GMT G962-15ADJTJUF

G962
Global Mixed-mode Technology Inc.
2A Low Dropout Regulator with Enable
Features
General Description
„
The G962 is a high performance positive voltage
regulator designed for use in applications requiring
very low dropout voltage at up to 2 Amps. Since it has
superior dropout characteristics compared to regular
LDOs, it can be used to supply 2.5V on motherboards
or 1.5V, 1.8V on peripheral cards from the 3.3V supply
thus allowing the elimination of costly heatsinks. An
enable pin further reduces power dissipation while
shut down. The G962 provides excellent regulation
over variations in line, load and temperature.
„
„
„
„
„
„
„
„
Adjustable Output from 1.2V to 4.8V Using External Resistors
1.5V, 1.8V and 2.5V options by Setting ADJ Pin
Below 0.2V
Over current and over temperature protection
500mV dropout @2A
Enable pin
10µA quiescent current in shutdown
Output recovery mode in OTP
Connect ADJ to GND for fixed output mode
TO-252-5 Package
The TO-252-5 is available with 1.5V, 1.8V and 2.5V
internally preset outputs that are also adjustable using
external resistors.
Applications
„
Battery powered systems
Motherboards
„ Peripheral cards
„ Set Top Boxes
„ Notebook Computers
„
Ordering Information
ORDER NUMBER
ORDER NUMBER
(Pb free)
MARKING
TEMP. RANGE
PACKAGE
G962-15ADJTJU
G962-15ADJTJUf
G962-15
-40°C ~ +85°C
TO-252-5
G962-18ADJTJU
G962-25ADJTJU
G962-18ADJTJUf
G962-25ADJTJUf
G962-18
G962-25
-40°C ~ +85°C
-40°C ~ +85°C
TO-252-5
TO-252-5
Note: TJ:TO-252-5
U : Tape & Reel
e.g. 18 denotes the 1.8V output voltage.
Pin Configuration
Typical Application Circuit
IENH
R3
VEN
VEN
VIN
VIN
VO
VO
R1
Top View
1
2
3
4
G962
5
C1
47µF
GND
ADJ
C2
100µF
R2
EN VIN GND VO ADJ
TO-252-5
1.2 (R1+R2)
Volts
R2
R2=12kΩ is recommended
R3 should be connected for current IENH
restriction as VEN > VIN+0.3V
VO =
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 0.8 Preliminary
Apr 01, 2005
1
G962
Global Mixed-mode Technology Inc.
Absolute Maximum Ratings
Operation Conditions
(Note 1)
Input Voltage……………………………………2.2V ~7V
Temperature Range……………......-40°C ≤TA ≤ +85°C
(Note 1)
Input Voltage……………………………….……………7V
VEN Voltage……………………………….………VIN+0.3V
Power Dissipation Internally Limited
(Note 2)
Maximum Junction Temperature.…..………..……150°C
Storage Temperature Range…..….-65°C ≤TJ ≤ +150°C
Reflow Temperature (Soldering, 10 sec)……..…260°C
Thermal Resistance Junction to Ambient, (θJA)
TO-252-5…………………………………………95°C/W
Thermal Resistance Junction to Case, (θJC)
TO-252-5…………………………………………..…..8°C/W
ESD Rating (Human Body Model)……….…………2kV
Electrical Characteristics
VEN=VIN, VIN =5V, IO = 0.5A, CIN = 4.7µF, COUT =10µF, TA = TJ = 25°C unless otherwise specified (Note 3)
PARAMETER
SYMBOL
CONDITION
MIN
TYP
MAX
UNIT
VD
VIN=VO +0.7V, IO=10mA
VO+0.7V < VIN < 5.5V, IO=10mA
10mA < IO < 2A
VIN=3.3V,VEN=VIN
VIN=3.3V,VEN=0V
fi=120Hz, 1VP-P, IO=100mA
IO=2A
VENH
VENL
IENL
VREF
(Note 4)
Output Active
Output Disabled
VEN=0.4V
VIN=2.2V, VADJ=VOUT, IO=10mA
-2
----------------1.6
----1.176
---
VO
0.2
0.8
1.7
16
55
0.7
0.8
150
------1.2
0.2
2
2
2
2.5
35
--0.85
------0.4
20
1.224
---
%
%
%
mA
µA
dB
V
A
°C
V
V
µA
V
V
Output Voltage
Line Regulation
Load Regulation
VO
Quiescent Current
IQ
Ripple Rejection
Dropout Voltage
Short Circuit Current
Over Temperature
VEN Voltage High
VEN Voltage Low
VEN Bias Current Low
ADJ Reference Voltage
ADJ Pin Threshold
Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For
guaranteed specifications and test conditions see the Electrical Characteristics.
Note2: The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal
resistance, θJA, and ambient temperature TA. The maximum allowable power dissipation at any ambient
temperature is (Tjmax-TA) / θJA. If this dissipation is exceeded, the die temperature will rise above 150°C
and IC will go into thermal shutdown.
Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible.
Note4: The over temperature point is guarantee by design.
Definitions
current at constant chip temperature. The measurement is made under conditions of low dissipation or by
using pulse techniques such that average chip temperature is not significantly affected.
Dropout Voltage
The input/output voltage differential at which the regulator output no longer maintains regulation against further
reductions in input voltage. Measured when the output
drops 2% below its nominal value, dropout voltage is
affected by junction temperature, load current and minimum input supply requirements.
Maximum Power Dissipation
The maximum total device dissipation for which the
regulator will operate within specifications.
Line Regulation
The change in output voltage for a change in input voltage. The measurement is made under conditions of low
dissipation or by using pulse techniques such that average chip temperature is not significantly affected.
Quiescent Bias Current
Current which is used to operate the regulator chip
and is not delivered to the load.
Output Capacitor for Stable Condition
The G962 can be stable for X5R MLCC capacitor larger than 10µF or POSCAP capacitor larger than 47µF.
Load Regulation
The change in output voltage for a change in load
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 0.8 Preliminary
Apr 01, 2005
2
G962
Global Mixed-mode Technology Inc.
Typical Characteristics
VEN=VIN, =5V, IO = 0.5A, CIN = 4.7µF, COUT =10µF, TA = TJ = 25°C
(VOUT=1.8V)
Line Transient
Load Transient
Short Circuit Current
Start-UP
Overcurrent Protection Characteristics
Ripple Rejection
70
IL=1A
Ripple Rejection (dB)
60
50
IL=2A
40
30
20
VIN=5V
COUT=10µF
Vripple=224mV
10
0
10
100
1000
10000 100000 1000000
Frequency (Hz)
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 0.8 Preliminary
Apr 01, 2005
3
G962
Global Mixed-mode Technology Inc.
Typical Characteristics (continued)
Max. Power Dissipation vs. TAMB (still air)
( Different PCB Top Copper Area )
Max. Power Dissipation vs.
PCB Top Copper Area
4
4.0
Max. Dissipation Power (W)
Max. Dissipation Power (W)
TAMB = 25°C ; Still Air
3.5
3.0
2.5
2.0
1.5
1.0
0.5
Unit: in2
A=0.5
3.5
A=1.0
3
A=1.5
2.5
A=2.0
A=2.5
2
A=3.0
1.5
A=3.5
A=4.0
1
A=4.5
0.5
0.0
A=5.0
0
25
0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
2
PCB Top Copper Area (in )
900
1.95
800
1.90
VIN=5.0V
1.85
1.80
1.75
1.70
VIN=3.0V
1.65
1.60
55
65
TAMB (°C)
75
85
700
600
T=85°C
500
400
T=25°C
300
200
T=-25°C
100
1.55
1.50
0
-25 -15 -5
5
15 25 35 45 55 65 75 85
Temperature (°C)
0
0.5
1
IL (A)
1.5
2
Output Voltage vs. VIN
Output Voltage vs. Temperature
1.864
1.864
IL=10mA
IL=10mA
1.844
1.844
1.824
VIN=5.0V
1.804
VIN=3.0V
Output Voltage (V)
Output Voltage (V)
45
Dropout Voltage vs. Temperature
2.00
Dropout Voltage (mV)
Quiescent Current (mA)
Quiescent Current vs. Temperature
35
1.784
T=85°C
1.824
1.804
T=-25°C
T=25°C
1.784
1.764
1.764
-25 -15 -5
5
15 25 35 45 55 65 75 85
2.5
Temperature (°C)
3
3.5
4
4.5 5
VIN (V)
5.5
6
6.5
7
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 0.8 Preliminary
Apr 01, 2005
4
Global Mixed-mode Technology Inc.
G962
Recommend Minimum Footprint
TO-252-5
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 0.8 Preliminary
Apr 01, 2005
5
G962
Global Mixed-mode Technology Inc.
Package Information
E
A
F
E1
L2
D
H
A1
L1
θ
L
e
b
C
A2
TO-252-5 (TJ) Package
SYMBOL
MILLIMETER
INCH
MIN.
MAX.
MIN.
MAX.
A
2.19
2.38
0.086
0.094
A1
b
0.89
0.64
1.27
0.89
0.035
0.025
0.050
0.035
C
D
0.46
5.36
0.58
5.61
0.018
0.211
0.023
0.221
E
E1
e
F
L
L1
L2
H
6.35
5.21
6.73
5.46
0.250
0.205
0.265
0.215
0.58
1.78
2.80
2.03
10.40
4°
0.018
0.055
0.087
0.060
0.370
0°
θ
1.27BSC
0.46
1.40
2.20
1.52
9.40
0°
0.050BSC
0.023
0.070
0.110
0.080
0.410
4°
Taping Specification
PACKAGE
Q’TY/REEL
TO-252-5
2,500 ea
Feed Direction
TO -252-5 Package O rientation
GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.
TEL: 886-3-5788833
http://www.gmt.com.tw
Ver: 0.8 Preliminary
Apr 01, 2005
6