TI SN74LVT162245ADL

SN54LVT162245A,, SN74LVT162245A
3.3-V ABT 16-BIT BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
www.ti.com
FEATURES
•
•
•
•
•
•
•
•
•
•
Members of the Texas Instruments Widebus™
Family
A-Port Outputs Have Equivalent 22-Ω Series
Resistors, So No External Resistors Are
Required
Supprt Mixed-Mode Signal Operation (5-V
Input and Output Voltages With 3.3-V VCC)
Support Unregulated Battery Operation Down
to 2.7 V
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
Ioff and Power-Up 3-State Support Hot
Insertion
Distributed VCC and GND Pins Minimize
High-Speed Switching Noise
Flow-Through Architecture Optimizes PCB
Layout
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
SCBS714D – FEBRUARY 2000 – REVISED NOVEMBER 2006
SN54LVT162245A . . . WD PACKAGE
SN74LVT162245A . . . DGG OR DL PACKAGE
(TOP VIEW)
1DIR
1B1
1B2
GND
1B3
1B4
VCC
1B5
1B6
GND
1B7
1B8
2B1
2B2
GND
2B3
2B4
VCC
2B5
2B6
GND
2B7
2B8
2DIR
1
48
2
47
3
46
4
45
5
44
6
43
7
42
8
41
9
40
10
39
11
38
12
37
13
36
14
35
15
34
16
33
17
32
18
31
19
30
20
29
21
28
22
27
23
26
24
25
1OE
1A1
1A2
GND
1A3
1A4
VCC
1A5
1A6
GND
1A7
1A8
2A1
2A2
GND
2A3
2A4
VCC
2A5
2A6
GND
2A7
2A8
2OE
DESCRIPTION/ORDERING INFORMATION
The 'LVT162245A devices are 16-bit (dual-octal) noninverting 3-state transceivers designed for low-voltage
(3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.
These devices are designed for asynchronous communication between two data buses. The logic levels of the
direction-control (DIR) input and the output-enable (OE) input activate either the B-port outputs or the A-port
outputs or place both output ports into the high-impedance mode. The device transmits data from the A bus to
the B bus when the B-port outputs are activated, and from the B bus to the A bus when the A-port outputs are
activated. The input circuitry on both A and B ports is always active and must have a logic HIGH or LOW level
applied to prevent excess ICC and ICCZ.
The A-port outputs, which are designed to source or sink up to 12 mA, include equivalent 22-Ω series resistors
to reduce overshoot and undershoot.
When VCC is between 0 and 1.5 V, the devices are in the high-impedance state during power up or power down.
However, to ensure the high-impedance state above 1.5 V, OE should be tied to VCC through a pullup resistor;
the minimum value of the resistor is determined by the current-sinking capability of the driver.
These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry
disables the outputs, preventing damaging current backflow through the devices when they are powered down.
The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,
which prevents driver conflict.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2000–2006, Texas Instruments Incorporated
SN54LVT162245A,, SN74LVT162245A
3.3-V ABT 16-BIT BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
www.ti.com
SCBS714D – FEBRUARY 2000 – REVISED NOVEMBER 2006
ORDERING INFORMATION
PACKAGE (1)
TA
FBGA – GRD
FBGA – ZRD (Pb-free)
Reel of 1000
Tube of 25
SSOP – DL
–40°C to 85°C
Reel of 1000
TSSOP – DGG
VFBGA – GQL
VFBGA – ZQL (Pb-free)
–55°C to 125°C
(1)
(2)
CFP – WD
Reel of 2000
Reel of 1000
Tube
ORDERABLE PART NUMBER
SN74LVT162245AGRDR
TOP-SIDE MARKING
LZ245A
SN74LVT162245AZRDR
SN74LVT162245ADL
SN74LVT162245ADLG4
LVT162245A
SN74LVT162245ADLR
74LVT162245ADLRG4
SN74LVT162245ADGGR
LVT162245A
74LVT162245ADGGRE4
SN74LVT162245AGQLR
LZ245A
SN74LVT162245AZQLR
SNJ54LVT162245AWD (2)
SNJ54LVT162245AWD
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Product preview
GQL OR ZQL PACKAGE
(TOP VIEW)
TERMINAL ASSIGNMENTS (1)
(56-Ball GQL/ZQL Package)
1 2 3 4 5 6
A
B
C
D
E
F
G
H
J
K
1
2
3
4
5
6
A
1DIR
NC
NC
NC
NC
1OE
B
1B2
1B1
GND
GND
1A1
1A2
C
1B4
1B3
VCC
VCC
1A3
1A4
D
1B6
1B5
GND
GND
1A5
1A6
E
1B8
1B7
1A7
1A8
F
2B1
2B2
2A2
2A1
G
2B3
2B4
GND
GND
2A4
2A3
H
2B5
2B6
VCC
VCC
2A6
2A5
J
2B7
2B8
GND
GND
2A8
2A7
K
2DIR
NC
NC
NC
NC
2OE
xxx
(1)
xxx
NC – No internal connection
GRD OR ZRD PACKAGE
(TOP VIEW)
1
2
3
4
5
6
TERMINAL ASSIGNMENTS (1)
(54-Ball GRD/ZRD Package)
A
B
1
2
3
4
5
6
A
1B1
NC
1DIR
1OE
NC
1A1
B
1B3
1B2
NC
NC
1A2
1A3
C
1B5
1B4
VCC
VCC
1A4
1A5
C
D
1B7
1B6
GND
GND
1A6
1A7
D
E
2B1
1B8
GND
GND
1A8
2A1
F
2B3
2B2
GND
GND
2A2
2A3
G
2B5
2B4
VCC
VCC
2A4
2A5
H
2B7
2B6
NC
NC
2A6
2A7
J
2B8
NC
2DIR
2OE
NC
2A8
E
F
G
H
J
(1)
2
NC – No internal connection
Submit Documentation Feedback
SN54LVT162245A,, SN74LVT162245A
3.3-V ABT 16-BIT BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
www.ti.com
SCBS714D – FEBRUARY 2000 – REVISED NOVEMBER 2006
FUNCTION TABLE (1)
(EACH 8-BIT SECTION)
CONTROL INPUTS
(1)
OUTPUT CIRCUITS
OPERATION
OE
DIR
A PORT
B PORT
L
L
Enabled
Hi-Z
B data to A bus
L
H
Hi-Z
Enabled
A data to B bus
H
X
Hi-Z
Hi-Z
Isolation
Input circuits of the data I/Os always are active.
LOGIC DIAGRAM (POSITIVE LOGIC)
1DIR
1
2DIR
48
1A1
25
1OE
47
2A1
2
24
2OE
36
13
1B1
2B1
To Seven Other Channels
To Seven Other Channels
Submit Documentation Feedback
3
SN54LVT162245A,, SN74LVT162245A
3.3-V ABT 16-BIT BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
www.ti.com
SCBS714D – FEBRUARY 2000 – REVISED NOVEMBER 2006
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
–0.5
4.6
V
VI
Input voltage range (2)
–0.5
7
V
–0.5
7
V
–0.5
VCC + 0.5
V
VO
Voltage range applied to any output in the high-impedance or power-off
VO
Voltage range applied to any output in the high state (2)
IO
Current into any output in the low state
IO
Current into any output in the high
state (3)
state (2)
SN54LVT162245A (B port)
96
SN74LVT162245A (B port)
128
A port
30
SN54LVT162245A (B port)
48
SN74LVT162245A (B port)
64
A port
30
UNIT
mA
mA
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
θJA
Package thermal impedance (4)
Tstg
Storage temperature range
DGG package
70
DL package
63
GQL/ZQL package
42
GRD/ZRD package
(1)
(2)
(3)
(4)
°C/W
36
–65
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
This current flows only when the output is in the high state and VO > VCC.
The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions (1)
SN54LVT162245A (2)
MAX
MIN
MAX
2.7
3.6
2.7
3.6
UNIT
VCC
Supply voltage
VIH
High-level input voltage
VIL
Low-level input voltage
0.8
0.8
V
VI
Input voltage
5.5
5.5
V
IOH
High-level output current
A port
–12
–12
B port
–24
–32
IOL
Low-level output current
A port
12
12
B port
48
64
∆t/∆v
Input transition rise or fall rate
2
Outputs enabled
200
TA
–55
(2)
Operating free-air temperature
2
10
∆t/∆VCC Power-up ramp rate
(1)
4
SN74LVT162245A
MIN
V
10
–40
mA
mA
ns/V
µs/V
200
125
V
85
°C
All unused or driven (floating) data inputs (I/Os) of the device must be held at logic HIGH or LOW (preferably VCCI or GND) to ensure
proper device operation and minimize power. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature
number SCBA004.
Product preview
Submit Documentation Feedback
SN54LVT162245A,, SN74LVT162245A
3.3-V ABT 16-BIT BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
www.ti.com
SCBS714D – FEBRUARY 2000 – REVISED NOVEMBER 2006
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
VIK
A port
VOH
B port
MIN TYP (2)
SN54LVT162245A
MAX
MIN TYP (2)
VCC = 2.7 V,
II = –18 mA
VCC = 2.7 V to 3.6 V,
IOH = –100 µA
VCC – 0.2
VCC = 3 V,
IOH = –12 mA
2
2
VCC = 2.7 V to 3.6 V,
IOH = –100 µA
VCC – 0.2
VCC – 0.2
VCC = 2.7 V,
IOH = –8 mA
2.4
2.4
VCC = 3 V
A port
SN54LVT162245A (1)
TEST CONDITIONS
IOH = –24 mA
–1.2
–1.2
2
IOH = –32 mA
2
IOL = 100 µA
0.2
0.2
IOL = 12 mA
0.8
0.8
IOL = 100 µA
0.2
0.2
IOL = 24 mA
0.5
0.5
IOL = 16 mA
0.4
0.4
IOL = 32 mA
0.5
0.5
IOL = 48 mA
0.55
B port
VCC = 3 V
IOL = 64 mA
II
A or B
port (3)
VI = VCC or GND
±1
±1
VCC = 0 or 3.6 V,
VI = 5.5 V
10
10
VI = 5.5 V
20
20
5
5
VI = VCC
VI = 0
–10
Ioff
VCC = 0,
IOZPU
VCC = 0 to 1.5 V, VO = 0.5 V to 3 V,
OE = don't care
IOZPD
VCC = 1.5 to 0 V, VO = 0.5 V to 3 V,
OE = don't care
ICC
VCC = 3.6 V,
IO = 0,
VI = VCC or GND
V
0.55
VCC = 3.6 V,
VCC = 3.6 V
V
V
VCC = 3 V,
VOL
UNIT
VCC – 0.2
VCC = 2.7 V to 3.6 V,
VCC = 2.7 V
Control
inputs
MAX
–10
±100
µA
±100 (4)
±100
µA
±100 (4)
±100
µA
0.19
0.19
VI or VO = 0 to 4.5 V
Outputs high
Outputs low
Outputs disabled
µA
5
5
0.19
0.19
0.3
0.2
mA
∆ICC (5)
VCC = 3 V to 3.6 V,
One input at VCC – 0.6 V,
Other inputs at VCC or GND
Ci
VI = 3 V or 0
4
4
pF
Cio
VO = 3 V or 0
10
10
pF
(1)
(2)
(3)
(4)
(5)
mA
Product preview
All typical values are at VCC = 3.3 V, TA = 25°C.
Unused pins at VCC or GND
On products compliant to MIL-PRF-38535, this parameter is not production tested.
This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
Submit Documentation Feedback
5
SN54LVT162245A,, SN74LVT162245A
3.3-V ABT 16-BIT BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
www.ti.com
SCBS714D – FEBRUARY 2000 – REVISED NOVEMBER 2006
Switching Characteristics
over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1)
SN54LVT162245A (1)
PARAMETER
tPLH
tPHL
tPLH
tPHL
tPZH
tPZL
tPZH
tPZL
tPHZ
tPLZ
tPHZ
tPLZ
(1)
(2)
6
FROM
(INPUT)
TO
(OUTPUT)
A
B
B
A
OE
B
OE
A
OE
B
OE
A
VCC = 3.3 V
± 0.3 V
SN74LVT162245A
VCC = 3.3 V
± 0.3 V
VCC = 2.7 V
MIN
MAX
VCC = 2.7 V
MIN TYP (2) MAX
MIN
MAX
1
3.5
4
1
2.3
3.3
3.7
1
3.5
3.9
1
2.2
3.3
3.5
1
4.3
5.3
1
2.8
4
4.6
1
4.2
4.5
1
2.5
3.4
3.6
1
4.8
5.9
1
2.8
4.6
5.4
1
4.8
5.5
1
3
4.6
5.2
1
5.5
7.2
1
3.3
5.3
6.3
1
5.4
6.4
1
3.3
5.1
5.8
1.5
5.5
5.8
1.5
3.8
5.2
5.5
1.5
5.5
5.8
1.5
3.5
5.1
5.4
1.5
5.8
6.5
1.5
4
5.6
5.9
1.2
6.3
6.3
1.5
3.8
5.5
5.5
tsk(LH)
0.5
tsk(HL)
0.5
Product preview
All typical values are at VCC = 3.3 V, TA = 25°C.
Submit Documentation Feedback
UNIT
MIN MAX
ns
ns
ns
ns
ns
ns
ns
SN54LVT162245A,, SN74LVT162245A
3.3-V ABT 16-BIT BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
www.ti.com
SCBS714D – FEBRUARY 2000 – REVISED NOVEMBER 2006
PARAMETER MEASUREMENT INFORMATION
500 Ω
From Output
Under Test
6V
Open
S1
GND
CL = 50 pF
(see Note A)
500 Ω
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
6V
GND
2.7 V
LOAD CIRCUIT
Timing Input
1.5 V
0V
tw
tsu
2.7 V
1.5 V
Input
1.5 V
th
2.7 V
Data Input
1.5 V
1.5 V
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
2.7 V
1.5 V
Input
1.5 V
0V
tPLH
tPHL
VOH
1.5 V
Output
1.5 V
VOL
tPHL
Output
Waveform 1
S1 at 6 V
(see Note B)
1.5 V
1.5 V
1.5 V
VOL
tPZL
tPLZ
3V
1.5 V
Output
Waveform 2
S1 at GND
(see Note B)
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
1.5 V
0V
tPZH
tPLH
VOH
Output
2.7 V
Output
Control
VOL + 0.3 V
VOL
tPHZ
1.5 V
VOH − 0.3 V
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns.
D. The outputs are measured one at a time, with one transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
Submit Documentation Feedback
7
PACKAGE OPTION ADDENDUM
www.ti.com
27-Sep-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
74LVT162245ADGGRE4
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74LVT162245ADGGRG4
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74LVT162245ADLRG4
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVT162245ADGGR
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVT162245ADL
ACTIVE
SSOP
DL
48
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVT162245ADLG4
ACTIVE
SSOP
DL
48
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVT162245ADLR
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LVT162245AGQLR
NRND
BGA MI
CROSTA
R JUNI
OR
GQL
56
1000
TBD
SNPB
Level-1-240C-UNLIM
SN74LVT162245AGRDR
ACTIVE
BGA MI
CROSTA
R JUNI
OR
GRD
54
1000
TBD
SNPB
Level-1-240C-UNLIM
SN74LVT162245AZQLR
ACTIVE
BGA MI
CROSTA
R JUNI
OR
ZQL
56
1000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
SN74LVT162245AZRDR
ACTIVE
BGA MI
CROSTA
R JUNI
OR
ZRD
54
1000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
27-Sep-2007
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SN74LVT162245ADGGR TSSOP
SN74LVT162245ADLR
SSOP
SPQ
Reel
Reel
Diameter Width
(mm) W1 (mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
1.8
12.0
24.0
Q1
DGG
48
2000
330.0
24.4
8.6
15.8
DL
48
1000
330.0
32.4
11.35
16.2
3.1
16.0
32.0
Q1
SN74LVT162245AGQLR BGA MI
CROSTA
R JUNI
OR
GQL
56
1000
330.0
16.4
4.8
7.3
1.45
8.0
16.0
Q1
SN74LVT162245AGRDR BGA MI
CROSTA
R JUNI
OR
GRD
54
1000
330.0
16.4
5.8
8.3
1.55
8.0
16.0
Q1
SN74LVT162245AZQLR BGA MI
CROSTA
R JUNI
OR
ZQL
56
1000
330.0
16.4
4.8
7.3
1.45
8.0
16.0
Q1
SN74LVT162245AZRDR BGA MI
CROSTA
R JUNI
OR
ZRD
54
1000
330.0
16.4
5.8
8.3
1.55
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
SN74LVT162245ADGGR
TSSOP
DGG
48
2000
346.0
346.0
41.0
SN74LVT162245ADLR
SSOP
DL
48
1000
346.0
346.0
49.0
SN74LVT162245AGQLR BGA MICROSTAR
JUNIOR
GQL
56
1000
346.0
346.0
33.0
SN74LVT162245AGRDR BGA MICROSTAR
JUNIOR
GRD
54
1000
346.0
346.0
33.0
SN74LVT162245AZQLR BGA MICROSTAR
JUNIOR
ZQL
56
1000
346.0
346.0
33.0
SN74LVT162245AZRDR BGA MICROSTAR
JUNIOR
ZRD
54
1000
346.0
346.0
33.0
Pack Materials-Page 2
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
0.0135 (0,343)
0.008 (0,203)
48
0.005 (0,13) M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
1
0°–ā8°
24
0.040 (1,02)
A
0.020 (0,51)
Seating Plane
0.110 (2,79) MAX
0.004 (0,10)
0.008 (0,20) MIN
PINS **
28
48
56
A MAX
0.380
(9,65)
0.630
(16,00)
0.730
(18,54)
A MIN
0.370
(9,40)
0.620
(15,75)
0.720
(18,29)
DIM
4040048 / E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
Falls within JEDEC MO-118
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Data Converters
DSP
Clocks and Timers
Interface
Logic
Power Mgmt
Microcontrollers
RFID
RF/IF and ZigBee® Solutions
amplifier.ti.com
dataconverter.ti.com
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/lprf
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
Telephony
Video & Imaging
Wireless
www.ti.com/audio
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2008, Texas Instruments Incorporated