G962 Global Mixed-mode Technology Inc. 2A Low Dropout Regulator with Enable Features General Description The G962 is a high performance positive voltage regulator designed for use in applications requiring very low dropout voltage at up to 2 Amps. Since it has superior dropout characteristics compared to regular LDOs, it can be used to supply 2.5V on motherboards or 1.5V, 1.8V on peripheral cards from the 3.3V supply thus allowing the elimination of costly heatsinks. An enable pin further reduces power dissipation while shut down. The G962 provides excellent regulation over variations in line, load and temperature. Adjustable Output from 1.2V to 4.8V Using External Resistors 1.5V, 1.8V and 2.5V options by Setting ADJ Pin Below 0.2V Over current and over temperature protection 500mV dropout @2A Enable pin 10µA quiescent current in shutdown Output recovery mode in OTP Connect ADJ to GND for fixed output mode TO-252-5 Package The TO-252-5 is available with 1.5V, 1.8V and 2.5V internally preset outputs that are also adjustable using external resistors. Applications Battery powered systems Motherboards Peripheral cards Set Top Boxes Notebook Computers Ordering Information ORDER NUMBER ORDER NUMBER (Pb free) MARKING TEMP. RANGE PACKAGE G962-15ADJTJU G962-15ADJTJUf G962-15 -40°C ~ +85°C TO-252-5 G962-18ADJTJU G962-25ADJTJU G962-18ADJTJUf G962-25ADJTJUf G962-18 G962-25 -40°C ~ +85°C -40°C ~ +85°C TO-252-5 TO-252-5 Note: TJ:TO-252-5 U : Tape & Reel e.g. 18 denotes the 1.8V output voltage. Pin Configuration Typical Application Circuit IENH R3 VEN VEN VIN VIN VO VO R1 Top View 1 2 3 4 G962 5 C1 47µF GND ADJ C2 100µF R2 EN VIN GND VO ADJ TO-252-5 1.2 (R1+R2) Volts R2 R2=12kΩ is recommended R3 should be connected for current IENH restriction as VEN > VIN+0.3V VO = TEL: 886-3-5788833 http://www.gmt.com.tw Ver: 0.8 Preliminary Apr 01, 2005 1 G962 Global Mixed-mode Technology Inc. Absolute Maximum Ratings Operation Conditions (Note 1) Input Voltage……………………………………2.2V ~7V Temperature Range……………......-40°C ≤TA ≤ +85°C (Note 1) Input Voltage……………………………….……………7V VEN Voltage……………………………….………VIN+0.3V Power Dissipation Internally Limited (Note 2) Maximum Junction Temperature.…..………..……150°C Storage Temperature Range…..….-65°C ≤TJ ≤ +150°C Reflow Temperature (Soldering, 10 sec)……..…260°C Thermal Resistance Junction to Ambient, (θJA) TO-252-5…………………………………………95°C/W Thermal Resistance Junction to Case, (θJC) TO-252-5…………………………………………..…..8°C/W ESD Rating (Human Body Model)……….…………2kV Electrical Characteristics VEN=VIN, VIN =5V, IO = 0.5A, CIN = 4.7µF, COUT =10µF, TA = TJ = 25°C unless otherwise specified (Note 3) PARAMETER SYMBOL CONDITION MIN TYP MAX UNIT VD VIN=VO +0.7V, IO=10mA VO+0.7V < VIN < 5.5V, IO=10mA 10mA < IO < 2A VIN=3.3V,VEN=VIN VIN=3.3V,VEN=0V fi=120Hz, 1VP-P, IO=100mA IO=2A VENH VENL IENL VREF (Note 4) Output Active Output Disabled VEN=0.4V VIN=2.2V, VADJ=VOUT, IO=10mA -2 ----------------1.6 ----1.176 --- VO 0.2 0.8 1.7 16 55 0.7 0.8 150 ------1.2 0.2 2 2 2 2.5 35 --0.85 ------0.4 20 1.224 --- % % % mA µA dB V A °C V V µA V V Output Voltage Line Regulation Load Regulation VO Quiescent Current IQ Ripple Rejection Dropout Voltage Short Circuit Current Over Temperature VEN Voltage High VEN Voltage Low VEN Bias Current Low ADJ Reference Voltage ADJ Pin Threshold Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Conditions are conditions under which the device functions but the specifications might not be guaranteed. For guaranteed specifications and test conditions see the Electrical Characteristics. Note2: The maximum power dissipation is a function of the maximum junction temperature, TJmax ; total thermal resistance, θJA, and ambient temperature TA. The maximum allowable power dissipation at any ambient temperature is (Tjmax-TA) / θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and IC will go into thermal shutdown. Note3: Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as possible. Note4: The over temperature point is guarantee by design. Definitions current at constant chip temperature. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly affected. Dropout Voltage The input/output voltage differential at which the regulator output no longer maintains regulation against further reductions in input voltage. Measured when the output drops 2% below its nominal value, dropout voltage is affected by junction temperature, load current and minimum input supply requirements. Maximum Power Dissipation The maximum total device dissipation for which the regulator will operate within specifications. Line Regulation The change in output voltage for a change in input voltage. The measurement is made under conditions of low dissipation or by using pulse techniques such that average chip temperature is not significantly affected. Quiescent Bias Current Current which is used to operate the regulator chip and is not delivered to the load. Output Capacitor for Stable Condition The G962 can be stable for X5R MLCC capacitor larger than 10µF or POSCAP capacitor larger than 47µF. Load Regulation The change in output voltage for a change in load TEL: 886-3-5788833 http://www.gmt.com.tw Ver: 0.8 Preliminary Apr 01, 2005 2 G962 Global Mixed-mode Technology Inc. Typical Characteristics VEN=VIN, =5V, IO = 0.5A, CIN = 4.7µF, COUT =10µF, TA = TJ = 25°C (VOUT=1.8V) Line Transient Load Transient Short Circuit Current Start-UP Overcurrent Protection Characteristics Ripple Rejection 70 IL=1A Ripple Rejection (dB) 60 50 IL=2A 40 30 20 VIN=5V COUT=10µF Vripple=224mV 10 0 10 100 1000 10000 100000 1000000 Frequency (Hz) TEL: 886-3-5788833 http://www.gmt.com.tw Ver: 0.8 Preliminary Apr 01, 2005 3 G962 Global Mixed-mode Technology Inc. Typical Characteristics (continued) Max. Power Dissipation vs. TAMB (still air) ( Different PCB Top Copper Area ) Max. Power Dissipation vs. PCB Top Copper Area 4 4.0 Max. Dissipation Power (W) Max. Dissipation Power (W) TAMB = 25°C ; Still Air 3.5 3.0 2.5 2.0 1.5 1.0 0.5 Unit: in2 A=0.5 3.5 A=1.0 3 A=1.5 2.5 A=2.0 A=2.5 2 A=3.0 1.5 A=3.5 A=4.0 1 A=4.5 0.5 0.0 A=5.0 0 25 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 2 PCB Top Copper Area (in ) 900 1.95 800 1.90 VIN=5.0V 1.85 1.80 1.75 1.70 VIN=3.0V 1.65 1.60 55 65 TAMB (°C) 75 85 700 600 T=85°C 500 400 T=25°C 300 200 T=-25°C 100 1.55 1.50 0 -25 -15 -5 5 15 25 35 45 55 65 75 85 Temperature (°C) 0 0.5 1 IL (A) 1.5 2 Output Voltage vs. VIN Output Voltage vs. Temperature 1.864 1.864 IL=10mA IL=10mA 1.844 1.844 1.824 VIN=5.0V 1.804 VIN=3.0V Output Voltage (V) Output Voltage (V) 45 Dropout Voltage vs. Temperature 2.00 Dropout Voltage (mV) Quiescent Current (mA) Quiescent Current vs. Temperature 35 1.784 T=85°C 1.824 1.804 T=-25°C T=25°C 1.784 1.764 1.764 -25 -15 -5 5 15 25 35 45 55 65 75 85 2.5 Temperature (°C) 3 3.5 4 4.5 5 VIN (V) 5.5 6 6.5 7 TEL: 886-3-5788833 http://www.gmt.com.tw Ver: 0.8 Preliminary Apr 01, 2005 4 Global Mixed-mode Technology Inc. G962 Recommend Minimum Footprint TO-252-5 TEL: 886-3-5788833 http://www.gmt.com.tw Ver: 0.8 Preliminary Apr 01, 2005 5 G962 Global Mixed-mode Technology Inc. Package Information E A F E1 L2 D H A1 L1 θ L e b C A2 TO-252-5 (TJ) Package SYMBOL MILLIMETER INCH MIN. MAX. MIN. MAX. A 2.19 2.38 0.086 0.094 A1 b 0.89 0.64 1.27 0.89 0.035 0.025 0.050 0.035 C D 0.46 5.36 0.58 5.61 0.018 0.211 0.023 0.221 E E1 e F L L1 L2 H 6.35 5.21 6.73 5.46 0.250 0.205 0.265 0.215 0.58 1.78 2.80 2.03 10.40 4° 0.018 0.055 0.087 0.060 0.370 0° θ 1.27BSC 0.46 1.40 2.20 1.52 9.40 0° 0.050BSC 0.023 0.070 0.110 0.080 0.410 4° Taping Specification PACKAGE Q’TY/REEL TO-252-5 2,500 ea Feed Direction TO -252-5 Package O rientation GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications. TEL: 886-3-5788833 http://www.gmt.com.tw Ver: 0.8 Preliminary Apr 01, 2005 6