TI SN74LVT162244ADGVR

SN54LVT162244A, SN74LVT162244A
3.3-V ABT 16-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
www.ti.com
FEATURES
•
•
•
•
•
•
•
•
•
•
Members of the Texas Instruments Widebus™
Family
Output Ports Have Equivalent 22-Ω Series
Resistors, So No External Resistors Are
Required
Support Mixed-Mode Signal Operation (5-V
Input and Output Voltages With 3.3-V VCC)
Support Unregulated Battery Operation Down
to 2.7 V
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
Ioff and Power-Up 3-State Support Hot
Insertion
Distributed VCC and GND Pins Minimize
High-Speed Switching Noise
Flow-Through Architecture Optimizes PCB
Layout
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
SCBS718D – JUNE 2000 – REVISED DECEMBER 2006
SN54LVT162244A . . . WD PACKAGE
SN74LVT162244A . . . DGG, DGV, OR DL PACKAGE
(TOP VIEW)
1OE
1Y1
1Y2
GND
1Y3
1Y4
VCC
2Y1
2Y2
GND
2Y3
2Y4
3Y1
3Y2
GND
3Y3
3Y4
VCC
4Y1
4Y2
GND
4Y3
4Y4
4OE
1
48
2
47
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17
32
18
31
19
30
20
29
21
28
22
27
23
26
24
25
2OE
1A1
1A2
GND
1A3
1A4
VCC
2A1
2A2
GND
2A3
2A4
3A1
3A2
GND
3A3
3A4
VCC
4A1
4A2
GND
4A3
4A4
3OE
DESCRIPTION/ORDERING INFORMATION
The 'LVT162244A devices are 16-bit buffers and line drivers designed for low-voltage (3.3-V) VCC operation, but
with the capability to provide a TTL interface to a 5-V system environment. These devices can be used as four
4-bit buffers, two 8-bit buffers, or one 16-bit buffer. These devices provide true outputs and symmetrical
active-low output-enable (OE) inputs.
The outputs, which are designed to source or sink up to 12 mA, include equivalent 22-Ω series resistors to
reduce overshoot and undershoot.
When VCC is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down.
However, to ensure the high-impedance state above 1.5 V, OE should be tied to VCC through a pullup resistor;
the minimum value of the resistor is determined by the current-sinking capability of the driver.
These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry
disables the outputs, preventing damaging current backflow through the devices when they are powered down.
The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,
which prevents driver conflict.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2000–2006, Texas Instruments Incorporated
SN54LVT162244A, SN74LVT162244A
3.3-V ABT 16-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
www.ti.com
SCBS718D – JUNE 2000 – REVISED DECEMBER 2006
DESCRIPTION/ORDERING INFORMATION (CONTINUED)
ORDERING INFORMATION
PACKAGE (1)
TA
FBGA – GRD
FBGA – ZRD (Pb-free)
ORDERABLE PART NUMBER
Reel of 1000
Tube of 25
SSOP – DL
Reel of 1000
–40°C to 85°C
TSSOP – DGG
Reel of 2000
TVSOP – DGV
Reel of 2000
VFBGA – GQL
VFBGA – ZQL
–55°C to 125°C
(1)
(2)
CFP – WD
Reel of 1000
Tube
SN74LVT162244AGRDR
TOP-SIDE MARKING
LZ244A
SN74LVT162244AZRDR
SN74LVT162244ADL
SN74LVT162244ADLG4
LVT162244A
SN74LVT162244ADLR
74LVT162244ADLRG4
SN74LVT162244ADGGR
LVT162244A
74LVT162244ADGGRE4
SN74LVT162244ADGVR
LZ244A
74LVT162244ADGVRE4
SN74LVT162244AGQLR
LZ244A
SN74LVT162244AZQLR
SNJ544LVT162244AWD (2)
SNJ54LVT162244AWD
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Product preview
GQL OR ZQL PACKAGE
(TOP VIEW)
TERMINAL ASSIGNMENTS (1)
(56-Ball GQL/ZQL Package)
1 2 3 4 5 6
1
2
3
4
5
6
A
1OE
NC
NC
NC
NC
2OE
B
1Y2
1Y1
GND
GND
1A1
1A2
C
1Y4
1Y3
VCC
VCC
1A3
1A4
D
2Y2
2Y1
GND
GND
2A1
2A2
E
2Y4
2Y3
2A3
2A4
F
3Y1
3Y2
3A2
3A1
G
3Y3
3Y4
GND
GND
3A4
3A3
H
4Y1
4Y2
VCC
VCC
4A2
4A1
xxx
J
4Y3
4Y4
GND
GND
4A4
4A3
xxx
K
4OE
NC
NC
NC
NC
3OE
A
B
C
D
E
F
G
H
J
K
xxx
xxx
2
(1)
NC – No internal connection
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SN54LVT162244A, SN74LVT162244A
3.3-V ABT 16-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
www.ti.com
SCBS718D – JUNE 2000 – REVISED DECEMBER 2006
TERMINAL ASSIGNMENTS (1)
(54-Ball GRD/ZRD Package)
GRD OR ZRD PACKAGE
(TOP VIEW)
1
2
3
4
5
1
2
3
4
5
6
A
1Y1
NC
1OE
2OE
NC
1A1
B
1Y3
1Y2
NC
NC
1A2
1A3
6
A
C
2Y1
1Y4
VCC
VCC
1A4
2A1
B
D
2Y3
2Y2
GND
GND
2A2
2A3
C
E
3Y1
2Y4
GND
GND
2A4
3A1
D
E
F
F
3Y3
3Y2
GND
GND
3A2
3A3
G
4Y1
3Y4
VCC
VCC
3A4
4A1
H
4Y3
4Y2
NC
NC
4A2
4A3
J
4Y4
NC
4OE
3OE
NC
4A4
G
H
J
(1)
NC – No internal connection
FUNCTION TABLE
(each 4-bit buffer/driver)
INPUTS
OE
A
OUTPUT
Y
L
H
H
L
L
L
H
X
Z
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SN54LVT162244A, SN74LVT162244A
3.3-V ABT 16-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
www.ti.com
SCBS718D – JUNE 2000 – REVISED DECEMBER 2006
LOGIC DIAGRAM (POSITIVE LOGIC)
1OE
1A1
1A2
1A3
1A4
2OE
2A1
2A2
2A3
2A4
1
3OE
47
2
46
3
44
5
43
6
1Y1
3A1
1Y2
3A2
1Y3
3A3
1Y4
3A4
48
4OE
41
8
40
9
38
11
37
12
2Y1
4A1
2Y2
4A2
2Y3
4A3
2Y4
4A4
Pin numbers shown are for the DGG, DGV, DL, and WD packages.
4
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25
36
13
35
14
33
16
32
17
3Y1
3Y2
3Y3
3Y4
24
30
19
29
20
27
22
26
23
4Y1
4Y2
4Y3
4Y4
SN54LVT162244A, SN74LVT162244A
3.3-V ABT 16-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
www.ti.com
SCBS718D – JUNE 2000 – REVISED DECEMBER 2006
Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
–0.5
4.6
V
VI
Input voltage range (2)
–0.5
7
V
–0.5
7
V
–0.5
VCC + 0.5
state (2)
UNIT
VO
Voltage range applied to any output in the high-impedance or power-off
VO
Voltage range applied to any output in the high state (2)
IO
Current into any output in the low state
IO
Current into any output in the high state (3)
IIK
Input clamp current
VI < 0
IOK
Output clamp current
VO < 0
–50
mA
θJA
Package thermal impedance (4)
(1)
(2)
(3)
(4)
mA
30
mA
–50
mA
DGG package
70
DGV package
58
DL package
63
GQL/ZQL package
42
GRD/ZRD package
Tstg
V
30
°C/W
36
Storage temperature range
–65
°C
150
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
This current flows only when the output is in the high state and VO > VCC.
The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions (1)
SN54LVT162244A (2)
SN74LVT162244A
MIN
MAX
MIN
MAX
2.7
3.6
2.7
3.6
UNIT
VCC
Supply voltage
VIH
High-level input voltage
VIL
Low-level input voltage
VI
Input voltage
5.5
5.5
V
IOH
High-level output current
–12
–12
mA
IOL
Low-level output current
12
12
mA
∆t/∆v
Input transition rise or fall rate
10
10
ns/V
2
0.8
Outputs enabled
∆t/∆VCC Power-up ramp rate
200
TA
–55
(1)
(2)
Operating free-air temperature
V
2
V
0.8
µs/V
200
125
–40
V
85
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
Product preview
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SN54LVT162244A, SN74LVT162244A
3.3-V ABT 16-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
www.ti.com
SCBS718D – JUNE 2000 – REVISED DECEMBER 2006
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
SN54LVT162244A (1)
TEST CONDITIONS
MIN
VIK
VCC = 2.7 V,
II = –18 mA
VOH
VCC = 3 V,
IOH = –12 mA
VOL
VCC = 3 V,
Control inputs
II
Data inputs
TYP (2)
SN74LVT162244A
MAX
MIN
TYP (2)
MAX
–1.2
–1.2
IOL = 12 mA
0.8
0.8
VCC = 0 or 3.6 V,
VI = 5.5 V
10
10
VCC = 3.6 V,
VI = VCC or GND
±1
±1
1
1
–5
–5
2
V
V
VI = VCC
VCC = 3.6 V
UNIT
VI = 0
V
µA
±100
µA
5
5
µA
–5
–5
µA
IOZPU
VCC = 0 to 1.5 V, VO = 0.5 V to 3 V,
OE = don't care
±100 (3)
±100
µA
IOZPD
VCC = 1.5 V to 0, VO = 0.5 V to 3 V,
OE = don't care
±100 (3)
±100
µA
VCC = 3.6 V,
IO = 0,
VI = VCC or GND
Outputs high
0.19
0.19
ICC
Ioff
VCC = 0,
VI or VO = 0 to 4.5 V
IOZH
VCC = 3.6 V,
VO = 3 V
IOZL
VCC = 3.6 V,
VO = 0.5 V
Outputs low
Outputs disabled
5
5
0.19
0.19
0.2
0.2
mA
∆ICC (4)
VCC = 3 V to 3.6 V, One input at VCC – 0.6
V, Other inputs at VCC or GND
Ci
VI = 3 V or 0
4
4
pF
Co
VO = 3 V or 0
9
9
pF
(1)
(2)
(3)
(4)
mA
Product preview
All typical values are at VCC = 3.3 V, TA = 25°C.
On products compliant to MIL-PRF-38535, this parameter is not production tested.
This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
Switching Characteristics
over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1)
SN54LVT162244A (1)
PARAMETER
tPLH
tPHL
tPZH
tPZL
tPHZ
tPLZ
(1)
(2)
6
FROM
(INPUT)
TO
(OUTPUT)
A
Y
OE
Y
OE
Y
VCC = 3.3 V
± 0.3 V
SN74LVT162244A
VCC = 2.7 V
VCC = 3.3 V
± 0.3 V
VCC = 2.7 V
MAX
MIN
TYP (2
)
4.6
5.1
1.4
3.4
4
4.8
3.9
4.5
1.2
2.9
3.6
4.1
1.1
5.4
6.7
1.2
3.9
5.1
6.5
1.3
4.9
6.1
1.4
3.8
4.5
5.8
1.6
5.9
6.5
2.2
4.4
5
5.4
1
5.9
5.8
2
4.2
5
5.4
MIN
MAX
1.1
1.1
MIN
MAX
tsk(LH)
0.5
tsk(HL)
0.5
Product preview
All typical values are at VCC = 3.3 V, TA = 25°C.
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MIN
UNIT
MAX
ns
ns
ns
ns
SN54LVT162244A, SN74LVT162244A
3.3-V ABT 16-BIT BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
www.ti.com
SCBS718D – JUNE 2000 – REVISED DECEMBER 2006
PARAMETER MEASUREMENT INFORMATION
6V
500 Ω
From Output
Under Test
S1
Open
GND
CL = 50 pF
(see Note A)
500 Ω
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
6V
GND
2.7 V
LOAD CIRCUIT
Timing Input
1.5 V
0V
tw
tsu
2.7 V
Input
1.5 V
th
2.7 V
1.5 V
Data Input
1.5 V
1.5 V
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
2.7 V
Input
1.5 V
1.5 V
0V
tPHL
tPLH
VOH
Output
1.5 V
1.5 V
VOL
tPHL
Output
Waveform 1
S1 at 6 V
(see Note B)
1.5 V
1.5 V
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
1.5 V
1.5 V
0V
tPZL
tPLZ
3V
1.5 V
tPZH
tPLH
VOH
Output
2.7 V
Output
Control
Output
Waveform 2
S1 at GND
(see Note B)
VOL + 0.3 V
VOL
tPHZ
1.5 V
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time, with one transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
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PACKAGE OPTION ADDENDUM
www.ti.com
27-Sep-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
74LVT162244ADGGRE4
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74LVT162244ADGGRG4
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74LVT162244ADGVRE4
ACTIVE
TVSOP
DGV
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74LVT162244ADGVRG4
ACTIVE
TVSOP
DGV
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74LVT162244ADLRG4
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVT162244ADGGR
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVT162244ADGVR
ACTIVE
TVSOP
DGV
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVT162244ADL
ACTIVE
SSOP
DL
48
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVT162244ADLG4
ACTIVE
SSOP
DL
48
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVT162244ADLR
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVT162244AGQLR
NRND
BGA MI
CROSTA
R JUNI
OR
GQL
56
1000
TBD
SNPB
Level-1-240C-UNLIM
SN74LVT162244AGRDR
ACTIVE
BGA MI
CROSTA
R JUNI
OR
GRD
54
1000
TBD
SNPB
Level-1-240C-UNLIM
SN74LVT162244AZQLR
ACTIVE
BGA MI
CROSTA
R JUNI
OR
ZQL
56
1000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
SN74LVT162244AZRDR
ACTIVE
BGA MI
CROSTA
R JUNI
OR
ZRD
54
1000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
27-Sep-2007
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
28-Feb-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
9.0
16.0
2.0
12.0
24.0
Q1
SN74LVT162244ADGGR TSSOP
DGG
48
2000
330.0
24.0
SN74LVT162244ADGVR
TVSOP
DGV
48
2000
330.0
24.0
7.0
10.0
2.0
12.0
24.0
Q1
SN74LVT162244ADLR
SSOP
DL
48
1000
330.0
32.0
11.0
16.0
3.0
16.0
32.0
Q1
SN74LVT162244AGQLR BGA MI
CROSTA
R JUNI
OR
GQL
56
1000
330.0
16.0
5.0
7.0
1.0
8.0
16.0
Q1
SN74LVT162244AGRDR BGA MI
CROSTA
R JUNI
OR
GRD
54
1000
330.0
16.0
6.0
8.0
2.0
8.0
16.0
Q1
SN74LVT162244AZQLR BGA MI
CROSTA
R JUNI
OR
ZQL
56
1000
330.0
16.0
5.0
7.0
1.0
8.0
16.0
Q1
SN74LVT162244AZRDR BGA MI
CROSTA
R JUNI
OR
ZRD
54
1000
330.0
16.0
6.0
8.0
2.0
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
28-Feb-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74LVT162244ADGGR
TSSOP
DGG
48
2000
346.0
346.0
41.0
SN74LVT162244ADGVR
TVSOP
DGV
48
2000
346.0
346.0
41.0
SN74LVT162244ADLR
SSOP
DL
48
1000
346.0
346.0
49.0
SN74LVT162244AGQLR BGA MICROSTAR
JUNIOR
GQL
56
1000
346.0
346.0
33.0
SN74LVT162244AGRDR BGA MICROSTAR
JUNIOR
GRD
54
1000
346.0
346.0
33.0
SN74LVT162244AZQLR BGA MICROSTAR
JUNIOR
ZQL
56
1000
346.0
346.0
33.0
SN74LVT162244AZRDR BGA MICROSTAR
JUNIOR
ZRD
54
1000
346.0
346.0
33.0
Pack Materials-Page 2
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
0.0135 (0,343)
0.008 (0,203)
48
0.005 (0,13) M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
1
0°–ā8°
24
0.040 (1,02)
A
0.020 (0,51)
Seating Plane
0.110 (2,79) MAX
0.004 (0,10)
0.008 (0,20) MIN
PINS **
28
48
56
A MAX
0.380
(9,65)
0.630
(16,00)
0.730
(18,54)
A MIN
0.370
(9,40)
0.620
(15,75)
0.720
(18,29)
DIM
4040048 / E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
Falls within JEDEC MO-118
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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