bq4847/bq4847Y RTC Module With CPU Supervisor Features General Description tolerance to allow for power supply and processor stabilization. ➤ Real-Time Clock counts seconds through years in BCD format The bq4847 Real-Time Clock Module is a low-power microprocessor peripheral that integrates a timeof-day clock, a 100-year calendar, a CPU supervisor, a battery, and a crystal in a 28-pin DIP module. The part is ideal for fax machines, copiers, industrial control systems, point-of-sale terminals, data loggers, and computers. The bq4847 also has a built-in watchdog timer to monitor processor operation. If the microprocessor does not toggle the watchdog input (WDI) within the programmed time-out, the bq4847 asserts WDO and RST. WDI unconnected disables the watchdog timer. ➤ Integrated battery and crystal ➤ On-chip battery-backup switchover circuit with nonvolatile control for an external SRAM ➤ 130mAh battery capacity ➤ ± 1 minute per month clock accuracy ➤ Less than 500nA of clock operation current in backup mode ➤ Microprocessor reset valid to VCC = VSS ➤ Independent watchdog timer with a programmable time-out period ➤ Power-fail interrupt warning ➤ Programmable clock alarm interrupt active in battery-backup mode ➤ Programmable periodic interrupt ➤ Battery-low warning Pin Connections VOUT NC NC WDO INT RST A3 A2 A1 A0 DQ0 DQ1 DQ2 VSS 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 The bq4847 contains an internal battery and crystal. Through the use of the conditional chip enable output (CEOUT) and battery voltage output (VOUT) pins, the bq4847 can writeprotect and make nonvolatile an external SRAM. The backup cell powers the real-time clock and maintains SRAM information in the absence of system voltage. The bq4847 contains a temperature-compensated reference and comparator circuit that monitors the status of its voltage supply. When an out-of-tolerance condition is detected, the bq4847 generates an interrupt warning and subsequently a microprocessor reset. The reset stays active for 200ms after V CC rises within The bq4847 can generate other interrupts based on a clock alarm condition or a periodic setting. The alarm interrupt can be set to occur from once per second to once per month. The alarm can be made active in the battery-backup mode to serve as a system wake-up call. For interrupts at a rate beyond once per second, the periodic interrupt can be programmed with periods of 30.5µs to 500ms. Caution: Take care to avoid inadvertent discharge through VOUT and CEOUT after battery isolation has been broken. Pin Names VCC WE CEIN CEOUT NC WDI OE CS NC DQ7 DQ6 DQ5 DQ4 DQ3 28-Pin DIP Module PN484701.eps A0–A3 Clock/Control address inputs DQ0–DQ7 Data inputs/outputs WE Write enable OE Output enable CS Chip select input CEIN External RAM chip enable CEOUT Conditional RAM chip enable Sept. 1996 1 NC No connect VOUT Back-up battery output INT Interrupt output RST Microprocessor reset WDI Watchdog input WDO Watchdog output VCC +5V supply VSS Ground bq4847/bq4847Y room temperature. For a complete description of features, operating conditions, electrical characteristics, bus timing, and pin descriptions, see the bq4845 data sheet. Valid part types for ordering are bq4847MT (5%) and bq4847YMT (10%). Functional Description Figure 1 is a block diagram of the bq4847. The bq4847 is functionally equivalent to the bq4845 except that the battery (20, 24) and crystal (2, 3) pins are not accessible. The pins are connected internally to a coin cell and quartz crystal. The coin cell provides 130mAh of capacity. It is internally isolated from VOUT and CEOUT until the initial application of VCC. Once VCC rises above VPFD, this isolation is broken, and the backup cell provides power to VOUT and CEOUT for the external SRAM. The real-time clock keeps time to within one minute per month at Figure 2 illustrates the address map for the bq4847. Table 1 is a map of the bq4847 registers, and Table 2 describes the register bits. Figure 1. Block Diagram Truth Table VCC CS OE WE CEOUT VOUT Mode DQ Power < VCC (max.) VIH X X CEIN VOUT1 Deselect High Z Standby VIL X VIL CEIN VOUT1 Write DIN Active > VCC (min.) VIL VIL VIH CEIN VOUT1 Read DOUT Active VIL VIH VIH CEIN VOUT1 Read High Z Active < VPFD (min.) > VSO X X X VOH VOUT1 Deselect High Z CMOS standby ≤ VSO X X X VOHB VOUT2 Deselect High Z Battery-backup mode Sept. 1996 2 bq4847/bq4847Y MT: 28-Pin T-Type Module 28-Pin MT (T-Type Module) Inches Millimeters Dimension Min. Max. Min. Max. A 0.360 0.390 9.14 9.91 A1 0.015 - 0.38 - B 0.015 0.022 0.38 0.56 C 0.008 0.013 0.20 0.33 D 1.520 1.535 38.61 38.99 E 0.710 0.740 18.03 18.80 e 0.590 0.620 14.99 15.75 G 0.090 0.110 2.29 2.79 L 0.110 0.130 2.79 3.30 S 0.100 0.120 2.54 3.05 Ordering Information bq4847 - MT Package Option: MT = 28-pin T-type Module Voltage Tolerance: Blank = 5% Y = 10% Device: bq4847 Real-Time Clock Module With CPU Supervisor Sept. 1996 3 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty BQ4847MT ACTIVE DIP MOD ULE MT 28 1 Pb-Free (RoHS) CU SN N / A for Pkg Type BQ4847YMT ACTIVE DIP MOD ULE MT 28 1 Pb-Free (RoHS) CU SN N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 MECHANICAL DATA MPDI064 – MAY 2001 MT (R-PDIP-T**) PLASTIC DUAL-IN-LINE 28 PINS SHOWN Inches D Millimeters Min. Dimension Min. Max. A 0.360 0.390 9.14 A1 0.015 0.38 Max. 9.91 – B 0.015 – 0.022 0.38 0.56 C 0.008 0.013 0.20 0.33 D/24 PIN 1.320 1.335 33.53 33.91 D/28 PIN 1.520 1.535 38.61 38.99 E 0.710 0.740 18.03 18.80 e G 0.590 0.630 16.00 0.090 0.110 14.99 2.29 L 0.110 2.79 3.30 S 0.100 0.130 0.120 2.54 3.05 2.79 E A1 A C B L S e G 4201978/A 03/01 NOTES: A. All linear dimensions are in inches (mm). B. This drawing is subject to change without notice. • POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443 • 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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