[ /Title (CD74 HC406 0, CD74 HCT40 60) /Subject (High Speed CMOS CD54HC4060, CD74HC4060, CD54HCT4060, CD74HCT4060 Data sheet acquired from Harris Semiconductor SCHS207G High-Speed CMOS Logic 14-Stage Binary Counter with Oscillator February 1998 - Revised October 2003 the negative transition of φI (and φO). All inputs and outputs are buffered. Schmitt trigger action on the input-pulse-line permits unlimited rise and fall times. Features • Onboard Oscillator • Common Reset In order to achieve a symmetrical waveform in the oscillator section the HCT4060 input pulse switch points are the same as in the HC4060; only the MR input in the HCT4060 has TTL switching levels. • Negative-Edge Clocking • Fanout (Over Temperature Range) - Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads - Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads Ordering Information • Wide Operating Temperature Range . . . -55oC to 125oC TEMP. RANGE (oC) PACKAGE CD54HC4060F3A -55 to 125 16 Ld CERDIP CD54HCT4060F3A -55 to 125 16 Ld CERDIP CD74HC4060E -55 to 125 16 Ld PDIP CD74HC4060M -55 to 125 16 Ld SOIC CD74HC4060MT -55 to 125 16 Ld SOIC CD74HC4060M96 -55 to 125 16 Ld SOIC CD74HC4060PW -55 to 125 16 Ld TSSOP CD74HC4060PWR -55 to 125 16 Ld TSSOP CD74HC4060PWT -55 to 125 16 Ld TSSOP CD74HCT4060E -55 to 125 16 Ld PDIP CD74HCT4060M -55 to 125 16 Ld SOIC CD74HCT4060MT -55 to 125 16 Ld SOIC CD74HCT4060M96 -55 to 125 16 Ld SOIC PART NUMBER • Balanced Propagation Delay and Transition Times • Significant Power Reduction Compared to LSTTL Logic ICs • HC Types - 2V to 6V Operation - High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V • HCT Types - 4.5V to 5.5V Operation - Direct LSTTL Input Logic Compatibility, VIL= 0.8V (Max), VIH = 2V (Min) - CMOS Input Compatibility, Il ≤ 1µA at VOL, VOH Description The ’HC4060 and ’HCT4060 each consist of an oscillator section and 14 ripple-carry binary counter stages. The oscillator configuration allows design of either RC or crystal oscillator circuits. A Master Reset input is provided which resets the counter to the all-0’s state and disables the oscillator. A high level on the MR line accomplishes the reset function. All counter stages are master-slave flip-flops. The state of the counter is advanced one step in binary order on NOTE: When ordering, use the entire part number. The suffixes 96 and R denote tape and reel. The suffix T denotes a small-quantity reel of 250. Pinout CD54HC4060, CD54HCT4060 (CERDIP) CD74HC4060 (PDIP, SOIC, TSSOP) CD74HCT4060 (PDIP, SOIC) TOP VIEW Q12 1 16 VCC Q13 2 15 Q10 Q14 3 14 Q8 Q6 4 13 Q9 Q5 5 12 MR Q7 6 11 φI Q4 7 10 φO GND 8 9 φO CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright © 2003, Texas Instruments Incorporated 1 CD54/74HC4060, CD54/74HCT4060 Functional Diagram 7 Q4 5 Q5 4 12 Q6 MR 6 Q7 φI 14 14-STAGE RIPPLE COUNTER AND OSCILLATOR 11 Q8 13 Q9 15 Q10 1 Q12 2 Q13 3 Q14 φO φO øO øO ø1 9 GND = 8 VCC = 16 10 9 ø1 ø4 Q1 FF1 11 ø1 FF4 ø4 Q1 R MR ø5 Q4 ø14 Q13 Q14 10 FF5 - FF13 ø5 Q4 R FF14 ø14 Q13 Q14 R R 12 7 2 Q4 5, 4, 6, 14, 13, 15, 1 Q13 Q5 - Q10, Q12 FIGURE 1. LOGIC BLOCK DIAGRAM TRUTH TABLE øI MR OUTPUT STATE ↑ L No Change ↓ L Advance to Next State X H All Outputs are Low 2 3 Q14 CD54/74HC4060, CD54/74HCT4060 Absolute Maximum Ratings Thermal Information DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA DC Drain Current, per Output, IO For -0.5V < VO < VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±25mA DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±50mA Thermal Resistance (Typical, Note 1) θJA (oC/W) E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . 67 M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . 73 PW (TSSOP) Package . . . . . . . . . . . . . . . . . . . . . . 108 Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) Operating Conditions Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Time 2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max) 4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max) 6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. The package thermal impedance is calculated in accordance with JESD 51-7. DC Electrical Specifications TEST CONDITIONS PARAMETER 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL VI (V) IO (mA) VCC (V) VIH - - 2 1.5 - - 1.5 4.5 3.15 - - 3.15 - 3.15 - V 6 4.2 - - 4.2 - 4.2 - V MIN TYP MAX MIN MAX MIN MAX UNITS - 1.5 - V HC TYPES High Level Input Voltage Low Level Input Voltage High Level Output Voltage Q Outputs CMOS Loads VIL VOH - VIH or VIL High Level Output Voltage Q Outputs TTL Loads Low Level Output Voltage Q Outputs CMOS Loads VOL VIH or VIL Low Level Output Voltage Q Outputs TTL Loads High-Level Output Voltage φO Output (Pin 10) CMOS Loads VOH VCC or GND - 2 - - 0.5 - 0.5 - 0.5 V 4.5 - - 1.35 - 1.35 - 1.35 V 6 - - 1.8 - 1.8 - 1.8 V -0.02 2 1.9 - - 1.9 - 1.9 - V -0.02 4.5 4.4 - - 4.4 - 4.4 - V -0.02 6 5.9 - - 5.9 - 5.9 - V - - - - - - - - - V -4 4.5 3.98 - - 3.84 - 3.7 - V -5.2 6 5.48 - - 5.34 - 5.2 - V 0.02 2 - - 0.1 - 0.1 - 0.1 V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 0.02 6 - - 0.1 - 0.1 - 0.1 V - - - - - - - - - V 4 4.5 - - 0.26 - 0.33 - 0.4 V 5.2 6 - - 0.26 - 0.33 - 0.4 V -0.02 2 1.9 - - 1.9 - 1.9 - V -0.02 4.5 4.4 - - 4.4 - 4.4 - V -0.02 6 5.9 - - 5.9 - 5.9 - V 3 CD54/74HC4060, CD54/74HCT4060 DC Electrical Specifications (Continued) TEST CONDITIONS 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL VI (V) IO (mA) VCC (V) High-Level Output Voltage φO Output (Pin 10) TTL Loads (Note 2) VOH VCC or GND -2.6 4.5 3.98 - - 3.84 - 3.7 - V -3.3 6 5.48 - - 5.34 - 5.2 - V Low-Level Output Voltage φO Output (Pin 10) CMOS Loads VOL VCC or GND 0.02 2 - - 0.1 - 0.1 - 0.1 V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 0.02 6 - - 0.1 - 0.1 - 0.1 V Low-Level Output Voltage φO Output (Pin 10) TTL Loads VOL VCC or GND 2.6 4.5 - - 0.26 - 0.33 - 0.4 V 3.3 6 - - 0.26 - 0.33 - 0.4 V High-Level Output Voltage φO Output (Pin 9) TTL Loads VOH VIL or VIH -3.2 4.5 3.98 - - 3.84 - 3.7 - V -4.2 6 5.48 - - 5.34 - 5.2 - V Low-Level Output Voltage φO Output (Pin 9) TTL Loads VOL -2.6 4.5 - - 0.26 - 0.33 - 0.4 V -3.3 6 - - 0.26 - 0.33 - 0.4 V PARAMETER VIL or VIH MIN TYP MAX MIN MAX MIN MAX UNITS II VCC or GND - 6 - - ±0.1 - ±1 - ±1 µA ICC VCC or GND 0 6 - - 8 - 80 - 160 µA High Level Input Voltage VIH - - 4.5 to 5.5 2 - - 2 - 2 - V Low Level Input Voltage VIL - - 4.5 to 5.5 - - 0.8 - 0.8 - 0.8 V High Level Output Voltage Q Outputs CMOS Loads VOH VIH or VIL (Note 3) -0.02 4.5 4.4 - - 4.4 - 4.4 - V -4 4.5 3.98 - - 3.84 - 3.7 - V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 4 4.5 - - 0.26 - 0.33 - 0.4 V Input Leakage Current Quiescent Device Current HCT TYPES High Level Output Voltage Q Outputs TTL Loads Low Level Output Voltage Q Outputs CMOS Loads VOL VIH or VIL (Note 3) Low Level Output Voltage Q Outputs TTL Loads High-Level Output Voltage φO Output (Pin 10) CMOS Loads VOH VCC or GND -0.02 4.5 4.4 - - 4.4 - 4.4 - V High-Level Output Voltage φO Output (Pin 10) TTL Loads (Note 2) VOH VCC or GND -2.6 4.5 3.98 - - 3.84 - 3.7 - V Low-Level Output Voltage φO Output (Pin 10) CMOS Loads VOL VCC or GND 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 4 CD54/74HC4060, CD54/74HCT4060 DC Electrical Specifications (Continued) TEST CONDITIONS 25oC -40oC TO 85oC -55oC TO 125oC SYMBOL VI (V) IO (mA) VCC (V) Low-Level Output Voltage φO Output (Pin 10) TTL Loads VOL VCC or GND 2.6 4.5 - - 0.26 - 0.33 - 0.4 V High-Level Output Voltage φO Output (Pin 9) TTL Loads VOH VIL or VIH -3.2 4.5 3.98 - - 3.84 - 3.7 - V Low-Level Output Voltage φO Output (Pin 9) TTL Loads VOL VIH or VIL (Note 3) 3.2 4.5 - 0.26 - 0.33 - 0.4 V II Any Voltage Between VCC and GND - 5.5 - ±0.1 - ±1 - ±1 µA ICC VCC or GND 0 5.5 - - 8 - 80 - 160 µA ∆ICC (Note 4) VCC - 2.1 - 4.5 to 5.5 - 100 360 - 450 - 490 µA PARAMETER Input Leakage Current Quiescent Device Current Additional Quiescent Device Current Per Input Pin: 1 Unit Load MIN TYP MAX MIN MAX MIN MAX UNITS NOTES: 2. Limits not valid when pin 12 (instead of pin 11) is used as control input. 3. For pin 11 VIH = 3.15V, VIL = 0.9V. 4. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA. HCT Input Loading Table INPUT UNIT LOADS MR 0.35 NOTE: Unit Load is ∆ICC limit specified in DC Electrical Specifications Table, e.g. 360µA max at 25oC. Prerequisite for Switching Specifications 25oC PARAMETER -40oC TO 85oC -55oC TO 125oC SYMBOL VCC (V) MIN TYP MAX MIN TYP MAX MIN TYP MAX UNITS fmax 2 6 - - 5 - - 4 - - MHz 4.5 30 - - 25 - - 20 - - MHz 6 35 - - 29 - - 23 - - MHz 2 80 - - 100 - - 120 - - ns 4.5 16 - - 20 - - 24 - - ns 6 14 - - 17 - - 20 - - ns 2 100 - - 125 - - 150 - - ns 4.5 20 - - 25 - - 30 - - ns 6 17 - - 21 - - 26 - - ns HC TYPES Maximum Input Pulse Frequency Input Pulse Width Reset Removal Time tW tREM 5 CD54/74HC4060, CD54/74HCT4060 Prerequisite for Switching Specifications (Continued) 25oC PARAMETER Reset Pulse Width -40oC TO 85oC -55oC TO 125oC SYMBOL VCC (V) MIN TYP MAX MIN TYP MAX MIN TYP MAX UNITS tW 2 80 - - 100 - - 120 - - ns 4.5 16 - - 20 - - 24 - - ns 6 14 - - 17 - - 20 - - ns HCT TYPES Maximum Input, Pulse Frequency fmax 4.5 30 - - 25 - - 20 - - MHz Input Pulse Width tW 4.5 16 - - 20 - - 24 - - ns tREM 4.5 26 - - 33 - - 39 - - ns tW 4.5 25 - - 31 - - 38 - - ns Reset Removal Time Reset Pulse Width Switching Specifications PARAMETER Input tr, tf = 6ns SYMBOL TEST CONDITIONS tPLH, tPHL CL = 50pF -40oC TO 85oC 25oC -55oC TO 125oC VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS 2 - - 300 - 375 - 450 ns 4.5 - - 60 - 75 - 90 ns CL = 15pF 5 - 25 - - - - - ns CL = 50pF 6 - - 51 - 64 - 78 ns CL = 50pF 2 - - 80 - 100 - 120 ns 4.5 - - 16 - 20 - 24 ns CL = 15pF 5 - 6 - - - - - ns CL = 50pF 6 - - 14 - 17 - 20 ns CL = 50pF 2 - - 175 - 220 - 265 ns 4.5 - - 35 - 44 - 53 ns CL = 15pF 5 - 14 - - - - - ns CL = 50pF 6 - - 30 - 37 - 45 ns CL = 50pF 2 - - 75 - 95 - 110 ns 4.5 - - 15 - 19 - 22 ns 6 - - 13 - 16 - 19 ns - - - - - pF HC TYPES Propagation Delay φI to Q4 Qn to Qn+1 MR to Qn Output Transition Time Input Capacitance Propagation Dissipation Capacitance (Notes 5, 6) tPLH, tPHL tPHL tTHL, tTLH CI (TBD) CPD - - - 40 tPLH, tPHL CL = 50pF 2 - - - - - - - -ns 4.5 - - 66 - 83 - 100 ns CL = 15pF 5 - 25 - - - - - -ns CL = 50pF 6 - - - - - - - -ns HCT TYPES Propagation Delay φI to Q4 6 CD54/74HC4060, CD54/74HCT4060 Switching Specifications PARAMETER Qn to Qn+1 Input tr, tf = 6ns (Continued) -55oC TO 125oC SYMBOL TEST CONDITIONS VCC (V) MIN TYP MAX MIN MAX MIN MAX UNITS tPLH, tPHL CL = 50pF 2 - - - - - - - ns 4.5 - - 16 - 20 - 24 ns CL = 15pF 5 - 6 - - - - - ns CL = 50pF 6 - - - - - - - ns CL = 50pF 2 - - - - - - - ns 4.5 - - 44 - 55 - 66 ns CL = 15pF 5 - 17 - - - - - ns CL = 50pF 6 - - - - - - - ns CL = 50pF 2 - - - - - - - ns 4.5 - - 15 - 19 - 22 ns 6 - - - - - - - ns - - 40 - - - - - pF MR to Qn tPHL Output Transition Time -40oC TO 85oC 25oC tTHL, tTLH Input Capacitance CI (TBD) Propagation Dissipation Capacitance (Notes 5, 6) CPD - NOTES: 5. CPD is used to determine the dynamic power consumption, per package. 6. PD = CPD VCC2 fi ∑(CL VCC2 fi/M) where M = 21, 22, 23, ...214, fi = input frequency, CL = output load capacitance. TYPICAL LIMIT VALUES FOR RX AND CX RX Minimum RX Maximum CX Minimum Maximum Astable Oscillator Frequency CX > 1000pF 102 VOLTAGE TYPICAL MAXIMUM LIMITS 2 1KΩ 10 CX > 10pF 4.5 CX > 10pF 6 CX > 10pF 2 CX > 10pF 4.5 CX > 10pF 6 RX > 10KΩ 2 RX > 10KΩ 4.5 RX > 10KΩ 6 TA = 25oC RX = 1KΩ 10KΩ 100KΩ 1MΩ 10MΩ 1 CX (µF) PARAMETER TEST CONDITIONS 20MΩ 10-1 10-2 10-3 10pF 10-4 RX = 1KΩ 2 1000pF RX = 1KΩ 4.5 10pF RX = 1KΩ 6 10pF CX = 1000pF, RX = 1KΩ 2 0.5MHz (Note 7) CX = 100pF, RX = 1KΩ 4.5 3MHz (Note 7) CX = 100pF, RX = 1KΩ 6 3MHz (Note 7) 10-5 10-1 100 103 10 102 104 OSCILLATOR FREQUENCY (Hz) 105 106 NOTE: OSC Frequency ≈ 1/2.2 RXCX For 1MΩ > RX > 1KΩ, CX > 10pF, f < 1MHz FIGURE 2. FREQUENCY OF ON-BOARD OSCILLATOR AS A FUNCTION OF CX AND RX NOTE: 7. At very high frequencies f = 1/2.2 RXCX no longer gives an accurate approximation. 7 CD54/74HC4060, CD54/74HCT4060 Typical Performance Curves tfCL trCL CLOCK tWL + tWH = 90% 10% I fCL 50% CLOCK 50% 1.3V 0.3V tWH tf = 6ns GND tTLH 3V 2.7V 1.3V 0.3V INPUT GND tTHL 90% 50% 10% INVERTING OUTPUT GND tr = 6ns VCC tTHL 1.3V FIGURE 4. HCT CLOCK PULSE RISE AND FALL TIMES AND PULSE WIDTH tf = 6ns 90% 50% 10% I fCL NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with device truth table. For fMAX, input duty cycle = 50%. FIGURE 3. HC CLOCK PULSE RISE AND FALL TIMES AND PULSE WIDTH tr = 6ns 1.3V tWL tWH NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with device truth table. For fMAX, input duty cycle = 50%. tPHL 2.7V 0.3V GND tWL INPUT tfCL = 6ns 3V VCC 50% 10% tWL + tWH = trCL = 6ns tTLH 90% 1.3V 10% INVERTING OUTPUT tPHL tPLH FIGURE 5. HC AND HCT TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC tPLH FIGURE 6. HCT TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC 8 PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 5962-8768001EA ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type 5962-8977101EA ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type Lead/Ball Finish MSL Peak Temp (3) CD54HC4060F3A ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type CD54HCT4060F3A ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type CD74HC4060E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC4060EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC4060M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4060M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4060M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4060ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4060MT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4060MTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4060PW ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4060PWE4 ACTIVE TSSOP PW 16 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4060PWR ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4060PWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4060PWT ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC4060PWTE4 ACTIVE TSSOP PW 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4060E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HCT4060EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HCT4060M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4060M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4060M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4060ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4060MT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT4060MTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 12-Jan-2006 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 2 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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