September 2003 ASM3P2811A/B ASM3P2812A/B ASM3P2814A/B rev 1.0 Low Power EMI Reduction IC Features FCC approved method of EMI attenuation. Provides up to 15dB EMI reduction. Generates a 1X, 2X and 4X low EMI spread spectrum clock of the input frequency. o 1X: ASM3P2811A/B o 2X: ASM3P2812A/B o 4X: ASM3P2814A/B ASM3P2811A/B: 10 to 40MHz o ASM3P2812A/B: 10 to 40MHz o ASM3P2814A/B: 10 to 40MHz Internal loop filter minimizes external components and board space. Selectable spread options: Down Spread and Center Spread. ferrite beads, shielding, and other passive components that are traditionally required to pass EMI regulations. The ASM3P28XX modulates the output of a single PLL in order to “spread” the bandwidth of a synthesized clock, and more importantly, decreases the peak amplitudes of its harmonics. This results in significantly lower system EMI compared to the typical narrow band signal produced by oscillators and most frequency generators. Lowering EMI by increasing a signal’s bandwidth is called ‘spread 8 spread frequency deviation selections: spectrum clock generation’. ±0.625% to –3.5% Low inherent cycle-to-cycle jitter. The ASM3P28XX uses the most efficient and optimized 3.3V operating voltage range. CMOS/TTL compatible inputs and outputs. with down stream clock and data dependent savings by reducing the number of circuit board layers, o compatible (EMI) at the clock source, allowing system wide reduction signals. The ASM3P28XX allows significant system cost to 40 MHz. Pinout The ASM3P28XX reduces electromagnetic interference of EMI of Optimized for input frequency range from 10MHz o deviation range from ±0.625% to –3.50%. Cypress CY25811, modulation profile approved by the FCC and is implemented in a proprietary all-digital method. CY25812 and CY25814. Products are available for industrial temperature range. Applications The ASM3P28XX is targeted towards EMI management Available in 8-pin SOIC and TSSOP. for memory and LVDS interfaces in mobile graphic chipsets and high-speed digital applications such as PC Product Description peripheral devices, consumer electronics, and embedded The ASM3P28XX devices are versatile spread spectrum controller systems. frequency modulators designed specifically for a wide range of input clock frequencies from 10MHz to 40MHz. (Refer Input/Output Frequency Range Selection Table). The ASM3P28XX can generate an EMI reduced clock from crystal, ceramic resonator, or system clock. The ASM3P28XX-A and the ASM3P28XX-B offer various combinations of spread options and percentage deviations (Refer Output Frequency Deviation and Spread Option Selection Table). These combinations include Down and Center Spread and percentage Alliance Semiconductor 2575, Augustine Drive • Santa Clara, CA • Tel: 408.855.4900 • Fax: 408.855.4999 • www.alsc.com Notice: The information in this document is subject to change without notice. September 2003 ASM3P2811A/B ASM3P2812A/B ASM3P2814A/B rev 1.0 Block Diagram VDD D_C SRS FRS PLL Modulation XIN Crystal Oscillator XOUT Frequency Divider Phase Detector Feedback Divider Loop Filter VCO Output Divider ModOUT VSS Pin Configuration XIN 1 VSS 2 D_C 3 ASM3P2811A/B ASM3P2812A/B 8 XOUT 7 VDD 6 FRS 5 ModOUT ASM3P2814A/B SRS 4 Low Power EMI Reduction IC Notice: The information in this document is subject to change without notice. 2 of 6 September 2003 ASM3P2811A/B ASM3P2812A/B ASM3P2814A/B rev 1.0 Pin Description Pin# Pin Name Type Description 1 XIN I Crystal connection or external frequency input. This pin has dual functions. It can be connected to either an external crystal or an external reference clock. 2 VSS P Ground to entire chip. 3 D_C I 4 SRS I 5 ModOUT O 6 FRS I 7 VDD P Power supply for the entire chip (3.3V). 8 XOUT I Crystal connection. Input connection for an external crystal. If using an external reference, this pin must be left unconnected. Digital logic input used to select Down (LOW) or Center (HIGH) spread options. (Refer Output Frequency Deviation and Spread Option Selection Table). This pin has an internal pull-up resistor. Spread range select. Digital logic input used to select frequency deviation (Refer Output Frequency Deviation and Spread Option Selection Table). This pin has an internal pull-up resistor. Spread spectrum clock output (Refer Input/Output Frequency Range Selection Table and Output Frequency Deviation and Spread Option Selection Table). Frequency range select. Digital logic input used to select input frequency range (Refer Input/Output Frequency Deviation and Spread Option Selection Table). This pin has an internal pull-up resistor. Input/Output Frequency Range Selection Table Part Number FRS (pin 6) ASM3P2811 (1X) ASM3P2812 (2X) ASM3P2814 (4X) Modulation Rate Input (MHz) Output (MHz) Input (MHz) Output (MHz) Input (MHz) Output (MHz) 0 10-20 10-20 10-20 20-40 10-20 40-80 Input Frequency / 448 1 20-40 20-40 20-40 40-80 20-40 80-160 Input Frequency / 896 Low Power EMI Reduction IC Notice: The information in this document is subject to change without notice. 3 of 6 September 2003 ASM3P2811A/B ASM3P2812A/B ASM3P2814A/B rev 1.0 Output Frequency Deviation and Spread Option Selection Table Part Number D_C (pin 3) SRS (pin 4) Output frequency deviation and spread option 0 0 -2.50% (Down) 0 1 -3.50% (Down) 1 0 ± 1.25% (Center) 1 1 ±1.75% (Center) 0 0 -1.25% (Down) 0 1 -1.75% (Down) 1 0 ± 0.625% (Center) 1 1 ± 0.875% (Center) ASM3P28XXA ASM3P28XXB Absolute Maximum Ratings Symbol Parameter VDD, VIN Voltage on any pin with respect to GND TSTG Storage temperature TA Operating temperature Rating Unit -0.5 to + 7.0 V -65 to +125 °C 0 to 70 °C Note: These are stress ratings only and functional operation is not implied. Exposure to absolute maximum ratings for extended periods may affect device reliability. Low Power EMI Reduction IC Notice: The information in this document is subject to change without notice. 4 of 6 September 2003 ASM3P2811A/B ASM3P2812A/B ASM3P2814A/B rev 1.0 DC Electrical Characteristics (3.3V, 25°C) Symbol Parameter Min Typ Max Unit VIL Input low voltage GND – 0.3 - 0.8 V VIH Input high voltage - - VDD + 0.3 V IIL Input low current (inputs D_C, SRS and FRS) -60.00 - -20.00 µA - - 1.00 µA 2.00 - 12.00 mA - - 12.00 mA IIH IXOL IXOH Input high current XOUT Output low current (@ 0.4V, VDD = 3.3V) XOUT Output high current (@ 2.5V, VDD = 3.3V) VOL Output low voltage (VDD = 3.3V, IOL = 20mA) - - 0.4 V VOH Output high voltage (VDD = 3.3V, IOH = 20mA) 2.8 - - V 7.1 fIN - min - 13.9 fIN - max mA - 4.5 - mA IDD Dynamic supply current Normal mode (3.3V and 25pF loading) Static supply current Standby mode VDD Operating voltage - 3.3 - V tON Power up time (first locked clock cycle after power up) - 0.18 - mS ZOUT Clock out impedance - 50 - Ω ICC AC Electrical Characteristics Symbol fIN fOUT Parameter Min Typ Max Unit Input frequency ASM3P2811/12/13/14 A/B 10 - 40 MHz Output frequency for ASM3P211A/B 10 - 40 MHz Output frequency for AS3P2812A/B 20 - 80 MHz Output frequency for AS3P2814A/B 40 - 160 MHz tLH* Output rise time (measured at 0.8V to 2.0V) - 0.69 - ns tHL* Output fall time (measured at 2.0V to 0.8V) - 0.66 - ns tJC Jitter (cycle to cycle) -200 - 200 ps TD Output duty cycle 45 50 55 % * tLH and tHL are measured into a capacitive load of 15pF Low Power EMI Reduction IC Notice: The information in this document is subject to change without notice. 5 of 6 September 2003 ASM3P2811A/B ASM3P2812A/B ASM3P2814A/B rev 1.0 Package Information 8-Pin SOIC H E D A2 A C θ e A1 B Symbol Dimensions in inches D L Dimensions in millimeters Min Max Min Max A 0.057 0.071 1.45 1.80 A1 0.004 0.010 0.10 0.25 A2 0.053 0.069 1.35 1.75 B 0.012 0.020 0.31 0.51 C 0.004 0.01 0.10 0.25 D 0.186 0.202 4.72 5.12 E 0.148 0.164 3.75 4.15 E 0.050 BSC 1.27 BSC H 0.224 0.248 5.70 6.30 L 0.012 0.028 0.30 0.70 θ 0° 8° 0° 8° Note: Controlling dimensions are millimeters. SOIC: 0.074 grams unit weight. Low Power EMI Reduction IC Notice: The information in this document is subject to change without notice. 6 of 6 September 2003 ASM3P2811A/B ASM3P2812A/B ASM3P2814A/B rev 1.0 8-Pin TSSOP H E D A2 A C θ e A1 L B Dimensions in inches Symbol Min A 0.047 A1 0.002 0.006 0.05 0.15 A2 0.031 0.041 0.80 1.05 B 0.007 0.012 0.19 0.30 C 0.004 0.008 0.09 0.20 D 0.114 0.122 2.90 3.10 E 0.169 0.177 4.30 4.50 E Max Dimensions in millimeters Min Max 1.10 0.026 BSC 0.65 BSC H 0.244 0.260 6.20 6.60 L 0.018 0.030 0.45 0.75 θ 0° 8° 0° 8° Note: Controlling dimensions are millimeters. TSSOP: 0.034 grams unit weight. Low Power EMI Reduction IC Notice: The information in this document is subject to change without notice. 7 of 7 September 2003 ASM3P2811A/B ASM3P2812A/B ASM3P2814A/B rev 1.0 Alliance Semiconductor Corporation 2595, Augustine Drive, Santa Clara, CA 95054 Tel# 408-855-4900 Fax: 408-855-4999 www.alsc.com Copyright © Alliance Semiconductor All Rights Reserved Preliminary Information Part Numbers: ASM3P2811A/B ASM3P2812A/B ASM3P2814A/B Document Version: v1.0 © Copyright 2003 Alliance Semiconductor Corporation. All rights reserved. Our three-point logo, our name and Intelliwatt are trademarks or registered trademarks of Alliance. All other brand and product names may be the trademarks of their respective companies. Alliance reserves the right to make changes to this document and its products at any time without notice. Alliance assumes no responsibility for any errors that may appear in this document. The data contained herein represents Alliance's best data and/or estimates at the time of issuance. Alliance reserves the right to change or correct this data at any time, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or customer. Alliance does not assume any responsibility or liability arising out of the application or use of any product described herein, and disclaims any express or implied warranties related to the sale and/or use of Alliance products including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual property rights, except as express agreed to in Alliance's Terms and Conditions of Sale (which are available from Alliance). All sales of Alliance products are made exclusively according to Alliance's Terms and Conditions of Sale. The purchase of products from Alliance does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other intellectual property rights of Alliance or third parties. Alliance does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of Alliance products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify Alliance against all claims arising from such use. Low Power EMI Reduction IC Notice: The information in this document is subject to change without notice. 8 of 8