbps dependent on pad loading and timing. (For pad requirement details, refer
to Phillips I2C Bus Specification, Version 2.1.) The I2C system is a true multiple-master bus, including
arbitration and collision detection that prevents data corruption if multiple devices attempt to control the
bus simultaneously. This feature supports complex applications with multiprocessor control and can be
used for rapid testing and alignment of end products through external connections to an assembly-line
computer.
2.3.17
IC Identification Module (IIM)
The IC Identification Module (IIM) provides an interface for reading and in some cases programming
and/or overriding identification and control information stored in on-chip fuse elements. The module
supports laser fuses (L-Fuses) or electrically-programmable poly fuses (e-Fuses) or both.
Contact your Freescale Semiconductor sales office or distributor for additional information on SCC, RTIC,
IIM, SAHARA2
2.3.18
JTAG Controller (JTAGC)
The JTAG Controller (JTAGC) module supports debug access to the ARM926 Platform and tristate enable
of the I/O pads. The overall strategy is to achieve good test and debug features without increasing the pin
count and reducing the complexity of I/O muxing. The JTAG Controller is compatible with
IEEE Std 1149.1™ Standard Test Access Port and Boundary Scan Architecture.
2.3.19
Keypad Port (KPP)
The Keypad Port (KPP) is designed to interface with a keypad matrix with 2-contact or 3-point contact
keys. KPP is designed to simplify the software task of scanning a keypad matrix. With appropriate
software support, the KPP is capable of detecting, debouncing, and decoding one or multiple keys pressed
simultaneously in the keypad. The KPP supports up to 8 × 8 external key pad matrix. Its port pins can be
used as general purpose I/O. Using an open drain design, the KPP includes glitch suppression circuit
design, multiple keys, long key, and standby key detection.
2.3.20
Liquid Crystal Display Controller (LCDC)
The Liquid Crystal Display Controller (LCDC) provides display data for external gray-scale or color LCD
panels. The LCDC is capable of supporting black-and-white, gray-scale, passive-matrix color (passive
color or CSTN), and active-matrix color (active color or TFT) LCD panels.
The LCDC provides the following features:
• Configurable AHB bus width (32-bit/64-bit)
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
17
Functional Description and Application Information
•
•
•
Support for single (non-split) screen monochrome or color LCD panels and self-refresh type LCD
panels
16 simultaneous gray-scale levels from a palette of 16 for monochrome display
Support for:
— Maximum resolution of 800 × 600
— Passive color panel:
– 4 (mapped to RGB444)/8 (mapped to RGB444)/12 (RGB444) bits per pixel (bpp)
— TFT panel:
– 4 (mapped to RGB666)/8 (mapped to RGB666)/12 (RGB444)/16 (RGB565)/18 (RGB666)
bpp
— 16 and 256 colors out of a palette of 4096 colors for 4 bpp and 8 bpp CSTN display,
respectively
— 16 and 256 colors out of a palette of 256 colors for 4 bpp and 8 bpp TFT display, respectively
— True 4096 colors for a 12 bpp display
— True 64-Kbyte colors for 16 bpp
— True 256-Kbyte colors for 18 bpp
— 16-bit AUO TFT LCD Panel
— 24-bit AUO TFT LCD Panel
2.3.21
Multi-Master Memory Interface (M3IF)/M3IF-ESDCTL/MDDRC
Interface
The M3IF-ESDCTL/MDDRC interface is optimized and designed to reduce access latency by generating
multiple accesses through the dedicated ESDCTL/MDDRC arbitration (MAB) module, which controls the
access to and from the Enhanced SDRAM/MDDR memory controller. For the other port interfaces, the
M3IF only arbitrates and forwards the master requests received through the Master Port Gasket (MPG)
interface and M3IF Arbitration (M3A) module toward the respective memory controller. The masters that
interface with the M3IF include the ARM Platform, FEC, LCDC, H.264, and the USB. The controllers are
the ESDCTL/MDDRC, PCMCIA, NFC, and WEIM.
2.3.22
Multi-Layer AHB Crossbar Switch (MAX)
The ARM926EJ-S processor’s instruction and data buses—and all alternate bus master
interfaces—arbitrate for resources via a 6 × 34 Multi-Layer AHB Crossbar Switch (MAX). There are six
(M0–M5) fully functional master ports and three (S0–S2) fully functional slave ports. The MAX is
uni-directional. All master and slave ports are AHB-Lite compliant.
The design of the crossbar switch enables concurrent transactions to proceed from any master port to any
slave port. That is, it is possible for all three slave ports to be active at the same time as a result of three
independent master requests. If a particular slave port is simultaneously requested by more than one master
port, arbitration logic exists inside the crossbar to allow the higher priority master port to be granted the
bus, while stalling the other requestor(s) until that transaction has completed. The slave port arbitration
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
18
Freescale Semiconductor
Functional Description and Application Information
schemes supported are fixed, programmable fixed, programmable default input port parking, and a round
robin arbitration scheme.
The Crossbar Switch also monitors the ccm_br input (clock control module bus request), which requests
a bus grant from all four slave ports. The priority of ccm_br is programmable and defaults to the highest
priority. Upon receiving bus grants for all four output ports, the ccm_bg output will assert. At this point,
the clock control and reset module (CRM) can turn off hclk and be assured there are no outstanding AHB
transactions in progress. Once the CRM is granted a port, no other master will receive a grant on that port
until the CRM bus request (ccm_br) negates.
2.3.23
Memory Stick Host Controller (MSHC)
The Memory Stick Host Controller (MSHC) is located between the AIPI and the Sony Memory Stick and
provides support for data transfers between the i.MX27 processor and the Memory Stick (MS). The MSHC
consists of two sub-modules; the MSHC gasket and the Sony Memory Stick Host Controller (SMSC). The
SMSC module, which is the actual memory stick host controller, is compatible with Sony Memory Stick
Ver 1.x and Memory Stick PRO. The gasket connects the AIPI IP bus to the SMSC interface to allow
communication and data transfers via the IP Bus.
NOTE
The i.MX27L does not include the MSHC feature.
The MSHC gasket uses a reduced IP Bus interface that supports the IP bus read/write transfers that include
a back-to-back read or write. DMA transfers also take place via the IP Bus interface.
A transfer can be initiated by the DMA or the host (through the AIPI) response to an MSHC DMA request
or interrupt. The SMSC has two DMA address modes—a single address mode and a dual address mode.
The MSHC is set to dual-address mode for transfers with the DMA. In dual-address mode, when the
MSHC requests a transfer with the DMA request (XDRQ), the DMA will initiate a transfer to the MSHC.
NOTE
Details regarding the operation of the MSHC module can be found
separately in Memory Stick/Memory Stick PRO Host Controller IP
Specification 1.3.
2.3.24
NAND Flash Controller (NFC)
NAND Flash Controller (NFC) interfaces standard NAND Flash devices to the i.MX27/MX27L
processors and hides the complexities of accessing the NAND Flash. It provides a glueless interface to
both 8-bit and 16-bit NAND Flash parts with page sizes of 512 Bytes or 2 Kbytes. Its addressing scheme
enables it to access flash devices of almost limitless capacity. The 2-Kbyte RAM buffer of the NAND
Flash is used as the boot RAM during a cold reset (if the i.MX27/MX27L device is configured for a boot
to be carried out from the NAND Flash device). After the boot procedure completes, the RAM is available
as buffer RAM. In addition, the NAND Flash controller provides an X16-bit and X32-bit interface to the
AHB bus on the chip side, and an X8/X16 interface to the NAND Flash device on the external side.
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
19
Functional Description and Application Information
2.3.25
Personal Computer Memory Card International Association
(PCMCIA)
The Personal Computer Memory Card International Association (PCMCIA) provides the PCMCIA 2.1
standard, which defines the usage of memory and I/O devices as insertable and exchangeable peripherals
for personal computers or PDAs. Examples of these types of devices include CompactFlash and WLAN
adapters.
The pcmcia_if host adapter module provides the control logic for PCMCIA socket interfaces, and requires
some additional external analog power switching logic and buffering. The additional external buffers
allow the pcmcia_if host adapter module to support one PCMCIA socket. The pcmcia_if shares its chip
level I/O with the external interface to memory (EIM) pins. Additional logic is required to multiplex the
EIM and the pcmcia_if on the same pins.
2.3.26
Digital Phase Lock Loop (DPLL)
Two on-chip Digital Phase Lock Loop (DPLLs) provide clock generation in digital and mixed
analog/digital chips designed for wireless communication and other applications. The DPLLs produce a
high-frequency chip clock signals with a low frequency and phase jitter.
2.3.27
Pulse-Width Modulator (PWM)
The Pulse-Width Modulator (PWM) has a 16-bit counter and is optimized to generate sounds from stored
sample audio images; it can also generate tones. The PWM uses 16-bit resolution and a 4 × 16 data FIFO
to generate sound. The 16-bit up-counter has a source selectable clock with 4 × 16 FIFO to minimize
interrupt overhead. Clock-in frequency is controlled by a 12-bit prescaler for the division of a clock.
Capable of sound and melody generation, the PWM has an active-high or active-low configurable output,
and can be programmed to be active in low-power and debug modes. The PWM can be programmed to
generate interrupts at compare and rollover events.
2.3.28
Real Time Clock (RTC)
The Real Time Clock (RTC) module maintains the system clock, provides stopwatch, alarm, and
interrupt functions, and supports the following features:
• Full clock—days, hours, minutes, seconds
• Minute countdown timer with interrupt
• Programmable daily alarm with interrupt
• Sampling timer with interrupt
• Once-per-day, once-per-hour, once-per-minute, and once-per-second interrupts
• Operation at 32.768 kHz or 32 kHz, or 38.4 kHz (determined by reference clock crystal)
The prescaler converts the incoming crystal reference clock to a 1 Hz signal, which is used to increment
the seconds, minutes, hours, and days TOD counters. The alarm functions, when enabled, generate RTC
interrupts when the TOD settings reach programmed values. The sampling timer generates
fixed-frequency interrupts, and the minute stopwatch allows for efficient interrupts on very small
boundaries.
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
20
Freescale Semiconductor
Functional Description and Application Information
2.3.29
Run-TIme Integrity Checker (RTIC)
The Run-Time Integrity Checker (RTIC) is one of the security components in the i.MX27/MX27L
processors. Its purpose is to ensure the integrity of the peripheral memory contents and assist with boot
authentication. The RTIC has the ability to verify the memory contents during system boot and during
run-time execution. If the memory contents at runtime fail to match the hash signature, an error in the
security monitor is triggered.
Contact your Freescale Semiconductor sales office or distributor for additional information on SCC, RTIC,
IIM, SAHARA2
2.3.30
Symmetric/Asymmetric Hashing and Random Accelerator
(SAHARA2)
SAHARA2 is a security co-processor, it implements encryption algorithms (AES, DES, and 3DES),
hashing algorithms (MD5, SHA-1, SHA_224, and SHA-256), stream cipher algorithm (ARC4), and a
hardware random number generator.
Contact your Freescale Semiconductor sales office or distributor for additional information on SCC, RTIC,
IIM, SAHARA2
2.3.31
Security Controller Module (SCC)
The Security Controller Module (SCC) is a hardware security component. Overall, its primary
functionality is associated with establishing a centralized security state controller and hardware security
state with a hardware configured, unalterable security policy.
Contact your Freescale Semiconductor sales office or distributor for additional information on SCC, RTIC,
IIM, and SAHARA2.
2.3.32
Secure Digital Host Controller (SDHC)
The Secure Digital Host Controller (SDHC) controls the MultiMedia Card (MMC), Secure Digital (SD)
memory, and I/O cards by sending commands to cards and performing data accesses to/from the cards. The
Multimedia Card/Secure Digital Host (MMC/SD) module integrates both MMC support along with SD
memory and I/O functions. The SDHC is fully compatible with the MMC System Specification Version
3.0, as well as with the SD Memory Card Specification 1.0, and SD I/O Specification 1.0 with 1/4
channel(s). The maximum data rate in 4-bit mode is 100 Mbps. The SDHC uses a built-in programmable
frequency counter for the SDHC bus, and provides a maskable hardware interrupt for an SDIO interrupt,
internal status, and FIFO status. It has a pair of 32 × 16-bit data FIFO buffers built in.
The MultiMedia Card (MMC) is a universal, low-cost data storage and communication media that is
designed to cover a wide area of applications, including, for example, electronic toys, organizers, PDAs,
and smart phones. The MMC communication is based on an advanced 7-pin serial bus designed to operate
in a low-voltage range.
The Secure Digital Card (SD) is an evolution of MMC technology, with two additional pins in the form
factor. It is specifically designed to meet the security, capacity, performance, and environment
requirements inherent in newly emerging audio and video consumer electronic devices. The physical form
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
21
Functional Description and Application Information
factor, pin assignment, and data transfer protocol are forward-compatible with the MultiMedia Card with
some additions. Under SD, it can be categorized into Memory and I/O. The memory card invokes a
copyright protection mechanism that complies with the security of the SDMI standard, which is faster and
provides the capability for a higher memory capacity. The I/O card provides high-speed data I/O with
low-power consumption for mobile electronic devices.
2.3.33
Smart Liquid Crystal Display Controller Module (SLCDC)
The Smart Liquid Crystal Display Controller (SLCDC) module transfers data from the display memory
buffer to the external display device. Direct Memory Access (DMA) transfers the data transparently with
minimal software intervention. Bus utilization of the DMA is controllable and deterministic.
As cellular phone displays become larger and more colorful, demands on the processor increase. More
CPU power is needed to render and manage the image. The role of the display controller is to reduce the
CPU’s involvement in the transfer of data from memory to the display device so the CPU can concentrate
on image rendering. DMA is used to optimize the transfer. Embedded control information needed by the
display device is automatically read from a second buffer in system memory and inserted into the data
stream at the proper time to completely eliminate the CPU’s role in the transfer.
A typical scenario for a cellular phone display is to have the display image rendered in main system
memory. After the image is complete, the CPU triggers the SLCDC module to transfer the image to the
display device. Image transfer is accomplished by burst DMA, which steals bus cycles from the CPU.
Cycle-stealing behavior is programmable so bus use is kept within predefined bounds. After the transfer
is complete, a maskable interrupt is generated indicating the status. For animated displays, it is suggested
that a two-buffer ping-pong scheme be implemented so that the DMA is fetching data from one buffer
while the next image is rendered into the other.
Several display sizes and types are used in the various products that use the SLCDC. The SLCDC module
has the capability of directly interfacing to the selected display devices. Both serial and parallel interfaces
are supported. The SLCDC module only supports writes to the display controller. SLCDC read operations
from the display controller are not supported.
2.3.34
Synchronous Serial Interface (SSI)
The Synchronous Serial Interface (SSI) is a full-duplex serial port that allows the chip to communicate
with a variety of serial devices. These serial devices can be standard codecs, Digital Signal Processors
(DSPs), microprocessors, peripherals, and popular industry audio codecs that implement the inter-IC
sound bus standard (I2S) and Intel AC97 standard.
The SSI is typically used to transfer samples in a periodic manner. The SSI consists of independent
transmitter and receiver sections with independent clock generation and frame synchronization.
The SSI contains independent (asynchronous) or shared (synchronous) transmit and receive sections with
separate or shared internal/external clocks and frame syncs, operating in Master or Slave mode. The SSI
can work in Normal mode operation using frame sync, and in Network mode operation allowing multiple
devices to share the port with as many as thirty-two time slots.
The SSI provides two sets of Transmit and Receive FIFOs. Each of the four FIFOs is 8 × 24 bits. The two
sets of Tx/RX FIFOs can be used in Network mode to provide two independent channels for transmission
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
22
Freescale Semiconductor
Functional Description and Application Information
and reception. It also has programmable data interface modes such as I2S, LSB, and MSB aligned and
programmable word lengths. Other program options include frame sync, clock generation, and
programmable I2S modes (Master, Slave, or Normal). Oversampling clock, ccm_ssi_clk is available as
output from SRCK in I2S Master mode.
In addition to AC97 support, the SSI has completely separate clock and frame sync selections for the
receive and transmit sections. In the AC97 standard, the clock is taken from an external source and frame
sync is generated internally. The SSI also has a programmable internal clock divider and Time Slot Mask
registers for reduced CPU overhead (for Tx and RX both).
2.3.35
Universal Asynchronous Receiver/Transmitter (UART)
The i.MX27/MX27L processors contain six UART modules. Each UART module is capable of standard
RS-232 non-return-to-zero (NRZ) encoding format and IrDA-compatible infrared modes. The UART
provides serial communication capability with external devices through an RS-232 cable or through use
of external circuitry that converts infrared signals to electrical signals (for reception); or it transforms
electrical signals to signals that drive an infrared LED (for transmission) to provide low-speed IrDA
compatibility.
The UART transmits and receives characters that are either 7 or 8 bits in length (program selectable). To
transmit, data is written from the peripheral data bus to a 32-byte transmitter FIFO (TxFIFO). This data is
passed to the shift register and shifted serially out on the transmitter pin (TXD). To receive, data is received
serially from the receiver pin (RXD) and stored in a 32-half-word-deep receiver FIFO (RxFIFO). The
received data is retrieved from the RxFIFO on the peripheral data bus. The RxFIFO and TxFIFO generate
maskable interrupts as well as DMA requests when the data level in each of the FIFO reaches a
programmed threshold level.
The UART generates baud rates based on a programmable divisor and input clock. The UART also
contains programmable auto baud detection circuitry to receive 1 or 2 stop bits as well as odd, even, or no
parity. The receiver detects framing errors, idle conditions, BREAK characters, parity errors, and overrun
errors.
2.3.36
Universal Serial Bus (USB)
The i.MX27/MX27L processors provide three USB ports. The USB module provides high performance
USB On-The-Go (OTG) functionality, compliant with the USB 2.0 specification, the OTG supplement,
and the ULPI 1.0 Low Pin Count specification. The module consists of three independent USB cores, each
controlling one USB port.
In addition to the USB cores, the USB module provides for Transceiverless Link (TLL) operation on host
Ports 1 and 2, and provides the ability of routing the OTG transceiver interface to Host Port 1 such that
this transceiver can be used to communicate with a USB peripheral connected to Host Port 1. The USB
module has two connections to the CPU bus—one IP-bus connection for register accesses and one
AHB-bus connection for the DMA transfer of data to and from the FIFOs.
The USB module includes the following features:
• Full Speed/Low speed Host only core (HOST 1)
• Transceiverless Link Logic (TLL) for on board connection to a FS/LS USB peripheral
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
23
Functional Description and Application Information
•
•
•
•
•
Bypass mode to route Host Port 1 signals to OTG I/O port
High Speed /Full Speed/Low Speed Host Only core (Host 2)
Full Speed/Low Speed interface for Serial transceiver
TLL function for direct connection to USB peripheral in FS/LS (serial) operation
High-speed OTG core
The USB module has two main modes of operation: Normal mode and Bypass mode. Furthermore, the
USB interfaces can be configured for high-speed operation (480 Mbps) and/or full/low speed operation
(12/1.5 Mbps). In Normal mode, each USB core controls its corresponding port. In additional to th4e
major operational modes, each port can work in one or more modes, as follows:
PHY mode
In PHY mode, an external serial transceiver is connected to the port. This is used
for off-board USB connections.
TLL mode
In TLL mode, internal logic is enabled to emulate the functionality of two
back-to-back connected transceivers. This mode is typically used for on-board
USB connections to USB-capable peripherals.
Host Port 2 supports ULPI and Serial Transceivers. The OTG port requires a transceiver and is intended
for off-board USB connections.
Serial Interface mode In serial mode, a serial OTG transceiver must be connected. The port does not
support dedicated signals for OTG signaling. Instead, a transceiver with built-in
OTG registers must be used. Typically, the Transceiver registers are accessible
over an I2C or SPI interface.
ULPI mode
In this mode, a ULPI transceiver is connected to the port pins to support
high-speed off board USB connection.
Bypass mode
Bypass mode affects the operation of the OTG port and Host Port 1. This mode is
only available when a serial transceiver is used on the OTG port, and the
peripheral device on Port 1 is using a TLL connection. Bypass mode is activated
by setting the bypass bit in the USBCONTROL register. In this mode, the USB
OTG port connections are internally routed to the USB Host 1 port, such that the
transceiver on the OTG port connects to a peripheral USB device on Host Port 1.
The OTG core and the Host 1 core are disconnected from their ports when bypass
is active.
Low Power mode
Each of the three USB cores has an associated power control module that is
controlled by the USB core and clocked on a 32-kHz clock. When a USB bus is
idle, the transceiver can be placed in low-power mode (suspend), after which the
clocks to the USB core can be stopped. The 32-kHz low power clock must remain
active as it is needed for walk-up detection.
2.3.37
Watchdog Timer Module (WDOG)
The Watchdog Timer module (WDOG) protects against system failures by providing a method of escaping
from unexpected events or programming errors. Once the WDOG module is activated, it must be serviced
by software on a periodic basis. If servicing does not take place, the timer times out. Upon a time-out, the
WDOG Timer module either asserts the wdog signal or a system reset signal wdog_rst, depending on
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
24
Freescale Semiconductor
Functional Description and Application Information
software configuration. The WDOG Timer module also generates a system reset via a software write to
the Watchdog Control Register (WCR) when there is a detection of a clock monitor event, an external
reset, an external JTAG reset signal, or if a power-on-reset has occurred.
2.3.38
Wireless External Interface Module (WEIM)
The Wireless External Interface Module (WEIM) handles the interface to devices external to the chip,
including generation of chip selects, clocks and controls for external peripherals and memory. It provides
asynchronous and synchronous access to devices with an SRAM-like interface.
The WEIM includes six chip selects for external devices, with two CS signals covering a range of
128 Mbytes, and the other four each covering a range of 32 Mbytes. The 128-Mbyte range can be
increased to 256 Mbytes when combined with the two signals. The WEIM offers selectable protection for
each chip select as well as programmable data port size. There is a programmable wait-state generator for
each chip select and support for Big Endian and Little Endian modes of operation per access.
2.3.39
Video Codec
The Video Codec module is the video processing module in the i.MX27 processor. It supports full duplex
video codec with 25 fps VGA resolution, supports multi-party calls, and integrates multiple video
processing standards, including H.264 BP, MPEG-4 SP, and H.263 P3 (including annex I, J, K, and T), D1
resolution, 30 fps—half-duplex.
NOTE
The Video Codec feature is not available on the i.MX27L
It has three 64-bit AHB-Lite master bus interfaces connecting to the EMI, which includes two read
channels and one write channel. Its 32-bit AHB-Lite master bus is connected to ARM Platform to access
system-internal SRAM.
The Video Codec module contains three major architectural components: video codec processing IP,
AXI-to-AHB bus protocol transfer module, and a 32-bit to 64-bit AHB master bus protocol transfer
module.
The Video Codec module supports following video stream processing features:
• Multi-standard video codec
— MPEG-4 part-II simple profile encoding/decoding
— H.264/AVC baseline profile encoding/decoding
— H.263 P3 encoding/decoding
— Multi-party call: max processing four image/bitstream encoding and/or decoding
simultaneously
— Multi-format: for example, encodes MPEG-4 bitstream, and decodes H.264 bitstream
simultaneously
• Coding tools
— High-performance motion estimation
– Single reference frame for both MPEG-4 and H.264 encoding
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
25
Functional Description and Application Information
•
•
– Support 16 reference frame for H.264 decoding
– Quarter-pel and half-pel accuracy motion estimation
– [+/-16, +/-16] Search range
– Unrestricted motion vector
— All variable block sizes are supported (in case of encoding, 8 × 4, 4 × 8, and 4 × 4 block sizes
are not supported).
— MPEG-4 AC/DC prediction and H.264 Intra prediction
— H.263 Annex I, J, K(RS = 0 and ASO =0), and T are supported. In case of encoding, the Annex
I and K(RS=1 or ASO=1) are not supported.
— CIR (Cyclic Intra Refresh)/AIR (Adaptive Intra Refresh)
— Error resilience tools
– MPEG-4 re-synchronize marker and data-partitioning with RVLC (fixed number of
bits/macroblocks between macroblocks)
– H.264/AVC FMO and ASO
– H.263 slice structured mode
— Bit-rate control (CBR and VBR)
Pre/post rotation/mirroring
— 8 rotation/mirroring modes for image to be encoded
— 8 rotation/mirroring modes for image to be displayed
Programmability
— Embeds 16-bit DSP processor that is dedicated to processing bitstream and driving codec
hardware
— General purpose registers and interrupt generation for communication between system and
video codec module
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
26
Freescale Semiconductor
Signal Descriptions
3
Signal Descriptions
This section discusses the following:
• Identifies and defines all device signals in text, tables, and (as appropriate) figures. Signals can be
organized by group, as applicable.
• Contains pin-assignment/contact-connection diagrams, if the sequence of information in the data
sheet requires them to be included here.
Table 3 shows the i.MX27/MX27L signal descriptions.
Table 3. i.MX27/MX27L Signal Descriptions
Pad Name
Function/Notes
External Bus/Chip Select (EMI)
A [13:0]
Address bus signals, shared with SDRAM/MDDR, WEIM and PCMCIA, A[10] for
SDRAM/MDDR is not the address but the pre-charge bank select signal.
MA10
Address bus signals for SDRAM/MDDR
A [25:14]
Address bus signals, shared with WEIM and PCMCIA
SDBA[1:0]
SDRAM/MDDR bank address signals
SD[31:0]
Data bus signals for SDRAM, MDDR
SDQS[3:0]
MDDR data sample strobe signals
DQM0–DQM3
SDRAM data mask strobe signals
EB0
Active low external enable byte signal that controls D [15:8], shared with PCMCIA PC_REG.
EB1
Active low external enable byte signal that controls D [7:0], shared with PCMCIA PC_IORD.
OE
Memory Output Enable—Active low output enables external data bus, shared with PCMCIA
PC_IOWR.
CS [5:0]
Chip Select—The chip select signals CS [3:2] are multiplexed with CSD [1:0] and are selected
by the Function Multiplexing Control Register (FMCR) in the System Control chapter. By default
CSD [1:0] is selected. DTACK is multiplexed with CS4.
CS[5:4] are multiplexed with ETMTRACECLK and ETMTRACESYNC; PF22, 21.
ECB
Active low input signal sent by flash device to the EIM whenever the flash device must terminate
an on-going burst sequence and initiate a new (long first access) burst sequence.
LBA
Active low signal sent by flash device causing external burst device to latch the starting burst
address.
BCLK
Clock signal sent to external synchronous memories (such as burst flash) during burst mode.
RW
RW signal—Indicates whether external access is a read (high) or write (low) cycle. This signal
is also shared with the PCMCIA PC_WE.
RAS
SDRAM/MDDR Row Address Select signal
CAS
SDRAM/MDDR Column Address Select signal
SDWE
SDRAM Write Enable signal
SDCKE0
SDRAM Clock Enable 0
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
27
Signal Descriptions
Table 3. i.MX27/MX27L Signal Descriptions (continued)
Pad Name
Function/Notes
SDCKE1
SDRAM Clock Enable 1
SDCLK
SDRAM Clock
SDCLK_B
SDRAM Clock_B
NFWE_B
NFC Write enable signal, multiplexed with ETMPIPESTAT2; PF6
NFRE_B
NFC Read enable signal, multiplexed with ETMPIPESTAT1; PF5
NFALE
NFC Address latch signal, multiplexed with ETMPIPESTAT0; PF4
NFCLE
NFC Command latch signal, multiplexed with ETMTRACEPKT0; PF1
NFWP_B
NFC Write Permit signal, multiplexed with ETMTRACEPKT1; PF2
NFCE_B
NFC Chip enable signal, multiplexed with ETMTRACEPKT2; PF3
NFRB
NFC read Busy signal, multiplexed with ETMTRACEPKT3; PF0
D[15:0]
Data Bus signal, shared with EMI, PCMCIA, and NFC
PC_CD1_B
PCMCIA card detect signal, multiplexed with ATA ATA_DIOR signal; PF20
PC_CD2_B
PCMCIA card detect signal, multiplexed with ATA ATA_DIOW signal; PF19
PC_WAIT_B
PCMCIA WAIT signal, multiplexed with ATA ATA_CS1 signal; PF18
PC_READY
PCMCIA READY/IRQ signal, multiplexed with ATA ATA_CS0 signal; PF17
PC_PWRON
PCMCIA signal, multiplexed with ATA ATA_DA2 signal; PF16
PC_VS1
PCMCIA voltage sense signal, multiplexed with ATA ATA_DA1 signal; PF14
PC_VS2
PCMCIA voltage sense signal, multiplexed with ATA ATA_DA0 signal; PF13
PC_BVD1
PCMCIA Battery voltage detect signal, multiplexed with ATA ATA_DMARQ signal; PF12
PC_BVD2
PCMCIA Battery voltage detect signal, multiplexed with ATA ATA_DMACK signalPF11
PC_RST
PCMCIA card reset signal, multiplexed with ATA ATA_RESET_B signal; PF10
IOIS16
PCMCIA mode signal, multiplexed with ATA ATA_INTRQ signal; PF9
PC_RW_B
PCMCIA read write signal, multiplexed with ATA ATA_IORDY signal; PF8
PC_POE
PCMCIA output enable signal, multiplexed with ATA ATA_BUFFER_EN signal; PF7
Clocks and Resets
CLKO
Clock Out signal selected from internal clock signals. Refer to the clock controller for internal
clock selection; PF15.
EXT_60M
This is a special factory test signal. To ensure proper operation, connect this signal to ground.
EXT_266M
This is a special factory test signal. To ensure proper operation, connect this signal to ground.
OSC26M_TEST
This is a special factory test signal. To ensure proper operation, leave this signal as a no
connect.
RESET_IN
Master Reset—External active low Schmitt trigger input signal. When this signal goes active,
all modules (except the reset module, SDRAMC module, and the clock control module) are
reset.
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
28
Freescale Semiconductor
Signal Descriptions
Table 3. i.MX27/MX27L Signal Descriptions (continued)
Pad Name
Function/Notes
RESET_OUT
Reset_Out—Output from the internal Hreset_b; and the Hreset can be caused by all reset
source: power on reset, system reset (RESET_IN), and watchdog reset.
POR
Power On Reset—Active low Schmitt trigger input signal. The POR signal is normally
generated by an external RC circuit designed to detect a power-up event.
XTAL26M
Oscillator output to external crystal
EXTAL26M
Crystal input (26 MHz), or a 16 MHz to 32 MHz oscillator (or square-wave) input when internal
oscillator circuit is shut down.
CLKMODE[1:0]
These are special factory test signals. To ensure proper operation, do not connect to these
signals.
EXTAL32K
32 kHz crystal input (Note: in the RTC power domain)
XTAL32K
Oscillator output to 32 kHz crystal (Note: in the RTC power domain)
Power_cut
(Note: in the RTC power domain)
Power_on_reset
(Note: in the RTC power domain)
osc32K_bypass
The signal for osc32k input bypass (Note: in the RTC power domain)
Bootstrap
BOOT [3:0]
System Boot Mode Select—The operational system boot mode of the i.MX27/MX27L processor
upon system reset is determined by the settings of these pins. BOOT[1:0] are also used as
handshake signals to PMIC(VSTBY).
JTAG
JTAG_CTRL
JTAG Controller select signal—JTAG_CTRL is sampled during rising edge of TRST. Must be
pulled to logic high for proper JTAG interface to debugger. Pulling JTAG_CRTL low is for
internal test purposes only.
TRST
Test Reset Pin—External active low signal used to asynchronously initialize the JTAG
controller.
TDO
Serial Output for test instructions and data. Changes on the falling edge of TCK.
TDI
Serial Input for test instructions and data. Sampled on the rising edge of TCK.
TCK
Test Clock to synchronize test logic and control register access through the JTAG port.
TMS
Test Mode Select to sequence JTAG test controller’s state machine. Sampled on rising edge
of TCK.
RTCK
JTAG Return Clock used to enhance stability of JTAG debug interface devices. This signal is
multiplexed with 1-Wire; thus, utilizing 1-Wire will render RTCK unusable and vice versa; PE16.
Secure Digital Interface (X2)
SD1_CMD
SD Command bidirectional signal—If the system designer does not want to make use of the
internal pull-up, via the Pull-up enable register, a 4. 7K–69 K external pull up resistor must be
added. This signal is multiplexed with CSPI3_MOSI; PE22.
SD1_CLK
SD Output Clock. This signal is multiplexed with CSPI3_SCLK; PE23.
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
29
Signal Descriptions
Table 3. i.MX27/MX27L Signal Descriptions (continued)
Pad Name
Function/Notes
SD1_D[3:0]
SD Data bidirectional signals—If the system designer does not want to make use of the internal
pull-up, via the Pull-up enable register, a 50 K–69 K external pull up resistor must be added.
SD1_D[3] is muxed with CSPI3_SS while SD1_D[0] is muxed with CSPI3_MISO PE21–18.
SD2_CMD
SD Command bidirectional signal. This signal is multiplexed with MSHC_BS; through GPIO
multiplexed with SLCDC1_CS; PB8.
SD2_CLK
SD Output Clock signal. This signal is multiplexed with MSHC_SCLK, through GPIO
multiplexed with SLCDC1_CLK; PB9.
SD2_D[3:0]
SD Data bidirectional signals. SD2_D[3:0] multiplexed with MSHC_DATA[0:3], also through
GPIO SD2_1:0] multiplexed with SLCDC1_RS and SLDCD1_D0; PB7–PB4.
SD3_CMD
SD Command bidirectional signal. This signal is multiplexed with ETMTRACEPKT15 and also
through GPIO PD1 multiplexed with FEC_TXD0.
SD3_CLK
SD Output Clock signal. This signal is through GPIO PD0 multiplexed with FEC_TXD1.
Note: SD3_DATA is multiplexed with ATA_DATA3–0.
UARTs (X6)
UART1_RTS
Request to Send input signal; PE15
UART1_CTS
Clear to Send output signal; PE14
UART1_RXD
Receive Data input signal; PE13
UART1_TXD
Transmit Data output signal, PE12
UART2_RXD
Receive Data input signal. This signal is multiplexed with KP_ROW6 signal from KPP; PE7.
UART2_TXD
Transmit Data output signal. This signal is multiplexed with KP_COL6 signal from KPP; PE6.
UART2_RTS
Request to Send input signal. This signal is multiplexed with KP_ROW7 signal from KPP; PE4.
UART2_CTS
Clear to Send output signal. This signal is multiplexed with KP_COL7 signal from KPP; PE3.
UART3_RTS
Request to Send input signal, PE11
UART3_CTS
Clear to Send output signal; PE10
UART3_RXD
Receive Data input signal; PE9
UART3_TXD
Transmit Data output signal; PE8
Note: UART 4, 5, and 6 are multiplexed with COMS Sensor Interface signals.
Keypad
KP_COL[5:0]
Keypad Column selection signals. KP_COL[7:6] are multiplexed with UART2_CTS and
UART2_TXD respectively. Alternatively, KP_COL6 is also available on the internal factory test
signal TEST_WB2. The Function Multiplexing Control Register in the System Control chapter
must be used in conjunction with programming the GPIO multiplexing (to select the alternate
signal multiplexing) to choose which signal KP_COL6 is available.
KP_ROW[5:0]
Keypad Row selection signals. KP_ROW[7:6] are multiplexed with UART2_RTS and
UART2_RXD signals respectively. The Function Multiplexing Control Register in the System
Control chapter must be used in conjunction with programming the GPIO multiplexing (to select
the alternate signal multiplexing) to choose which signals KP_ROW6 and KP_ROW7 are
available.
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
30
Freescale Semiconductor
Signal Descriptions
Table 3. i.MX27/MX27L Signal Descriptions (continued)
Pad Name
Function/Notes
Note: KP_COL[7:6] and KP_ROW[7:6] are multiplexed with UART2 signals as show above, also see UARTs table.
PWM
PWMO
PWM Output. This signal is multiplexed with PC_SPKOUT of PCMCIA, as well as TOUT2 and
TOUT3 of the General Purpose Timer module; PE5.
CSPI (X3)
CSPI1_MOSI
Master Out/Slave In signal, PD31
CSPI1_MISO
Master In/Slave Out signal, PD30
CSPI1_SS[2:0]
Slave Select (Selectable polarity) signal, the CSPI1_SS2 is multiplexed with
USBH2_DATA5/RCV; and CSPI1_SS1 is multiplexed with EXT_DMAGRANT; PD26–28.
CSPI1_SCLK
Serial Clock signal, PD29
CSPI1_RDY
Serial Data Ready signal, shared with Ext_DMAReq_B signal; PD25
CSPI2_MOSI
Master Out/Slave In signal, multiplexed with USBH2_DATA1/TXDP; PD24
CSPI2_MISO
Master In/Slave Out signal, multiplexed with USBH2_DATA2/TXDm; PD23
CSPI2_SS[2:0]
Slave Select (Selectable polarity) signals, multiplexed with USBH2_DATA4/RXDM,
USBH2_DATA3/RXDP, USBH2_DATA6/SPEED; PD19–PD21
CSPI2_SCLK
Serial Clock signal, multiplexed with USBH2_DATA0/OEn; PD22
Note: CSPI3 CSPI3_MOSI, CSPI3_MISO, CSPI3_SS, andCSPI3_SCLK are multiplexed with SD1 signals.
I2C
I2C2_SCL
I2C2 Clock, through GPIO, multiplexed with SLCDC_data8; PC6
I2C2_SDA
I2C2 Data, through GPIO, multiplexed with SLCDC_data7; PC5
I2C_CLK
I2C1 Clock; PD18
I2C_DATA
I2C1 Data; PD17
CMOS Sensor Interface
CSI_HSYNC
Sensor port horizontal sync, multiplexed with UART5_RTSP; PB21
CSI_VSYNC
Sensor port vertical sync, multiplexed with UART5_CTS; PB20
CSI_D7
Sensor port data, multiplexed with UART5_RXD; PB19
CSI_D6
Sensor port data, multiplexed with UART5_TXD; PB18
CSI_D5
Sensor port data; PB17
CSI_PIXCLK
Sensor port data latch clock; PB16
CSI_MCLK
Sensor port master clock, PB15
CSI_D4
Sensor port data, PD14
CSI_D3
Sensor port data, multiplexed with UART6_RTS; PB13
CSI_D2
Sensor port data, multiplexed with UART6_CTS; PB12
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
31
Signal Descriptions
Table 3. i.MX27/MX27L Signal Descriptions (continued)
Pad Name
Function/Notes
CSI_D1
Sensor port data, multiplexed with UART6_RXD; PB11
CSI_D0
Sensor port data, multiplexed with UART6_TXD; PB10
Serial Audio Port—SSI (Configurable to I2S Protocol and AC97) (2 to 4)
SSI1_CLK
Serial clock signal that is output in master or input in slave; PC23
SSI1_TXD
Transmit serial data; PC22
SSI1_RXD
Receive serial data; PC21
SSI1_FS
Frame Sync signal that is output in master and input in slave; PC20
SSI2_CLK
Serial clock signal that is output in master or input in slave, multiplexed with GPT4_TIN. PC27
SSI2_TXD
Transmit serial data signal, multiplexed with GPT4_TOUT; PC26
SSI2_RXD
Receive serial data, multiplexed with GPT5_TIN; PC25
SSI2_FS
Frame Sync signal which is output in master and input in slave, multiplexed with GPT5_TOUT:
PC24
SSI3_CLK
Serial clock signal which is output in master or input in slave. This signal is multiplexed with
SLCDC2_CLK; through GPIO multiplexed with PC_WAIT_B; PC31.
SSI3_TXD
Transmit serial data signal which is multiplexed with SLCDC2_CS, through GPIO multiplexed
with PC_READY; PC30
SSI3_RXD
Receive serial data which is multiplexed with SLCDC2_RS; through GPIO multiplexed with
PC_VS1; PC29
SSI3_FS
Frame Sync signal which is output in master and input in slave. This signal is multiplexed with
SLCDC2_D0; through GPIO multiplexed with PC_VS1; PC28.
SSI4_CLK
Serial clock signal which is output in master or input in slave; through GPIO multiplexed with
PC_BVD1; PC19
SSI4_TXD
Transmit serial data; through GPIO multiplexed with PC_BVD2; PC18
SSI4_RXD
Receive serial data; through GPIO multiplexed with IOIS16; PC17
SSI4_FS
Frame Sync signal which is output in master and input in slave; PC16
General Purpose Timers (X6)
TIN
Timer Input Capture or Timer Input Clock—The signal on this input is applied to GPT 1–3
simultaneously. This signal is muxed with the Walk-up Guard Mode WKGD signal in the PLL,
Clock, and Reset Controller module, and is also multiplexed with GPT6_TOUT; PC15.
TOUT1
Timer Output signal from General Purpose Timer1 (GPT1). This signal is multiplexed with
SSI1_MCLK and SSI2_MCLK signal of SSI1 and SSI2. The pin name of this signal is simply
TOUT, and is also multiplexed with GPT6_TIN; PC14.
Note: TOUT2, TOUT3 are multiplexed with PWMO pad; GPT4 and GPT5 signals are multiplexed with SSI2 pads.
USB2.0
USBOTG_DIR/TXDM
USB OTG direction/Transmit Data Minus signal, multiplexed with KP_ROW7A; PE2
USBOTG_STP/TXDM
USB OTG Stop signal/Transmit Data Minus signal, multiplexed with KP_ROW6A; PE1
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
32
Freescale Semiconductor
Signal Descriptions
Table 3. i.MX27/MX27L Signal Descriptions (continued)
Pad Name
Function/Notes
USBOTG_NXT/TXDM
USB OTG NEXT/Transmit Data Minus signal, multiplexed with KP_COL6A; PE0
USBOTG_CLK/TXDM
USB OTG Clock/Transmit Data Minus signal, PE24
USBOTG_DATA7/SUSPEND
USB OTG Data7/Suspend signal, PE25
USBH2_STP/TXDM
USB Host2 Stop signal/Transmit Data Minus signal, PA4
USBH2_NXT/TXDM
USB Host2 NEXT/Transmit Data Minus signal, PA3
USBH2_DATA7/SUSPEND
USB Host2 Data7/Suspend signal, PA2
USBH2_DIR/TXDM
USB Host2 Direction/Transmit Data Minus signal, PA1
USBH2_CLK/TXDM
USB Host2 Clock/Transmit Data Minus signal; PA0
USBOTG_DATA3/RXDP
USB OTG data4/Receive Data Plus signal; multiplexed with SLCDC1_DAT15 through PC13
USBOTG_DATA4/RXDM
USB OTG data4/Receive Data Minus signal; multiplexed with SLCDC1_DAT14 through PC12
USBOTG_DATA1/TXDP
USB OTG data1/Transmit Data Plus signal; multiplexed with SLCDC1_DAT13 through PC11
USBOTG_DATA2/TXDm
USB OTG data2/Transmit Data Minus signal; multiplexed with SLCDC1_DAT12 through PC10
USBOTG_DATA0/Oen
USB OTG data0/Output Enable signal; multiplexed with SLCDC1_DAT11 through PC9
USBOTG_DATA6/SPEED
USB OTG data6/Suspend signal; multiplexed with SLCDC1_DAT10 and USBG_TXR_INT_B
through PC8
USBOTG_DATA5/RCV
USB OTG data5/RCV signal; multiplexed with SLCDC1_DAT9 through PC7
USBH1_RXDP
USB Host1 Receive Data Plus signal, multiplexed with UART4_RXD; multiplexed with
SLCDC1_DAT6 and UART4_RTS_ALT through PB31
USBH1_RXDM
USB Host1 Receive Data Minus signal; multiplexed with SLCDC1_DAT5 and UART4_CTS
through PB30
USBH1_TXDP
USB Host1 Transmit Data Plus signal; multiplexed with UART4_CTS, multiplexed with
SLCDC1_DAT4 and UART4_RXD_ALT through PB29
USBH1_TXDM
USB Host1 Transmit Data Minus signal; multiplexed with UART4_TXD, multiplexed with
SLCDC1_DAT3 through PB28
USBH1_OE_B
USB Host1 Output Enable signal; multiplexed with SLCDC1_DAT2 through PB27
USBH1_FS
USB Host1 Full Speed output signal, multiplexed with UART4_RTS, multiplexed with
SLCDC1_DAT1 through PB26
USBH1_RCV
USB Host1 RCV signal; multiplexed with SLCDC1_DAT0 through PB25
USB_OC_B
USB OC signal. PB24
USB_PWR
USB Power signal; PB23
USBH1_SUSP
USB Host1 Suspend signal; PB22
LCD Controller and Smart LCD Controller
OE_ACD
Alternate Crystal Direction/Output Enable; PA31
CONTRAST
This signal is used to control the LCD bias voltage as contrast control; PA30
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
33
Signal Descriptions
Table 3. i.MX27/MX27L Signal Descriptions (continued)
Pad Name
Function/Notes
VSYNC
Frame Sync or Vsync—This signal also serves as the clock signal output for gate;
driver (dedicated signal SPS for Sharp panel HR-TFT); PA29.
HSYNC
Line Pulse or HSync; PA28
SPL_SPR
Sampling start signal for left and right scanning. Through GPIO, this signal is multiplexed with
the SLCDC1_CLK; PA27.
PS
Control signal output for source driver (Sharp panel dedicated signal). This signal is multiplexed
with the SLCDC1_CS; PA26.
CLS
Start signal output for gate driver. This signal is invert version of PS (Sharp panel dedicated
signal). This signal is multiplexed with the SLCDC1_RS; PA25.
REV
Signal for common electrode driving signal preparation (Sharp panel dedicated signal). This
signal is multiplexed with SLCDC1_D0; PA24.
LD [17:0]
LCD Data Bus—All LCD signals are driven low after reset and when LCD is off. Through GPIO,
LD[15:0] signals are multiplexed with SLCDC1_DAT[15:0], SLCDC. PA23–PA6.
LSCLK
Shift Clock; PA5
Note: SLCDC signals are multiplexed with LCDC signals.
ATA (not available on i.MX27L)
ATA_DATA15–0
ATA Data Bus, [15:0] are multiplexed with
ETMTRACEPKT4–12,
FEC_MDIO,
ETMTRACEPKT13–14
SD3_D3–0;
Through GPIO also are multiplexed with SLCDC 15–0, and FEC signals; PF23, PD16–PD2.
Noisy I/O Supply Pins
NVDD1–15, AVDD
Noisy Supply for the I/O pins. There are 16 I/O voltage pads, N VDD1 through NVDD15 + AVDD.
Analog Supply Pins
FPMVDD
MPLLVDD
OSC26VDD
UPLLVDD
OSC32VDD
OSC32VSS
Supply for analog blocks
FPMVSS
MPLLVSS
OSC26VSS
UPLLVSS
Quiet GND for analog blocks
QVDD Internal Power Supply
QVDD
Power supply pins for silicon internal circuitry
QVSS
GND pins for silicon internal circuitry
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
34
Freescale Semiconductor
Signal Descriptions
Table 3. i.MX27/MX27L Signal Descriptions (continued)
Pad Name
Function/Notes
FUSEVDD
For FuseVDD
RTCVDD
For RTC, SCC power supply
RTCVSS
For RTC, SCC GND
Note: Both 1-Wire and Fast Ethernet Controller signals are multiplexed with other signals. As a result these signal names do
not appear in this list. The signals are listed below with the named signal that they are multiplexed.
1-Wire Signals:
The 1-Wire input and output signal is multiplexed with JTAG RTCK pad, PE16.
Fast Ethernet Controller (FEC) Signals on the i.MX27. The ATA module does not exist on the i.MX27L:
FEC_TX_EN: Transmit enable signal, through GPIO multiplexed with ATA_DATA15 pad; PF23
FEC_TX_ER: Transmit Data Error; through GPIO multiplexed with ATA_DATA14 pad; PD16
FEC_COL: Collision signal; through GPIO multiplexed with ATA_DATA13 pad; PD15
FEC_RX_CLK: Receive Clock signal; through GPIO multiplexed with ATA_DATA12 pad; PD14
FEC_RX_DV: Receive data Valid signal; through GPIO multiplexed with ATA_DATA11 pad; PD13
FEC_RXD0: Receive Data0; through GPIO multiplexed with ATA_DATA10 pad; PD12
FEC_TX_CLK: Transmit Clock signal; through GPIO multiplexed with ATA_DATA9 pad; PD11
FEC_CRS: Carrier Sense enable; through GPIO multiplexed with ATA_DATA8 pad; PD10
FEC_MDC: Management Data Clock; through GPIO multiplexed with ATA_DATA7 pad; PD9
FEC_MDIO: Management Data Input/Output, multiplexed with ATA_DATA6 pad; PD8
FEC_RXD3–1: Receive Data; through GPIO multiplexed with ATA_DATA5–3 pad; PD7–5
FEC_RX_ER: Receive Data Error; through GPIO multiplexed with ATA_DATA2 pad; PD4
FEC_TXD3–2: Transmit Data; through GPIO multiplexed with ATA_DATA1–0; pad; PD3–2
FEC_TXD1: Transmit Data; through GPIO multiplexed with SD3_CLK pad; PD1
FEC_TXD0: Transmit Data; through GPIO multiplexed with SD3_CMD pad; PD0
Note: The Rest ATA signals are multiplexed with PCMCIA Pads.
3.1
Power-Up Sequence
The i.MX27/MX27L processor consists of three major sets for power supply voltage named QVDD (core
logic supply), FUSEVDD (analog supply for FUSEBOX), and NVDD,VDDA (IO supply). The External
Voltage Regulators and power-on devices must provide the applications processor with a specific sequence
of power and resets to ensure proper operation.
It is important that the applications processor power supplies be powered-up in a certain order to avoid
unintentional fuse blown. QVDD should be powered up before FUSEVDD. The recommended order is:
1. QVDD(1.5 V)
2. FUSEVDD (1.8 V), NVDD (1.8/2.775 V), and Analog Supplies (2.775 V). See Table 3 for signal
descriptions.
or
1. QVDD (1.5 V), NVDD (1.8/2.775 V), and Analog Supplies (2.775 V). See Table 3 for signal
descriptions.
2. FUSEVDD (1.8 V).
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
35
Signal Descriptions
3.2
EMI Pins Multiplexing
This section discusses the multiplexing of EMI signals. The EMI signals’ multiplexing is done inside the
EMI. Table 4 lists the i.MX27 pin names, pad types, and the memory devices’ equivalent pin names.
Table 4. EMI Multiplexing
Pin Name
Pad Type
WEIM
SDRAM
PCMCIA
DDR
NFC
A0
regular
A0
MA0
A0
MA0
—
A1
regular
A1
MA1
A1
MA1
—
A2
regular
A2
MA2
A2
MA2
—
A3
regular
A3
MA3
A3
MA3
—
A4
regular
A4
MA4
A4
MA4
—
A5
regular
A5
MA5
A5
MA5
—
A6
regular
A6
MA6
A6
MA6
—
A7
regular
A7
MA7
A7
MA7
—
A8
regular
A8
MA8
A8
MA8
—
A9
regular
A9
MA9
A9
MA9
—
A10
regular
A10
—
A10
—
—
MA10
regular
—
MA10
—
MA10
—
A11
regular
A11
MA11
A11
MA11
—
A12
regular
A12
MA12
A12
MA12
—
A13
regular
A13
MA13
A13
MA13
—
A14
regular
A14
—
A14
—
—
A15
regular
A15
—
A15
—
—
A16
regular
A16
—
A16
—
—
A17
regular
A17
—
A17
—
—
A18
regular
A18
—
A18
—
—
A19
regular
A19
—
A19
—
—
A20
regular
A20
—
A20
—
—
A21
regular
A21
—
A21
—
—
A22
regular
A22
—
A22
—
—
A23
regular
A23
—
A23
—
—
A24
regular
A24
—
A24
—
—
A25
regular
A25
—
A25
—
—
SDBA1
regular
—
SDBA1
CE1
—
—
SDBA0
regular
—
SDBA0
CE2
—
—
SD0
ddr
—
SD0
—
—
—
SD1
ddr
—
SD1
—
—
—
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
36
Freescale Semiconductor
Signal Descriptions
Table 4. EMI Multiplexing (continued)
Pin Name
Pad Type
WEIM
SDRAM
PCMCIA
DDR
NFC
SD2
ddr
—
SD2
—
—
—
SD3
ddr
—
SD3
—
—
—
SD4
ddr
—
SD4
—
—
—
SD5
ddr
—
SD5
—
—
—
SD6
ddr
—
SD6
—
—
—
SD7
ddr
—
SD7
—
—
—
SD8
ddr
—
SD8
—
—
—
SD9
ddr
—
SD9
—
—
—
SD10
ddr
—
SD10
—
—
—
SD11
ddr
—
SD11
—
—
—
SD12
ddr
—
SD12
—
—
—
SD13
ddr
—
SD13
—
—
—
SD14
ddr
—
SD14
—
—
—
SD15
ddr
—
SD15
—
—
—
SD16
ddr
—
SD16
—
—
—
SD17
ddr
—
SD17
—
—
—
SD18
ddr
—
SD18
—
—
—
SD19
ddr
—
SD19
—
—
—
SD20
ddr
—
SD20
—
—
—
SD21
ddr
—
SD21
—
—
—
SD22
ddr
—
SD22
—
—
—
SD23
ddr
—
SD23
—
—
—
SD24
ddr
—
SD24
—
—
—
SD25
ddr
—
SD25
—
—
—
SD26
ddr
—
SD26
—
—
—
SD27
ddr
—
SD27
—
—
—
SD28
ddr
—
SD28
—
—
—
SD29
ddr
—
SD29
—
—
—
SD30
ddr
—
SD30
—
—
—
SD31
ddr
—
SD31
—
—
—
DQM0
ddr
—
DQM0
—
—
—
DQM1
ddr
—
DQM1
—
—
—
DQM2
ddr
—
DQM2
—
—
—
DQM3
ddr
—
DQM3
—
—
—
EB0
regular
EB0
—
REG
—
—
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
37
Signal Descriptions
Table 4. EMI Multiplexing (continued)
Pin Name
Pad Type
WEIM
SDRAM
PCMCIA
DDR
NFC
EB1
regular
EB1
—
IORD
—
—
OE
regular
OE
—
IOWR
—
—
CS0
regular
CS0
—
—
—
—
CS1
regular
CS1
—
—
—
—
CS2
regular
CS2
CSD0
—
—
—
CS3
regular
CS3
CSD1
—
—
—
CS4
regular
CS4
—
—
—
—
CS5
regular
CS5
—
—
—
—
ECB
regular
ECB
—
—
—
—
LBA
regular
LBA
—
OE
—
—
BCLK
regular
BCLK
—
—
—
—
RW
regular
RW
—
WE
—
—
RAS
regular
—
RAS
—
—
—
CAS
regular
—
CAS
—
—
—
SDWE
regular
—
SDWE
—
—
—
SDCKE0
regular
—
SDCKE0
—
—
—
SDCKE1
regular
—
SDCKE1
—
—
—
SDCLK
regular
—
SDCLK
—
—
—
SDCLK
—
—
—
—
—
—
SDQS0
ddr
—
—
—
SDQS0
—
SDQS1
ddr
—
—
—
SDQS1
—
SDQS2
ddr
—
—
—
SDQS2
—
SDQS3
ddr
—
—
—
SDQS3
—
NFWE
regular
—
—
—
—
WE
NFRE
regular
—
—
—
—
RE
NFALE
regular
—
—
—
—
ALE
NFCLE
regular
—
—
—
—
CLE
NFWP
regular
—
—
—
—
WP
NFCE
regular
—
—
—
—
CE
NFRB
regular
—
—
—
—
R/B
D15
regular
D15
—
D15
—
D15
D14
regular
D14
—
D14
—
D14
D13
regular
D13
—
D13
—
D13
D12
regular
D12
—
D12
—
D12
D11
regular
D11
—
D11
—
D11
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
38
Freescale Semiconductor
Signal Descriptions
Table 4. EMI Multiplexing (continued)
Pin Name
Pad Type
WEIM
SDRAM
PCMCIA
DDR
NFC
D10
regular
D10
—
D10
—
D10
D9
regular
D9
—
D9
—
D9
D8
regular
D8
—
D8
—
D8
D7
regular
D7
—
D7
—
D7
D6
regular
D6
—
D6
—
D6
D5
regular
D5
—
D5
—
D5
D4
regular
D4
—
D4
—
D4
D3
regular
D3
—
D3
—
D3
D2
regular
D2
—
D2
—
D2
D1
regular
D1
—
D1
—
D1
D0
regular
D0
—
D0
—
D0
PC_CD1
regular
—
—
CD1
—
—
PC_CD2
regular
—
—
CD2
—
—
PC_WAIT
regular
—
—
WAIT
—
—
PC_READY
regular
—
—
READY
—
—
PC_PWRON
regular
—
—
PC_PWRON
—
—
PC_VS1
regular
—
—
VS1
—
—
PC_VS2
regular
—
—
VS2
—
—
PC_BVD1
regular
—
—
BVD1
—
—
PC_BVD2
regular
—
—
BVD2
—
—
PC_RST
regular
—
—
RST
—
—
IOIS16
regular
—
—
IOIS16/WP
—
—
PC_RW
regular
—
—
RW
—
—
PC_POE
regular
—
—
POE
—
—
M_REQUEST
regular
—
—
—
—
—
M_GRANT
regular
—
—
—
—
—
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
39
Electrical Characteristics
4
Electrical Characteristics
This section provides the chip-level and module-level electrical characteristics for the i.MX27/iMX27L.
4.1
i.MX27/iMX27L Chip-Level Conditions
This section provides the chip-level electrical characteristics for the IC. See Table 5 for a quick reference
to the individual tables and sections.
Table 5. i.MX27/iMX27L Chip-Level Conditions
For these characteristics…
Topic appears…
Table 6, “DC Absolute Maximum Conditions”
on page 40
Table 7, “DC Operating Conditions”
on page 40
Table 9, “Interface Frequency”
on page 41
Table 10, “Frequency Definition for Power Consumption Measurement”
on page 42
Table 11, “Current Consumption”
on page 42
Section 4.1.3, “Test Conditions and Recommended Settings”
on page 43
Table 6 provides the DC absolute maximum operating conditions.
CAUTION
Stresses beyond those listed under Table 6 may cause permanent damage to
device. These are stress ratings only. Functional operation of device at these
or any other conditions beyond those indicated under “DC operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions
for extended periods may affect device reliability.
Table 6. DC Absolute Maximum Conditions
Ref.
Num
Parameter
1
Supply Voltage
2
Supply Voltage (Level Shift I/O)
3
Input Voltage Range
4
Storage Temperature Range
Symbol
Min
Max
Units
VDDmax
–0.5
1.52
V
VDDIOmax
–0.5
3.3
V
VImax
–0.5
NVDD (1, 5–13) + 0.3
V
Tstorage
–20
125
oC
Table 7 provides the DC recommended operating conditions.
Table 7. DC Operating Conditions
ID
Parameter
Symbol
Min
Typical
Max
Units
1
Core Supply Voltage (@266 MHz)
QVDD
1.2
1.3
1.52
V
2
Core Supply Voltage (@400 MHz)
QVDD
1.38
1.45
1.52
V
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
40
Freescale Semiconductor
Electrical Characteristics
Table 7. DC Operating Conditions (continued)
ID
Parameter
Symbol
Min
Typical
Max
Units
RTC VDD
1.2
—
1.52
V
3
RTC, SCC separate Supply Voltage
4
I/O Supply Voltage, Fast (7, 11, 12, 14, 15)1
NVDD_FAST
1.75
—
2.8
V
5
I/O Supply Voltage, Slow (5, 6, 8, 9, 10, 13, AVDD)
NVDD_SLOW
1.75
—
3.05
V
NVDD_SLOW
1.75
—
3.1
V
NVDD_DDR
1.75
—
1.9
V
VDD
1.35
1.4
1.6
V
FUSEVDD
(read mode)
1.7
1.875
1.95
V
FUSEVDD
(program mode)
3.00
3.15
3.30
V
6
I/O Supply Voltage, DDR (1, 2, 3, 4)2
7
Analog Supply Voltage: FPMVDD, UPLLVDD, MPLLVDD
8
Fusebox read Supply Voltage
9
Fusebox Program Supply Voltage
10
OSC32VDD
VOSC32
1.1
—
1.6
V
11
OSC26VDD
VOSC26
2.68
—
2.875
V
12
Operating Ambient Temperature (17mm x17mm package)
TA
–20
—
85
oC
13
Operating Ambient Temperature (19mm x19mm package)
TA
–40
—
85
oC
Note:
1
2
Segments 11, 14, 15 are mixture of Fast and Slow GPIO.
Segments 1, 3, 4 are mixture of DDR and Fast GPIO.
4.1.1
DPLL Frequency Specification
Table 8 provides the frequency specifications for the DPLL.
Table 8. DPLL FREQUENCY Specifications
Parameter
Min
Typical
Max
Unit
Output Duty Cycle (dpdck)
48.5
50.0
51.5
%
Output Duty Cycle (dpgdck_2)
48.5
50.0
51.5
%
Frequency lock time
(FOL mode or non-integer MF)
—
—
80
µs
Phase lock time
—
—
100
µs
Cycle-to-cycle jitter
—
—
0.2
ns
Table 9 provides information for interface frequency limits.
Table 9. Interface Frequency
ID
1
Parameter
JTAG: TCK Frequency of Operation
Symbol
Min
Typical
Max
Units
fJTAG
DC
5
33.25
MHz
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
41
Electrical Characteristics
4.1.2
Current Consumption
Table 10 defines the frequency settings used for specifying power consumption in Table 11. All power
states are specified. The temperature setting of 25° C is used for specifying the Deep Sleep Mode (DSM)
per the temperature range shown in Table 7.
Table 10. Frequency Definition for Power Consumption Measurement
ID
Parameter
Symbol
Value
Units
1
MCU core
fMCUmeas@266
266
MHz
2
MCU core
fMCUmeas@400
400
MHz
3
MCU AHB bus
fMCU-AHBmeas
133
MHz
4
MCU IP bus
fMCU-IPmeas
66
MHz
5
OSC32
fosc32khzmeas
32.768
kHz
Table 11 shows the power consumption for the i.MX27/iMX27L device.
Table 11. Current Consumption
ID
1
Parameter
Conditions
Symbol
Typical
Units
RUN Current RUN Current at 266 MHz
(QVDD current) QVDD = 1.3 V
IddRUN
260
mA
RUN Current at 400 MHz
QVDD = 1.45 V
IddRUN
300
mA
2
Doze Current
•
•
•
•
•
•
•
•
•
•
•
QVDD = 1.2 V
NVDD = 1.75 V
ARM is in wait for interrupt mode.
ARM well bias is enabled.
MCU PLL is on.
SPLL is off.
FPM is on.
26MHz oscillator is on.
32 kHz oscillator is on.
Other modules are off.
TA = 25° C.
IddDOZE
11
mA
3
Sleep Current
•
•
•
•
•
•
•
•
•
QVDD = 1.2 V.
NVDD = 1.75 V.
Both PLLs are off.
FPM is off.
ARM well bias is enabled.
32 kHz oscillator is on.
26MHz oscillator is off.
All the modules are off.
TA = 25° C.
IddSLEEP
900
µA
4
Power Gate
IddPG
75
µA
• NVDD13 is on. See Table 7 for specific values.
• RTCVDD, OSC32VDD are on. See Table 7 for specific
values.
• All other VDD = 0 V
• TA = 25° C.
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
42
Freescale Semiconductor
Electrical Characteristics
4.1.3
Test Conditions and Recommended Settings
Unless specified, AC timing parameters are specified for 15 pF loading on i.MX27/iMX27L pads. Drive
strength has been kept at default/reset values for testing. EMI timing has been verified with high drive
strength setting and 25 pF loads. SDHC timing has also been verified with high drive strength setting.
Unless otherwise noted, AC/DC parameters are guaranteed at operating conditions shown in Table 7.
4.2
Module-Level Electrical Specifications
This section contains the i.MX27/iMX27L electrical information including timing specifications, arranged
in alphabetical order by module name.
4.2.1
4.2.1.1
Pads IO (PADIO) Electricals
DC Electrical Characteristics
The over-operating characteristics appear in Table 12 for GPIO pads and Table 13 for DDR (Double Data
Rate) pads (unless otherwise noted).
Table 12. GPIO Pads DC Electrical Parameters
Parameter
High-level output voltage
Low-level output voltage
High-level output current, slow slew rate
High-level output current, fast slew rate
Low-level output current, slow slew rate
Low-level output current, fast slew rate
Symbol
Test Conditions
Min
Typical
Max
Units
VOH
IOH = -1 mA
NVDD -0.15
—
—
V
IOH = specified Drive
0.8*NVDD
—
—
V
IOL = 1 mA
—
—
0.15
V
IOL = specified Drive
—
—
0.2*NVDD
V
VOH = 0.8*NVDD
Normal
High
Max High1
—
—
mA
–2
–4
–8
VOH = 0.8*NVDD
Normal
High
Max High1
—
—
mA
–4
–6
–8
VOL = 0.2*NVDD
Normal
High
Max High1
—
—
mA
2
4
8
VOL = 0.2*NVDD
Normal
High
Max High1
—
—
mA
4
6
8
VOL
IOH_S
IOH_F
IOL_S
IOL_F
Input Hysteresis
VHYS
Hysteresis enabled
0.25
—
—
V
Schmitt trigger VT+
VT +
Hysteresis enabled
0.5*QVDD
—
—
V
Schmitt trigger VT-
VT -
Hysteresis enabled
—
—
0.5*QVDD
V
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
43
Electrical Characteristics
Table 12. GPIO Pads DC Electrical Parameters (continued)
Parameter
Symbol
Test Conditions
Min
Typical
Max
Units
Pull-up resistor (22 kΩ PU)
RPU
—
15
22
59
Pull-up resistor (47 kΩ PU)
RPU
—
30
47
128
Pull-up resistor (100 kΩ PU)
RPU
—
34
100
268
Pull-down resistor (100 kΩ PD)
RPD
—
25
100
343
Input current (no PU/PD)
IIN
VI = 0
VI = NVDD
—
0.33
±1
μA
Input current (22 kΩ PU)
IIN
VI = 0
VI = NVDD
—
—
115
0.1
μA
μA
Input current (47 kΩ PU)
IIN
VI = 0
VI = NVDD
—
—
53
0.1
μA
μA
Input current (100 kΩ PU)
IIN
VI = 0
VI = NVDD
—
—
25
0.1
μA
μA
Input current (100 kΩ PD)
IIN
VI = 0
VI = NVDD
—
—
0.25
28
μA
μA
Tri-state input leakage current
IZ
VI = NVDD or 0
I/O = high Z
—
0.33
±2
μA
High Level DC Input Voltage
VIH
—
0.7*VDDIO
—
VDDIO
V
Low-Level DC Input Voltage
VIL
—
0
—
0.3*VDDIO
V
kΩ
Note:
1
Max High strength should be avoided due to excessive overshoot and ringing.
Table 13. DDR (Double Data Rate) I/O Pads DC Electrical Parameters
Parameter
High-level output voltage
Symbol
Test Conditions
Min
Typical
Max
Units
VOH
IOH = -1 mA
NVDD_DDR
–0.08
—
—
V
IOH = specified Drive
0.8*NVDD_
—
—
V
DDR
Low-level output voltage
VOL
IOL = 1 mA
—
—
0.08
V
IOL = specified Drive
—
—
0.2*NVDD_
V
DDR
High-level output current
IOH
VOH=0.8*NVDD_DDR
Normal
High
Max High1
DDR Drive1
—
—
mA
–3.6
–7.2
–10.8
–14.4
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
44
Freescale Semiconductor
Electrical Characteristics
Table 13. DDR (Double Data Rate) I/O Pads DC Electrical Parameters (continued)
Parameter
Symbol
Test Conditions
Min
IOL
VOL=0.2*NVDD_DDR
Normal
High
Max High1
DDR Drive1
3.6
7.2
10.8
14.4
Low-level output current
Low-level input current
IIL
VI = 0
—
High-level input current
IIH
VI = NVDD_DDR
—
Tri-state current
IZ
VI = NVDD_DDR or 0
I/O = high Z
—
Typical
Max
Units
—
—
mA
1.7
2
μA
2
μA
2
μA
1.7
Note:
1
Max High and DDR Drive strengths should be avoided due to excessive overshoot and ringing.
4.2.1.2
AC Electrical Characteristics
Figure 2 depicts the load circuit for output pads. Figure 3 depicts the output pad transition time waveform.
The range of operating conditions appear in Table 14 for slow general I/O, Table 15 for fast general I/O,
and Table 16 for DDR I/O (unless otherwise noted).
From Output
Under Test
Test Point
CL
CL includes package, probe and jig capacitance
Figure 2. Load Circuit for Output Pad
NVDD
80%
80%
20%
20%
Output (at pad)
0V
PA1
PA1
Figure 3. Output Pad Transition Time Waveform
Table 14. AC Electrical Characteristics of Slow General I/O Pads
ID
PA1
—
Parameter
Symbol
Test Condition
Min
Typical
Max
Units
Output Pad Transition Times (Max High)
tpr
25 pF
50 pF
1.25
1.95
1.9
2.9
3.2
4.75
ns
Output Pad Transition Times (High)
tpr
25 pF
50 pF
1.45
2.6
—
4.8
8.4
ns
Output Pad Transition Times (Standard Drive)
tpr
25 pF
50 pF
2.6
5.1
—
8.5
16.5
ns
Maximum Input Transition Times1
trm
—
—
—
25
ns
Note:
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
45
Electrical Characteristics
1
Hysteresis mode is recommended for input with transition time greater than 25 ns.
Table 15. AC Electrical Characteristics of Fast General I/O Pads
ID
PA1
—
Parameter
Symbol
Test Condition
Min
Typical
Max
Units
Output Pad Transition Times (Max High)
tpr
25 pF
50 pF
0.9
1.7
1.2
2.4
2.0
4.0
ns
Output Pad Transition Times (High)
tpr
25 pF
50 pF
1.15
2.3
1.6
3.1
2.7
5.3
ns
Output Pad Transition Times (Normal)
tpr
25 pF
50 pF
1.7
3.4
2.4
4.7
4.0
8.0
ns
Maximum Input Transition Times1
trm
—
—
—
25
ns
Note:
1
Hysteresis mode is recommended for input with transition time greater than 25 ns.
Table 16. AC Electrical Characteristics of DDR I/O Pads
ID
PA1
—
4.2.2
Parameter
Symbol
Test Condition
Min
Typical
Max
Units
Output Pad Transition Times (DDR Drive)
tpr
25 pF
50 pF
0.5
1.0
0.75
1.45
1.2
2.4
ns
Output Pad Transition Times (Max High)
tpr
25 pF
50 pF
0.67
1.3
1.0
2.0
1.6
3.1
ns
Output Pad Transition Times (High)
tpr
25 pF
35 pF
1.0
1.95
1.5
2.9
2.4
4.7
ns
Output Pad Transition Times (Normal)
tpr
25 pF
50 pF
2.0
3.9
2.9
5.9
4.8
8.4
ns
Maximum Input Transition Times
trm
—
—
—
5
ns
1-Wire Electrical Specifications
Figure 4 depicts the RPP timing, and Table 17 lists the RPP timing parameters.
1-Wire Tx
“Reset Pulse”
DS2502 Tx
“Presence Pulse”
OW2
One-Wire bus
(BATT_LINE)
OW1
OW3
OW4
Figure 4. Reset and Presence Pulses (RPP) Timing Diagram
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
46
Freescale Semiconductor
Electrical Characteristics
Table 17. RPP Sequence Delay Comparisons Timing Parameters
ID
Parameters
Symbol
Min
Typical
Max
Units
OW1
Reset Time Low
tRSTL
480
511
OW2
Presence Detect High
tPDH
15
—
60
µs
OW3
Presence Detect Low
tPDL
60
—
240
µs
OW4
Reset Time High
tRSTH
480
512
—
—
µs
Figure 5 depicts Write 0 Sequence timing, and Table 18 lists the timing parameters.
OW6
One-Wire bus
(BATT_LINE)
OW5
Figure 5. Write 0 Sequence Timing Diagram
Table 18. WR0 Sequence Timing Parameters
ID
Parameter
OW5
Write 0 Low Time
OW6
Transmission Time Slot
Symbol
Min
Typical
Max
Units
tWR0_low
60
100
120
µs
tSLOT
OW5
117
120
µs
Figure 6 depicts Write 1 Sequence timing, Figure 7 depicts the Read Sequence timing, and Table 19 lists
the timing parameters.
OW8
One-Wire bus
(BATT_LINE)
OW7
Figure 6. Write 1 Sequence Timing Diagram
OW8
One-Wire bus
(BATT_LINE)
OW7
OW9
Figure 7. Read Sequence Timing Diagram
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
47
Electrical Characteristics
Table 19. Write 1/Read Timing Parameters
ID
4.2.3
Parameter
Symbol
Min
Typical
Max
Units
OW7
Write 1/Read Low Time
tLOW1
1
5
15
µs
OW8
Transmission Time Slot
tSLOT
60
117
120
µs
OW9
Release Time
tRELEASE
15
—
45
µs
ATA Electrical Specifications
This section describes the electrical information of the Parallel ATA module compliant with ATA/ATAPI-6
specification.
NOTE
The parallel ATA module is not available on the i.MX27L
Parallel ATA module can work on PIO/Multi-Word DMA/Ultra DMA transfer modes. Each transfer mode
has different data transfer rate, Ultra DMA mode 4 data transfer rate is up to 100 MB/s. Parallel ATA
module interface consist of a total of 29 pins, Some pins act on different function in different transfer
mode. There are different requirements of timing relationships among the function pins conform with
ATA/ATAPI-6 specification and these requirements are configurable by the ATA module registers.
Below defines the AC characteristics of all the interface signals on all data transfer modes.
4.2.3.1
General Timing Requirements
These are the general timing requirements for the ATA interface signals.
Table 20. AC Characteristics of All Interface Signals
ID
Parameter
Symbol
Min
Max
Unit
SI1
Rising edge slew rate for any signal on ATA
interface (see note)
Srise
—
1.25
V/ns
SI2
Falling edge slew rate for any signal on ATA
interface (see note)
Sfall
—
1.25
V/ns
SI3
Host interface signal capacitance at the host
connector
Chost
—
20
pF
Note: SRISE and SFALL meets this requirement when measured at the sender’s connector from 10–90% of full signal
amplitude with all capacitive loads from 15 pf through 40 pf where all signals have the same capacitive load value.
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
48
Freescale Semiconductor
Electrical Characteristics
ATA Interface Signals
SI2
SI1
Figure 8. ATA interface Signals Timing Diagram
4.2.4
Digital Audio Mux (AUDMUX)
The AUDMUX provides a programmable interconnect logic for voice, audio and data routing between
internal serial interfaces (SSI, SAP) and external serial interfaces (audio and voice codecs). The AC timing
of AUDMUX external pins is hence governed by SSI and SAP modules. Please refer to their respective
electrical specifications.
4.2.5
CMOS Sensor Interface (CSI)
This section describes the electrical information (AC timing) of the CSI.
4.2.5.1
Gated Clock Mode Timing
VSYNC, HSYNC, and PIXCLK signals are used in this mode. A frame starts with a rising/falling edge on
VSYNC, then HSYNC goes high and holds for the entire line. The pixel clock is valid as long as HSYNC
is high. Figure 9 and Figure 10 depict the gated clock mode timings of CSI, and Table 21 lists the timing
parameters.
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
49
Electrical Characteristics
Figure 9 shows sensor output data on the pixel clock falling edge. The CSI latches data on the pixel clock
rising edge.
1
VSYNC
7
HSYNC
2
5
6
PIXCLK
Valid Data
Valid Data
DATA[7:0]
3
Valid Data
4
Figure 9. CSI Timing Diagram, Gated, PIXCLK—Sensor Data at Falling Edge, Latch Data at Rising Edge
Figure 10 shows sensor output data on the pixel clock rising edge. The CSI latches data on the pixel clock
falling edge.
1
VSYNC
7
HSYNC
2
5
6
PIXCLK
DATA[7:0]
Valid Data
Valid Data
3
Valid Data
4
Figure 10. CSI Timing Diagram, Gated, PIXCLK—Sensor Data at Rising Edge, Latch Data at Falling Edge
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
50
Freescale Semiconductor
Electrical Characteristics
Table 21. Gated Clock Mode Timing Parameters
Number
Parameter
Minimum
Maximum
Unit
1
csi_vsync to csi_hsync
9*THCLK
—
ns
2
csi_hsync to csi_pixclk
3
(Tp/2)-3
ns
3
csi_d setup time
1
—
ns
4
csi_d hold time
1
—
ns
5
csi_pixclk high time
THCLK
—
ns
6
csi_pixclk low time
THCLK
—
ns
7
csi_pixclk frequency
0
HCLK/2
MHz
HCLK = AHB System Clock, THCLK = Period for HCLK, Tp = Period of CSI_PIXCLK
The limitation on pixel clock rise time/fall time is not specified. It should be calculated from the hold
time and setup time based on the following assumptions:
Rising-edge latch data:
max rise time allowed = (positive duty cycle—hold time)
max fall time allowed = (negative duty cycle—setup time)
In most of case, duty cycle is 50/50, therefore:
max rise time = (period/2—hold time)
max fall time = (period/2—setup time)
For example: Given pixel clock period = 10 ns, duty cycle = 50/50, hold time = 1 ns, setup time = 1 ns.
positive duty cycle = 10/2 = 5 ns
max rise time allowed = 5 –1 = 4 ns
negative duty cycle = 10/2 = 5 ns
max fall time allowed = 5 –1 = 4 ns
Falling-edge latch data:
max fall time allowed = (negative duty cycle—hold time)
max rise time allowed = (positive duty cycle—setup time)
4.2.5.2
Non-Gated Clock Mode Timing
In non-gated mode only, the VSYNC, and PIXCLK signals are used; the HSYNC signal is ignored. Figure
3 and Figure 4 show the different clock edge timing of CSI and Sensor in Non-Gated Mode. Table 3 is the
parameter value. Figure 11 and Figure 12 show the non-gated clock mode timings of CSI, and Table 22
lists the timing parameters.
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
51
Electrical Characteristics
Figure 11 shows sensor output data on the pixel clock falling edge. The CSI latches data on the pixel clock
rising edge.
1
VSYNC
6
4
5
PIXCLK
Valid Data
DATA[7:0]
2
Valid Data
Valid Data
3
Figure 11. CSI Timing Diagram, Non-Gated, PIXCLK—Sensor Data at Falling Edge, Latch Data at Rising
Edge
Figure 12 shows sensor output data on the pixel clock rising edge. The CSI latches data on the pixel clock
falling edge.
1
VSYNC
6
5
4
PIXCLK
Valid Data
DATA[7:0]
2
Valid Data
Valid Data
3
Figure 12. CSI Timing Diagram, Non-Gated, PIXCLK—Sensor Data at Rising Edge, Latch Data at Falling
Edge
Table 22. Non-Gated Clock Mode Parameters
Number
Parameter
—
csi_vsync to csi_pixclk
—
csi_d setup time
Minimum
Maximum
Unit
9*THCLK
—
ns
1
—
ns
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
52
Freescale Semiconductor
Electrical Characteristics
Table 22. Non-Gated Clock Mode Parameters (continued)
Number
Parameter
Minimum
Maximum
Unit
1
—
ns
—
csi_d hold time
—
csi_pixclk high time
THCLK
—
ns
—
csi_pixclk low time
THCLK
—
ns
—
csi_pixclk high time
0
HCLK/2
MHz
HCLK = AHB System Clock, THCLK = Period of HCLK
4.2.6
Configurable Serial Peripheral Interface (CSPI)
This section describes the electrical information of the CSPI.
4.2.6.1
CSPI Timing
Figure 13 and Figure 14 show the master mode and slave mode timings of CSPI, and Table 23 lists the
timing parameters.
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
53
Electrical Characteristics
4.3
Timing Diagrams
Figure 13 and Figure 14 depict the master mode and slave mode timing diagrams of the CSPI and Table 23
lists the timing parameters. The values shown in timing diagrams were tested using a worst case core
voltage of 1.1 V, slow pad voltage of 2.68 V, and fast pad voltage of 1.65 V.
t7
SSn
(output)
t5
t8
t9
t6
CSPI1_RDY
(input)
t1
SCLK
(output)
t10
t2
t3
t11
t4
t4
MOSI
t12
t13
MISO
Figure 13. CSPI Master Mode Timing Diagram
t7’
t5’
SSn
(Input)
t6’
t1’
SCLK
(Input)
t10
t2’
t3’
t11
t4
t4
MISO
t12
t13
MOSI
Figure 14. CSPI Slave Mode Timing Diagram
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
54
Freescale Semiconductor
Electrical Characteristics
Table 23. CSPI Interface Timing Parameters
ID
Num
Parameter Description
Symbol
Minimum
Maximum
Units
t1
CSPI master SCLK cycle time
tclko
45.12
-
ns
t2
CSPI master SCLK high time
tclkoH
22.65
—
ns
t3
CSPI master SCLK low time
tclkoL
22.47
—
ns
t1’
CSPI slave SCLK cycle time
tclki
60.2
—
ns
t2’
CSPI slave SCLK high time
tclkiH
30.1
—
ns
t3’
CSPI slave SCLK low time
tclkiL
30.1
—
ns
t4
CSPI SCLK transition time
tpr1
2.6
8.5
ns
—
—
2Tsclk2
+T wait3
t5
SSn output pulse width
tWsso
t5’
SSn input pulse width
tWssi
Tper4
—
—
t6
SSn output asserted to first SCLK edge (SS output
setup time)
tSsso
3T sclk
—
—
t6’
SSn input asserted to first SCLK edge (SS input
setup time)
tSssi
Tper + 20 ns
—
—
t7
CSPI master: Last SCLK edge to SSn deasserted
(SS output hold time)
tHsso
2T sclk
—
—
t7’
CSPI slave: Last SCLK edge to SSn deasserted
(SS input hold time)
tHssi
30
—
ns
t8
CSPI master: CSPI1_RDY low to SSn asserted
(CSPI1_RDY setup time)
tSrdy
2Tper
5Tper
—
t9
CSPI master: SSn deasserted to CSPI1_RDY low
tHrdy
0
—
ns
t10
Output data setup time
tSdatao
(tclkoL or tclkoH or
tclkiL or tclkiH) Tipg5
—
—
t11
Output data hold time
tHdatao
tclkoL or tclkoH or
tclkiL or tclkiH
—
—
t12
Input data setup time
tSdatai
Tipg + 0.5
—
ns
t13
Input data hold time
tHdatai
5
—
ns
Note:
1
The output SCLK transition time is tested with 25 pF drive.
Tsclk = CSPI clock period
3
Twait = Wait time as per the Sample Period Control Register value.
4 T
per = CSPI reference baud rate clock period (PERCLK2)
5 T
ipg = CSPI main clock IPG_CLOCK period
2
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
55
Electrical Characteristics
4.3.1
Direct Memory Access Controller (DMAC)
After assertion of External DMA Request the DMA burst will start when the corresponding DMA channel
becomes the current highest priority channel. The External DMA Request should be kept asserted until it
is serviced by the DMAC. One External request will initiate at least one DMA burst.
The output External Grant signal from the DMAC is an active-low signal. This signal will be asserted
during the time when a DMA burst is ongoing for an External DMA Request, when the following
conditions are true:
• The DMA channel for which the DMA burst is ongoing has requested source as external DMA
Request (as per RSSR settings).
• REN and CEN bit of this channel are set.
• External DMA Request is asserted.
Once the grant is asserted the External DMA Request will not be sampled until completion of the DMA
burst. The priority of the external request will become low, for the next consecutive burst, if another DMA
request signal is asserted.
The waveforms are shown for the worst case—that is, smallest burst (1 byte read/write). Minimum and
maximum timings for the External request and External grant signal are present in the data sheet.
Figure 15 shows the minimum time for which the External Grant signal remains asserted if External DMA
request is de-asserted immediately after sensing grant signal active.
Ext_DMAReq
Ext_DMAGrant
tmin_assert
Figure 15. Assertion of DMA External Grant Signal
Figure 16 shows the safe maximum time for which External DMA request can be kept asserted, after
sensing grant signal active such that a new burst is not initiated.
Ext_DMAReq
Ext_DMAGrant
tmax_req_assert
Data read from
External device
tmax_read
tmax_write
Data written to
External device
NOTE: Assuming worst case that the data is read/written from/to external device as per the above waveform.
Figure 16. Timing Diagram of Safe Maximums for External Request De-Assertion
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
56
Freescale Semiconductor
Electrical Characteristics
Table 24. DMAC Timing Parameters
3.0 V
Parameter
1.8 V
Description
Unit
WCS
BCS
WCS
BCS
8hclk+8.6
8hclk+2.74
8hclk+7.17
8hclk+3.25
ns
Tmax_req_assert Maximum External Request assertion time after
assertion of Grant signal
9hclk–20.66
9hclk–6.7
9hclk–17.96
9hclk–8.16
ns
Tmax_read
Maximum External Request assertion time after
first read completion
8hclk–6.21
8hclk–0.77
8hclk–5.84
8hclk–0.66
ns
Tmax_write
Maximum External Request assertion time after
first write completion
3hclk–5.87
3hclk–8.83
3hclk–15.9
3hclkv91.2
ns
Tmin_assert
4.3.2
Minimum assertion time of External Grant signal
Fast Ethernet Controller (FEC)
This section describes the AC timing specifications of the FEC. The MII signals are compatible with
transceivers operating at a voltage of 3.3 V.
4.3.2.1
MII Receive Signal Timing (FEC_RXD[3:0], FEC_RX_DV, FEC_RX_ER,
and FEC_RX_CLK)
The receiver functions correctly up to a FEC_RX_CLK maximum frequency of 25 MHz + 1%. There is
no minimum frequency requirement. In addition, the FEC IPG clock frequency must exceed twice the
FEC_RX_CLK frequency.
Figure 17 shows the MII receive signal timings, and Table 25 lists the timing parameters.
M3
FEC_RX_CLK (input)
M4
FEC_RXD[3:0] (inputs)
FEC_RX_DV
FEC_RX_ER
M1
M2
Figure 17. MII Receive Signal Timing Diagram
Table 25. MII Receive Signal Timing Parameters
Parameter1
Min
Max
Unit
M1
FEC_RXD[3:0], FEC_RX_DV, FEC_RX_ER to FEC_RX_CLK setup
5
—
ns
M2
FEC_RX_CLK to FEC_RXD[3:0], FEC_RX_DV, FEC_RX_ER hold
5
—
ns
M3
FEC_RX_CLK pulse width high
35%
65%
FEC_RX_CLK period
ID
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
57
Electrical Characteristics
Table 25. MII Receive Signal Timing Parameters (continued)
Parameter1
ID
M4
FEC_RX_CLK pulse width low
Min
Max
Unit
35%
65%
FEC_RX_CLK period
Note:
1
FEC_RX_DV, FEC_RX_CLK, and FEC_RXD0 have the same timing in 10 Mbps 7-wire interface mode.
4.3.2.2
MII Transmit Signal Timing (FEC_TXD[3:0], FEC_TX_EN, FEC_TX_ER,
and FEC_TX_CLK)
The transmitter functions correctly up to a FEC_TX_CLK maximum frequency of 25 MHz + 1%. There
is no minimum frequency requirement. In addition, the FEC IPG clock frequency must exceed twice the
FEC_TX_CLK frequency.
Figure 18 shows the MII transmit signal timings, and Table 26 lists the timing parameters.
M7
FEC_TX_CLK (input)
M5
M8
FEC_TXD[3:0] (outputs)
FEC_TX_EN
FEC_TX_ER
M6
Figure 18. MII Transmit Signal Timing Diagram
Table 26. MII Transmit Signal Timing Parameters
Parameter1
ID
Min
Max
Unit
M5
FEC_TX_CLK to FEC_TXD[3:0], FEC_TX_EN, FEC_TX_ER invalid
5
—
ns
M6
FEC_TX_CLK to FEC_TXD[3:0], FEC_TX_EN, FEC_TX_ER valid
—
20
ns
M7
FEC_TX_CLK pulse width high
35%
65%
FEC_TX_CLK period
M8
FEC_TX_CLK pulse width low
35%
65%
FEC_TX_CLK period
Note:
1
FEC_TX_EN, FEC_TX_CLK, and FEC_TXD0 have the same timing in 10 Mbps 7-wire interface mode.
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
58
Freescale Semiconductor
Electrical Characteristics
4.3.2.3
MII Asynchronous Inputs Signal Timing (FEC_CRS and FEC_COL)
Figure 19 shows the MII asynchronous input timings, and Table 27 lists the timing parameters.
FEC_CRS, FEC_COL
M9
Figure 19. MII Asynchronous Inputs Signal Timing Diagram
Table 27. MII Asynchronous Inputs Signal Timing Parameter
ID
Parameter
M91
Min
Max
Unit
1.5
—
FEC_TX_CLK period
FEC_CRS to FEC_COL minimum pulse width
Note:
1
FEC_COL has the same timing in 10 Mbit 7-wire interface mode.
4.3.2.4
MII Serial Management Channel Timing (FEC_MDIO and FEC_MDC)
The FEC functions correctly with a maximum MDC frequency of 2.5 MHz. The MDC frequency should
be equal to or less than 2.5 MHz to be compliant with IEEE 802.3 MII specification. However the FEC
can function correctly with a maximum MDC frequency of 15 MHz.
Figure 20 shows the MII serial management channel timings, and Table 28 lists the timing parameters.
M14
M15
FEC_MDC (output)
M10
FEC_MDIO (output)
M11
FEC_MDIO (input)
M12
M13
Figure 20. MII Serial Management Channel Timing Diagram
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
59
Electrical Characteristics
Table 28. MII Serial Management Channel Timing Parameters
ID
Parameter
Min Max
Unit
M10
FEC_MDC falling edge to FEC_MDIO output invalid (minimum propagation delay)
0
—
ns
M11
FEC_MDC falling edge to FEC_MDIO output valid (max propagation delay)
—
5
ns
M12
FEC_MDIO (input) to FEC_MDC rising edge setup
18
—
ns
M13
FEC_MDIO (input) to FEC_MDC rising edge hold
0
—
ns
M14
FEC_MDC pulse width high
40% 60%
FEC_MDC period
M15
FEC_MDC pulse width low
40% 60%
FEC_MDC period
4.3.3
Inter IC Communication (I2C)
This section describes the electrical information of the I2C module.
I2C Module Timing
4.3.3.1
The I2C communication protocol consists of seven elements: START, Data Source/Recipient, Data
Direction, Slave Acknowledge, Data, Data Acknowledge, and STOP. Figure 21 shows the timing of the
I2C module. Table 29 lists the I2C module timing parameters.
SDA
IC5
IC3 IC4
SCL
IC1
IC2
IC6
2
Figure 21. I C Bus Timing Diagram
Table 29. I2C Module Timing Parameters
ID
1.8 V +/–0.10 V
3.0 V +/–0.30 V
Min
Max
Min
Max
Parameter
Unit
—
SCL Clock Frequency
0
100
0
100
kHz
IC1
Hold time (repeated) START Condition
114.8
—
111.1
—
ns
IC2
Data Hold Time
0
69.7
0
72.3
ns
IC3
Data Setup Time
3.1
—
1.76
—
ns
IC4
HIGH period of the SCL clock
69.7
—
68.3
—
ns
IC5
LOW period of the SCL clock
336.4
—
335.1
—
ns
IC6
Setup Time for STOP condition
110.5
—
111.1
—
ns
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
60
Freescale Semiconductor
Electrical Characteristics
4.3.4
JTAG Controller (JTAGC)
This section details the electrical characteristics for the JTAGC module. Figure 22 shows the JTAGC test
clock input timing; Figure 23 shows the JTAGC boundary scan timing; Figure 24 shows the JTAGC test
access port; Figure 25 shows the JTAGC TRST timing; and Table 30 lists the JTAGC timing parameters.
J1
J2
J2
Tck
(input)
J3
J3
Figure 22. Test Clock Input Timing Diagram
TCK
(input)
J5
J4
Data
(inputs)
Input Data Valid
J6
Data
(outputs)
Output Data Valid
J7
Data
(outputs)
J6
Data
(outputs)
Output Data Valid
Figure 23. Boundary Scan Timing Diagram
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
61
Electrical Characteristics
TCK
(input)
J9
J8
TDI, TMS
(inputs)
Input Data Valid
J10
TD0
(outputs)
Output Data Valid
J11
TD0
(outputs)
J10
TD0
(outputs)
Output Data Valid
Figure 24. Test Access Port (TAP) Diagram
TCK
(input)
J13
TRST
(input)
J12
Figure 25. TRST Timing Diagram
Table 30. JTAGC Timing Parameters
All Frequencies
ID
J1
Parameter
Unit
TCK cycle time in crystal mode
VM1
Min
Max
30.08
—
ns
15.04
—
ns
J2
TCK clock pulse width measured at
J3
TCK rise and fall times
—
2.0
ns
J4
Boundary scan input data set-up time
3.5
—
ns
J5
Boundary scan input data hold time
16.0
—
ns
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
62
Freescale Semiconductor
Electrical Characteristics
Table 30. JTAGC Timing Parameters (continued)
All Frequencies
ID
Parameter
Unit
Min
Max
J6
TCK low to output data valid
—
25.0
ns
J7
TCK low to output high impedance
—
25.0
ns
J8
TMS, TDI data set-up time
3.5
—
ns
J9
TMS, TDI data hold time
20.0
—
ns
J10
TCK low to TDO data valid
—
29.0
ns
J11
TCK low to TDO high impedance
—
29.0
ns
J12
TRST assert time
70.0
—
ns
J13
TRST set-up time to TCK low
2.5.0
—
ns
Note:
1
4.3.5
Midpoint voltage
Liquid Crystal Display Controller Module (LCDC)
Figure 26 and Figure 27 depict the timings of the LCDC, and Table 31 and Table 32 list the timing
parameters.
T5
FLM
LP
Line 1
Line n
Line 2
Line 1
T2
LP
T1
T6
LSCLK
T3
T4
LD
Figure 26. LCDC Non-TFT Mode Timing Diagram
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
63
Electrical Characteristics
Table 31. LCDC Non-TFT Mode Timing Parameters
ID
Description
Min
Max
Unit
22.5
1000
ns
T1
Pixel Clock period
T2
LP width
1
—
T1
T3
LD setup time
5
—
ns
T4
LD hold time
5
—
ns
T5
Wait between LP and FLM rising edge
2
—
T1
T6
Wait between last data and LP rising edge
1
—
T1
Note:
1
T is pixel clock period.
VSYNC
HSYNC
Line 1
Line n
Line 2
Line 1
HSYNC
T2
T5
T6
OE
T1
LSCLK
T3
T4
LD
Figure 27. LCDC TFT Mode Timing Diagram
Table 32. LCDC TFT Mode Timing Parameters
ID
Description
Min
Ma
Unit
T1
Pixel Clock period
22.5
1000
ns
T2
HSYNC width
1
—
T1
T3
LD setup time
5
—
ns
T4
LD hold time
5
—
ns
T5
Delay from the end of HSYNC to the beginning of the OE pulse.
3
—
T1
T6
Delay from end of OE to the beginning of the HSYNC pulse.
1
—
T1
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
64
Freescale Semiconductor
Electrical Characteristics
1
4.3.6
T is pixel clock period.
Memory Stick Host Controller (MSHC)
Figure 30, Figure 28, and Figure 29 show the MSHC timings. Table 33 and Table 34 list the timing
parameters.
NOTE
The i.MX27L does not contain an MSHC module.
tSCLKc
MSHC_SCLK
tBSsu
tBSh
MSHC_BS
tDsu
tDh
MSHC_DATA
(Output)
tDd
MSHC_DATA
(Input)
Figure 28. Transfer Operation Timing Diagram (Serial)
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
65
Electrical Characteristics
tSCLKc
MSHC_SCLK
tBSsu
tBSh
MSHC_BS
tDsu
tDh
MSHC_DATA
(Output)
tDd
MSHC_DATA
(Input)
Figure 29. Transfer Operation Timing Diagram (Parallel)
tSCLKc
tSCLKwh
tSCLKwl
MSHC_SCLK
tSCLKr
tSCLKf
Figure 30. MSHC_CLK Timing Diagram
Table 33. Serial Interface Timing Parameters
Standards
Signal
MSHC_SCLK
Parameter
Symbol
Unit
Min.
Max.
tSCLKc
50
—
ns
H pulse length
tSCLKwh
15
—
ns
L pulse length
tSCLKwl
15
—
ns
Rise time
tSCLKr
—
10
ns
Fall time
tSCLKf
—
10
ns
Cycle
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
66
Freescale Semiconductor
Electrical Characteristics
Table 33. Serial Interface Timing Parameters (continued)
Standards
Signal
MSHC_BS
MSHC_DATA
Parameter
Symbol
Unit
Min.
Max.
Setup time
tBSsu
5
—
ns
Hold time
tBSh
5
—
ns
Setup time
tDsu
5
—
ns
Hold time
tDh
5
—
ns
Output delay time
tDd
—
15
ns
Table 34. Parallel Interface Timing Parameters
Standards
Signal
MSHC_SCLK
MSHC_BS
MSHC_DATA
4.3.7
Parameter
Symbol
Unit
Min
Max
tSCLKc
25
—
ns
H pulse length
tSCLKwh
5
—
ns
L pulse length
tSCLKwl
5
—
ns
Rise time
tSCLKr
—
10
ns
Fall time
tSCLKf
—
10
ns
Setup time
tBSsu
8
—
ns
Hold time
tBSh
1
—
ns
Setup time
tDsu
8
—
ns
Hold time
tDh
1
—
ns
Output delay time
tDd
—
15
ns
Cycle
NAND Flash Controller Interface (NFC)
Figure 31, Figure 32, Figure 33, and Figure 34 show the relative timing requirements among different
signals of the NFC at module level, and Table 35 lists the timing parameters. The NAND Flash Controller
(NFC) timing parameters are based on the internal NFC clock generated by the Clock Controller module,
where time T is the period of the NFC clock in ns. The relationship between the NFC clock and the external
timing parameters of the NFC is provided in Table 35.
Table 35 also provides two examples of external timing parameters with NFC clock frequencies of
22.17 MHz and 33.25 MHz. Assuming a 266 MHz FCLK (CPU clock), NFCDIV should be set to
divide-by-12 to generate a 22.17 MHz NFC clock and divide-by-8 to generate a 33.25 MHz NFC clock.
The user should compare the parameters of the selected NAND Flash memory with the NFC external
timing parameters to determine the proper NFC clock. The maximum NFC clock allowed is 66 MHz. It
should also be noted that the default NFC clock on power up is 16.63 MHz.
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
67
Electrical Characteristics
NFCLE
NF1
NF2
NF3
NF4
NFCE
NF5
NFWE
NF6
NF7
NFALE
NF9
NF8
command
NFIO[7:0]
Figure 31. Command Latch Cycle Timing Diagram
NFCLE
NF1
NFCE
NF4
NF3
NF5
NFWE
NF6
NF7
NFALE
NF8
NFIO[7:0]
NF9
Address
Address
Time it takes for SW to issue the next address command
Figure 32. Address Latch Cycle Timing Diagram
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
68
Freescale Semiconductor
Electrical Characteristics
NFCLE
NF1
NF3
NFCE
NF10
NF4
NF5
NF11
NF8
NF9
NFWE
NF6
NFALE
NFIO[15:0]
Data to Flash
Figure 33. Write Data Latch Timing Diagram
NFCLE
NFCE
NF14
NF3
NF15
NF13
NFRE
NF17
NF16
NFRB
Data from Flash
NFIO[15:0]
NF12
Figure 34. Read Data Latch Timing Diagram
Table 35. NFC Target Timing Parameters
ID
Parameter
Symbol
Relationship to NFC NFC clock 22.17 MHz NFC clock 33.25 MHz
clock period (T)
T = 45 ns
T = 30 ns
Min
Max
Min
Max
Min
Max
Unit
NF1
NFCLE Setup Time
tCLS
T
—
45
—
30
—
ns
NF2
NFCLE Hold Time
tCLH
T
—
45
—
30
—
ns
NF3
NFCE Setup Time
tCS
T
—
45
—
30
—
ns
NF4
NFCE Hold Time
tCH
T
—
45
—
30
—
ns
NF5
NF_WP Pulse Width
tWP
T
—
45
—
30
—
ns
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
69
Electrical Characteristics
Table 35. NFC Target Timing Parameters (continued)
ID
Parameter
Symbol
Relationship to NFC NFC clock 22.17 MHz NFC clock 33.25 MHz
clock period (T)
T = 45 ns
T = 30 ns
Min
Max
Min
Max
Min
Max
Unit
NF6
NFALE Setup Time
tALS
T
—
45
—
30
—
ns
NF7
NFALE Hold Time
tALH
T
—
45
—
30
—
ns
NF8
Data Setup Time
tDS
T
—
45
—
30
—
ns
NF9
Data Hold Time
tDH
T
—
45
—
30
—
ns
NF10
Write Cycle Time
tWC
2T
—
90
—
60
—
ns
NF11
NFWE Hold Time
tWH
T
—
45
—
30
—
ns
NF12
Ready to NFRE Low
tRR
4T
—
180
—
120
—
ns
NF13
NFRE Pulse Width
tRP
1.5T
—
67.5
—
45
—
ns
NF14
READ Cycle Time
tRC
2T
—
90
—
60
—
ns
NF15
NFRE High Hold Time
tREH
0.5T
—
22.5
—
15
—
ns
NF16
Data Setup on READ
tDSR
15
—
15
—
15
—
ns
NF17
Data Hold on READ
tDHR
0
—
0
—
0
—
ns
NOTE
High is defined as 80% of signal value and low is defined as 20% of signal
value. All timings are listed according to this NFC clock frequency
(multiples of NFC clock period) except NF16, which is not NFC clock
related.
The read data is generated by the NAND Flash device and sampled with the
internal NFC clock.
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
70
Freescale Semiconductor
Electrical Characteristics
4.3.8
Personal Computer Memory Card International Association
(PCMCIA)
Figure 35 and Figure 36 show the timings pertaining to the PCMCIA module, each of which is an example
of one clock of strobe setup time and one clock of strobe hold time. Table 36 lists the timing parameters.
HCLK
HADDR
CONTROL
HWDATA
ADDR 1
CONTROL 1
DATA write 1
HREADY
HRESP
OKAY
A[25:0]
ADDR 1
D[15:0]
OKAY
OKAY
DATA write 1
WAIT
REG
REG
OE/WE/IORD/IOWR
CE1/CE2
RD/WR
POE
PSST
PSL
PSHT
Figure 35. Write Accesses Timing Diagram—PSHT=1, PSST=1
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
71
Electrical Characteristics
HCLK
ADDR 1
HADDR
CONTROL
CONTROL 1
DATA read 1
RWDATA
HREADY
HRESP
OKAY
A[25:0]
ADDR 1
OKAY
OKAY
D[15:0]
WAIT
REG
REG
OE/WE/IORD/IOWR
CE1/CE2
RD/WR
POE
PSST
PSHT
PSL
Figure 36. Read Accesses Timing Diagram—PSHT=1, PSST=1
Table 36. PCMCIA Write and Read Timing Parameters
Symbol
Parameter
Min
Max
Unit
PSHT
PCMCIA strobe hold time
0
63
clock
PSST
PCMCIA strobe set up time
1
63
clock
PSL
PCMCIA strobe length
1
128
clock
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
72
Freescale Semiconductor
Electrical Characteristics
4.3.9
SDRAM (DDR and SDR) Memory Controller
Figure 37, Figure 38, Figure 39, Figure 40, Figure 41, and Figure 42 depict the timings pertaining to the
ESDCTL module, which interfaces Mobile DDR or SDR SDRAM. Table 37, Table 38, Table 39, Table 40,
Table 41, and Table 42 list the timing parameters.
SD1
SDCLK
SDCLK
SD2
SD3
SD4
CS
SD5
RAS
SD4
SD5
SD4
CAS
SD4
SD5
SD5
WE
SD6
SD7
ADDR
ROW/BA
COL/BA
SD8
SD10
SD9
DQ
Data
SD4
DQM
Note: CKE is high during the read/write cycle.
SD5
Figure 37. SDRAM Read Cycle Timing Diagram
Table 37. DDR/SDR SDRAM Read Cycle Timing Parameters
ID
Parameter
Symbol
Min
Max
Unit
SD1
SDRAM clock high-level width
tCH
3.4
4.1
ns
SD2
SDRAM clock low-level width
tCL
3.4
4.1
ns
SD3
SDRAM clock cycle time
tCK
7.5
—
ns
SD4
CS, RAS, CAS, WE, DQM, CKE setup time
tCMS
2.0
—
ns
SD5
CS, RAS, CAS, WE, DQM, CKE hold time
tCMH
1.8
—
ns
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
73
Electrical Characteristics
Table 37. DDR/SDR SDRAM Read Cycle Timing Parameters (continued)
ID
Parameter
Symbol
Min
Max
Unit
SD6
Address setup time
tAS
2.0
—
ns
SD7
Address hold time
tAH
1.8
—
ns
SD8
SDRAM access time
tAC
—
6.47
ns
SD9
Data out hold time1
tOH
1.8
—
ns
SD10
Active to read/write command period
tRC
10
—
clock
Note:
1
Timing parameters are relevant only to SDR SDRAM. For the specific DDR SDRAM data related timing parameters, see
Table 41 and Table 42.
NOTE
SDR SDRAM CLK parameters are being measured from the 50%
point—that is, high is defined as 50% of signal value and low is defined as
50% of signal value. SD1 + SD2 does not exceed 7.5 ns for 133 MHz.
The timing parameters are similar to the ones used in SDRAM data
sheets—that is, Table 37 indicates SDRAM requirements. All output signals
are driven by the ESDCTL at the negative edge of SDCLK and the
parameters are measured at maximum memory frequency.
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
74
Freescale Semiconductor
Electrical Characteristics
SD1
SDCLK
SDCLK
SD2
SD3
SD4
CS
SD5
RAS
SD11
SD4
CAS
SD5
SD4
SD4
WE
SD5
SD5
SD12
SD7
SD6
ADDR
BA
COL/BA
ROW / BA
SD13
DQ
SD14
DATA
DQM
Figure 38. SDR SDRAM Write Cycle Timing Diagram
Table 38. SDR SDRAM Write Timing Parameters
ID
Parameter
Symbol
Min
Max
Unit
SD1
SDRAM clock high-level width
tCH
3.4
4.1
ns
SD2
SDRAM clock low-level width
tCL
3.4
4.1
ns
SD3
SDRAM clock cycle time
tCK
7.5
—
ns
SD4
CS, RAS, CAS, WE, DQM, CKE setup time
tCMS
2.0
—
ns
SD5
CS, RAS, CAS, WE, DQM, CKE hold time
tCMH
1.8
—
ns
SD6
Address setup time
tAS
2.0
—
ns
SD7
Address hold time
tAH
1.8
—
ns
SD11
Precharge cycle period1
tRP
1
4
clock
tRCD
1
8
clock
SD12
Active to read/write command
delay1
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
75
Electrical Characteristics
Table 38. SDR SDRAM Write Timing Parameters (continued)
ID
Parameter
Symbol
Min
Max
Unit
SD13
Data setup time
tDS
2.0
—
ns
SD14
Data hold time
tDH
1.3
—
ns
Note:
1
SD11 and SD12 are determined by SDRAM controller register settings.
NOTE
SDR SDRAM CLK parameters are being measured from the 50%
point—that is, high is defined as 50% of signal value and low is defined as
50% of signal value.
The timing parameters are similar to the ones used in SDRAM data
sheets—that is, Table 38 indicates SDRAM requirements. All output signals
are driven by the ESDCTL at the negative edge of SDCLK and the
parameters are measured at maximum memory frequency.
SD1
SDCLK
SDCLK
SD2
SD3
CS
RAS
SD11
CAS
SD10
SD10
WE
SD7
SD6
ADDR
BA
ROW/BA
Figure 39. SDRAM Refresh Timing Diagram
Table 39. SDRAM Refresh Timing Parameters
ID
Parameter
Symbol
Min
Max
Unit
SD1
SDRAM clock high-level width
tCH
3.4
4.1
ns
SD2
SDRAM clock low-level width
tCL
3.4
4.1
ns
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
76
Freescale Semiconductor
Electrical Characteristics
Table 39. SDRAM Refresh Timing Parameters (continued)
ID
Parameter
Symbol
Min
Max
Unit
SD3
SDRAM clock cycle time
tCK
7.5
—
ns
SD6
Address setup time
tAS
1.8
—
ns
SD7
Address hold time
tAH
1.8
—
ns
SD10
Precharge cycle period1
tRP
1
4
clock
SD11
Auto precharge command period1
tRC
2
20
clock
Note:
1
SD10 and SD11 are determined by SDRAM controller register settings.
NOTE
SDR SDRAM CLK parameters are being measured from the 50%
point—that is, high is defined as 50% of signal value and low is defined as
50% of signal value.
The timing parameters are similar to the ones used in SDRAM data
sheets—that is, Table 39 indicates SDRAM requirements. All output signals
are driven by the ESDCTL at the negative edge of SDCLK and the
parameters are measured at maximum memory frequency.
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
77
Electrical Characteristics
SDCLK
CS
RAS
CAS
WE
ADDR
BA
SD16
CKE
SD16
Don’t care
Figure 40. SDRAM Self-Refresh Cycle Timing Diagram
NOTE
The clock continues to run unless both CKEs are low. Then the clock is
stopped in low state.
Table 40. SDRAM Self-Refresh Cycle Timing Parameters
ID
SD16
Parameter
CKE output delay time
Symbol
Min
Max
Unit
tCKS
1.8
—
ns
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
78
Freescale Semiconductor
Electrical Characteristics
SDCLK
SDCLK
SD20
SD19
DQS (output)
SD18
SD17
DQ (output)
DQM (output)
SD17
SD18
Data
Data
Data
Data
Data
Data
Data
Data
DM
DM
DM
DM
DM
DM
DM
DM
SD17
SD17
SD18
SD18
Figure 41. Mobile DDR SDRAM Write Cycle Timing Diagram
Table 41. Mobile DDR SDRAM Write Cycle Timing Parameters1
ID
Parameter
Symbol
Min
Max
Unit
SD17
DQ and DQM setup time to DQS
tDS
0.95
—
ns
SD18
DQ and DQM hold time to DQS
tDH
0.95
—
ns
SD19
Write cycle DQS falling edge to SDCLK output delay time.
tDSS
1.8
—
ns
SD20
Write cycle DQS falling edge to SDCLK output hold time.
tDSH
1.8
—
ns
Note:
1
Test condition: Measured using delay line 5 programmed as follows: ESDCDLY5[15:0] = 0x0703.
NOTE
SDRAM CLK and DQS related parameters are being measured from the
50% point—that is, high is defined as 50% of signal value and low is
defined as 50% of signal value.
The timing parameters are similar to the ones used in SDRAM data
sheets—that is, Table 41 indicates SDRAM requirements. All output signals
are driven by the ESDCTL at the negative edge of SDCLK and the
parameters are measured at maximum memory frequency.
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
79
Electrical Characteristics
SDCLK
SDCLK
SD23
DQS (input)
SD22
SD21
DQ (input)
Data
Data
Data
Data
Data
Data
Data
Data
Figure 42. Mobile DDR SDRAM DQ versus DQS and SDCLK Read Cycle Timing Diagram
Table 42. Mobile DDR SDRAM Read Cycle Timing Parameters
ID
Parameter
SD21 DQS–DQ Skew (defines the Data valid window in read cycles related to DQS).
SD22 DQS DQ HOLD time from DQS
SD23 DQS output access time from SDCLK posedge
Symbol
Min
Max
Unit
tDQSQ
—
0.85
ns
tQH
2.3
—
ns
tDQSCK
—
6.7
ns
NOTE
SDRAM CLK and DQS related parameters are being measured from the
50% point—that is, high is defined as 50% of signal value and low is
defined as 50% of signal value.
The timing parameters are similar to the ones used in SDRAM data
sheets—that is, Table 42 indicates SDRAM requirements. All output signals
are driven by the ESDCTL at the negative edge of SDCLK and the
parameters are measured at maximum memory frequency.
4.3.9.1
SDHC Electrical DC Characteristics
Table 43 lists the SDHC electrical DC characteristics.
Table 43. SDHC Electrical DC Characteristics
ID
Parameter
Min
Max
Unit
Comments
Peak Voltage on All Lines
–0.3
VDD + 0.3
V
—
Input Leakage Current
–10
10
μA
—
–10
10
μA
—
General
SD10
All Inputs
SD11
All Outputs
SD12
Output Leakage Current
Power Supply
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
80
Freescale Semiconductor
Electrical Characteristics
Table 43. SDHC Electrical DC Characteristics
ID
Parameter
Min
Max
Unit
Comments
SD13
Supply Voltage (low voltage)
1.65
1.95
V
1.95 ~2.7 V is not supported.
SD14
Supply Voltage (high
voltage)
2.7
3.6
V
SD15
Power Up Time
—
250
ms
—
SD16
Supply Current
100
—
mA
—
Bus Signal Line Load
SD17
Pull-up Resistance
10
100
kΩ
Internal PU
SD18
Open Drain Resistance
NA
NA
kΩ
For MMC cards only
Open Drain Signal Level
—
SD19
Output High Voltage
VDD – 0.2
—
V
IOH=-100 mA
SD20
Output Low Voltage
—
0.3
V
IOL= 2 mA
Push-Pull Signal Levels (High Voltage)
SD21
Output HIGH Voltage
0.75 x VDD
—
V
IOH=-100 mA @VDD min
SD22
Output LOW Voltage
—
0.125 x VDD
V
IOL=100 mA @VDD min
SD23
Input HIGH Voltage
0.625 x VDD
VDD + 0.3
V
—
SD24
Input LOW Voltage
VSS – 0.3
0.25 x VDD
V
—
Push-Pull Signal Levels (Low Voltage)
SD25
Output HIGH Voltage
VDD – 0.2
—
V
IOH=-100 mA @VDD min
SD26
Output LOW Voltage
—
0.2
V
IOL=100 mA @VDD min
SD27
Input HIGH Voltage
0.7 x VDD
VDD + 0.3
V
—
SD28
Input LOW Voltage
VSS – 0.3
0.3 x VDD
V
—
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
81
Electrical Characteristics
4.3.10
Smart Liquid Crystal Display Controller (SLCDC)
Figure 43 and Figure 44 show the timings of the SLCDC, and Table 44 and Table 45 list the timing
parameters.
tcsh
tcss
tcyc
LCD_CS
tcl
tch
LCD_CLK (LCD_DATA[6])
SDATA (LCD_DATA[7])
trsh
tdh
tds
MSB
LSB
trss
RS=0 => command data, RS=1=> display data
RS
This diagram illustrates the timing when the SCKPOL = 1, CSPOL = 0
tcss
tcsh
tcyc
LCD_CS
tcl
tch
LCD_CLK (LCD_DATA[6])
trsh
tdh
tds
SDATA (LCD_DATA[7])
MSB
LSB
trss
RS=0 => command data, RS=1=> display data
RS
This diagram illustrates the timing when the SCKPOL = 0, CSPOL = 0
tcss
tcsh
tcyc
LCD_CS
tcl
tch
LCD_CLK (LCD_DATA[6])
SDATA (LCD_DATA[7])
trsh
tdh
tds
MSB
LSB
trss
RS=0 => command data, RS=1=> display data
RS
This diagram illustrates the timing when the SCKPOL = 1, CSPOL = 1
tcss
tcsh
tcyc
LCD_CS
tcl
tch
LCD_CLK (LCD_DATA[6])
tdh
tds
SDATA (LCD_DATA[7])
MSB
trsh
LSB
trss
RS
RS=0 => command data, RS=1=> display data
This diagram illustrates the timing when the SCKPOL = 0, CSPOL = 1
Figure 43. SLCDC Timing Diagram—Serial Transfers to LCD Device
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
82
Freescale Semiconductor
Electrical Characteristics
Table 44. SLCDC Serial Interface Timing Parameters
Symbol
Parameter
Min
Typical
Max
Units
tcss
Chip select setup time
(tcyc / 2) (±) tprop
—
—
ns
tcsh
Chip select hold time
(tcyc / 2) (±) tprop
—
—
ns
tcyc
Serial clock cycle time
39 (±) tprop
—
2641
ns
tcl
Serial clock low pulse
18 (±) tprop
—
—
ns
tch
Serial clock high pulse
18 (±) tprop
—
—
ns
tds
Data setup time
(tcyc / 2) (±) tprop
—
—
ns
tdh
Data hold time
(tcyc / 2) (±) tprop
—
—
ns
trss
Register select setup time
(15 * tcyc / 2) (±) tprop
—
—
ns
trsh
Register select hold time
(tcyc / 2) (±) tprop
—
—
ns
LCD_CLK
trss
trsh
LCD_RS
tcyc
LCD_CS
tds
tdh
command data
LCD_DATA[15:0]
display data
This diagram illustrates the timing when CSPOL=0
LCD_CLK
trsh
trss
LCD_RS
tcyc
LCD_CS
tds
tdh
command data
LCD_DATA[15:0]
display data
This diagram illustrates the timing when CSPOL=1
Figure 44. SLCDC Timing Diagram—Parallel Transfers to LCD Device
Table 45. SLCDC Parallel Interface Timing Parameters
Symbol
Parameter
Min
Typical
Max
Units
tcyc
Parallel clock cycle time
78 (±) tprop
—
4923
—
tds
Data setup time
(tcyc / 2) (±) tprop
—
—
—
tdh
Data hold time
(tcyc / 2) (±) tprop
—
—
—
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
83
Electrical Characteristics
Table 45. SLCDC Parallel Interface Timing Parameters (continued)
Symbol
4.3.11
Parameter
Min
Typical
Max
Units
trss
Register select setup time
(tcyc / 2) (±) tprop
—
—
—
trsh
Register select hold time
(tcyc / 2) (±) tprop
—
—
—
Synchronous Serial Interface (SSI)
This section describes the electrical information of SSI.
4.3.11.1
SSI Transmitter Timing with Internal Clock
Figure 45 and Figure 46 show the SSI transmitter timing with internal clock, and Table 46 lists the timing
parameters.
SS1
SS5
SS2
SS3
SS4
AD1_TXC
(Output)
SS6
SS8
AD1_TXFS (bl)
(Output)
SS10
AD1_TXFS (wl)
(Output)
SS12
SS14
SS15
SS16
SS17
SS18
AD1_TXD
(Output)
SS43
SS42
SS19
AD1_RXD
(Input)
Note: SRXD Input in Synchronous mode only
Figure 45. SSI Transmitter with Internal Clock Timing Diagram
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
84
Freescale Semiconductor
Electrical Characteristics
SS1
SS3
SS5
SS4
SS2
DAM1_T_CLK
(Output)
SS8
SS6
DAM1_T_FS (bl)
(Output)
SS10
DAM1_T_FS (wl)
(Output)
SS12
SS14
SS15
SS16
SS18
SS17
DAM1_TXD
(Output)
SS43
SS42
SS19
DAM1_RXD
(Input)
Note: SRXD Input in Synchronous mode only
Figure 46. SSI Transmitter with Internal Clock Timing Diagram
Table 46. SSI Transmitter with Internal Clock Timing Parameters
ID
Parameter
Min
Max
Unit
Internal Clock Operation
SS1
(Tx/Rx) CK clock period
81.4
—
ns
SS2
(Tx/Rx) CK clock high period
36.0
—
ns
SS3
(Tx/Rx) CK clock rise time
—
6
ns
SS4
(Tx/Rx) CK clock low period
36.0
—
ns
SS5
(Tx/Rx) CK clock fall time
—
6
ns
SS6
(Tx) CK high to FS (bl) high
—
15.0
ns
SS8
(Tx) CK high to FS (bl) low
—
15.0
ns
SS10
(Tx) CK high to FS (wl) high
—
15.0
ns
SS12
(Tx) CK high to FS (wl) low
—
15.0
ns
SS14
(Tx/Rx) Internal FS rise time
—
6
ns
SS15
(Tx/Rx) Internal FS fall time
—
6
ns
SS16
(Tx) CK high to STXD valid from high impedance
—
15.0
ns
SS17
(Tx) CK high to STXD high/low
—
15.0
ns
SS18
(Tx) CK high to STXD high impedance
—
15.0
ns
SS19
STXD rise/fall time
—
6
ns
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
85
Electrical Characteristics
Table 46. SSI Transmitter with Internal Clock Timing Parameters (continued)
ID
Parameter
Min
Max
Unit
10.0
—
ns
Synchronous Internal Clock Operation
•
•
•
•
SS42
SRXD setup before (Tx) CK falling
SS43
SRXD hold after (Tx) CK falling
0
—
ns
SS52
Loading
—
25
pF
All the timings for the SSI are given for a non-inverted serial clock polarity (TSCKP/RSCKP = 0)
and a non-inverted frame sync (TFSI/RFSI = 0). If the polarity of the clock and/or the frame sync
have been inverted, all the timing remains valid by inverting the clock signal STCK/SRCK and/or
the frame sync STFS/SRFS shown in the tables and in the figures.
All timings are on AUDMUX pads when SSI is being used for data transfer.
“Tx” and “Rx” refer to the Transmit and Receive sections of the SSI.
For internal Frame Sync operation using external clock, the FS timing will be same as that of Tx
Data (for example, during AC97 mode of operation).
4.3.11.2
SSI Receiver Timing with Internal Clock
Figure 47 and Figure 48 show the SSI receiver timing with internal clock, and Table 47 lists the timing
parameters.
SS1
SS3
SS5
SS4
SS2
AD1_TXC
(Output)
SS9
SS7
AD1_TXFS (bl)
(Output)
SS11
SS13
AD1_TXFS (wl)
(Output)
SS20
SS21
AD1_RXD
(Input)
SS47
SS48
SS51
SS50
SS49
AD1_RXC
(Output)
Figure 47. SSI Receiver with Internal Clock Timing Diagram
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
86
Freescale Semiconductor
Electrical Characteristics
SS1
SS3
SS5
SS2
SS4
DAM1_T_CLK
(Output)
SS9
SS7
DAM1_T_FS (bl)
(Output)
SS11
SS13
DAM1_T_FS (wl)
(Output)
SS20
SS21
DAM1_RXD
(Input)
SS47
SS48
SS51
SS49
SS50
DAM1_R_CLK
(Output)
Figure 48. SSI Receiver with Internal Clock Timing Diagram
Table 47. SSI Receiver with Internal Clock Timing Parameters
ID
Parameter
Min
Max
Unit
Internal Clock Operation
SS1
(Tx/Rx) CK clock period
81.4
—
ns
SS2
(Tx/Rx) CK clock high period
36.0
—
ns
SS3
(Tx/Rx) CK clock rise time
—
6
ns
SS4
(Tx/Rx) CK clock low period
36.0
—
ns
SS5
(Tx/Rx) CK clock fall time
—
6
ns
SS7
(Rx) CK high to FS (bl) high
—
15.0
ns
SS9
(Rx) CK high to FS (bl) low
—
15.0
ns
SS11
(Rx) CK high to FS (wl) high
—
15.0
ns
SS13
(Rx) CK high to FS (wl) low
—
15.0
ns
SS20
SRXD setup time before (Rx) CK low
10.0
—
ns
SS21
SRXD hold time after (Rx) CK low
0
—
ns
15.04
—
ns
6
—
ns
Oversampling Clock Operation
SS47
Oversampling clock period
SS48
Oversampling clock high period
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
87
Electrical Characteristics
Table 47. SSI Receiver with Internal Clock Timing Parameters (continued)
ID
Parameter
Min
Max
Unit
SS49
Oversampling clock rise time
—
3
ns
SS50
Oversampling clock low period
6
—
ns
SS51
Oversampling clock fall time
—
3
ns
NOTE
All the timings for the SSI are given for a non-inverted serial clock polarity
(TSCKP/RSCKP = 0) and a non-inverted frame sync (TFSI/RFSI = 0). If the
polarity of the clock and/or the frame sync have been inverted, all the timing
remains valid by inverting the clock signal STCK/SRCK and/or the frame
sync STFS/SRFS shown in the tables and in the figures.
All timings are on AUDMUX pads when SSI is being used for data transfer.
“Tx” and “Rx” refer to the Transmit and Receive sections of the SSI.
For internal Frame Sync operation using external clock, the FS timing is the
same as that of Tx Data, for example, during the AC97 mode of operation.
4.3.11.3
SSI Transmitter Timing with External Clock
Figure 49 and Figure 50 show the SSI transmitter timing with external clock, and Table 48 lists the timing
parameters.
SS22
SS23
AD1_TXC
(Input)
SS25
SS26
SS27
SS24
SS29
AD1_TXFS (bl)
(Input)
SS33
SS31
AD1_TXFS (wl)
(Input)
SS37
SS39
SS38
AD1_TXD
(Output)
SS45
SS44
AD1_RXD
(Input)
Note: SRXD Input in Synchronous mode only
SS46
Figure 49. SSI Transmitter with External Clock Timing Diagram
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
88
Freescale Semiconductor
Electrical Characteristics
SS22
SS26
SS25
SS23
SS24
DAM1_T_CLK
(Input)
SS29
SS27
DAM1_T_FS (bl)
(Input)
SS33
SS31
DAM1_T_FS (wl)
(Input)
SS39
SS37
SS38
DAM1_TXD
(Output)
SS45
SS44
DAM1_RXD
(Input)
SS46
Note: SRXD Input in Synchronous mode only
Figure 50. SSI Transmitter with External Clock Timing Diagram
Table 48. SSI Transmitter with External Clock Timing Parameters
ID
Parameter
Min
Max
Unit
External Clock Operation
SS22
(Tx/Rx) CK clock period
81.4
—
ns
SS23
(Tx/Rx) CK clock high period
36.0
—
ns
SS24
(Tx/Rx) CK clock rise time
—
6.0
ns
SS25
(Tx/Rx) CK clock low period
36.0
—
ns
SS26
(Tx/Rx) CK clock fall time
—
6.0
ns
SS27
(Tx) CK high to FS (bl) high
–10.0
15.0
ns
SS29
(Tx) CK high to FS (bl) low
10.0
—
ns
SS31
(Tx) CK high to FS (wl) high
–10.0
15.0
ns
SS33
(Tx) CK high to FS (wl) low
10.0
—
ns
SS37
(Tx) CK high to STXD valid from high impedance
—
15.0
ns
SS38
(Tx) CK high to STXD high/low
—
15.0
ns
SS39
(Tx) CK high to STXD high impedance
—
15.0
ns
Synchronous External Clock Operation
SS44
SRXD setup before (Tx) CK falling
10.0
—
ns
SS45
SRXD hold after (Tx) CK falling
2.0
—
ns
SS46
SRXD rise/fall time
—
6.0
ns
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
89
Electrical Characteristics
NOTE
All the timings for the SSI are given for a non-inverted serial clock polarity
(TSCKP/RSCKP = 0) and a non-inverted frame sync (TFSI/RFSI = 0). If the
polarity of the clock and/or the frame sync have been inverted, all the timing
remains valid by inverting the clock signal STCK/SRCK and/or the frame
sync STFS/SRFS shown in the tables and in the figures.
All timings are on AUDMUX pads when the SSI is being used for data
transfer.
“Tx” and “Rx” refer to the Transmit and Receive sections of the SSI.
For internal Frame Sync operation using external clock, the FS timing will
be same as that of Tx Data, for example, during the AC97 mode of
operation.
4.3.11.4
SSI Receiver Timing with External Clock
Figure 51 and Figure 52 show the SSI receiver timing with external clock, and Table 49 lists the timing
parameters.
SS22
SS26
SS24
SS25
SS23
AD1_TXC
(Input)
SS28
AD1_TXFS (bl)
(Input)
AD1_TXFS (wl)
(Input)
SS30
SS32
SS34
SS35
SS41
SS40
SS36
AD1_RXD
(Input)
Figure 51. SSI Receiver with External Clock Timing Diagram
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
90
Freescale Semiconductor
Electrical Characteristics
SS22
SS24
SS26
SS23
SS25
DAM1_T_CLK
(Input)
SS30
SS28
DAM1_T_FS (bl)
(Input)
SS32
DAM1_T_FS (wl)
(Input)
SS34
SS35
SS41
SS36
SS40
DAM1_RXD
(Input)
Figure 52. SSI Receiver with External Clock Timing Diagram
Table 49. SSI Receiver with External Clock Timing Parameters
ID
Parameter
Min
Max
Unit
External Clock Operation
SS22
(Tx/Rx) CK clock period
81.4
—
ns
SS23
(Tx/Rx) CK clock high period
36.0
—
ns
SS24
(Tx/Rx) CK clock rise time
—
6.0
ns
SS25
(Tx/Rx) CK clock low period
36.0
—
ns
SS26
(Tx/Rx) CK clock fall time
—
6.0
ns
SS28
(Rx) CK high to FS (bl) high
–10.0
15.0
ns
SS30
(Rx) CK high to FS (bl) low
10.0
—
ns
SS32
(Rx) CK high to FS (wl) high
–10.0
15.0
ns
SS34
(Rx) CK high to FS (wl) low
10.0
—
ns
SS35
(Tx/Rx) External FS rise time
—
6.0
ns
SS36
(Tx/Rx) External FS fall time
—
6.0
ns
SS40
SRXD setup time before (Rx) CK low
10.0
—
ns
SS41
SRXD hold time after (Rx) CK low
2.0
—
ns
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
91
Electrical Characteristics
NOTE
All the timings for the SSI are given for a non-inverted serial clock polarity
(TSCKP/RSCKP = 0) and a non-inverted frame sync (TFSI/RFSI = 0). If the
polarity of the clock and/or the frame sync have been inverted, all the timing
remains valid by inverting the clock signal STCK/SRCK and/or the frame
sync STFS/SRFS shown in the tables and in the figures.
All timings are on AUDMUX pads when the SSI is being used for data
transfer.
“Tx” and “Rx” refer to the Transmit and Receive sections of the SSI.
For internal Frame Sync operation using external clock, the FS timing will
be same as that of Tx Data, for example, during the AC97 mode of
operation.
4.3.12
Wireless External Interface Module (WEIM)
All WEIM output control signals may be asserted and deasserted by internal clock related to BCLK rising
edge or falling edge according to corresponding assertion/negation control fields. Address always begins
related to BCLK falling edge but may be ended both on rising and falling edge in muxed mode according
to control register configuration. Output data begins related to BCLK rising edge except in muxed mode
where both rising and falling edge may be used according to control register configuration. Input data,
ECB and DTACK all captured according to BCLK rising edge time. Figure 53 shows the timing of the
WEIM module, and Table 50 lists the timing parameters.
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
92
Freescale Semiconductor
Electrical Characteristics
WEIM Outputs Timing
WE22
WE21
WE23
BCLK (for rising edge timing)
...
...
BCLK (for falling edge timing)
WE1
WE2
WE3
WE4
WE5
WE6
WE7
WE8
WE9
WE10
WE11
WE12
WE13
WE14
Address
CS[x]
RW
OE
EB[x]
LBA
Output Data
WEIM Inputs Timing
BCLK (for rising edge timing)
WE16
Input Data
WE15
WE18
ECB
WE17
WE20
DTACK
WE19
Figure 53. WEIM Bus Timing Diagram
Table 50. WEIM Bus Timing Parameters
1.8 V
ID
Parameter
Unit
Min
Max
WE1
Clock fall to address valid
0.68
2.05
ns
WE2
Clock rise/fall to address invalid
0.68
2.49
ns
WE3
Clock rise/fall to CS[x] valid
0.45
2.25
ns
WE4
Clock rise/fall to CS[x] invalid
0.45
2.25
ns
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
93
Electrical Characteristics
Table 50. WEIM Bus Timing Parameters (continued)
1.8 V
ID
Parameter
Unit
Min
Max
WE5
Clock rise/fall to RW Valid
0.90
2.60
ns
WE6
Clock rise/fall to RW Invalid
0.90
2.60
ns
WE7
Clock rise/fall to OE Valid
1.17
3.57
ns
WE8
Clock rise/fall to OE Invalid
1.17
3.57
ns
WE9
Clock rise/fall to EB[x] Valid
0.73
2.43
ns
WE10
Clock rise/fall to EB[x] Invalid
0.73
2.43
ns
WE11
Clock rise/fall to LBA Valid
1.03
2.84
ns
WE12
Clock rise/fall to LBA Invalid
1.03
2.84
ns
WE13
Clock rise/fall to Output Data Valid
1.04
4.01
ns
WE14
Clock rise to Output Data Invalid
1.04
4.01
ns
WE15
Input Data Valid to Clock rise, FCE=0
6.95
—
ns
WE16
Cloc/k rise to Input Data Invalid, FCE=0
2.35
—
ns
WE17
Input Data Valid to Clock rise, FCE=1
1.24
—
ns
WE18
Clock rise to Input Data Invalid, FCE=1
0.23
—
ns
WE19
ECB setup time, FCE=0
7.23
—
ns
WE20
ECB hold time, FCE=0
2.93
—
ns
WE21
ECB setup time, FCE=1
1.08
—
ns
WE22
ECB hold time, FCE=1
0
—
ns
WE23
DTACK setup time
5.35
—
ns
WE24
DTACK hold time
3.19
—
ns
WE25
BCLK High Level Width1
3.0
—
ns
WE26
BCLK Low Level
Width1
3.0
—
ns
WE27
BCLK Cycle time1
7.5
—
ns
Note:
1
BCLK parameters are being measured from the 50% point—that is, high is defined as 50% of signal
value and low is defined as 50% of signal value.
NOTE
High is defined as 80% of signal value and low is defined as 20% of signal
value.
Test conditions: pad voltage, 1.7–1.95 V; pad capacitance, 25 pF.
Recommended drive strength for all controls, address, and BCLK is Max
High.
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
94
Freescale Semiconductor
Electrical Characteristics
Figure 54, Figure 55, Figure 34, Figure 57, Figure 58, and Figure 59 show examples of basic WEIM
accesses to external memory devices with the timing parameters mentioned in Table 50 for specific control
parameter settings.
BCLK
WE2
WE1
ADDR
V1
Last Valid Address
Next Address
WE3
WE4
WE11
WE12
WE7
WE8
WE9
WE10
CS[x]
RW
LBA
OE
EB[y]
WE16
V1
DATA
WE15
Figure 54. Asynchronous Memory Timing Diagram for
Read Access—WSC=1
BCLK
WE2
WE1
ADDR
Last Valid Address
CS[x]
WE3
WE4
WE5
WE6
RW
LBA
Next Address
V1
WE11
WE12
OE
WE9
EB[y]
WE10
WE14
V1
DATA
WE13
Figure 55. Asynchronous Memory Timing Diagram for
Write Access—WSC=1, EBWA=1, EBWN=1, LBN=1
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
95
Electrical Characteristics
BCLK
WE1
WE2
ADDR Last Valid Addr
Address V1
Address V2
WE4
WE3
CS[x]
RW
WE11
LBA
WE12
WE8
WE7
OE
WE10
WE9
EB[y]
WE18
WE18
ECB
WE17
WE17
WE16
WE16
V1
V1+2
Halfword Halfword
DATA
WE15
V2
Halfword
V2+2
Halfword
WE15
Figure 56. Synchronous Memory Timing Diagram for Two Non-Sequential
Read Accesses: WSC=2, SYNC=1, DOL=0
BCLK
WE2
WE1
ADDR Last Valid Addr
CS[x]
RW
LBA
Address V1
WE3
WE4
WE5
WE6
WE12
WE11
OE
EB[y]
WE10
WE9
WE18
ECB
WE17
WE14
V1+4 V1+8 V1+12
V1
DATA
WE13
WE14
WE13
Figure 57. Synchronous Memory TIming Diagram for Burst
Write Access—BCS=1, WSC=4, SYNC=1, DOL=0, PSR=1
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
96
Freescale Semiconductor
Electrical Characteristics
BCLK
WE1
ADDR/
M_DATA Last Valid Addr
CS[x]
RW
WE14
WE2
Write Data
Address V1
WE13
WE3
WE5
WE4
WE6
Write
WE11
WE12
LBA
OE
EB[y]
WE9
WE10
Figure 58. Muxed A/D Mode Timing Diagram for Asynchronous
Write Access—WSC=7, LBA=1, LBN=1, LAH=1
BCLK
WE1
ADDR/
Last
Valid
Addr
M_DATA
WE3
CS[x]
WE2
Address V1
WE16
Read Data
WE15
WE4
RW
WE11
WE12
LBA
WE7
OE
EB[y]
WE9
WE8
WE10
Figure 59. Muxed A/D Mode Timing Diagram for Asynchronous
Read Access—WSC=7, LBA=1, LBN=1, LAH=1, OEA=7
4.3.13
USBOTG Electricals
This section describes the electrical information of the USB OTG port and host ports.
4.3.14
Serial Interface
In order to support four serial different interfaces, the USBOTG transceiver can be configured to operate
in one of the following modes:
• DAT_SE0 bidirectional, 3-wire mode
• DAT_SE0 unidirectional, 6-wire mode
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
97
Electrical Characteristics
•
VP_VM bidirectional, 4-wire mode
•
VP_VM unidirectional, 6-wire mode
4.3.14.1
DAT_SE0 Bidirectional Mode
Table 51. Signal Definitions—DAT_SE0 Bidirectional Mode
Name
Direction
Signal Description
USB_TXOE_B
Out
• Transmit enable, active low
USB_DAT_VP
Out
In
• TX data when USB_TXOE_B is low
• Differential RX data when USB_TXOE_B is high
USB_SE0_VM
Out
In
• SE0 drive when USB_TXOE_B is low
• SE0 RX indicator when USB_TXOE_B is high
USB_DAT_VP
USB_SE0_VM
Figure 60. USB Transmit Waveform in DAT_SE0 Bidirectional Mode
USB_TXOE_B
USB_DAT_VP
USB_SE0_VM
Figure 61. USB Receive Waveform in DAT_SE0 Bidirectional Mode
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
98
Freescale Semiconductor
Electrical Characteristics
Table 52. OTG Port Timing Specification in DAT_SE0 Bidirectional Mode
Parameter
Signal Name
Direction
Min
Max
Unit
Conditions/
Reference Signal
TX Rise/Fall Time
USB_DAT_VP
Out
—
5.0
ns
50 pF
TX Rise/Fall Time
USB_SE0_VM
Out
—
5.0
ns
50 pF
TX Rise/Fall Time
USB_TXOE_B
Out
—
5.0
ns
50 pF
TX Duty Cycle
USB_DAT_VP
Out
49.0
51.0
%
—
Enable Delay
USB_DAT_VP
USB_SE0_VM
In
—
8.0
ns
USB_TXOE_B
Disable Delay
USB_DAT_VP
USB_SE0_VM
In
—
10.0
ns
USB_TXOE_B
RX Rise/Fall Time
USB_DAT_VP
In
—
3.0
ns
35 pF
RX Rise/Fall Time
USB_SE0_VM
In
—
3.0
ns
35 pF
4.3.14.2
DAT_SE0 Unidirectional Mode
Table 53. Signal Definitions—DAT_SE0 Unidirectional Mode
Name
Direction
Signal Description
USB_TXOE_B
Out
Transmit enable, active low
USB_DAT_VP
Out
TX data when USB_TXOE_B is low.
USB_SE0_VM
Out
SE0 drive when USB_TXOE_B is low.
USB_VP1
In
Buffered data on DP when USB_TXOE_B is high.
USB_VM1
In
Buffered data on DM when USB_TXOE_B is high.
USB_RCV
In
Differential RX data when USB_TXOE_B is high.
USB_DAT_VP
USB_SE0_VM
Figure 62. USB Transmit Waveform in DAT_SE0 Unidirectional Mode
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
99
Electrical Characteristics
USB_DAT_VP/
USB_SE0_VM
VP, VM,
RCV
Figure 63. USB Receive Waveform in DAT_SE0 Unidirectional Mode
Table 54. OTG Port Timing Specification in DAT_SE0 Unidirectional Mode
Parameter
Signal Name
Signal Source
Min
Max
Unit
Condition/
Reference Signal
TX Rise/Fall Time
USB_DAT_VP
Out
—
5.0
ns
50 pF
TX Rise/Fall Time
USB_SE0_VM
Out
—
5.0
ns
50 pF
TX Rise/Fall Time
USB_TXOE_B
Out
—
5.0
ns
50 pF
TX Duty Cycle
USB_DAT_VP
Out
49.0
51.0
%
—
Enable Delay
USB_DAT_VP
USB_SE0_VM
In
—
8.0
ns
USB_TXOE_B
Disable Delay
USB_DAT_VP
USB_SE0_VM
In
—
10.0
ns
USB_TXOE_B
RX Rise/Fall Time
USB_VP1
In
—
3.0
ns
35 pF
RX Rise/Fall Time
USB_VM1
In
—
3.0
ns
35 pF
RX Rise/Fall Time
USB_RCV
In
—
3.0
ns
35 pF
4.3.14.3
VP_VM Bidirectional Mode
Table 55. Signal Definitions—VP_VM Bidirectional Mode
Name
Direction
Signal Description
USB_TXOE_B
Out
USB_DAT_VP
Out (Tx)
In (Rx)
• TX VP data when USB_TXOE_B is low
• RX VP data when USB_TXOE_B is high
USB_SE0_VM
Out (Tx)
In (Rx)
• TX VM data when USB_TXOE_B low
• RX VM data when USB_TXOE_B high
USB_RCV
In
• Transmit enable, active low
• Differential RX data
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
100
Freescale Semiconductor
Electrical Characteristics
USB_TXOE_B
USB_DAT_VP
USB_SE0_VM
USB_SE0_VM
Figure 64. USB Transmit Waveform in VP_VM Bidirectional Mode
USB_TXOE_B
USB_DAT_VP
USB_SE0_VM
USB_SE0_VM
Figure 65. USB Receive Waveform in VP_VM Bidirectional Mode
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
101
Electrical Characteristics
Table 56. OTG Port Timing Specification in VP_VM Bidirectional Mode
Parameter
Signal Name
Direction
Min
Max
Unit
Condition/
Reference Signal
TX Rise/Fall Time
USB_DAT_VP
Out
—
5.0
ns
50 pF
TX Rise/Fall Time
USB_SE0_VM
Out
—
5.0
ns
50 pF
TX Rise/Fall Time
USB_TXOE_B
Out
—
5.0
ns
50 pF
TX Duty Cycle
USB_DAT_VP
Out
49.0
51.0
%
—
TX High Overlap
USB_SE0_VM
Out
0.0
—
ns
USB_DAT_VP
TX Low Overlap
USB_SE0_VM
Out
—
0.0
ns
USB_DAT_VP
Enable Delay
USB_DAT_VP
USB_SE0_VM
In
—
8.0
ns
USB_TXOE_B
Disable Delay
USB_DAT_VP
USB_SE0_VM
In
—
10.0
ns
USB_TXOE_B
RX Rise/Fall Time
USB_DAT_VP
In
—
3.0
ns
35 pF
RX Rise/Fall Time
USB_SE0_VM
In
—
3.0
ns
35 pF
RX Skew
USB_DAT_VP
Out
–4.0
+4.0
ns
USB_SE0_VM
RX Skew
USB_RCV
Out
–6.0
+2.0
ns
USB_DAT_VP
4.3.14.4
VP_VM Unidirectional Mode
Table 57. Signal Definitions—VP_VM Unidirectional Mode
Name
Direction
Signal Description
USB_TXOE_B
Out
Transmit enable, active low
USB_DAT_VP
Out
TX VP data when USB_TXOE_B is low
USB_SE0_VM
Out
TX VM data when USB_TXOE_B is low
USB_VP1
In
RX VP data when USB_TXOE_B is high
USB_VM1
In
RX VM data when USB_TXOE_B is high
USB_RCV
In
Differential RX data
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
102
Freescale Semiconductor
Electrical Characteristics
USB_TXOE_B
USB_DAT_VP
USB_SE0_VM
USB_SE0_VM
Figure 66. USB Transmit Waveform in VP_VM Unidirectional Mode
USB_TXOE_B
USB_VP1
USB_VM1
UH1_RXD
Figure 67. USB Receive Waveform in VP_VM Unidirectional Mode
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
103
Electrical Characteristics
Table 58. USB Timing Specification in VP_VM Unidirectional Mode
Signal
Direction
Min
Max
Unit
Conditions/
Reference Signal
TX Rise/Fall Time
USB_DAT_VP
Out
—
5.0
ns
50 pF
TX Rise/Fall Time
USB_SE0_VM
Out
—
5.0
ns
50 pF
TX Rise/Fall Time
USB_TXOE_B
Out
—
5.0
ns
50 pF
TX Duty Cycle
USB_DAT_VP
Out
49.0
51.0
%
—
TX High Overlap
USB_SE0_VM
Out
0.0
—
ns
USB_DAT_VP
TX Low Overlap
USB_SE0_VM
Out
—
0.0
ns
USB_DAT_VP
Enable Delay
USB_DAT_VP
USB_SE0_VM
In
—
8.0
ns
USB_TXOE_B
Disable Delay
USB_DAT_VP
USB_SE0_VM
In
—
10.0
ns
USB_TXOE_B
RX Rise/Fall Time
USB_VP1
In
—
3.0
ns
35 pF
RX Rise/Fall Time
USB_VM1
In
—
3.0
ns
35 pF
RX Skew
USB_VP1
Out
–4.0
+4.0
ns
USB_SE0_VM
RX Skew
USB_RCV
Out
–6.0
+2.0
ns
USB_DAT_VP
Parameter
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
104
Freescale Semiconductor
Package Information and Pinout
5
Package Information and Pinout
The i.MX27/MX27L processor is available in a 17 mm × 17 mm, 0.65 mm pitch, 404-pin MAPBGA
package and a 19 mm × 19 mm, 0.8 mm pitch, 473-pin MAPBGA package.
5.1
Full Package Outline Drawing (17 mm × 17 mm)
Figure 68 shows the package drawings and dimensions of the production package.
Figure 68. i.MX27/MX27L 17 mm × 17 mm Full Package MAPBGA: Mechanical Drawing
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
105
Pin Assignments (17 mm × 17 mm)
Table 59 shows the i.MX27 full 17 × 17 mm package MAPBGA pin assignment.
i.MX27/i.MX27L Block Guide, Rev. 1.3
Table 60 identifies the pin assignments for the ball grid array (BGA) for full package. The connections of these pins depend solely
upon the user application, however there are a few factory test signals that are not used in a normal application. Following is a list of
these signals and how they are to be terminated for proper operation of the i.MX27/MX27L processor:
• CLKMODE[1:0]: To ensure proper operation, leave these signals as no connects.
• OSC26M_TEST: To ensure proper operation, leave this signal as no connect.
• EXT_60M: To ensure proper operation, connect this signal to ground.
• EXT_266M: To ensure proper operation, connect this signal to ground.
• Most of the signals shown in Table 60 are multiplexed with other signals. For ease of reference, all of the signals at a particular
pad are shown in the form of a compound signal name. Please refer to Table 3 for complete information on the signal
multiplexing schemes of these signals.
Table 59. i.MX27 Full 17 × 17 mm Package MAPBGA Pin Assignment
Freescale Semiconductor
1
2
3
4
5
6
11
12
13
14
15
16
A
GND
GND
SD2_ SD2_ CSI_D CSI_D CSI_H SSI4_ SSI1_ SSI2_
D3_M CLK_ 3_UA 5_PB1 SYNC RXDA RXDA RXDA
SHC_ MSHC RT6_ 7_PAD _UAR T_PC T_PC T_GP
T5_R 17_PA 21_PA T5_TI
DATA _SCL RTS_
N_PC
D
D
TS_P
3_PB K_PB PB13_
25_PA
B21_
7_PA 9_PAD PAD
D
PAD
D
SSI3_
RXDA
T_SL
CDC2
_RS_
PC29
_PAD
KP_R
OW1_
PAD
KP_R
OW5_
PAD
UART
2_RT
S_KP
_ROW
7_PE
4_PA
D
KP_C
OL2_
PAD
UART
2_TX
D_KP
_COL
6_PE
6_PA
D
UART3 UART1 RTCK_
_CTS_ _CTS_ OWIR
PE10_ PE14_ E_PE1
PAD
PAD
6_PAD
B
GND
GND
SPL_
SPR_
PA27
_PAD
CSI_D CSI_M CSI_D TIN_P
1_UA CLK_ 7_UA C15_
PAD
RT6_ PB15_ RT5_
RXD_
PAD
RXD_
PB19_
PB11_
PAD
PAD
SSI1_
CLK_
PC23
_PAD
SSI2_
CLK_
GPT4
_TIN_
PC27
_PAD
SSI3_
CLK_
SLCD
C2_C
LK_P
C31_
PAD
KP_R
OW3_
PAD
I2C_C
LK_P
D18_
PAD
KP_C
OL0_
PAD
KP_C
OL4_
PAD
UART
3_TX
D_PE
8_PA
D
UART1
_TXD_
PE12_
PAD
TDI_P
AD
TMS_
PAD
C
SD2_ CON
D0_M TRA
SHC_ ST_
DATA PA30
0_PB _PA
D
4_PA
D
CSI_
D0_U
ART6
_TXD
_PB1
0_PA
D
SD2_
CMD_
MSHC
_BS_
PB8_
PAD
KP_R
OW2_
PAD
PWM
O_PE
5_PA
D
UART
1_RT
S_PE
15_PA
D
TRST
_B_P
AD
CSPI1
_SS1_
PD27_
PAD
CSPI1
_MOSI
_PD31
_PAD
CSPI2 USB
_SS1_ H1_O
USBH E_B_
2_DAT PB27
A3_PD _PAD
20
SD2_
D2_M
SHC_
DATA2
_PB6_
PAD
7
SSI3_
TXDA
T_SL
CDC2
_CS_
PC30
_PAD
8
SSI4_
CLK_
PC19
_PAD
9
10
17
18
19
20
23
24
SD1_ SD1_ CSPI
D0_C CMD_ 1_MI
SPI3_ CSPI SO_
MISO 3_MO PD3
_PE1 SI_PE 0_PA
8_PA 22_P
D
AD
D
GND
GND
CSPI
1_S
S0_
PD2
8_PA
D
GND
GND
SD1_
D2_P
E20_
PAD
21
CSPI
1_RD
Y_PD
25_P
AD
22
Package Information and Pinout
106
5.2
Freescale Semiconductor
Table 59. i.MX27 Full 17 × 17 mm Package MAPBGA Pin Assignment (continued)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
CSPI CSPI USBH
2_S 1_TX
2_S
S2_ CLK DP_U
USB _US ART4
H2_ BH2 _CTS
DATA _DAT _PB2
9
A0_
4_P
D19 PD2
2
i.MX27/i.MX27L Block Guide, Rev. 1.3
HSY PS_ OE_A
NC_P PA26 CD_P
A28_ _PA A31_
PAD
D
PAD
E
REV_ LD1 SD2_
PA24 6_PA D1_M
_PAD 22_P SHC_
DATA
AD
1_PB
5_PA
D
CSI_D CSI_P
2_UA IXCLK
RT6_ _PB16
CTS_ _PAD
PB12_
PAD
F
LD14
_PA2
0_PA
D
LD1
0_PA
16_P
AD
VSYN CSI_D CSI_D
C_PA2 4_PB1 6_UA
9_PAD 4_PAD RT5_
TXD_
PB18
_PAD
G
LD8_
PA14
_PAD
LD6
_PA1
2_PA
D
LD17_
PA23_
PAD
H
NFRB LD4
_ETM _PA1
TRAC 0_PA
D
EPKT
3_PF
0
LD12
_PA1
8_PA
D
LD13_ LD15_
PA19_ PA21_
PAD
PAD
NVDD
15
NVDD
14
USBO USB_ USBH USB USB
TG_D OC_B 1_RC H2_ OTG
ATA5_ _PB2 V_PB CLK _DAT
PC7_P 4_PA 25_P _PA0 A4_
_PA PC1
AD
D
AD
2_PA
D
D
J
NFW LD0
P_B_ _PA6
ETMT _PA
D
RAC
EPKT
1_PF
2
LD2_
PA8_
PAD
LD7_P LD5_P LD11_
A13_P A11_P PA17_
PAD
AD
AD
UPLLV
DD_PA
D
USBO USB
TG_D H1_R
ATA0_ XDM
PC9_P _PB3
0_PA
AD
D
UART UART
2_RX 3_RT
D_KP S_PE
_ROW 11_PA
D
6_PE
7_PA
D
TDO_
PAD
SD1_
D1_P
E19_
PAD
SD1_D USBH
3_CSP 1_FS_
I3_SS UART4
_PE21 _RTS_
_PAD PB26_
PAD
CSPI
1_SS
2_US
BH2_
DATA
5_PD
26
KP_C
OL1_
PAD
KP_C
OL5_
PAD
UART
3_RX
D_PE
9_PA
D
UART TCK_P CSPI1 USBH
AD
_SCLK 1_TXD
1_RX
_PD29 M_UA
D_PE
_PAD RT4_T
13_PA
XD_P
D
B28
CSPI
2_SS
0_US
BH2_
DATA
6_PD
21
QVDD QVDD
NVDD
9
NVDD
8
QVDD SD1_C USBO USBH CSPI
LK_CS TG_D 1_SUS 2_MI
PI3_S ATA1_ P_PB2 SO_U
CLK_P PC11_ 2_PAD SBH2
_DAT
PAD
E23_P
A2_P
AD
D23
KP_C
OL3_
PAD
SSI1_ SSI3_ KP_R
TXDA FS_S OW4_
PAD
T_PC LCDC
22_PA 2_D0_
PC28
D
_PAD
UART
2_CT
S_KP
_COL
7_PE
3_PA
D
SSI4_
FS_P
C16_
PAD
SSI1_
FS_P
C20_
PAD
SSI2_
TXDA
T_GP
T4_T
OUT_
PC26
_PAD
KP_R I2C_D
OW0_ ATA_P
PAD
D17_
PAD
CLS_ CSI_V SSI4_
PA25_ SYNC TXDA
PAD
_UAR T_PC
T5_C 18_PA
D
TS_P
B20_
PAD
SSI2_
FS_G
PT5_
TOUT
_PC2
4_PA
D
NVDD
11
NVDD
10
TOUT
_PC1
4_PA
D
CSPI
2_MO
SI_U
SBH2
_DAT
A1_P
D24
USB
H1_
RXD
P_U
ART
4_R
XD_
PB3
1
USB
_PW
R_P
B23_
PAD
I2C2
_SC
L_P
C6_
PAD
USB USB
OTG OTG
_DAT _DAT
A6_
A2_
PC1 PC8
0_PA _PA
D
D
I2C2_ USB USB
SDA_ H2_ H2_
PC5_ STP DATA
PAD _PA4 7_PA
_PA 2_PA
D
D
Package Information and Pinout
107
D
i.MX27/i.MX27L Block Guide, Rev. 1.3
Freescale Semiconductor
1
2
3
K
NFAL
E_ET
MPIP
ESTA
T0_P
F4
LSC
LK_
PA5_
PAD
L
NFW
E_B_
ETM
PIPE
STAT
2_PF
6
NFC
E_B
_ET
MTR
ACE
PKT
2_P
F3
M
D14_
PAD
D15
_PA
D
D11_
PAD
N
D12_
PAD
D7_
PAD
D5_P
AD
P
D10_
PAD
R
D6_P
AD
4
5
6
7
8
9
10
11
12
13
14
15
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
D13_P D9_PA NVDD
AD
D
1
GND
GND
GND
GND
GND
D3_PA D1_PA NVDD
D
D
1
GND
GND
GND
GND
D8_
PAD
A9_PA A12_P QVDD
D
AD
GND
GND
GND
D4_
PAD
A5_PA A7_PA NVDD
D
D
2
GND
GND
GND
LD3_P LD1_P LD9_
A9_PA A7_PA PA15_
PAD
D
D
NFRE NFCL
_B_ET E_ET
MPIP MTRA
ESTAT CEPK
1_PF5 T0_PF
1
NVDD
12
GND
16
17
18
19
20
21
23
USB USB
H2_ OTG
DIR_ _CL
PA1_ K_P
PAD E24_
PAD
USB
RTCV RTCV
SS_PA DD_PA OTG_
DATA
D
D
3_PC
13_P
AD
NVDD
7
22
USBO OSC
TG_S 32K_
TP_K BYP
P_RO ASS
W6A_ _PA
D
PE1_
PAD
NVDD
7
USBH
2_NXT
_PA3_
PAD
UPLL
VSS_
PAD
FPMV
DD_PA
D
NVDD
13
USB USBO
OTG_ TG_D
NXT_ ATA7_
KP_C PE25
OL6A _PAD
_PE0
_PAD
OSC
32V
DD_
PAD
EXT
AL32
K_PA
D
GND
GND
NVDD
6
POWE USB POW
R_ON OTG_ ER_C
_RES DIR_ UT_P
AD
ET_PA KP_R
OW7
D
A_PE
2_PA
D
OSC
32V
SS_
PAD
XTAL
32K_
PAD
GND
GND
FPMV
SS_P
AD
NVDD
6
ATA_D
ATA6_
FEC_
MDIO_
PD8_P
AD
ATA_
DATA
2_SD
3_D2
_PD4
_PAD
SD3
_CM
D_P
D0_
PAD
SD3
_CL
K_E
TMT
RAC
EPK
T15_
PD1
GND
GND
MPLL
VSS_
PAD
FUSE
VDD_
PAD
FUSE
VSS_P
AD
ATA_
DATA
10_E
TMT
RAC
EPKT
9_PD
12
ATA_ ATA_
DATA DATA
1_S
0_S
D3_ D3_
D0_ D1_
PD2 PD3
_PA
_PA
D
D
24
Package Information and Pinout
108
Table 59. i.MX27 Full 17 × 17 mm Package MAPBGA Pin Assignment (continued)
Freescale Semiconductor
Table 59. i.MX27 Full 17 × 17 mm Package MAPBGA Pin Assignment (continued)
i.MX27/i.MX27L Block Guide, Rev. 1.3
1
2
3
T
D2_P
AD
D0_
PAD
MA10
_PAD
SDBA A1_PA NVDD
1_PAD
D
2
MPLLV AVSS_
PAD
DD_PA
D
ATA_ ATA_ ATA_ ATA_
DATA DATA DATA DATA
14_E 4_ET 5_ET 3_S
TMT MTRA MTR D3_
RAC CEPK ACE D3_
EPKT T14_ PKT PD5
5_PD PD6 13_P _PA
D
D7
16
U
A13_
PAD
A11_
PAD
A3_P
AD
SD31_ A25_P NVDD
PAD
AD
2
AVDD
_PAD
BOOT
2_PAD
IOIS1 ATA_
6_AT DATA
A_IN 8_ET
TRQ_ MTRA
PF9_ CEPK
T11_
PAD
PD10
V
A8_P
AD
A6_
PAD
SD26_ SD28_
PAD
PAD
SD29
_PAD
A19_
PAD
NVDD
2
NVDD
2
NVDD
3
NVDD
3
OSC2 PC_P
6M_TE OE_A
ST_PA TA_B
UFFE
D
R_EN
_PF7
_PAD
W
A4_P
AD
A2_
PAD
SD23_ SDQS
PAD 2_PAD
SD25
_PAD
SDQS
1_PA
D
SD13
_PAD
SD6_
PAD
A16_
PAD
DQM1 SDWE
_PAD _B_P
AD
CS3_
B_PA
D
Y
A0_P
AD
SDB
A0_
PAD
A20_P
AD
SD18
_PAD
SD15
_PAD
SD12
_PAD
SD8_
PAD
A15_
PAD
SD2_
PAD
SDCK
E1_P
AD
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
NVDD QVDD QVDD QVDD
4
NVDD
5
NVDD
5
CS5_
B_ET
MTRA
CECL
K_PF
22_PA
D
EB0_
B_PA
D
EXT_6
0M_PA
D
PC_C PC_V PC_B
D1_B_ S2_AT VD2_
ATA_D A_DA0 ATA_
IOR_P _PF13 DMA
F20_P _PAD CK_P
F11_
AD
PAD
CS2_
B_PA
D
LBA_
B_PA
D
OE_B_
PAD
PC_W PC_P
AIT_B WRON
_ATA_ _ATA_
CS1_P DA2_P
F18_P F16_P
AD
AD
DQM2
_PAD
21
22
ATA_
DATA
12_E
TMT
RAC
EPK
T7_P
D14
23
24
ATA_
DATA
7_ET
MTR
ACE
PKT
12_P
D9
BOO ATA_
T0_P DATA
AD 9_ET
MTR
ACE
PKT
10_P
D11
ATA_
DATA
11_E
TMT
RAC
EPK
T8_P
D13
ATA_
DATA
13_E
TMT
RAC
EPK
T6_P
D15
BOOT BOO ATA_
3_PA T1_P DATA
AD 15_E
D
TMT
RAC
EPK
T4_P
F23
109
Package Information and Pinout
SDQ
S3_P
AD
4
1
2
3
4
5
6
i.MX27/i.MX27L Block Guide, Rev. 1.3
AA
SD30 A24_
_PAD PAD
AB
A23_
PAD
SD2
4_PA
D
AC
GND
GND
A22_
PAD
SD20_ SD17_ A18_P
PAD
PAD
AD
AD
GND
GND
SD22 SD19_ SD16_ SD14_
_PAD
PAD
PAD
PAD
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
SD27
_PAD
A21_P SD21_
AD
PAD
SD10
_PAD
A14_
PAD
SD0_
PAD
RAS_
B_PA
D
A17_
PAD
SD9_
PAD
SD5_
PAD
SD4_
PAD
SD1_
PAD
A10_
PAD
CAS_
B_PA
D
SDCK
E0_P
AD
SD11
_PAD
SD7_
PAD
SDQS
0_PA
D
SD3_
PAD
DQM3 DQM0
_PAD _PAD
SDCL
K_PA
D
SDCL
K_PA
D_B
22
23
24
RES
ET_
OUT
_B_
PE1
7_PA
D
OSC
26V
DD_
PAD
XTAL
26M_
PAD
OSC
26V
SS_
PAD
EXTA
L26M
_PAD
CS1_
B_PA
D
BCLK_
PAD
CLK
MOD
E0_P
AD
CLKM
ODE1
_PAD
RW_B
_PAD
ECB_
B_PA
D
EB1_B JTAG_ PC_C PC_V
_PAD CTRL_ D2_B_ S1_A
ATA_D TA_D
PAD
IOW_P A1_P
F19_P F14_
AD
PAD
PC_R
ST_A
TA_R
ESET
_B_P
F10_
PAD
RES
ET_I
N_B
_PA
D
GND
GND
CS4_
B_ET
MTRA
CESY
NC_P
F21_P
AD
CS0_
B_PA
D
CLKO_ EXT_2 PC_R PC_B PC_R POR
PF15_ 66M_P EADY_ VD1_ W_B_ _B_
ATA_C ATA_ ATA_I PAD
AD
PAD
S0_PF DMA ORDY
17_PA RQ_P _PF8
F12_ _PAD
D
PAD
GND
GND
Package Information and Pinout
110
Table 59. i.MX27 Full 17 × 17 mm Package MAPBGA Pin Assignment (continued)
Freescale Semiconductor
Package Information and Pinout
Table 60 shows the device pin list, sorted by signal identification, including pad locations for ground and
power supply voltages.
Table 60. i.MX27 24 mm × 24 mm BGA (17 mm × 17 mm)—Signal ID by Ball Grid Location
Pin Name
Ball Grid Location
A0
Y1
A1
T6
A10
AC12
A11
U2
A12
P6
A13
U1
A14
AB9
A15
Y11
A16
W11
A17
AC7
A18
AC6
A19
V8
A2
W2
A20
Y6
A21
AB4
A22
AC3
A23
AB1
A24
AA2
A25
U6
A3
U3
A4
W1
A5
R5
A6
V2
A7
R6
A8
V1
A9
P5
ATA_DATA0_SD3_D0_PD2
R23
ATA_DATA1_SD3_D1_PD3
R24
ATA_DATA10_ETMTRACEPKT9_PD12
R20
ATA_DATA11_ETMTRACEPKT8_PD13
W23
ATA_DATA12_ETMTRACEPKT7_PD14
U23
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
111
Package Information and Pinout
Table 60. i.MX27 24 mm × 24 mm BGA (17 mm × 17 mm)—Signal ID by Ball Grid Location (continued)
Pin Name
Ball Grid Location
ATA_DATA13_ETMTRACEPKT6_PD15
W24
ATA_DATA14_ETMTRACEPKT5_PD16
T20
ATA_DATA15_ETMTRACEPKT4_PF23
Y24
ATA_DATA2_SD3_D2_PD4
P20
ATA_DATA3_SD3_D3_PD5
T24
ATA_DATA4_ETMTRACEPKT14_PD6
T22
ATA_DATA5_ETMTRACEPKT13_PD7
T23
ATA_DATA6_FEC_MDIO_PD8
P19
ATA_DATA7_ETMTRACEPKT12_PD9
U24
ATA_DATA8_ETMTRACEPKT11_PD10
U22
ATA_DATA9_ETMTRACEPKT10_PD11
V24
AVDD
U18
AVSS
T19
BCLK
AB17
BOOT0
V23
BOOT1
Y23
BOOT2
U19
BOOT3
Y22
CAS
AC13
CLKMODE0
AB20
CLKMODE1
AB21
CLKO_PF15
AD17
CLS_PA25
G6
CONTRAST_PA30
C2
CS0
AD16
CS1
AB16
CS2
Y15
CS3
W14
CS4_ETMTRACESYNC_PF21
AD15
CS5_ETMTRACECLK_PF22
W15
CSI_D0_UART6_TXD_PB10
C4
CSI_D1_UART6_RXD_PB11
B4
CSI_D2_UART6_CTS_PB12
E6
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
112
Freescale Semiconductor
Package Information and Pinout
Table 60. i.MX27 24 mm × 24 mm BGA (17 mm × 17 mm)—Signal ID by Ball Grid Location (continued)
Pin Name
Ball Grid Location
CSI_D3_UART6_RTS_PB13
A5
CSI_D4_PB14
F6
CSI_D5_PB17
A6
CSI_D6_UART5_TXD_PB18
F7
CSI_D7_UART5_RXD_PB19
B6
CSI_HSYNC_UART5_RTS_PB21
A7
CSI_MCLK_PB15
B5
CSI_PIXCLK_PB16
E7
CSI_VSYNC_UART5_CTS_PB20
G7
CSPI1_MISO_PD30
A22
CSPI1_MOSI_PD31
C21
CSPI1_RDY_PD25
B21
CSPI1_SCLK_PD29
F18
CSPI1_SS0_PD28
B22
CSPI1_SS1_PD27
C20
CSPI1_SS2_USBH2_DATA5_PD26
E22
CSPI2_MISO_USBH2_DATA2_PD23
G20
CSPI2_MOSI_USBH2_DATA1_PD24
E23
CSPI2_SCLK_USBH2_DATA0_PD22
D23
CSPI2_SS0_USBH2_DATA6_PD21
F20
CSPI2_SS1_USBH2_DATA3_PD20
C23
CSPI2_SS2_USBH2_DATA4_PD19
D22
D0
T2
D1
N6
D2
T1
D3
N5
D4
R2
D5
N3
D6
R1
D7
N2
D8
P2
D9
M6
D10
P1
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
113
Package Information and Pinout
Table 60. i.MX27 24 mm × 24 mm BGA (17 mm × 17 mm)—Signal ID by Ball Grid Location (continued)
Pin Name
Ball Grid Location
D11
M3
D12
N1
D13
M5
D14
M1
D15
M2
DQM0
AD12
DQM1
W12
DQM2
Y13
DQM3
AD11
EB0
W16
EB1
AC17
ECB
AC16
EXT_266M
AD18
EXT_60M
W17
EXTAL26M
AB24
EXTAL32K
M24
FPMVDD
M18
FPMVSS
P15
FUSEVDD
R18
FUSEVSS
R19
GND
L12
GND
N10
GND
N11
GND
N12
GND
N13
GND
N14
GND
N15
GND
P10
GND
P11
GND
P12
GND
P13
GND
P14
GND
R10
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
114
Freescale Semiconductor
Package Information and Pinout
Table 60. i.MX27 24 mm × 24 mm BGA (17 mm × 17 mm)—Signal ID by Ball Grid Location (continued)
Pin Name
Ball Grid Location
GND
R11
GND
R12
GND
R13
GND
R14
HSYNC_PA28
D1
I2C_CLK_PD18
B13
I2C_DATA_PD17
F12
I2C2_SCL_PC6
F24
I2C2_SDA_PC5
J22
IOIS16_ATA_INTRQ_PF9
U20
JTAG_CTRL
AC18
KP_COL0
B14
KP_COL1
F13
KP_COL2
A15
KP_COL3
E13
KP_COL4
B15
KP_COL5
F14
KP_ROW0
F11
KP_ROW1
A12
KP_ROW2
C12
KP_ROW3
B12
KP_ROW4
E11
KP_ROW5
A13
LBA
Y16
LD0_PA6
J2
LD1_PA7
K6
LD10_PA16
F2
LD11_PA17
J7
LD12_PA18
H3
LD13_PA19
H5
LD14_PA20
F1
LD15_PA21
H6
LD16_PA22
E2
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
115
Package Information and Pinout
Table 60. i.MX27 24 mm × 24 mm BGA (17 mm × 17 mm)—Signal ID by Ball Grid Location (continued)
Pin Name
Ball Grid Location
LD17_PA23
G5
LD2_PA8
J3
LD3_PA9
K5
LD4_PA10
H2
LD5_PA11
J6
LD6_PA12
G2
LD7_PA13
J5
LD8_PA14
G1
LD9_PA15
K7
LSCLK_PA5
K2
MA10
T3
MPLLVDD
T18
MPLLVSS
R15
NVDD2
V10
NFALE_ETMPIPESTAT0_PF4
K1
NFCE_B_ETMTRACEPKT2_PF3
L2
NFCLE_ETMTRACEPKT0_PF1
L6
FRB_ETMTRACEPKT3_PF0
H1
NFRE_ETMPIPESTAT1_PF5
L5
NFWE_ETMPIPESTAT2_PF6
L1
NFWP_ETMTRACEPKT1_PF2
J1
NVDD1
M7
NVDD1
N7
NVDD10
G11
NVDD11
G10
NVDD12
L7
NVDD13
M19
NVDD14
H18
NVDD15
H7
NVDD2
R7
NVDD2
T7
NVDD2
U7
NVDD2
V9
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
116
Freescale Semiconductor
Package Information and Pinout
Table 60. i.MX27 24 mm × 24 mm BGA (17 mm × 17 mm)—Signal ID by Ball Grid Location (continued)
Pin Name
Ball Grid Location
NVDD3
V11
NVDD3
V12
NVDD4
V13
NVDD5
V17
NVDD5
V18
NVDD6
N18
NVDD6
P18
NVDD7
L18
NVDD7
L19
NVDD8
G15
NVDD9
G14
GND
A1
GND
A24
GND
AC1
GND
AC2
GND
A23
GND
AC23
GND
A2
GND
AC24
GND
AD1
GND
AD2
GND
AD23
GND
AD24
GND
B1
GND
B2
GND
B23
GND
B24
GND
K10
GND
K11
GND
K12
GND
K13
GND
K14
GND
K15
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
117
Package Information and Pinout
Table 60. i.MX27 24 mm × 24 mm BGA (17 mm × 17 mm)—Signal ID by Ball Grid Location (continued)
Pin Name
Ball Grid Location
GND
L10
GND
L11
OE
Y17
OE_ACD_PA31
D3
OSC26M_TEST
V19
OSC26VDD
AA23
OSC26VSS
AB23
OSC32K_BYPASS
L24
OSC32VDD
M23
OSC32VSS
N23
PC_BVD1_ATA_DMARQ_PF12
AD20
PC_BVD2_ATA_DMACK_PF11
W20
PC_CD1_B_ATA_DIOR_PF20
W18
PC_CD2_B_ATA_DIOW_PF19
AC19
PC_POE_ATA_BUFFER_EN_PF7
V20
PC_PWRON_ATA_DA2_PF16
Y19
PC_READY_ATA_CS0_PF17
AD19
PC_RST_ATA_RESET_PF10
AC21
PC_RW_ATA_IORDY_PF8
AD21
PC_VS1_ATA_DA1_PF14
AC20
PC_VS2_ATA_DA0_PF13
W19
PC_WAIT_ATA_CS1_PF18
Y18
POR
AD22
POWER_CUT
N22
POWER_ON_RESET
N19
PS_PA26
D2
PWMO_PE5
C13
Q VDD
G12
Q VDD
G13
Q VDD
G16
Q VDD
P7
Q VDD
V14
Q VDD
V15
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
118
Freescale Semiconductor
Package Information and Pinout
Table 60. i.MX27 24 mm × 24 mm BGA (17 mm × 17 mm)—Signal ID by Ball Grid Location (continued)
Pin Name
Ball Grid Location
Q VDD
V16
QVSS
L13
QVSS
L14
QVSS
L15
QVSS
M10
QVSS
M11
QVSS
M12
QVSS
M13
QVSS
M14
RAS
AB13
RESET_IN
AC22
RESET_OUT_PE17
AA22
REV_PA24
E1
RTCK_OWIRE_PE16
A19
RTCVDD
K19
RTCVSS
K18
RW_B
AC15
SD0
AB12
SD1
AC11
SD1_CLK_CSPI3_SCLK_PE23
G17
SD1_CMD_CSPI3_MOSI_PE22
A21
SD1_D0_CSPI3_MISO_PE18
A20
SD1_D1_PE19
E17
SD1_D2_PE20
B20
SD1_D3_CSPI3_SS_PE21
E18
SD10
AB8
SD11
AD7
SD12
Y9
SD13
W9
SD14
AD6
SD15
Y8
SD16
AD5
SD17
AC5
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
119
Package Information and Pinout
Table 60. i.MX27 24 mm × 24 mm BGA (17 mm × 17 mm)—Signal ID by Ball Grid Location (continued)
Pin Name
Ball Grid Location
SD18
Y7
SD19
AD4
SD2
Y12
SD2_CLK_MSHC_SCLK_PB9
A4
SD2_CMD_MSHC_BS_PB8
C5
SD2_D0_MSHC_DATA0_PB4
C1
SD2_D1_MSHC_DATA1_PB5
E3
SD2_D2_MSHC_DATA2_PB6
C8
SD2_D3_MSHC_DATA3_PB7
A3
SD20
AC4
SD21
AB5
SD22
AD3
SD23
W5
SD24
AB2
SD25
W7
SD26
V5
SD27
AA3
SD28
V6
SD29
V7
SD3
AD10
SD3_CLK_ETMTRACEPKT15_PD1
P24
SD3_CMD_PD0_
P23
SD30
AA1
SD31
U5
SD4
AC10
SD5
AC9
SD6
W10
SD7
AD8
SD8
Y10
SD9
AC8
SDBA0
Y2
SDBA1
T5
SDCKE0
AC14
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
120
Freescale Semiconductor
Package Information and Pinout
Table 60. i.MX27 24 mm × 24 mm BGA (17 mm × 17 mm)—Signal ID by Ball Grid Location (continued)
Pin Name
Ball Grid Location
SDCKE1
Y14
SDCLK
AD13
SDCLK
AD14
SDQS0
AD9
SDQS1
W8
SDQS2
W6
SDQS3
Y3
SDWE
W13
SPL_SPR_PA27
B3
SSI1_CLK_PC23
B9
SSI1_FS_PC20
F9
SSI1_RXDAT_PC21
A9
SSI1_TXDAT_PC22
E9
SSI2_CLK_GPT4_TIN_PC27
B10
SSI2_FS_GPT5_TOUT_PC24
G9
SSI2_RXDAT_GPT5_TIN_PC25
A10
SSI2_TXDAT_GPT4_TOUT_PC26
F10
SSI3_CLK_SLCDC2_CLK_PC31
B11
SSI3_FS_SLCDC2_D0_PC28
E10
SSI3_RXDAT_SLCDC2_RS_PC29
A11
SSI3_TXDAT_SLCDC2_CS_PC30
C9
SSI4_CLK_PC19
B8
SSI4_FS_PC16
F8
SSI4_RXDAT_PC17
A8
SSI4_TXDAT_PC18
G8
TCK
F17
TDI
B18
TDO
E16
TIN_PC15
B7
TMS
B19
TOUT_PC14
E8
TRST
C17
UART1_CTS_PE14
A18
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
121
Package Information and Pinout
Table 60. i.MX27 24 mm × 24 mm BGA (17 mm × 17 mm)—Signal ID by Ball Grid Location (continued)
Pin Name
Ball Grid Location
UART1_RTS_PE15
C16
UART1_RXD_PE13
F16
UART1_TXD_PE12
B17
UART2_CTS_KP_COL7_PE3_PAD
E12
UART2_RTS_KP_ROW7_PE4
A14
UART2_RXD_KP_ROW6_PE7
E14
UART2_TXD_KP_COL6_PE6
A16
UART3_CTS_PE10
A17
UART3_RTS_PE11
E15
UART3_RXD_PE9
F15
UART3_TXD_PE8
B16
UPLLVDD
J18
UPLLVSS
M15
USB_OC_PB24
H20
USB_PWR_PB23
F23
USBH1_FS_UART4_RTS_PB26
E19
USBH1_OE_PB27
C24
USBH1_RCV_PB25
H22
USBH1_RXDM_PB30
J20
USBH1_RXDP_UART4_RXD_PB31
E24
USBH1_SUSP_PB22
G19
USBH1_TXDM_UART4_TXD_PB28
F19
USBH1_TXDP_UART4_CTS_PB29
D24
USBH2_CLK_PA0
H23
USBH2_DATA7_PA2_SUSPEND
J24
USBH2_DIR_PA1
K23
USBH2_NXT_PA3
L20
USBH2_STP_PA4
J23
USBOTG_CLK_PE24
K24
USBOTG_DATA0_PC9_OEN
J19
USBOTG_DATA1_PC11_TXDP
G18
USBOTG_DATA2_PC10_TXDM
G23
USBOTG_DATA3_PC13_RXDP
K20
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
122
Freescale Semiconductor
Package Information and Pinout
Table 60. i.MX27 24 mm × 24 mm BGA (17 mm × 17 mm)—Signal ID by Ball Grid Location (continued)
Pin Name
Ball Grid Location
USBOTG_DATA4_PC12_RXDM
H24
USBOTG_DATA5_PC7_RCV
H19
USBOTG_DATA6_PC8_SPEED
G24
USBOTG_DATA7_PE25_SUSPEND
M22
USBOTG_DIR_KP_ROW7A_PE2
N20
USBOTG_NXT_KP_COL6A_PE0
M20
USBOTG_STP_KP_ROW6A_PE1
L23
VSYNC_PA29
F5
XTAL26M
AA24
XTAL32K
N24
Notes:
1. GND and QVSS contacts are tied together inside the BGA package
2. Freescale recommends tying GND and QVSS contacts to a single plane.
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
123
Package Information and Pinout
5.3
Full Package Outline Drawing (19 mm × 19 mm)
Figure 69 shows the package drawings and dimensions of the production package.
Figure 69. i.MX27/MX27L 19 × 19 mm Full Package MAPBGA: Mechanical Drawing
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
124
Freescale Semiconductor
Pin Assignments (19 mm × 19 mm)
Freescale Semiconductor
5.4
Table 61 shows the i.MX27 full 19 × 19 mm package MAPBGA pin assignment.
i.MX27/i.MX27L Block Guide, Rev. 1.3
Table 62 identifies the pin assignments for the ball grid array (BGA) for full package. The connections of these pins depend solely
upon the user application, however there are a few factory test signals that are not used in a normal application. Following is a list of
these signals and how they are to be terminated for proper operation of the i.MX27/MX27L processor:
• CLKMODE[1:0]: To ensure proper operation, leave these signals as no connects.
• OSC26M_TEST: To ensure proper operation, leave this signal as no connect.
• EXT_60M: To ensure proper operation, connect this signal to ground.
• EXT_266M: To ensure proper operation, connect this signal to ground.
• Most of the signals shown in Table 62 are multiplexed with other signals. For ease of reference, all of the signals at a particular
pad are shown in the form of a compound signal name. Refer to Table 3 for complete information on the signal multiplexing
schemes of these signals.
Table 61. i.MX27 Full 19 mm × 19 mm package MAPBGA Pin Assignment
2
3
4
5
6
A
GND
GND
SD2_ CSI_D CSI_M CSI_D
D3_M 1_UAR CLK_P 5_PB1
SHC_ T6_RX B15_P 7_PAD
AD
DATA3 D_PB1
_PB7_ 1_PAD
PAD
B
GND
GND
SD2_
D1_M
SHC_
DATA1
_PB5_
PAD
C
SD2_
D0_M
SHC_
DATA0
_PB4_
PAD
CONT
RAST
_PA30
_PAD
7
8
9
13
14
15
TOUT SSI4_ SSI1_ SSI3_ SSI3_ KP_R
_PC14 CLK_P CLK_P FS_SL CLK_S OW3_
PAD
_PAD C19_P C23_P CDC2 LCDC
AD
AD
_D0_P 2_CLK
C28_P _PC31
_PAD
AD
UART
2_CT
S_KP
_COL
7_PE
3_PA
D
PWM
O_PE
5_PA
D
KP_C
OL4_
PAD
SSI3_
RXDA
T_SLC
DC2_
RS_P
C29_P
AD
KP_R
OW2_
PAD
I2C_C
LK_P
D18_
PAD
KP_C
OL2_
PAD
KP_C
OL5_
PAD
SSI2_ SSI3_
FS_G TXDAT
PT5_T _SLC
OUT_ DC2_
PC24_ CS_P
C30_P
PAD
AD
KP_R
OW4_
PAD
UART
2_RT
S_KP
_ROW
7_PE
4_PA
D
KP_C
OL3_
PAD
SD2_ CSI_D CSI_PI CSI_H SSI4_ SSI1_
CMD_ 2_UAR XCLK_ SYNC RXDA TXDAT
MSHC T6_CT PB16_ _UART T_PC1 _PC22
5_RTS 7_PAD _PAD
PAD
_BS_P S_PB1
_PB21
B8_PA 2_PAD
_PAD
D
OE_A
SD2_ CSI_D CSI_D CSI_D TIN_P
CD_PA D2_M 0_UAR 4_PB1 7_UAR C15_P
AD
31_PA SHC_ T6_TX 4_PAD T5_RX
D_PB1
D
DATA2 D_PB1
9_PAD
_PB6_ 0_PAD
PAD
SSI1_
FS_P
C20_P
AD
10
SSI2_
RXDA
T_GP
T5_TI
N_PC
25_PA
D
11
12
16
17
18
19
UART3 UART
_TXD_ 1_RX
PE8_P D_PE
AD
13_P
AD
RTCK
_OWI
RE_P
E16_
PAD
SD1_
D1_P
E19_
PAD
UART3 UART
_CTS_ 1_CT
PE10_ S_PE
14_P
PAD
AD
SD1_
D0_C
SPI3_
MISO
_PE1
8_PA
D
UART UART3 UART
2_RX _RTS_ 1_RT
D_KP PE11_ S_PE
PAD
15_P
_ROW
AD
6_PE
7_PA
D
TMS_
PAD
20
21
22
23
SD1_ CSPI
CMD 1_MI
SO_
_CS
PI3_ PD30
MOSI _PAD
_PE2
2_PA
D
GND
GND
SD1_
D2_P
E20_
PAD
CSPI CSPI
1_RD 1_SS
Y_P 0_PD
D25_ 28_P
AD
PAD
GND
GND
SD1_
CLK_
CSPI
3_SC
LK_P
E23_
PAD
CSPI CSPI
1_M 1_SS
OSI_ 1_PD
PD31 27_P
AD
_PAD
CSPI
2_SS
1_US
BH2_
DATA
3_PD
20
CSPI
2_SS
0_US
BH2_
DATA
6_PD
21
125
Package Information and Pinout
1
1
2
3
4
5
6
7
8
9
10
CSI_D CSI_D SSI4_ SSI1_ SSI2_
3_UAR 6_UAR FS_P RXDA CLK_
T6_RT T5_TX C16_P T_PC2 GPT4_
1_PAD TIN_P
AD
S_PB1 D_PB1
C27_P
3_PAD 8_PAD
AD
i.MX27/i.MX27L Block Guide, Rev. 1.3
11
12
13
14
15
16
17
18
19
20
21
22
23
KP_R
OW1_
PAD
KP_R
OW5_
PAD
KP_C
OL0_
PAD
UART
2_TX
D_KP
_COL
6_PE
6_PA
D
UART
1_TX
D_PE
12_PA
D
TDO_
PAD
TDI_
PAD
SD1_
D3_C
SPI3_
SS_P
E21_
PAD
CSPI
1_SC
LK_P
D29_
PAD
CSPI
1_SS
2_US
BH2_
DATA
5_PD
26
CSPI CSPI CSPI
2_SS 2_SC 2_MO
2_US LK_U SI_U
BH2_ SBH2 SBH2
DATA _DAT _DAT
4_PD A0_P A1_P
D24
D22
19
CSPI
2_MI
SO_
USB
H2_D
ATA2
_PD2
3
USB USB_ USB
_PW OC_B H1_R
R_P _PB2 CV_P
B23_ 4_PA B25_
PAD
D
PAD
Freescale Semiconductor
D
HSYN
C_PA2
8_PAD
PS_PA SPL_S VSYN SD2_
26_PA PR_PA C_PA2 CLK_
27_PA 9_PAD MSHC
D
_SCLK
D
_PB9_
PAD
E
LD15_
PA21_
PAD
LD16_
PA22_
PAD
LD17_
PA23_
PAD
CLS_P
A25_P
AD
F
LD13_
PA19_
PAD
LD12_
PA18_
PAD
LD14_
PA20_
PAD
REV_
PA24_
PAD
GND
GND
CSI_V SSI4_ SSI2_
SYNC TXDAT TXDAT
_UART _PC18 _GPT4
_TOU
5_CTS _PAD
T_PC2
_PB20
6_PAD
_PAD
KP_R
OW0_
PAD
I2C_D
ATA_P
D17_
PAD
KP_C
OL1_
PAD
UART
3_RX
D_PE
9_PA
D
TCK_
PAD
TRST_
B_PAD
QVD
D
GND
USB
USB
USB USB
H1_F H1_ H1_T H1_T
S_UA OE_ XDM XDP_
RT4_ B_PB _UAR UART
RTS_ 27_P T4_T 4_CT
XD_P S_PB
AD
PB26
29
B28
_PAD
G
LD8_P
A14_P
AD
LD7_P
A13_P
AD
LD10_
PA16_
PAD
LD11_
PA17_
PAD
NVDD
15
GND
NVDD
11
NVDD
11
NVDD
11
NVDD
10
NVDD
10
NVDD NVDD
9
9
NVDD
8
NVDD
8
QVD
D
USBH
1_SU
SP_P
B22_
PAD
USB USB I2C2_ I2C2_
H1_R H1_R SDA_ SCL_
XDM XDP PC5_ PC6_
PAD
PAD
_PB3 _UA
0_PA RT4_
RXD
D
_PB3
1
H
LD3_P
A9_PA
D
LD5_P
A11_P
AD
LD6_P
A12_P
AD
LD9_P
A15_P
AD
NVDD
15
QVDD
QVDD
QVDD
QVDD
QVDD
QVDD QVDD QVDD QVDD
QVDD
QVD
D
NVD
D14
USB
USB
USB USB
OTG OTG OTG_ OTG_
_DAT _DAT DATA DATA
A5_P A6_P 0_PC 2_PC
C7_P C8_P 9_PA 10_P
AD
D
AD
AD
J
LD0_P
A6_PA
D
LD1_P
A7_PA
D
LD2_P
A8_PA
D
LD4_P
A10_P
AD
NVDD
12
NVDD
12
QVDD
GND
GND
GND
QVDD
NVD
D14
NVD
D7
USB
USB
USB USB
OTG OTG OTG_ H2_C
_DAT _DAT DATA LK_P
A1_P A4_P 3_PC A0_P
AD
C11_ C12_ 13_P
AD
PAD
PAD
GND
GND
GND
GND
Package Information and Pinout
126
Table 61. i.MX27 Full 19 mm × 19 mm package MAPBGA Pin Assignment (continued)
Freescale Semiconductor
Table 61. i.MX27 Full 19 mm × 19 mm package MAPBGA Pin Assignment (continued)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
USB
H2_N
XT_P
A3_P
AD
USB
H2_S
TP_P
A4_P
AD
i.MX27/i.MX27L Block Guide, Rev. 1.3
NFWP NFRB NFCE LSCLK
_B_ET _ETM _B_ET _PA5_
PAD
MTRA TRAC MTRA
CEPK EPKT3 CEPK
T1_PF _PF0 T2_PF
3
2
NVDD
1
NVDD
1
QVDD
GND
GND
GND
GND
GND
GND
GND
QVDD
UPLL
VDD_
PAD
NVD
D7
USB USB
H2_D H2_D
IR_P ATA7
A1_P _PA2
_PAD
AD
L
NFWE NFALE NFRE
_B_ET _ETM _B_ET
MPIPE PIPES MPIPE
STAT2 TAT0_ STAT1
_PF5
PF4
_PF6
NFCL
E_ET
MTRA
CEPK
T0_PF
1
NVDD
1
NVDD
1
QVDD
GND
GND
GND
GND
GND
GND
GND
QVDD
UPLL
VSS_
PAD
NVD
D13
USB
USB
USB USB
OTG OTG OTG_ OTG_
_DAT _NXT CLK_ STP_
A7_P _KP_ PE24 KP_R
E25_ COL _PAD OW6
A_PE
PAD 6A_P
1_PA
E0_P
D
AD
M
D15_P
AD
D14_P
AD
D12_P
AD
D13_P
AD
D11_P
AD
QVDD
QVDD
GND
GND
GND
GND
GND
GND
GND
QVDD
RTCV
SS_P
AD
RTCV
DD_P
AD
USB OSC POW POW
OTG 32K_ ER_O ER_C
_DIR BYPA N_RE UT_P
AD
_KP_ SS_P SET_
PAD
AD
ROW
7A_P
E2_P
AD
N
D10_P
AD
D9_PA D5_PA
D
D
D8_PA
D
D7_PA
D
D0_PA
D
QVDD
GND
GND
GND
GND
GND
GND
GND
QVDD
FPMV FPMV
SS_P DD_P
AD
AD
P
D6_PA
D
D4_PA D3_PA
D
D
NC_P
4_1
MA10_
PAD
NVDD
2
QVDD
GND
GND
GND
GND
GND
GND
GND
QVDD
NVD
D6
R
D2_PA
D
D1_PA
D
A12_P
AD
NVDD
2
NVDD
2
QVDD
GND
GND
GND
GND
GND
GND
GND
QVDD
FUSE FUSE
VSS_ VDD_
PAD
PAD
A13_P
AD
NVD
D6
SD3_ OSC OSC3
CMD 32VD 2VSS
_PD0 D_PA _PAD
D
_PAD
EXTA
L32K
_PAD
ATA_ ATA_ SD3_
DATA DATA CLK_
0_SD 1_SD ETMT
3_D0 3_D1 RACE
_PD2 _PD3 PKT1
_PAD _PAD 5_PD
1
XTAL
32K_
PAD
ATA_
DATA
3_SD
3_D3
_PD5
_PAD
ATA_
DATA
2_SD
3_D2
_PD4
_PAD
ATA_ ATA_
DATA DATA
5_ET 4_ET
MTR MTR
ACE ACE
PKT1 PKT1
3_PD 4_PD
6
7
127
Package Information and Pinout
K
i.MX27/i.MX27L Block Guide, Rev. 1.3
1
2
3
4
T
A11_P
AD
A9_PA
D
A8_PA
D
U
A6_PA
D
A5_PA
D
V
A2_PA
D
W
Y
5
6
7
8
9
10
11
12
13
A7_PA
D
A1_PA
D
NVDD
2
QVDD
QVDD
QVDD
QVDD
QVDD QVDD QVDD QVDD
A4_PA
D
A3_PA
D
SD29_
PAD
NVDD
2
NVDD
2
NVDD
2
QVDD
NVDD
3
NVDD
3
A0_PA
D
SDBA
0_PAD
SD31_
PAD
A22_P
AD
GND
GND
SD12_ SD6_P SD2_P DQM1 SDCK
PAD
AD
AD
_PAD E0_P
AD
SDBA
1_PAD
A25_P
AD
SDQS
3_PAD
SD27_
PAD
SD30_
PAD
A24_P
AD
SD28_
PAD
SD26_
PAD
SDCK
E1_P
AD
14
15
16
17
18
19
20
21
22
23
ATA_
DATA
6_FE
C_M
DIO_
PD8_
PAD
QVDD
MPLL BOOT
VSS_ 2_PA
D
PAD
ATA_ ATA_ ATA_
DATA DATA DATA
8_ET 9_ET 7_ET
MTR MTR MTR
ACE ACE ACEP
PKT1 PKT1 KT12
1_PD 0_PD _PD9
11
10
NVDD
4
NVDD
4
AVDD
_PAD
AVSS
_PAD
ATA_
DATA
13_E
TMT
RAC
EPK
T6_P
D15
ATA_ ATA_ ATA_
DATA DATA DATA
12_E 11_E 10_E
TMT
TMT TMT
RAC RACE RACE
EPK PKT8 PKT9
T7_P _PD1 _PD1
2
3
D14
CS5_ NVDD
5
B_ET
MTRA
CECL
K_PF
22_PA
D
NVDD
5
MPLL
VDD_
PAD
GND
BOO
T1_P
AD
BOO
T0_P
AD
NVDD
4
ATA_ ATA_
DATA DATA
15_E 14_E
TMT
TMT
RACE RACE
PKT4 PKT5
_PF2 _PD1
6
3
OSC OSC OSC2
26M_ 26VS 6VDD
TEST S_PA _PAD
_PAD
D
BOO
T3_P
AD
Freescale Semiconductor
CS4_
B_ET
MTRA
CESY
NC_P
F21_P
AD
CS0_
B_PA
D
OE_B_ PC_C PC_V
PAD
D2_B S1_A
_ATA_ TA_D
DIOW A1_P
_PF1 F14_
PAD
9_PA
D
PC_R PC_ POR
ST_A POE _B_P
AD
TA_R _ATA
ESET _BUF
_B_P FER_
F10_ EN_
PAD PF7_
PAD
CLK
MOD
E1_P
AD
EXTA
L26M
_PAD
AA SD25_ A23_P SD24_ SD22_ A20_P SD16_ SD15_ SD11_ SD7_P A15_P SD0_P DQM0 SDCL RW_B
CS1_
B_PA
D
EB0_B
_PAD
PC_B IOIS1 RES
VD1_ 6_AT ET_I
ATA_ A_IN N_B_
DMA TRQ PAD
RQ_P _PF9
F12_ _PAD
PAD
CLK
MOD
E0_P
AD
XTAL
26M_
PAD
PAD
AD
PAD
PAD
SD20_
PAD
AD
SD17_
PAD
PAD
A19_P
AD
PAD
SD13_ SD9_P SDQS
PAD
AD
0_PAD
PAD
AD
AD
DQM3
_PAD
AD
RAS_
B_PA
D
_PAD
SDCL
K_PA
D_B
K_PA
D
_PAD
EXT_
60M_
PAD
PC_
WAIT
_B_A
TA_C
S1_P
F18_
PAD
Package Information and Pinout
128
Table 61. i.MX27 Full 19 mm × 19 mm package MAPBGA Pin Assignment (continued)
Freescale Semiconductor
Table 61. i.MX27 Full 19 mm × 19 mm package MAPBGA Pin Assignment (continued)
1
2
3
4
5
6
7
8
9
AB
GND
GND
SDQS
2_PAD
SD21_
PAD
SD19_
PAD
SDQS
1_PAD
SD14_
PAD
SD10_ SD5_P SD4_P SD1_P
PAD
AD
AD
AD
AC
GND
GND
SD23_
PAD
A21_P
AD
SD18_
PAD
A18_P
AD
A17_P
AD
SD8_P
AD
A16_P
AD
10
A14_P
AD
11
12
13
14
15
16
17
A10_
PAD
SDWE
_B_P
AD
CS2_
B_PA
D
ECB_
B_PA
D
EB1_B
_PAD
JTAG
_CTR
L_PA
D
SD3_P DQM2
AD
_PAD
CAS_
B_PA
D
CS3_
B_PA
D
LBA_
B_PA
D
BCLK_ CLKO
PAD
_PF1
5_PA
D
18
i.MX27/i.MX27L Block Guide, Rev. 1.3
22
23
PC_
PC_C PC_R PC_
D1_B EADY BVD RW_
_ATA_ _ATA_ 2_AT B_AT
DIOR CS0_ A_D A_IO
_PF2 PF17 MAC RDY_
0_PA _PAD K_PF PF8_
11_P PAD
D
AD
GND
GND
PC_ RES
VS2_ ET_
ATA_ OUT
DA0_ _B_P
PF13 E17_
_PAD PAD
GND
GND
EXT_
266M
_PAD
19
PC_P
WRO
N_AT
A_DA
2_PF
16_P
AD
20
21
Package Information and Pinout
129
Package Information and Pinout
Table 62 shows the device pin list, sorted by sorted by location.
Table 62. i.MX27 23 mm × 23 mm BGA (19 mm × 19 mm)—Signal ID by Ball Grid Location
Location
Contact Name
A1
GND
A2
GND
A3
SD2_D3_MSHC_DATA3_PB7
A4
CSI_D1_UART6_RXD_PB11
A5
CSI_MCLK_PB15
A6
CSI_D5_PB17
A7
TOUT_PC14
A8
SSI4_CLK_PC19
A9
SSI1_CLK_PC23
A10
SSI3_FS_SLCDC2_D0_PC28
A11
SSI3_CLK_SLCDC2_CLK_PC31
A12
KP_ROW3
A13
UART2_CTS_KP_COL7_PE3
A14
PWMO_PE5
A15
KP_COL4
A16
UART3_TXD_PE8
A17
UART1_RXD_PE13
A18
RTCK_OWIRE_PE16
A19
SD1_D1_PE19
A20
SD1_CMD_CSPI3_MOSI_PE22
A21
CSPI1_MISO_PD30
A22
GND
A23
GND
AA1
SD25
AA2
A23
AA3
SD24
AA4
SD22
AA5
A20
AA6
SD16
AA7
SD15
AA8
SD11
AA9
SD7
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
130
Freescale Semiconductor
Package Information and Pinout
Table 62. i.MX27 23 mm × 23 mm BGA (19 mm × 19 mm)—Signal ID by Ball Grid Location (continued)
Location
Contact Name
AA10
A15
AA11
SD0
AA12
DQM0
AA13
SDCLK
AA14
RW_B
AA15
CS1_B
AA16
EB0_B
AA17
EXT_60M
AA18
PC_WAIT_B_ATA_CS1_PF18
AA19
PC_BVD1_ATA_DMARQ_PF12
AA20
IOIS16_ATA_INTRQ_PF9
AA21
RESET_IN_B
AA22
CLKMODE0
AA23
XTAL26M
AB1
GND
AB2
GND
AB3
SDQS2
AB4
SD21
AB5
SD19
AB6
SDQS1
AB7
SD14
AB8
SD10
AB9
SD5
AB10
SD4
AB11
SD1
AB12
A10
AB13
SDWE_B
AB14
CS2_B
AB15
ECB_B
AB16
EB1_B
AB17
JTAG_CTRL
AB18
PC_CD1_B_ATA_DIOR_PF20
AB19
PC_READY_ATA_CS0_PF17
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
131
Package Information and Pinout
Table 62. i.MX27 23 mm × 23 mm BGA (19 mm × 19 mm)—Signal ID by Ball Grid Location (continued)
Location
Contact Name
AB20
PC_BVD2_ATA_DMACK_PF11
AB21
PC_RW_B_ATA_IORDY_PF8
AB22
GND
AB23
GND
AC1
GND
AC2
GND
AC3
SD23
AC4
A21
AC5
SD18
AC6
A18
AC7
A17
AC8
SD8
AC9
A16
AC10
A14
AC11
SD3
AC12
DQM2
AC13
CAS_B
AC14
CS3_B
AC15
LBA_B
AC16
BCLK
AC17
CLKO_PF15
AC18
EXT_266M
AC19
PC_PWRON_ATA_DA2_PF16
AC20
PC_VS2_ATA_DA0_PF13
AC21
RESET_OUT_B_PE17
AC22
GND
AC23
GND
B1
GND
B2
GND
B3
SD2_D1_MSHC_DATA1_PB5
B4
SD2_CMD_MSHC_BS_PB8
B5
CSI_D2_UART6_CTS_PB12
B6
CSI_PIXCLK_PB16
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
132
Freescale Semiconductor
Package Information and Pinout
Table 62. i.MX27 23 mm × 23 mm BGA (19 mm × 19 mm)—Signal ID by Ball Grid Location (continued)
Location
Contact Name
B7
CSI_HSYNC_UART5_RTS_PB21
B8
SSI4_RXDAT_PC17
B9
SSI1_TXDAT_PC22
B10
SSI2_RXDAT_GPT5_TIN_PC25
B11
SSI3_RXDAT_SLCDC2_RS_PC29
B12
KP_ROW2
B13
I2C_CLK_PD18
B14
KP_COL2
B15
KP_COL5
B16
UART3_CTS_PE10
B17
UART1_CTS_PE14
B18
SD1_D0_CSPI3_MISO_PE18
B19
SD1_D2_PE20
B20
CSPI1_RDY_PD25
B21
CSPI1_SS0_PD28
B22
GND
B23
GND
C1
SD2_D0_MSHC_DATA0_PB4
C2
CONTRAST_PA30
C3
OE_ACD_PA31
C4
SD2_D2_MSHC_DATA2_PB6
C5
CSI_D0_UART6_TXD_PB10
C6
CSI_D4_PB14
C7
CSI_D7_UART5_RXD_PB19
C8
TIN_PC15
C9
SSI1_FS_PC20
C10
SSI2_FS_GPT5_TOUT_PC24
C11
SSI3_TXDAT_SLCDC2_CS_PC30
C12
KP_ROW4
C13
UART2_RTS_KP_ROW7_PE4
C14
KP_COL3
C15
UART2_RXD_KP_ROW6_PE7
C16
UART3_RTS_PE11
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
133
Package Information and Pinout
Table 62. i.MX27 23 mm × 23 mm BGA (19 mm × 19 mm)—Signal ID by Ball Grid Location (continued)
Location
Contact Name
C17
UART1_RTS_PE15
C18
TMS
C19
SD1_CLK_CSPI3_SCLK_PE23
C20
CSPI1_MOSI_PD31
C21
CSPI1_SS1_PD27
C22
CSPI2_SS1_USBH2_DATA3_PD20
C23
CSPI2_SS0_USBH2_DATA6_PD21
D1
HSYNC_PA28
D2
PS_PA26
D3
SPL_SPR_PA27
D4
VSYNC_PA29
D5
SD2_CLK_MSHC_SCLK_PB9
D6
CSI_D3_UART6_RTS_PB13
D7
CSI_D6_UART5_TXD_PB18
D8
SSI4_FS_PC16
D9
SSI1_RXDAT_PC21
D10
SSI2_CLK_GPT4_TIN_PC27
D11
KP_ROW1
D12
KP_ROW5
D13
KP_COL0
D14
UART2_TXD_KP_COL6_PE6
D15
UART1_TXD_PE12
D16
TDO
D17
TDI
D18
SD1_D3_CSPI3_SS_PE21
D19
CSPI1_SCLK_PD29
D20
CSPI1_SS2_USBH2_DATA5_PD26
D21
CSPI2_SS2_USBH2_DATA4_PD19
D22
CSPI2_SCLK_USBH2_DATA0_PD22
D23
CSPI2_MOSI_USBH2_DATA1_PD24
E1
LD15_PA21
E2
LD16_PA22
E3
LD17_PA23
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
134
Freescale Semiconductor
Package Information and Pinout
Table 62. i.MX27 23 mm × 23 mm BGA (19 mm × 19 mm)—Signal ID by Ball Grid Location (continued)
Location
Contact Name
E4
CLS_PA25
E20
CSPI2_MISO_USBH2_DATA2_PD23
E21
USB_PWR_PB23
E22
USB_OC_B_PB24
E23
USBH1_RCV_PB25
F1
LD13_PA19
F2
LD12_PA18
F3
LD14_PA20
F4
REV_PA24
F6
GND
F7
GND
F8
CSI_VSYNC_UART5_CTS_PB20
F9
SSI4_TXDAT_PC18
F10
SSI2_TXDAT_GPT4_TOUT_PC26
F11
KP_ROW0
F12
I2C_DATA_PD17
F13
KP_COL1
F14
UART3_RXD_PE9
F15
TCK
F16
TRST_B
F17
QVDD
F18
GND
F20
USBH1_FS_UART4_RTS_PB26
F21
USBH1_OE_B_PB27
F22
USBH1_TXDM_UART4_TXD_PB28
F23
USBH1_TXDP_UART4_CTS_PB29
G1
LD8_PA14
G2
LD7_PA13
G3
LD10_PA16
G4
LD11_PA17
G6
NVDD15
G7
GND
G8
NVDD11
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
135
Package Information and Pinout
Table 62. i.MX27 23 mm × 23 mm BGA (19 mm × 19 mm)—Signal ID by Ball Grid Location (continued)
Location
Contact Name
G9
NVDD11
G10
NVDD11
G11
NVDD10
G12
NVDD10
G13
NVDD9
G14
NVDD9
G15
NVDD8
G16
NVDD8
G17
QVDD
G18
USBH1_SUSP_PB22
G20
USBH1_RXDM_PB30
G21
USBH1_RXDP_UART4_RXD_PB31
G22
I2C2_SDA_PC5
G23
I2C2_SCL_PC6
H1
LD3_PA9
H2
LD5_PA11
H3
LD6_PA12
H4
LD9_PA15
H6
NVDD15
H7
QVDD
H8
QVDD
H9
QVDD
H10
QVDD
H11
QVDD
H12
QVDD
H13
QVDD
H14
QVDD
H15
QVDD
H16
QVDD
H17
QVDD
H18
NVDD14
H20
USBOTG_DATA5_PC7
H21
USBOTG_DATA6_PC8
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
136
Freescale Semiconductor
Package Information and Pinout
Table 62. i.MX27 23 mm × 23 mm BGA (19 mm × 19 mm)—Signal ID by Ball Grid Location (continued)
Location
Contact Name
H22
USBOTG_DATA0_PC9
H23
USBOTG_DATA2_PC10
J1
LD0_PA6
J2
LD1_PA7
J3
LD2_PA8
J4
LD4_PA10
J6
NVDD12
J7
NVDD12
J8
QVDD
J9
GND
J10
GND
J11
GND
J12
GND
J13
GND
J14
GND
J15
GND
J16
QVDD
J17
NVDD14
J18
NVDD7
J20
USBOTG_DATA1_PC11
J21
USBOTG_DATA4_PC12
J22
USBOTG_DATA3_PC13
J23
USBH2_CLK_PA0
K1
NFWP_B_ETMTRACEPKT1_PF2
K2
NFRB_ETMTRACEPKT3_PF0
K3
NFCE_B_ETMTRACEPKT2_PF3
K4
LSCLK_PA5
K6
NVDD1
K7
NVDD1
K8
QVDD
K9
GND
K10
GND
K11
GND
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
137
Package Information and Pinout
Table 62. i.MX27 23 mm × 23 mm BGA (19 mm × 19 mm)—Signal ID by Ball Grid Location (continued)
Location
Contact Name
K12
GND
K13
GND
K14
GND
K15
GND
K16
QVDD
K17
UPLLVDD
K18
NVDD7
K20
USBH2_DIR_PA1
K21
USBH2_DATA7_PA2
K22
USBH2_NXT_PA3
K23
USBH2_STP_PA4
L1
NFWE_B_ETMPIPESTAT2_PF6
L2
NFALE_ETMPIPESTAT0_PF4
L3
NFRE_B_ETMPIPESTAT1_PF5
L4
NFCLE_ETMTRACEPKT0_PF1
L6
NVDD1
L7
NVDD1
L8
QVDD
L9
GND
L10
GND
L11
GND
L12
GND
L13
GND
L14
GND
L15
GND
L16
QVDD
L17
UPLLVSS
L18
NVDD13
L20
USBOTG_DATA7_PE25
L21
USBOTG_NXT_KP_COL6A_PE0
L22
USBOTG_CLK_PE24
L23
USBOTG_STP_KP_ROW6A_PE1
M1
D15
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
138
Freescale Semiconductor
Package Information and Pinout
Table 62. i.MX27 23 mm × 23 mm BGA (19 mm × 19 mm)—Signal ID by Ball Grid Location (continued)
Location
Contact Name
M2
D14
M3
D12
M4
D13
M6
D11
M7
QVDD
M8
QVDD
M9
GND
M10
GND
M11
GND
M12
GND
M13
GND
M14
GND
M15
GND
M16
QVDD
M17
RTCVSS
M18
RTCVDD
M20
USBOTG_DIR_KP_ROW7A_PE2
M21
OSC32K_BYPASS
M22
POWER_ON_RESET
M23
POWER_CUT
N1
D10
N2
D9
N3
D5
N4
D8
N6
D7
N7
D0
N8
QVDD
N9
GND
N10
GND
N11
GND
N12
GND
N13
GND
N14
GND
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
139
Package Information and Pinout
Table 62. i.MX27 23 mm × 23 mm BGA (19 mm × 19 mm)—Signal ID by Ball Grid Location (continued)
Location
Contact Name
N15
GND
N16
QVDD
N17
FPMVSS
N18
FPMVDD
N20
SD3_CMD_PD0
N21
OSC32VDD
N22
OSC32VSS
N23
EXTAL32K
P1
D6
P2
D4
P3
D3
P4
NC_P4_1
P6
MA10
P7
NVDD2
P8
QVDD
P9
GND
P10
GND
P11
GND
P12
GND
P13
GND
P14
GND
P15
GND
P16
QVDD
P17
NVDD6
P18
NVDD6
P20
ATA_DATA0_SD3_D0_PD2
P21
ATA_DATA1_SD3_D1_PD3
P22
SD3_CLK_ETMTRACEPKT15_PD1
P23
XTAL32K
R1
D2
R2
D1
R3
A13
R4
A12
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
140
Freescale Semiconductor
Package Information and Pinout
Table 62. i.MX27 23 mm × 23 mm BGA (19 mm × 19 mm)—Signal ID by Ball Grid Location (continued)
Location
Contact Name
R6
NVDD2
R7
NVDD2
R8
QVDD
R9
GND
R10
GND
R11
GND
R12
GND
R13
GND
R14
GND
R15
GND
R16
QVDD
R17
FUSEVSS
R18
FUSEVDD
R20
ATA_DATA5_ETMTRACEPKT13_PD7
R21
ATA_DATA4_ETMTRACEPKT14_PD6
R22
ATA_DATA3_SD3_D3_PD5
R23
ATA_DATA2_SD3_D2_PD4
T1
A11
T2
A9
T3
A8
T4
A7
T6
A1
T7
NVDD2
T8
QVDD
T9
QVDD
T10
QVDD
T11
QVDD
T12
QVDD
T13
QVDD
T14
QVDD
T15
QVDD
T16
QVDD
T17
MPLLVSS
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
141
Package Information and Pinout
Table 62. i.MX27 23 mm × 23 mm BGA (19 mm × 19 mm)—Signal ID by Ball Grid Location (continued)
Location
Contact Name
T18
BOOT2
T20
ATA_DATA8_ETMTRACEPKT11_PD10
T21
ATA_DATA9_ETMTRACEPKT10_PD11
T22
ATA_DATA7_ETMTRACEPKT12_PD9
T23
ATA_DATA6_FEC_MDIO_PD8
U1
A6
U2
A5
U3
A4
U4
A3
U6
SD29
U7
NVDD2
U8
NVDD2
U9
NVDD2
U10
QVDD
U11
NVDD3
U12
NVDD3
U13
SDCKE1
U14
NVDD4
U15
NVDD4
U16
NVDD4
U17
AVDD
U18
AVSS
U20
ATA_DATA13_ETMTRACEPKT6_PD15
U21
ATA_DATA12_ETMTRACEPKT7_PD14
U22
ATA_DATA11_ETMTRACEPKT8_PD13
U23
ATA_DATA10_ETMTRACEPKT9_PD12
V1
A2
V2
A0
V3
SDBA0
V4
SD31
V6
A22
V7
GND
V8
GND
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
142
Freescale Semiconductor
Package Information and Pinout
Table 62. i.MX27 23 mm × 23 mm BGA (19 mm × 19 mm)—Signal ID by Ball Grid Location (continued)
Location
Contact Name
V9
SD12
V10
SD6
V11
SD2
V12
DQM1
V13
SDCKE0
V14
CS5_B_ETMTRACECLK_PF22
V15
NVDD5
V16
NVDD5
V17
MPLLVDD
V18
GND
V20
BOOT1
V21
BOOT0
V22
ATA_DATA15_ETMTRACEPKT4_PF23
V23
ATA_DATA14_ETMTRACEPKT5_PD16
W1
SDBA1
W2
A25
W3
SDQS3
W4
SD27
W20
OSC26M_TEST
W21
OSC26VSS
W22
OSC26VDD
W23
BOOT3
Y1
SD30
Y2
A24
Y3
SD28
Y4
SD26
Y5
SD20
Y6
SD17
Y7
A19
Y8
SD13
Y9
SD9
Y10
SDQS0
Y11
DQM3
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
Freescale Semiconductor
143
Product Documentation
Table 62. i.MX27 23 mm × 23 mm BGA (19 mm × 19 mm)—Signal ID by Ball Grid Location (continued)
6
Location
Contact Name
Y12
RAS_B
Y13
SDCLK_B
Y14
CS4_B_ETMTRACESYNC_PF21
Y15
CS0_B
Y16
OE_B
Y17
PC_CD2_B_ATA_DIOW_PF19
Y18
PC_VS1_ATA_DA1_PF14
Y19
PC_RST_ATA_RESET_B_PF10
Y20
PC_POE_ATA_BUFFER_EN_PF7
Y21
POR_B
Y22
CLKMODE1
Y23
EXTAL26M
Product Documentation
This Data Sheet is labeled as a particular type: Product Preview, Advance Information, or Technical Data.
Definitions of these types are available at: http://www.freescale.com.
7
Revision History
Table 63 summarizes revisions to this document since the previous release.
Table 63. Document Revision History
Rev. No.
Date
Significant Change(s)
1.3
11/2008
• In Table 3, “i.MX27/MX27L Signal Descriptions,” switched FEC_TXD0 and FEC_TXD1 for
SD3_CMD and SD3_CLK.
• In Table 23, “CSPI Interface Timing Parameters,” updated t6’ and t13, and removed t14.
• In Table 60, “i.MX27 24 mm × 24 mm BGA (17 mm × 17 mm)—Signal ID by Ball Grid Location,”
changed “RW” to “RW_B.”
• Added Table 59, “i.MX27 Full 17 × 17 mm Package MAPBGA Pin Assignment.”
• Updated Table 62, “i.MX27 23 mm × 23 mm BGA (19 mm × 19 mm)—Signal ID by Ball Grid
Location.”
1.2
7/2008
Corrected part number in section 1.3, “Ordering Information,” on p. 4. Part number previously listed
as MCIMX27FVOP4A has been corrected to read MCIMX27VOP4A.
1.1
7/2008
Formatting and template work.
i.MX27 and i.MX27L Data Sheet, Rev. 1.3
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Revision History
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Revision History
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