PCS3P2537A February 2008 rev 0.2 Low Power Peak EMI Reduction IC Features PCS3P2537A modulates the output of a single PLL in order to “spread” the bandwidth of a synthesized clock, • 1x Peak EMI Reduction IC • Input Frequency: 18MHz-36MHz • Output Frequency: 18MHz-36MHz • Frequency Deviation @ 27MHz : -0.25% • Modulation Rate @ 27MHz : 30.1KHz • Supply Voltage: 3.3V±0.3V • Operating current less than 8mA @ 27MHz. • Spread Spectrum Enable Control. • Low power CMOS design. • 8 pin TDFN (2X2) COL package. • Commercial temperature and more importantly, decreases the peak amplitudes of its harmonics. This results in significantly lower system EMI compared to the typical narrow band signal produced by oscillators and most frequency generators. Lowering EMI by increasing a signal’s bandwidth is called ‘spread spectrum clock generation’. PCS3P2537A has a frequency range of 18MHz-36MHz, and accepts input clock either from a Crystal or from an external reference and locks on to it delivering a 1x spread spectrum clock output. It has an SSON control for Product Description enabling and disabling Spread Spectrum function. PCS3P2537A is a versatile Low Power, 1x spread PCS3P2537A operates with a supply voltage of 3.3V, spectrum frequency modulator designed to reduce and is available in 8L TDFN(2X2) COL package over electromagnetic interference (EMI) at the clock source, commercial temperature. allowing system wide reduction of EMI of down stream clock and data dependent signals. The device allows Application significant system cost savings by reducing the number of PCS3P2537A is targeted towards PC peripheral devices circuit board layers ferrite beads, shielding and other and embedded systems. passive components that are traditionally required to pass EMI regulations. Block Diagram VDD CLKIN / XIN XOUT Crystal Oscillator SSON PLL ModOUT GND PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200, Campbell, CA 95008 • Tel: 408-879-9077 • Fax: 408-879-9018 www.pulsecoresemi.com Notice: The information in this document is subject to change without notice. PCS3P2537A February 2008 rev 0.2 Pin Configuration (8-pin TDFN Package) CLKIN / XIN 1 8 VDD 7 NC SSON 3 6 ModOUT NC 4 5 GND XOUT 2 PCS3P2537A Pin Description Pin# Pin Name Type Description 1 CLKIN / XIN I External reference Clock input or Crystal connection. This pin has dual functions. It can be connected either to an external crystal or an external reference clock. 2 XOUT O Crystal connection. If using an external reference, this pin must be left unconnected. 3 SSON I When SSON is HIGH, the spread spectrum is enabled and when LOW, it turns off the spread spectrum. 4 NC 5 GND P Ground connection. 6 ModOUT O Spread Spectrum Clock Output. 7 NC 8 VDD No Connect No Connect P Power supply for the entire chip Low Power Peak EMI Reduction IC Notice: The information in this document is subject to change without notice. 2 of 7 PCS3P2537A February 2008 rev 0.2 Absolute Maximum Ratings Symbol Parameter Rating Unit VDD, VIN Voltage on any pin with respect to Ground -0.5 to +4.6 V Storage temperature -65 to +125 °C TA Operating temperature -40 to +85 °C Ts Max. Soldering Temperature (10 sec) 260 °C TJ Junction Temperature 150 °C TDV Static Discharge Voltage (As per JEDEC STD22- A114-B) 2 KV TSTG Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect device reliability. DC Electrical Characteristics for 3.3V Supply Symbol Max Unit VIL Input low voltage VSS - 0.3 0.8 V VIH Input high voltage 2.0 VDD + 0.3 V IIL Input low current -35 µA IIH Parameter Min Typ Input high current 35 µA VOL Output low voltage (VDD = 3.3V, IOL = 8mA) 0.4 V VOH Output high voltage (VDD = 3.3V, IOH = 8mA) IDD Static supply current* ICC Dynamic supply current (3.3V, 27MHz and no load) VDD tON ZOUT 2.5 V 2.5 Operating Voltage 7 3 3.3 Power-up time (first locked cycle after power-up) Output impedance mA mA 3.6 V 5 mS 36 Ω * CLKIN is pulled to GND AC Electrical Characteristics for 3.3V Supply Symbol CLKIN ModOUT fd Parameter Min Typ Max Unit Input frequency 18 27 36 MHz Output frequency 18 27 36 MHz Frequency Deviation @ 27MHz -0.2 -0.25 -0.3 % 33 KHz 2 nS MR Modulation Rate @ 27MHz 30 tLH* Output rise time (measured from 20% to 80%) tHL* Output fall time (measured at 80% to 20%) 1.5 nS tJC Jitter (cycle to cycle) 200 pS tD Output duty cycle 55 % 45 50 *tLH and tHL are measured into a capacitive load of 15pF Low Power Peak EMI Reduction IC Notice: The information in this document is subject to change without notice. 3 of 7 PCS3P2537A February 2008 rev 0.2 Typical Application Schematic VDD CLKIN / XIN 1 CLKIN / XIN 2 XOUT NC 7 3 SSON ModOUT 6 4 NC VDD VDD 8 0.01uF 0Ω 0Ω GND 5 Note: Refer to Pin Description table for Functionality Details PCB Layout Recommendation For optimum device performance, following guidelines are recommended. • Dedicated VDD and GND planes. • The device must be isolated from system power supply noise. A 0.01µF decoupling capacitor should be mounted on the component side of the board as close to the VDD pin as possible. No vias should be used between the decoupling capacitor and VDD pin. The PCB trace to VDD pin and the ground via should be kept as short as possible. All the VDD pins should have decoupling capacitors. • In an optimum layout all components are on the same side of the board, minimizing vias through other signal layers. A typical layout is shown in the figure As short as possible CLKIN VDD XOUT NC SSON NC Modout GND GND Low Power Peak EMI Reduction IC Notice: The information in this document is subject to change without notice. 4 of 7 PCS3P2537A February 2008 rev 0.2 Package Information TDFN COL 2x2 8L package Symbol A A3 Dimensions Inches Millimeters Min Max Min Max 0.027 0.0315 0.70 0.008 BSC 0.80 0.203 BSC b 0.008 0.012 0.20 0.30 D 0.077 0.080 1.95 2.05 E 0.077 0.080 1.95 e L 0.020 BSC 0.020 0.024 2.05 0.50 BSC 0.50 0.60 Low Power Peak EMI Reduction IC Notice: The information in this document is subject to change without notice. 5 of 7 PCS3P2537A February 2008 rev 0.2 Ordering Codes Part Number Marking Package Temperature PCS3P2537AG -08-CR AM1LL 8- pin 2-mm TDFN COL - TAPE & REEL, Green Commercial LL = 2 Character LOT # Device Ordering Information P C S 3 P 2 5 3 7 A G - 0 8 C R R = Tape & Reel, T = Tube or Tray O = TSOT23 S = SOIC T = TSSOP A = SSOP V = TVSOP B = BGA Q = QFN U = MSOP E = TQFP L = LQFP U = MSOP P = PDIP D = QSOP X = SC-70 J=TSOT26 C=TDFN (2X2) COL DEVICE PIN COUNT F = LEAD FREE AND RoHS COMPLIANT PART G = GREEN PACKAGE PART NUMBER X= Automotive I= Industrial P or n/c = Commercial (-40C to +125C) (-40C to +85C) (0C to +70C) 1 = Reserved 2 = Non PLL based 3 = EMI Reduction 4 = DDR support products 5 = STD Zero Delay Buffer 6 = Power Management 7 = Power Management 8 = Power Management 9 = Hi Performance 0 = Reserved PulseCore Semiconductor Mixed Signal Product Licensed under US patent #5,488,627, #6,646,463 and #5,631,920. Low Power Peak EMI Reduction IC Notice: The information in this document is subject to change without notice. 6 of 7 PCS3P2537A February 2008 rev 0.2 PulseCore Semiconductor Corporation 1715 S. Bascom Ave Suite 200 Campbell, CA 95008 Tel: 408-879-9077 Fax: 408-879-9018 www.pulsecoresemi.com Campbell, CA 95008 Copyright © PulseCore Semiconductor All Rights Reserved Part Number: PCS3P2537A Document Version: 0.2 Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to PulseCore Semiconductor, dated 11-11-2003 Many PulseCore Semiconductor products are protected by issued patents or by applications for patent © Copyright 2006 PulseCore Semiconductor Corporation. All rights reserved. Our logo and name are trademarks or registered trademarks of PulseCore Semiconductor. All other brand and product names may be the trademarks of their respective companies. PulseCore reserves the right to make changes to this document and its products at any time without notice. PulseCore assumes no responsibility for any errors that may appear in this document. The data contained herein represents PulseCore’s best data and/or estimates at the time of issuance. PulseCore reserves the right to change or correct this data at any time, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or customer. PulseCore does not assume any responsibility or liability arising out of the application or use of any product described herein, and disclaims any express or implied warranties related to the sale and/or use of PulseCore products including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual property rights, except as express agreed to in PulseCore’s Terms and Conditions of Sale (which are available from PulseCore). All sales of PulseCore products are made exclusively according to PulseCore’s Terms and Conditions of Sale. The purchase of products from PulseCore does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other intellectual property rights of PulseCore or third parties. PulseCore does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of PulseCore products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify PulseCore against all claims arising from such use. Low Power Peak EMI Reduction IC Notice: The information in this document is subject to change without notice. 7 of 7