APA4863 Stereo 2.2W Audio Power Amplifier Features General Description • • • The APA4863 is a stereo bridge-tied audio power amplifier in various power packages , including SOP , TSSOP and TSSOP-P . When connecting to a 5V voltage supply , the APA4863 is capable of delivering 2.2W/1.8W/1.2W of continuous RMS power per channel into 3Ω/4Ω/8Ω bridge-tied loads with less than 1% THD+N respectively . When APA4863 operates in the single-ended load , it is capable of delivering 90mW of continuous RMS power per channel into 32Ω load . The APA4863 simplifies design and frees up board space for other features . Depop Circuitry Integrated Thermal Shutdown Circuitry Integrated Bridge-Tied Load (BTL) or Single-Ended (SE) Modes Operation • Output Power at 1% THD+N, VDD=5V - 2.2W/Ch (typ) into a 3 Ω Load - 1.8W/Ch (typ) into a 4 Ω Load - 1.2 W/Ch (typ) into a 8 Ω Load • • Shutdown Control Mode, ISD= 0.5 µA The APA4863 also served well in low-voltage applications , which provides 750mW (1% THD+N) per channel into 4Ω loads with a 3.3V supply voltage . Both of the depop circuitry and the thermal shutdown protection circuitry are integrated in the APA4863 , that reduces pops and clicks noise during power up and when using the shutdown mode and protects the chip from being destroyed by over-temperature failure . To simplify the audio system design in notebook computer applications , the APA4863 combines a stereo bridge-tied loads mode for speaker drive and a stereo single-end mode for headphone drive into a single chip , where both modes are easily switched by the HP-IN input control pin signal . For power sensitive applications , the APA4863 also features a shutdown function which keeps the supply current only 0.5 µA (typ.) . Output Power (SE) at 0.5% THD+N, VDD=5V - 90mW/Ch (typ.) into a 32Ω Load • Various Power Packages Available SOP, TSSOP, TSSOP-P Applications • Stereo Audio Power Amplifier for Notebook Computer • • Portable Televisions Portable and Desktop Computers Ordering Information Package Code K: SOP O: TSSOP Temp. Range I : -40 to 85 ° C Handling Code TU : Tube TR : Tape & Reel APA4863 Handling Code Temp. Range Package Code R: TSSOP-P* TY: Tray * TSSOP-P is a standard TSSOP package with a thermal pad exposed on the bottom of the package. ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2001 1 www.anpec.com.tw APA4863 Block Diagram VDD CS 0.1µF RF 20KΩ 6 - IN A 8 + IN A* - OUT A Bypass 10 + 50ΚΩ VDD / 2 2.2µF 100µF 1KΩ Control Pin RL 8Ω + OUT A Ring To HP-IN Circuit 3 + CB CO 5 20KΩ 20KΩ 20KΩ - C1 1 µF 4, 13 20KΩ - R1 + Audio Input 50KΩ Tip C1 1 µF 11 - IN B 9 + IN B* 20KΩ RF 20KΩ + R1 - Audio Input - OUT B 1 16 1KΩ + OUT B 14 + To Control Pin on Headphone Jack 100µF RL 8Ω 20KΩ VDD 100ΚΩ + 20KΩ 20KΩ Headphone Jack CO 12 Sleeve Shutdown HP-IN 100KΩ GND 2,7,15 * +INA and +INB pins are connected to Bypass pin inside the IC. Absolute Maximum Ratings (Over operating free-air temperature range unless otherwise noted.) Symbol VDD Parameter Supply Voltage TA Operating Ambient Temperature Range TJ Maximum Junction Temperature TSTG TS VESD Storage Temperature Range Soldering Temperature,10 seconds Electrostatic Discharge Rating 6 Unit V -40 to 85 °C 150 °C -65 to +150 °C °C 260 -2000 to 2000 *1 V Note: *1. Human body model : C=100pF, R=1500Ω, 3 positive pulses plus 3 negative pulses Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2001 2 www.anpec.com.tw APA4863 Recommended Operating Conditions Min. Typ. Max. Unit 3 5 5.5 V °C Supply Voltage, VDD Operating free-air VDD=5V, temperature, TA 250mW/Ch average power VDD=5V, 1.8 W/Ch average power 4-Ω stereo BTL drive, with proper PCB design -20 85 4-Ω stereo BTL drive, with proper PCB design and 300 CFM forced-air cooling -20 85 1.25 4.5 1.25 2.7 Common mode VDD=5 V input voltage, VICM VDD=3.3V V Dissipation Rating Table Package Air Flow (CFM) SO16 + TSSOP ++ 0 0 200 0 200 TSSOP-P ++ Thermal Resistance θ JA(°° C/W) 50 73.2 66.6 37.6 32.3 T A≤ 25°° C T A=70°° C 2.5W 1.7W 1.8W 3.3W 3.8W 1.6W 1.1W 1.2W 2.1W 2.4W + : The parameter is measured with the recommended copper heat sink pattern on an 2-layer PCB, 11.7 in2 3.0×2.4 in2 in PCB, 1oz. copper, 3.0×1.5 in2 in coverage at Top-layer and Bottom-layer at 100% coverage (7.2in2). ++:The parameter is measured with the JEDEC standard test boards (multi-layer PCB). Electical Characteristics Electrical Characteristics for Entire IC The following specifications apply for VDD= 5V unless otherwise noted. Limits apply for TA= 25°C Symbol Parameter Test Conditions VDD V IN=0V, IO=0A, HP-IN=0V V IN=0V, IO=0A, HP-IN=4V V PIN1= VDD ISD Supply Voltage Quiescent Power Supply Current Shutdown Current VIH Headphone High Input Voltage VIL Headphone Low Input Voltage IDD Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2001 APA4863 Min. Typ. 3 5 9 5 0.5 Max. 5.5 13.5 7.5 V mA µA 4 V 0.8 3 Unit V www.anpec.com.tw APA4863 Electical Characteristics Cont. Electrical Characteristics for BTL Mode Operation The following specifications apply for VDD= 5V unless otherwise noted. Limits apply for TA= 25°C Symbol V OS PO THD+N RSRR X TALK SNR Parameter Output Offset Voltage Output Power Test Conditions V IN=0V THD=1%, f=1kHz R L=3Ω R L=4Ω R L=8Ω THD=10%, f=1kHz R L=3Ω R L=4Ω R L=8Ω Total Harmonic Distortion + Noise A VD =2, f=1kHz R L=4Ω , P O =1.8W R L=8Ω , P O =1W Power Supply Rejection Ratio V DD =5V, V RIPPLE=200Mv Rms , R L=8Ω C B=2.2µF Channel Separation f=1kHz , C B =2.2µF, P O =1W, R L=8Ω Signal-to-Noise Ratio V DD =5V, P O =1.1W, R L=8Ω APA4863 Typ. 5 Unit 2.2 1.8 1.2 W mV 2.7 2.3 1.5 0.3 0.15 64 % dB 90 95 dB dB APA4863 Typ. 5 90 320 400 0.02 Unit Electrical Characteristics for SE Mode Operation The following specifications apply for VDD= 5V unless otherwise noted. Limits apply for TA= 25°C Symbol V OS PO Parameter Test Conditions Output Offset Voltage Output Power V IN=0V THD=0.5%, f=1kHz, RL=32Ω THD=1%, f=1kHz, RL=8Ω THD=10%, f=1kHz, RL=8Ω THD+N Total Harmonic Distortion A V= -1 , P O=75mW, f=1kHz, RL=32Ω plus Noise RSRR Power Supply Rejection V RIPPLE=200mV RMS , f=1kHz, CB=2.2µF, RL=8Ω Ratio X TALK Channel Separation f=1kHz , CB=2.2µF, P O=32mW, RL=32Ω SNR Signal-to-Noise Ratio V DD=5V , PO =340mW, RL=8Ω mV mW % 49 dB 85 95 dB dB Truth Table for Logic Inputs Shutdown Low Low High High Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2001 HP-IN Low High Low High APA4863 Mode Bridge -Tied Single-Ended APA4863 Shutdown APA4863 Shutdown 4 www.anpec.com.tw APA4863 Pin Description SHUTDOWN GND 1 + OUT A VDD 3 4 - OUT A - IN A GND + IN A 5 16 2 15 14 13 12 11 6 7 10 8 9 HP-IN GND + OUT B VDD - OUT B - IN B BYPASS + IN B Top View 1 + OUT A VDD 3 4 - OUT A - IN A GND + IN A GND GND 5 5 16 6 7 15 14 13 - OUT B - IN B BYPASS + IN B 1 + OUT A VDD - OUT A - IN A GND + IN A NC NC 2 8 9 12 10 11 + OUT B VDD NC NC Top View for SOP SHUTDOWN GND HP-IN GND 3 4 20 19 18 17 SHUTDOWN GND for TSSOP 20 19 18 2 6 7 8 9 10 HP-IN GND 17 + OUT B VDD 16 15 14 13 - OUT B - IN B BYPASS + IN B 12 GND GND 11 Thermal Pad Bottom View Top View for TSSOP-P for TSSOP -P Pin Description Name GND V DD + INA - INA + OUT A - OUT A + IN B - IN B + OUT B - OUT B BYPASS HP-IN SHUTDOWN I/O I I I O O I I O O I I Description Ground connection of circuitry Supply voltage input Non-inverting input of channel A, connected to bypass pin inside the IC Input pin of channel A A channel + output in BTL mode, high impedance in SE mode A channel - output in BTL mode, + output in SE mode Non-inverting input of channel B, connected to bypass pin inside the IC Input pin of channel B B channel + output in BTL mode, high impedance in SE mode B channel - output in BTL mode, + output in SE mode Connect to voltage divider for internal mid-supply bias Headphone control pin input, hold high for single-ended mode operation Shutdown mode control pin input, places entire IC in shutdown mode when held high, IDD= 0.5µA Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2001 5 www.anpec.com.tw APA4863 Typical Characteristics THD+N vs Output Power 10 THD+N vs Frequency 10 VDD=5V, RL=4Ω BW<80kHz VDD=5V, PO=1.8W RL=4Ω, BW<80kHz 20Hz 1 THD+N (%) THD+N (%) 1 20kHz 1kHz 0.1 0.1 0.01 20 0.01 10m 100m 1 1k 10k 20k 3 Figure 1 : Output Power (W) Figure 2 : Frequency (Hz) Power Dissipation vs Output Power THD+N vs Frequency 10 1.4 VDD=5V, PO=1W RL=8Ω, BTL Mode 1.2 VDD=5V 1 1 Ω RL=4Ω 0.8 0.6 THD+N (%) Power Dissipation (W) 100 Ω RL= 8Ω AVD=10 0.1 0.4 AVD=2 0.2 0.01 0 0 0.5 1 1.5 2 20 2.5 Figure 3 : Output Power (W) Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2001 100 1k 10k 20k Figure 4 : Frequency (Hz) 6 www.anpec.com.tw APA4863 Typical Characteristics Cont. THD+N vs Frequency VDD=5V, PO=150mW RL=16Ω, SE Mode 1 THD+N (%) THD+N (%) 1 0.1 THD+N vs Frequency 10 10 AV= -5 AV= -1 VDD=5V, PO=75mW RL=32Ω, SE Mode 0.1 AV= -5 AV= -1 0.001 0.001 20 100 1k 10k 20k 20 THD+N vs Output Power THD+N vs Output Power 1 f= 20Hz THD+N (%) THD+N (%) 10 f= 1kHz f= 20kHz 0.1 f= 20Hz f= 1kHz VDD=5V, RL=8Ω AVD=2, BW< 80kHz BTL Mode 0.01 10k 20k Figure 6 : Frequency (Hz) f= 20kHz 0.1 1k Figure 5 : Frequency (Hz) 10 1 100 10m 100m 1 0.001 10m 2 Figure 7 : Output Power (W) Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2001 VDD=5V, RL=16Ω AV=-1, BW< 80kHz SE Mode 70m 200m 500m Figure 8 : Output Power (W) 7 www.anpec.com.tw APA4863 Typical Characteristics Cont. THD+N vs Output Power 1 THD+N vs Output Power 10 10 VDD=5V, RL=32Ω AV=-1, BW< 80kHz SE Mode f= 20kHz f= 20Hz THD+N (%) THD+N (%) 1 f= 20kHz 0.1 f= 20Hz f= 1kHz 0.1 f= 1kHz 0.001 10m VDD=3.3V, RL=4Ω AVD= 2 50m 100m 0.01 200m 10m 100m 1 Figure 9 : Output Power (W) Figure 10 : Output Power (W) THD+N vs Frequency THD+N vs Output Power 2 10 10 VDD=3.3V, PO=700mW RL=4Ω, AVD=2 f= 20kHz 1 THD+N (%) THD+N (%) 1 0.1 f= 20Hz f= 1kHz 0.1 VDD=3.3V, RL=8Ω, AVD=2 0.01 0.01 20 100 1k 10k 20k 10m Figure 11 : Frequency (Hz) Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2001 100m 1 Figure 12 : Output Power (W) 8 www.anpec.com.tw APA4863 Typical Characteristics Cont. Output Power vs Load Resistance THD+N vs Frequency 10 0.2 VDD=3.3V, f=1kHz AVD=2, BW<80kHz VDD=3.3V, PO=450mW RL=8Ω, AVD=2 Output Power (W) 0.15 THD+N (%) 1 0.1 THD+N = 1% 0.05 0 0.01 20 100 1k 0 10k 20k 10 20 30 40 Figure 13 : Frequency (Hz) Figure 14 : Load Resistance (Ω) Power Dissipation vs Output Power Output Power vs Supply Voltage 2 0.35 VDD=3.3V, SE Mode 1.75 0.3 0.25 1.5 RL=8Ω Output Power (W) Power Dissipation (W) THD+N = 10% 0.1 0.2 RL=16Ω 0.15 0.1 0.05 0 1.25 VDD=5V, f=1kHz RL=8Ω, BW<80kHz BTL Mode THD+N = 10% 1 0.75 0.5 THD+N = 1% 0.25 0 0.2 0.4 0.6 0 0.8 Figure 15 : Output Power (W) Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2001 2 2.5 3 3.5 4 4.5 5 5.5 Figure 16 : Supply Voltage (V) 9 www.anpec.com.tw APA4863 Typical Characteristics Cont. Output Power vs Supply Voltage Output Power vs Supply Voltage 150 300 VDD=5V, f=1kHz RL=16Ω, BW<80kHz SE Mode 110 Output Power Output Power 250 200 THD+N = 10% 150 100 THD+N = 1% 50 0 VDD=5V, f=1kHz RL=32Ω, BW<80kHz SE Mode 130 90 THD+N = 10% 70 50 THD+N = 1% 30 10 2 2.5 3 3.5 4 4.5 5 -10 5.5 2 2.5 Supply Voltage (V) 4.5 5 5.5 Output Power vs Load Resistance 1 1.75 VDD=5V, f=1kHz AVD=2, BW<80kHz BTL Mode 1.5 VDD=5V, f=1kHz AV=-1, BW<80kHz SE Mode 0.8 1.25 Output Power (W) Output Power (W) 4 Figure 18 Output Power vs Load Resistance 1 10% THD+N 0.75 0.5 1% THD+N 0.6 0.4 10% THD+N 0.2 0 8 3.5 Supply Voltage (V) Figure 17 0.25 3 18 28 38 48 58 1% THD+N 68 0 Figure 19 : Load Resistance (Ω) Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2001 0 10 20 30 40 50 60 70 Figure 20 : Load Resistance (Ω) 10 www.anpec.com.tw APA4863 Typical Characteristics Cont. Power Dissipation vs Output Power Power Dissipation vs Output Power 1.4 0.18 1 0.8 RL=8Ω VDD=5V, f=1kHz THD+N <1% BW<80kHz BTL Mode Power Dissipation 1.2 Power Dissipation 0.16 RL=4Ω 0.6 RL=16Ω 0.4 RL=32Ω 0.2 0 0 0.5 1 0.12 RL=16Ω 0.1 0.08 0.06 RL=32Ω 0.04 0.02 0 1.5 RL=8Ω 0.14 0 0.1 Output Power (W) 0.4 0.5 Figure 22 Noise Floor Channel Separation 100 +0 VO+ + VO- Channel Separation (dB) Output Noise Voltage (µV) 0.3 Output Power (W) Figure 21 VO10 VDD=5V, RL=8Ω AVD=2, CB=1µF 1 20 0.2 VDD=5V, f=1kHz THD+N <1% BW<80kHz SE Mode 100 1k -20 -40 -60 -80 Channel A to B -100 -120 20 10k 20k Figure 23 : Frequency (Hz) Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2001 VDD=5V, RL=8Ω AVD=2, PO=1W CB=1µF BTL Mode Channel B to A 100 1k 10k 20k Figure 24 : Frequency (Hz) 11 www.anpec.com.tw APA4863 Typical Characteristics Cont. Open Loop Frequency Response Channel Separation -20 -40 +80 VDD=5V, RL=32Ω AV=-1, PO=75mW CB=1µF SE Mode +70 VDD=5V SE Mode +60 Gain (dB) Channel Separation (dB) +0 -60 Channel A to B -80 Gain +50 +40 +30 +20 -100 +10 Channel B to A -120 20 100 1k Phase +0 100 10k 20k 1k 10k 100k 1M 10M Figure 26 : Frequency (Hz) Figure 25 : Frequency (Hz) Supply Current vs Supply Voltage 10 VIN=0V No Load Supply Current (mA) 8 BTL Mode (HP-IN=GND) 6 4 SE Mode (HP-IN=VDD) 2 0 2 2.5 3 3.5 4 4.5 5 5.5 Figure 27 : Supply Voltage(V) Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2001 12 www.anpec.com.tw APA4863 Packaging Information TSSOP/ TSSOP-P ( Reference JEDEC Registration MO-153) e N 2x E/2 E1 1 2 3 E e/2 D A2 A ( 2) GAUGE PLANE A1 b D1 S R1 EXPOSED THERMAL PAD ZONE R E2 0.25 L 1 (L1) ( 3) BOTTOM VIEW (THERMALLY ENHANCED VARIATIONDS ONLY) Dim Millimeters Min. A A1 A2 D D1 e E E1 E2 L L1 R R1 S φ1 φ2 φ3 Inches Max. 1.2 0.15 1.05 6.6 (N=20PIN) 7.9 (N=24PIN) 0.00 0.80 6.4 (N=20PIN) 7.7 (N=24PIN) 2.20 (N=20PIN) 2.70 (N=24PIN) Thermally Enhanced 0.65 BSC 6.40 BSC 4.30 4.50 1.50 0.45 0.75 1.0 REF 0.09 0.09 0.2 0° 8° 12° REF 12° REF Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2001 13 Min. Max. 0.047 0.006 0.041 0.260 (N=20PIN) 0.311 (N=24PIN) 0.000 0.031 0.252 (N=20PIN) 0.303 (N=24PIN) 0.087 (N=20PIN) 0.106 (N=24PIN) Thermally Enhanced 0.026 BSC 0.252 BSC 0.169 0.177 0.059 0.018 0.030 0.039REF 0.004 0.004 0.008 0° 8° 12° REF 12° REF www.anpec.com.tw APA4863 Packaging Information SO – 300mil ( Reference JEDEC Registration MS-013) D N H GAUGE PLANE E 1 2 3 A Dim Millimeters Min. Max. 1 A1 B e L Variations- D Variations Min. Max. Dim Inches Min. Max. Variations- D Variations Min. Max. A 2.35 2.65 SO-16 10.10 10.50 A 0.093 0.1043 SO-16 0.398 0.413 A1 0.10 0.30 SO-18 11.35 11.76 A1 0.004 0.0120 SO-18 0.447 0.463 B 0.33 0.51 SO-20 12.60 13 B 0.013 0.020 SO-20 0.496 0.512 D See variations SO-24 15.20 15.60 D See variations SO-24 0.599 0.614 E 7.40 SO-28 17.70 18.11 E 0.2914 0.2992 SO-28 0.697 0.713 SO-14 8.80 9.20 e 0.050BSC SO-14 0.347 0.362 e 7.60 1.27BSC H 10 10.65 H 0.394 0.419 L 0.40 1.27 L 0.016 0.050 N See variations N See variations φ1 0° φ1 8° Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2001 14 0° 8° www.anpec.com.tw APA4863 Physical Specifications Terminal Material Lead Solderability Packaging Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb) Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3. 2000 devices per reel Reflow Condition (IR/Convection or VPR Reflow) temperature Reference JEDEC Standard J-STD-020A APRIL 1999 Peak temperature 183°C Pre-heat temperature Time Classification Reflow Profiles Convection or IR/ Convection Average ramp-up rate(183°C to Peak) 3°C/second max. 120 seconds max Preheat temperature 125 ± 25°C) 60 – 150 seconds Temperature maintained above 183°C Time within 5°C of actual peak temperature 10 –20 seconds Peak temperature range 220 +5/-0°C or 235 +5/-0°C Ramp-down rate 6 °C /second max. 6 minutes max. Time 25°C to peak temperature VPR 10 °C /second max. 60 seconds 215-219°C or 235 +5/-0°C 10 °C /second max. Package Reflow Conditions pkg. thickness ≥ 2.5mm and all bgas Convection 220 +5/-0 °C VPR 215-219 °C IR/Convection 220 +5/-0 °C pkg. thickness < 2.5mm and pkg. volume ≥ 350 mm³ Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2001 15 pkg. thickness < 2.5mm and pkg. volume < 350mm³ Convection 235 +5/-0 °C VPR 235 +5/-0 °C IR/Convection 235 +5/-0 °C www.anpec.com.tw APA4863 Reliability test program Test item SOLDERABILITY HOLT PCT TST ESD Latch-Up Method MIL-STD-883D-2003 MIL-STD-883D-1005.7 JESD-22-B, A102 MIL-STD-883D-1011.9 MIL-STD-883D-3015.7 JESD 78 Description 245°C , 5 SEC 1000 Hrs Bias @ 125 °C 168 Hrs, 100 % RH , 121°C -65°C ~ 150°C, 200 Cycles VHBM > 2KV, VMM > 200V 10ms , Itr > 100mA Carrier Tape & Reel Dimensions t D P Po E P1 Bo F W Ko Ao D1 T2 J C A B T1 Application SOP-16W A 330±3 Application SOP-16W F 7.5 ± 0.1 B 100 ± 2 C 13 + 0.5 J 2 ± 0.5 T1 T2 16.4 +0.3 2.5± 0.5 -0.2 W 16 ± 0.2 P 12± 0.1 E 1.75± 0.1 D D1 Po P1 Ao Bo Ko t 1.5 +0.1 1.5 +0.25 4.0 ± 0.1 2.0 ± 0.1 10.9 ± 0.1 10.8± 0.1 3.0± 0.1 0.3±0.013 (mm) Cover Tape Dimensions 16 13.3 Carrier Width Cover Tape Width (mm) Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2001 16 www.anpec.com.tw APA4863 Customer Service Analog and Power Electronics Corp. Head Office : 5F, No. 2 Li-Hsin Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 24F-1. No. 268, Sec. 2, PeiHsin Rd. HsinDian, Taipei County, Taiwan, R. O. C. Tel : 886-2-86658533 Fax : 886-2-86658529 Copyright ANPEC Electronics Corp. Rev. A.3 - Apr., 2001 17 www.anpec.com.tw