SCLS403H − APRIL 1998 − REVISED APRIL 2005
D 2-V to 5.5-V VCC Operation
D Max tpd of 10.5 ns at 5 V
D Typical VOLP (Output Ground Bounce)
14
2
13
3
12
4
5
11
10
9
6
8
7
VCC
QH
QG
QF
QE
CLR
CLK
B
QA
QB
QC
QD
14
B
A
NC
VCC
QH
1
2
13 QH
3
12 QG
4
11 QF
5
10 QE
9 CLR
6
7
8
SN54LV164A . . . FK PACKAGE
(TOP VIEW)
QA
NC
QB
NC
QC
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
QG
NC
QF
NC
QE
QD
GND
NC
CLK
CLR
1
CLK
A
B
QA
QB
QC
QD
GND
VCC
SN74LV164A . . . RGY PACKAGE
(TOP VIEW)
SN54LV164A . . . J OR W PACKAGE
SN74LV164A . . . D, DB, DGV, NS,
OR PW PACKAGE
(TOP VIEW)
A
D
D
<0.8 V at VCC = 3.3 V, TA = 25°C
Typical VOHV (Output VOH Undershoot)
>2.3 V at VCC = 3.3 V, TA = 25°C
Support Mixed-Mode Voltage Operation on
All Ports
JESD 17
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
− 200-V Machine Model (A115-A)
− 1000-V Charged-Device Model (C101)
GND
D
D Latch-Up Performance Exceeds 250 mA Per
NC − No internal connection
description/ordering information
The ’LV164A devices are 8-bit parallel-out serial shift registers designed for 2-V to 5.5-V VCC operation.
ORDERING INFORMATION
QFN − RGY
SN74LV164ARGYR
Tube of 50
SN74LV164AD
Reel of 2500
SN74LV164ADR
SOP − NS
Reel of 2000
SN74LV164ANSR
74LV164A
SSOP − DB
Reel of 2000
SN74LV164ADBR
LV164A
Tube of 90
SN74LV164APW
Reel of 2000
SN74LV164APWR
Reel of 250
SN74LV164APWT
TVSOP − DGV
Reel of 2000
SN74LV164ADGVR
LV164A
CDIP − J
Tube of 25
SNJ54LV164AJ
SNJ54LV164AJ
CFP − W
Tube of 150
SNJ54LV164AW
SNJ54LV164AW
LCCC − FK
Tube of 55
SNJ54LV164AFK
TSSOP − PW
−55°C
−55
C to 125
125°C
C
TOP-SIDE
MARKING
Reel of 1000
SOIC − D
−40°C
85°C
−40
C to 85
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
LV164A
LV164A
LV164A
SNJ54LV164AFK
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2005, Texas Instruments Incorporated
!"#$%& "!&'& (
&)!*$'!& "#**%& ' !) +#,-"'!& '%. *!#" "!&)!*$ !
+%")"'!& +%* % %*$ !) %/' &*#$%& '&'* 0'**'&1.
*!#"!& +*!"%&2 !% &! &%"%'*-1 &"-#% %&2 !) '-+'*'$%%*.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCLS403H − APRIL 1998 − REVISED APRIL 2005
description/ordering information (continued)
These devices feature AND-gated serial (A and B) inputs and an asynchronous clear (CLR) input. The gated
serial inputs permit complete control over incoming data, as a low at either input inhibits entry of the new data
and resets the first flip-flop to the low level at the next clock pulse. A high-level input enables the other input,
which then determines the state of the first flip-flop. Data at the serial inputs can be changed while the clock
is high or low, provided the minimum setup time requirements are met. Clocking occurs on the low-to-high-level
transition of the clock (CLK) input.
FUNCTION TABLE
OUTPUTS
INPUTS
CLR
CLK
A
B
QA
L
X
X
X
L
QB . . . QH
L
L
H
L
X
X
QA0
QB0
H
↑
H
H
H
QAn
QH0
QGn
H
↑
L
X
L
QAn
QGn
H
↑
X
L
L
QAn
QGn
QA0, QB0, QH0 = the level of QA, QB, or QH, respectively,
before the indicated steady-state input conditions were
established.
QAn, QGn = the level of QA or QG before the most recent
↑ transition of the clock: indicates a 1-bit shift.
logic diagram (positive logic)
CLK
A
B
CLR
8
C1
1
2
C1
C1
C1
C1
C1
C1
1D
1D
1D
1D
1D
1D
1D
R
R
R
R
R
R
R
R
9
3
QA
4
QB
5
QC
6
QD
Pin numbers shown are for the D, DB, DGV, J, NS, PW, RGY, and W packages.
2
C1
1D
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
10
QE
11
QF
12
QG
13
QH
SCLS403H − APRIL 1998 − REVISED APRIL 2005
typical clear, shift, and clear sequences
Serial Inputs
CLR
A
B
CLK
QA
QB
Outputs
QC
QD
QE
QF
QG
QH
Clear
Clear
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SCLS403H − APRIL 1998 − REVISED APRIL 2005
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Voltage range applied to any output in the high-impedance
or power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Output voltage range, VO (see Notes 1 and 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −20 mA
Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Package thermal impedance, θJA (see Note 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
(see Note 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W
(see Note 3): DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127°C/W
(see Note 3): NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
(see Note 3): PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W
(see Note 4): RGY package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.
2. This value is limited to 5.5 V maximum.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
4. The package thermal impedance is calculated in accordance with JESD 51-5.
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCLS403H − APRIL 1998 − REVISED APRIL 2005
recommended operating conditions (see Note 5)
SN54LV164A
VCC
VIH
High-level input voltage
VIL
Low-level input voltage
VI
VO
Input voltage
IOH
IOL
∆t/∆v
MIN
MAX
2
5.5
Supply voltage
VCC = 2 V
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
1.5
2
5.5
VCC × 0.7
VCC × 0.7
VCC × 0.7
VCC × 0.7
Output voltage
UNIT
V
V
0.5
0.5
VCC × 0.3
VCC × 0.3
VCC × 0.3
5.5
0
0
VCC
−50
VCC = 2 V
VCC = 2.3 V to 2.7 V
VCC × 0.3
VCC × 0.3
0
V
VCC
−50
µA
0
V
−2
−6
−6
−12
−12
VCC = 2 V
VCC = 2.3 V to 2.7 V
50
50
2
2
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
6
6
12
12
200
200
100
100
20
20
VCC = 2.3 V to 2.7 V
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
V
VCC × 0.3
5.5
−2
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
Input transition rise or fall rate
MAX
VCC × 0.7
VCC × 0.7
VCC = 3 V to 3.6 V
VCC = 4.5 V to 5.5 V
Low-level output current
MIN
1.5
VCC = 2 V
VCC = 2.3 V to 2.7 V
High-level output current
SN74LV164A
mA
µA
mA
ns/V
TA
Operating free-air temperature
−55
125
−40
85
°C
NOTE 5: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
SN54LV164A
PARAMETER
VOH
VOL
TEST CONDITIONS
IOH = −50 µA
IOH = −2 mA
IOL = 50 µA
IOL = 2 mA
IOL = 6 mA
IOL = 12 mA
VI = 5.5 V or GND
VI = VCC or GND,
Ioff
Ci
VI or VO = 0 to 5.5 V
VI = VCC or GND
MIN
2 V to 5.5 V
IOH = −6 mA
IOH = −12 mA
II
ICC
VCC
IO = 0
TYP
SN74LV164A
MAX
MIN
2.3 V
VCC−0.1
2
VCC−0.1
2
3V
2.48
2.48
4.5 V
3.8
TYP
MAX
UNIT
V
3.8
2 V to 5.5 V
0.1
0.1
2.3 V
0.4
0.4
3V
0.44
0.44
4.5 V
V
0.55
0.55
0 to 5.5 V
±1
±1
µA
5.5 V
20
20
µA
0
5
5
µA
3.3 V
2.2
2.2
pF
( &)!*$'!& "!&"%*& +*!#" & % )!*$'3% !*
%2& +'% !) %3%-!+$%&. ('*'"%*" '' '& !%*
+%")"'!& '*% %2& 2!'-. %/' &*#$%& *%%*3% % *2 !
"'&2% !* "!&&#% %% +*!#" 0!# &!"%.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
SCLS403H − APRIL 1998 − REVISED APRIL 2005
timing requirements over recommended operating free-air temperature range, VCC = 2.5 V ± 0.2 V
(unless otherwise noted) (see Figure 1)
TA = 25°C
MIN
MAX
CLR low
tw
Pulse duration
tsu
Setup time
th
Hold time
SN54LV164A
MIN
MAX
SN74LV164A
MIN
6
6.5
6.5
CLK high or low
6.5
7.5
7.5
Data before CLK↑
6.5
8.5
8.5
3
3
3
−0.5
0
0
CLR inactive
Data after CLK↑
MAX
UNIT
ns
ns
ns
timing requirements over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V
(unless otherwise noted) (see Figure 1)
TA = 25°C
MIN
MAX
tw
Pulse duration
tsu
Setup time
th
Hold time
SN54LV164A
MIN
MAX
SN74LV164A
MIN
CLR low
5
5
5
CLK high or low
5
5
5
Data before CLK↑
CLR inactive
Data after CLK↑
5
6
6
2.5
2.5
2.5
0
0
0
MAX
UNIT
ns
ns
ns
timing requirements over recommended operating free-air temperature range, VCC = 5 V ± 0.5 V
(unless otherwise noted) (see Figure 1)
TA = 25°C
MIN
MAX
tw
Pulse duration
tsu
Setup time
th
Hold time
TO
(OUTPUT)
fmax
tpd
CLK
tPHL
CLR
Q
tpd
CLK
Q
tPHL
CLR
MIN
5
CLK high or low
5
5
5
Data before CLK↑
4.5
4.5
4.5
CLR inactive
2.5
2.5
2.5
1
1
1
free-air
TA = 25°C
TYP
MAX
SN54LV164A
CL = 15 pF
55*
105*
50*
50
CL = 50 pF
45
85
40
40
CL = 15 pF
CL = 50 pF
ns
ns
ns
MIN
MAX
17.6*
1*
20*
1
20
8.6*
16*
1*
18*
1
18
11.5
21.1
1
24
1
24
10.8
19.5
1
22
1
22
• DALLAS, TEXAS 75265
range,
UNIT
MHz
9.2*
( &)!*$'!& "!&"%*& +*!#" & % )!*$'3% !*
%2& +'% !) %3%-!+$%&. ('*'"%*" '' '& !%*
+%")"'!& '*% %2& 2!'-. %/' &*#$%& *%%*3% % *2 !
"'&2% !* "!&&#% %% +*!#" 0!# &!"%.
POST OFFICE BOX 655303
MAX
UNIT
SN74LV164A
MIN
MIN
MAX
temperature
LOAD
CAPACITANCE
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
6
SN74LV164A
5
Q
Q
MAX
5
Data after CLK↑
FROM
(INPUT)
MIN
CLR low
switching characteristics over recommended operating
VCC = 2.5 V ± 0.2 V (unless otherwise noted) (see Figure 1)
PARAMETER
SN54LV164A
ns
ns
SCLS403H − APRIL 1998 − REVISED APRIL 2005
switching characteristics over recommended operating
VCC = 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
fmax
tpd
CLK
tPHL
tpd
CLR
free-air
TA = 25°C
TYP
MAX
temperature
SN54LV164A
SN74LV164A
LOAD
CAPACITANCE
MIN
CL = 15 pF
80*
155*
65*
65
CL = 50 pF
50
120
45
45
MIN
MAX
MIN
MAX
12.8*
1*
15*
1
15
6*
12.8*
1*
15*
1
15
CLK
8.3
Q
CL = 50 pF
tPHL
CLR
7.9
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
16.3
1
18.5
1
18.5
16.3
1
18.5
1
18.5
CL = 15 pF
switching characteristics over recommended operating
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
fmax
tpd
CLK
tPHL
tpd
CLR
free-air
TA = 25°C
TYP
MAX
temperature
SN54LV164A
MIN
CL = 15 pF
125*
220*
105*
105
CL = 50 pF
85
165
75
75
MAX
MIN
MAX
9*
1*
10.5*
1
10.5
4.2*
8.6*
1*
10*
1
10
CLK
6
Q
CL = 50 pF
tPHL
CLR
5.8
* On products compliant to MIL-PRF-38535, this parameter is not production tested.
11
1
12.5
1
12.5
10.6
1
12.5
1
12.5
CL = 15 pF
ns
range,
UNIT
MHz
4.5*
Q
ns
SN74LV164A
LOAD
CAPACITANCE
MIN
UNIT
MHz
6.4*
Q
range,
ns
ns
noise characteristics, VCC = 3.3 V, CL = 50 pF, TA = 25°C (see Note 6)
SN74LV164A
PARAMETER
MIN
TYP
MAX
UNIT
VOL(P)
VOL(V)
Quiet output, maximum dynamic VOL
0.28
0.8
V
Quiet output, minimum dynamic VOL
−0.22
−0.8
V
VOH(V)
VIH(D)
Quiet output, minimum dynamic VOH
3.09
High-level dynamic input voltage
V
2.31
V
VIL(D)
Low-level dynamic input voltage
NOTE 6: Characteristics are for surface-mount packages only.
0.99
V
VCC
3.3 V
TYP
UNIT
5V
47.5
operating characteristics, TA = 25°C
PARAMETER
Cpd
Power dissipation capacitance
TEST CONDITIONS
CL = 50 pF,
f = 10 MHz
48.1
pF
( &)!*$'!& "!&"%*& +*!#" & % )!*$'3% !*
%2& +'% !) %3%-!+$%&. ('*'"%*" '' '& !%*
+%")"'!& '*% %2& 2!'-. %/' &*#$%& *%%*3% % *2 !
"'&2% !* "!&&#% %% +*!#" 0!# &!"%.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
7
SCLS403H − APRIL 1998 − REVISED APRIL 2005
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
RL = 1 kΩ
From Output
Under Test
Test
Point
VCC
Open
S1
TEST
GND
CL
(see Note A)
CL
(see Note A)
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open Drain
Open
VCC
GND
VCC
LOAD CIRCUIT FOR
3-STATE AND OPEN-DRAIN OUTPUTS
LOAD CIRCUIT FOR
TOTEM-POLE OUTPUTS
VCC
50% VCC
Timing Input
0V
tw
tsu
VCC
50% VCC
Input
50% VCC
th
VCC
50% VCC
Data Input
50% VCC
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VCC
50% VCC
Input
50% VCC
tPLH
In-Phase
Output
tPHL
50% VCC
tPHL
Out-of-Phase
Output
0V
VOH
50% VCC
VOL
VOH
50% VCC
VOL
50% VCC
50% VCC
0V
tPLZ
tPZL
Output
Waveform 1
S1 at VCC
(see Note B)
≈VCC
50% VCC
Output
Waveform 2
S1 at GND
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOL + 0.3 V
VOL
tPHZ
tPZH
tPLH
50% VCC
VCC
Output
Control
50% VCC
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤ 3 ns, tf ≤ 3 ns.
D. The outputs are measured one at a time, with one input transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPHL and tPLH are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
SN74LV164AD
ACTIVE
SOIC
D
14
SN74LV164ADBR
ACTIVE
SSOP
DB
SN74LV164ADBRE4
ACTIVE
SSOP
SN74LV164ADE4
ACTIVE
SN74LV164ADGVR
50
Lead/Ball Finish
MSL Peak Temp (3)
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SOIC
D
14
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
ACTIVE
TVSOP
DGV
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV164ADGVRE4
ACTIVE
TVSOP
DGV
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV164ADR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV164ADRE4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV164ANSR
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV164ANSRE4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV164APW
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV164APWE4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV164APWG4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV164APWR
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV164APWRE4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV164APWRG4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV164APWT
ACTIVE
TSSOP
PW
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV164APWTE4
ACTIVE
TSSOP
PW
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LV164ARGYR
ACTIVE
QFN
RGY
14
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
SN74LV164ARGYRG4
ACTIVE
QFN
RGY
14
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
50
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to
discontinue any product or service without notice. Customers should obtain the latest relevant information
before placing orders and should verify that such information is current and complete. All products are sold
subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent
TI deems necessary to support this warranty. Except where mandated by government requirements, testing
of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible
for their products and applications using TI components. To minimize the risks associated with customer
products and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent
right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine,
or process in which TI products or services are used. Information published by TI regarding third-party
products or services does not constitute a license from TI to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or
other intellectual property of the third party, or a license from TI under the patents or other intellectual
property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices.
Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not
responsible or liable for such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for
that product or service voids all express and any implied warranties for the associated TI product or service
and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Low Power Wireless
www.ti.com/lpw
Telephony
www.ti.com/telephony
Mailing Address:
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated