SLUS508A – DECEMBER 2001 REVISED – JUNE 2002
FEATURES
Detachable Unit Allowing Replacement
Integrated 6-pF Watch Crystal for Real-Time
DESCRIPTION
Clock Operation
Integrated Lithium Coin Cell for Nonvolatile
Memory Backup
Protects Battery and Crystal From Conditions
Associated with Surface Mount Soldering
For Use With bq4802YDSH and bq4802LYDSH
Keyed Insertion to Avoid Incorrect Attachment
The bq48SH–28x6 is the top section suitable for any
SOIC (DSH) packaged IC including the bq4802YDSH
or bq4802LYDSH parallel real-time clock (RTC) and
NVSRAM controller.
The fully integrated SNAPHAT includes a 6-pF watch
crystal and lithium coin cell with 48 mAh of capacity.
The SNAPHAT is designed to be attached after the
DSH packaged base SOIC has been soldered
preventing the battery and crystal being over-stressed
by the soldering temperatures.
APPLICATIONS
Telecommunications Base Stations
Servers
Handheld Data Collection Equipment
AVAILABLE OPTIONS
TA
PACKAGED DEVICES
SNAPHAT (NSH)
SYMBOL
0°C to 70°C
bq48SH–28x6NSH
bq48SH–28x6
† The SNAPHAT package is available taped and
reeled. Add an R suffix to the device type (e.g.
bq48SH–28x6NSHR to order quantities of 2,500
devices per reel.
CONNECTION DIAGRAMS
X2
BC
X1
VSS
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
SNAPHAT is a trademark of STMicroelectronics.
Copyright 2002, Texas Instruments Incorporated
!"# $ %& '# "$ (&)%"# *"#'+
*&%#$ % ! # $('%%"#$ (' #,' #' !$ '"$ $# &!'#$
$#"*" * -" "#.+ *&%# ( %'$$/ *'$ # '%'$$" ). %)&*'
#'$#/ ")) (" "!'#' $+
www.ti.com
1
SLUS508A – DECEMBER 2001 REVISED – JUNE 2002
absolute maximum ratings over operating free-air temperature (unless otherwise noted)†
Operating temperature range, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to 85°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
recommended operating conditions
TYP
UNIT
Nominal battery voltage, VCC
2.8
V
Nominal battery capacity
48
mAh
MAX
UNIT
crystal specifications (DT–35 or equivalent)
PARAMETER
TEST CONDITIONS
MIN
TYP
fO
CL
Oscillation frequency
TP
k
Temperature turnover point
Q
Quality factor
R1
Series resistance
45
kΩ
CO
Shunt capacitance
1.1
1.8
pF
CO/C1
Capacitance ratio
430
600
DL
Drive level
∆f/fO
Aging (first year at 25C)
Load capacitance
20
kHz
6
pF
25
Parabolic curvature constant
40,000
NO.
C
70,000
1
1
TERMINAL
NAME
30
–0.042 ppm/C
TERMINAL FUNCTIONS
I/O
DESCRIPTION
BC
3
O
Battery positive terminal
VSS
2
I
Battery negative terminal
X1
1
I
Crystal input
X2
4
O
Crystal output
2
32.768
www.ti.com
µW
ppm
SLUS508A – DECEMBER 2001 REVISED – JUNE 2002
functional description
connections
The SOIC (DSH) is connected to the SNAPHAT containing the battery and crystal through four pins that insert
into four press-fitted sockets in the SOIC (DSH) where the contact area is gold platted. Each of the sockets
internally contains six independent contacts to ensure solid reliable connectivity and minimize contact
resistance.
Four molded retaining clips on the SNAPHAT also help fasten the SOIC (DSH), ensuring mechanical and
electrical connection even under severe mechanical shock and vibration. The combined SOIC (DSH) and
SNAPHAT assembly can sustain shock levels in excess of 100 g without separating. This package also passes
variable frequency testing in accordance with MIL–STD–883, method 2007.2, condition A.
Force – lbs
Figure 1 illustrates the effect of repeated insertion and extraction of the SNAPHAT top to the SOIC (DSH). The
force required to extract the SNAPHAT, and then to re-insert it, reduces each time. After three or four
extractions, though, the reduction starts to become unnoticeable, and the force required remains at a fairly
constant figure. Typically, though, the SNAPHAT needs to be extracted and re-inserted only once in its lifetime.
Figure 1. SNAPHAT Insertion and Extraction Forces
www.ti.com
3
SLUS508A – DECEMBER 2001 REVISED – JUNE 2002
functional description (continued)
battery characteristics
Figure 2 illustrates the lithium coin cell discharge rate for a given load. This demonstrates the characteristically
flat voltage level supplied by the battery until very near the end of its life. These discharge levels have been
greatly accelerated in comparison to the normal, actual usage.
UL recognition
The bq48SH–28x6 has been recognized by Underwriters Laboratories under their Component Recognition
Program and carries UL File No. E89556.
battery life
The life expectancy of the battery is greatly affected by temperature and usage profiles. Figure 2 highlights the
effective discharge during loading periods, but temperature during loading periods can greatly affect the
effective run time as shown in Figure 3.
general notes
To remove the SNAPHAT top for replacement, a DIP/IC extractor tool should be used. The SNAPHAP top
should be grasped by the narrow end to avoid bending the pins.
CAUTION:
To avoid draining the battery, do NOT place SNAPHAT pins into conductive foam.
TYPICAL CHARACTERISTICS
BR1225 LITHIUM COIN CELL DISCHARGE RATE
vs
CELL VOLTAGE
3.5
TA = 20C
VCC – Cell Voltage – V
3.0
2.5
2.0
RL = 30 kΩ
RL = 15 kΩ
1.5
RL = 100 kΩ
1.0
0
400
800
1200
1600
tD – Discharge Duration – h
Figure 2
4
www.ti.com
2000
SLUS508A – DECEMBER 2001 REVISED – JUNE 2002
MECHANICAL DATA
NSH (R-PDIP-P4)
PLASTIC DUAL-IN-LINE
D
Dimension
E
Inches
Millimeters
Min.
Max.
Min.
Max.
A
–
0.385
–
9.78
A1
0.265
0.285
6.73
7.24
A2
0.255
0.275
6.48
6.99
A3
–
0.015
–
0.38
B
0.018
0.022
0.46
0.56
D
0.835
0.860
21.21
21.84
E
0.560
0.590
14.22
14.99
eA
eB
0.612
0.628
15.95
0.126
0.142
15.54
3.20
L
0.080
0.090
2.03
2.29
3.61
A2
A1
A3
A
B
L
eA
eB
4201973/A 08/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
www.ti.com
5
PACKAGE OPTION ADDENDUM
www.ti.com
25-Feb-2008
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
BQ48SH-28X6NSH
NRND
PDIP
NSH
Pins Package Eco Plan (2)
Qty
4
23
TBD
Lead/Ball Finish
Call TI
MSL Peak Temp (3)
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated