October 2003 ASM3P5821A rev 1.0 The ASM3P5821A reduces electromagnetic interference Features (EMI) at the clock source, allowing system wide reduction FCC approved method of EMI attenuation. Generates a 1X low EMI spread spectrum clock of the input frequency. Internal loop filter minimizes external components and board space. Frequency deviation: -1.5% implemented in a proprietary all digital method. TTL or CMOS compatible inputs and outputs. Ultra-low power CMOS design. The ASM3P5821A modulates the output of a single PLL TBD mA @ 3.3V, 25MHz in order to “spread” the bandwidth of a synthesized clock, TBD mA @ 3.3V, 31MHz compatible with Cypress that are traditionally required to pass EMI regulations. modulation profile approved by the FCC and is 3.3V operating voltage. Pinout ferrite beads, shielding and other passive components The ASM3P5821A uses the most efficient and optimized Low inherent cycle-to-cycle jitter. o down stream clock and data dependent signals. The ASM3P5821A allows significant system cost savings by reducing the number of circuit board layers Input frequency range: 20MHz –34MHz. o of EMI of CY25811. Products are available for industrial temperature range. and more importantly, decreases the peak amplitudes of its harmonics. This results in significantly lower system EMI compared to the typical narrow band signal produced by oscillators and most frequency generators. Lowering Available in 8-pin SOIC and TSSOP. EMI by increasing a signal’s bandwidth is called ‘spread Product Description spectrum clock generation’. The ASM3P5821A is a versatile spread spectrum frequency modulator designed specifically for input clock Applications frequencies in the range of 20MHz – 34MHz. The ASM3P5821A can generate an EMI reduced clock from The ASM3P5821A is targeted towards EMI management crystal, for high speed digital applications such as PC peripheral ceramic resonator, or system clock. The ASM3P5821A offers a percentage deviation of –1.5%. devices, consumer electronics and embedded controller systems. VDD Block Diagram PLL Modulation XIN Crystal Oscillator Frequency Divider XOUT Feedback Divider Phase Detector Loop Filter VCO Output Divider MODOUT VSS Alliance Semiconductor 2575, Augustine Drive • Santa Clara, CA • Tel: 408.855.4900 • Fax: 408.855.4999 • www.alsc.com Notice: The information in this document is subject to change without notice. October 2003 ASM3P5821A rev 1.0 Pin Configuration XIN 1 VSS 2 8 XOUT 7 VDD ASM3P5821A NC 3 6 NC NC 4 5 ModOUT Pin Description Pin# Pin Name Type 1 XIN I Crystal connection or external reference frequency input. This pin has dual functions. It can be connected to either an external crystal or an external reference clock. 2 VSS P Ground to entire chip. 3 NC No Connect. 4 NC No Connect. 5 MODOUT 6 NC 7 VDD P Power supply for the entire chip (3.3V). 8 XOUT O Crystal connection. If using an external reference clock, this pin must be left unconnected. O Description Spread spectrum low EMI output. No Connect. Low Power EMI Reduction IC Notice: The information in this document is subject to change without notice. 2 of 7 October 2003 ASM3P5821A rev 1.0 Absolute Maximum Ratings Symbol Parameter VDD, VIN Voltage on any pin with respect to GND TSTG Storage temperature TA Operating temperature Rating Unit -0.5 to + 7.0 V -65 to +125 °C 0 to 70 °C Note: These are stress ratings only and functional operation is not implied. Exposure to absolute maximum ratings for extended periods may affect device reliability. DC Electrical Characteristics Symbol Parameter Min Typ Max Unit VIL Input low voltage GND – 0.3 - TBD V VIH Input high voltage TBD - VDD + 0.3 V IIL Input low current TBD µA IIH Input high current TBD µA IXOL XOUT output low current (@0.4V, VDD=3.3V) TBD mA IXOH XOUT output high current (@ 2.5V, VDD=3.3V) TBD mA VOL Output low voltage (VDD = 3.3V, IOL = 4mA) TBD V VOH Output high voltage (VDD = 3.3V, IOH = 4mA) TBD V ICC Dynamic supply current normal mode (3.3V and 10pF loading) TBD mA IDD Static supply current standby mode VDD Operating voltage tON ZOUT µA TBD 3.3 TBD V Power up time (first locked clock cycle after power up) - TBD - mS Clock out impedance - TBD - Ω Low Power EMI Reduction IC Notice: The information in this document is subject to change without notice. 3 of 7 October 2003 ASM3P5821A rev 1.0 AC Electrical Characteristics Symbol Parameter Min Typ Max Unit XIN Input frequency 20 25/31 34 MHz MODOUT Output frequency 20 25/31 34 MHz tLH* Output rise time (measured at 0.8V to 2.0V) ns tHL* Output fall time (measured at 2.0V to 0.8V) ns tJC Jitter (cycle to cycle) - - TBD ps tD Output duty cycle - TBD - % *tLH and tHL are measured into a capacitive load of 15pF Low Power EMI Reduction IC Notice: The information in this document is subject to change without notice. 4 of 7 October 2003 ASM3P5821A rev 1.0 Package Information 8-Pin SOIC H E D A2 A C A1 D θ e L B Symbol Dimensions in inches Dimensions in millimeters Min Max Min Max A 0.057 0.071 1.45 1.80 A1 0.004 0.010 0.10 0.25 A2 0.053 0.069 1.35 1.75 B 0.012 0.020 0.31 0.51 C 0.004 0.01 0.10 0.25 D 0.186 0.202 4.72 5.12 E 0.148 0.164 3.75 4.15 e 0.050 BSC 1.27 BSC H 0.224 0.248 5.70 6.30 L 0.012 0.028 0.30 0.70 0° 8° 0° 8° Low Power EMI Reduction IC Notice: The information in this document is subject to change without notice. 5 of 7 October 2003 ASM3P5821A rev 1.0 8-Pin TSSOP H E D A2 A C θ e A1 L B Dimensions in inches Symbol Min A 0.047 A1 0.002 0.006 0.05 0.15 A2 0.031 0.041 0.80 1.05 B 0.007 0.012 0.19 0.30 C 0.004 0.008 0.09 0.20 D 0.114 0.122 2.90 3.10 E 0.169 0.177 4.30 4.50 e Max Dimensions in millimeters Min Max 1.10 0.026 BSC 0.65 BSC H 0.244 0.260 6.20 6.60 L 0.018 0.030 0.45 0.75 θ 0° 8° 0° 8° Low Power EMI Reduction IC Notice: The information in this document is subject to change without notice. 6 of 7 October 2003 ASM3P5821A rev 1.0 Alliance Semiconductor Corporation 2595, Augustine Drive, Santa Clara, CA 95054 Tel# 408-855-4900 Fax: 408-855-4999 www.alsc.com Copyright © Alliance Semiconductor All Rights Reserved Preliminary Information Part Number: ASM3P5821A Document Version: v1.0 © Copyright 2003 Alliance Semiconductor Corporation. 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Alliance does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of Alliance products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify Alliance against all claims arising from such use. Low Power EMI Reduction IC Notice: The information in this document is subject to change without notice. 7 of 7