CALOGIC X2N5114-16

P-Channel JFET Switch
CORPORATION
2N5114 – 2N5116
GENERAL DESCRIPTION
ABSOLUTE MAXIMUM RATINGS
(TA = 25oC unless otherwise noted)
Ideal for inverting switching or "Virtual Gnd" switching into
inverting input of Op. Amp. No driver is required and ±10VAC
signals can be handled using only +5V logic (TTL or CMOS).
Gate-Drain or Gate-Source Voltage . . . . . . . . . . . . . . . . . 30V
Gate Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA
Storage Temperature Range . . . . . . . . . . . . . -65oC to +200oC
Operating Temperature Range . . . . . . . . . . . -55oC to +200oC
Lead Temperature (Soldering, 10sec) . . . . . . . . . . . . . +300oC
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500mW
Derate above 25oC . . . . . . . . . . . . . . . . . . . . . . . . 3mW/ oC
FEATURES
ON Resistance
• Low
• ID(off)<500pA
• Switches directly from TTL Logic
NOTE: Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or
any other conditions above those indicated in the operational sections
of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
PIN CONFIGURATION
ORDERING INFORMATION
Part
TO-18
D
5508
G,C
Package
Temperature Range
2N5114-16 Hermetic TO-18
X2N5114-16 Sorted Chips in Carriers
-55oC to +200oC
-55oC to +200oC
S
SWITCHING CHARACTERISTICS (TA = 25oC unless otherwise specified)
SYMBOL
PARAMETER
2N5114
MAX
2N5115
MAX
2N5116
MAX
12
td
Turn-ON Delay Time
6
10
tr
Rise Time (Note 2)
10
20
30
toff
Turn-OFF Delay Time (Note 2)
6
8
10
tf
Fall Time (Note 2)
15
30
50
UNITS
ns
ELECTRICAL CHARACTERISTICS (TA = 25oC unless otherwise specified)
SYMBOL
PARAMETER
BVGSS
Gate-Source Breakdown Voltage
IGSS
Gate Reverse Current
ID(off)
Drain Cutoff Current
VP
Gate-Source Pinch-Off Voltage
2N5114
MIN
MAX
30
5
2N5115
MIN
MAX
30
2N5116
MIN
MAX
30
UNITS
V
500
500
500
pA
1.0
1.0
1.0
µA
-500
-500
-500
pA
-1.0
-1.0
-1.0
µA
4
V
10
3
6
1
TEST CONDITIONS
IG = 1µA, VDS = 0
VGS = 20V, VDS = 0
TA 150oC
VDS = -15V
VGS = 12V (2N5114)
VGS = 7V (2N5115)
VGS = 5V (2N5116)
VDS = -15V, ID = -1nA
2N5114 – 2N5116
CORPORATION
ELECTRICAL CHARACTERISTICS (TA = 25oC unless otherwise specified) (Continued)
SYMBOL
2N5114
MIN
MAX
PARAMETER
2N5115
MIN
MAX
2N5116
MIN
MAX
IDSS
Drain Current at Zero Gate Voltage
(Note 1)
VGS(f)
Forward Gate-Source Voltage
VDS(on)
Drain-Source ON Voltage
rDS(on)
Static Drain-Source ON Resistance
rds(on)
Small-Signal Drain-Source ON
Resistance
75
100
150
Ciss
Common-Source Input Capacitance
(Note 2)
25
25
25
-30
-90
-60
-5
-25
-1
-1
-1
-1.3
-0.8
-0.6
75
100
150
TEST CONDITIONS
VGS = -0
VDS = -18V (2N5114)
VDS = -15V (2N5115)
VDS = -15V (2N5116)
mA
IG = -1mA, VDS = 0
VGS = 0
ID = -15mA (2N5114)
ID = -7mA (2N5115)
ID = -3mA (2N5116)
V
VGS = 0, I D = -1mA
Ω
VGS = 0, I D = 0, f = 1kHz
VDS = -15V, VGS = 0,
f = 1mHz
VDS = 0
VGS = 12V (2N5114)
VGS = 7V (2N5115)
VGS = 5V (2N5116)
f = 1mHz
pF
Common-Source Reverse Transfer
Capacitance (Note 2)
Crss
-15
UNITS
7
7
7
NOTES 1. Pulse test; duration = 2ms.
2. For design reference only, not 100% tested.
VGG
TEST CONDITIONS
VDD
VGG
2N5114
2N5115
2N5116
-10V
-6V
-6V
20V
12V
430Ω
910Ω
2KΩ
RG
100Ω
220Ω
390Ω
VIN
-7mA
-3mA
-12V
-7V
-5V
0.1µF
90%
VIN
RG
VIN
tOFF
td
tr
51Ω
VDS(ON)
1.2K
7.5K
90%
-6V
-15mA
RL
1.2K
10%
8V
RL
ID(ON)
VDD
INPUT
10%
51Ω
10%
SAMPLING
SCOPE
51Ω
tr
OUTPUT
0040
SAMPLING SCOPE
RISE TIME 0.4ns
INPUT RESISTANCE 10MΩ
INPUT CAPACITANCE 1.5pF
0050
TYPICAL PERFORMANCE CHARACTERISTICS
Vp vs IDSS
Vp vs g fs
10.0
9.0
8.0
7.0
6.0
5.0
10.0
9.0
8.0
7.0
6.0
5.0
4.0
4.0
4.0
3.0
3.0
VDS = 0.1V
VGS = 0
2.0
1.0
0.9
0.8
0.7
0.6
0.5
3.0
VDS = 20V
VGS = 0
(pulsed)
2.0
Vp (V)
Vp (V)
Vp (V)
Vp vs rDS(ON)
10.0
9.0
8.0
7.0
6.0
5.0
1.0
0.9
0.8
0.7
0.6
0.5
10
30
100
300
1,000
rDS(ON) (ohms)
1.0
0.9
0.8
0.7
0.6
0.5
1
3
10
30
100
1,000
3,000
10,000
30,000
100,000
g fs (µV)
t DSS (mA)
0060
VDS = 20V
VGS = 0
(pulsed)
2.0
0070
0080