TI TPS658640ZQZR

TPS658640
SLVSAC7 – NOVEMBER 2011
www.ti.com
Advanced Power Management Unit
Check for Samples: TPS658640
1 INTRODUCTION
1.1
MAIN FEATURES
12
• INTEGRATED POWER SUPPLIES
– 3 Programmable Step-Down converters
• Software Controlled Enable/Forced PWM
Mode
• Automatic Power Saving Mode
• Maximum 1.5A Outputs (SM0 and SM2)
• Maximum 2.A Output (SM1)
– 11 Programmable General Purpose LDOs
• 7 With Output Voltages of 1.25V to 3.3V
• 2 With Output Voltages of 0.725V to 1.5V
or 1.25V to 2.586V (factory
programmable)
• 1 “ Always On” With Output Voltages of
1.25V to 3.3V
• 1 With Output Voltage of 1.7V–2.475V
• DISPLAY SUPPORT FUNCTIONS
– 3 PWM Outputs With Programmable
Frequency and Duty Cycle
– Dual RGB LED Drivers
• HOST INTERFACE
– I2C Bus
– Interrupt Controller With Maskable Interrupts
– GPIO Control (4)
• SYSTEM MANAGEMENT
– Power Good Monitoring on all Supply
Outputs
– Software Reset Function
– Hardware On/Off and Reboot Control
1.3
– Real Time Counter
– 11 Channel ADC With 3 Operating Modes
• Single Conversion
• Peak Detection
• Averaging
1.2
•
•
•
•
•
APPLICATIONS
Tablet PCs
Netbooks
SmartPhones
Portable Navigation Devices
Portable Media Players
DESCRIPTION
The TPS658640 provides an easy to use, fully integrated solution for handheld devices, integrating
multiple regulated power supplies, system management and display functions in a small package. The I2C
interface enables control of a wide range of subsystem parameters. Internal registers have a complete set
of status information, enabling easy diagnostics and host-controlled handling of fault conditions.
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
MicroStar BGA is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date. Products conform to
specifications per the terms of the Texas Instruments standard warranty. Production
processing does not necessarily include testing of all parameters.
Copyright © 2011, Texas Instruments Incorporated
To request a full data sheet, please send an email to:
[email protected]
PACKAGE OPTION ADDENDUM
www.ti.com
12-Dec-2011
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package
Drawing
Pins
Package Qty
Eco Plan
(2)
Lead/
Ball Finish
MSL Peak Temp
(3)
Samples
(Requires Login)
TPS658640ZGUR
ACTIVE
BGA
MICROSTAR
ZGU
169
1000
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
TPS658640ZGUT
ACTIVE
BGA
MICROSTAR
ZGU
169
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
TPS658640ZQZR
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQZ
120
2500
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
TPS658640ZQZT
ACTIVE
BGA
MICROSTAR
JUNIOR
ZQZ
120
250
Green (RoHS
& no Sb/Br)
SNAGCU
Level-3-260C-168 HR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
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provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
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TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
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