SN74ALVCHR16269A 12-BIT TO 24-BIT REGISTERED BUS EXCHANGER WITH 3-STATE OUTPUTS www.ti.com SCES050O – AUGUST 1995 – REVISED SEPTEMBER 2004 FEATURES • DGG, DGV, OR DL PACKAGE (TOP VIEW) Member of the Texas Instruments Widebus™ Family Operates From 1.65 V to 3.6 V Max tpd of 5.2 ns at 3.3 V ±24-mA Output Drive at 3.3 V All Outputs Have Equivalent 26-Ω Series Resistors, So No External Resistors Are Required Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors Latch-Up Performance Exceeds 250 mA Per JESD 17 ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A) – 200-V Machine Model (A115-A) • • • • • • • OEA OEB1 2B3 GND 2B2 2B1 VCC A1 A2 A3 GND A4 A5 A6 A7 A8 A9 GND A10 A11 A12 VCC 1B1 1B2 GND 1B3 NC SEL DESCRIPTION/ORDERING INFORMATION This 12-bit to 24-bit registered bus exchanger is designed for 1.65-V to 3.6-V VCC operation. The SN74ALVCHR16269A is used in applications in which two ports must be multiplexed onto, or demultiplexed from, a single port. It is particularly suitable as an interface between synchronous DRAMs and high-speed microprocessors. 1 56 2 55 3 54 4 53 5 52 6 51 7 50 8 49 9 48 10 47 11 46 12 45 13 44 14 43 15 42 16 41 17 40 18 39 19 38 20 37 21 36 22 35 23 34 24 33 25 32 26 OEB2 CLKENA2 2B4 GND 2B5 2B6 VCC 2B7 2B8 2B9 GND 2B10 2B11 2B12 1B12 1B11 1B10 GND 1B9 1B8 1B7 VCC 1B6 1B5 GND 1B4 CLKENA1 CLK 31 Data is stored in the internal B-port registers on the 27 30 low-to-high transition of the clock (CLK) input, when the appropriate clock-enable (CLKENA) inputs are 28 29 low. Proper control of these inputs allows two sequential 12-bit words to be presented as a 24-bit NC − No internal connection word on the B port. For data transfer in the B-to-A direction, a single storage register is provided. The select (SEL) line selects 1B or 2B data for the A outputs. The register on the A output permits the fastest possible data transfer, thus extending the period during which the data is valid on the bus. The control terminals are registered so that all transactions are synchronous with CLK. Data flow is controlled by the active-low output enables (OEA, OEB1, and OEB2). ORDERING INFORMATION PACKAGE (1) TA (1) TOP-SIDE MARKING SN74ALVCHR16269AL Tape and reel SN74ALVCHR16269ALR TSSOP – DGG Tape and reel SN74ALVCHR16269AGR ALVCHR16269A TVSOP – DGV Tape and reel SN74ALVCHR16269AVR VR269A SSOP – DL -40°C to 85°C ORDERABLE PART NUMBER Tube ALVCHR16269A Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1995–2004, Texas Instruments Incorporated SN74ALVCHR16269A 12-BIT TO 24-BIT REGISTERED BUS EXCHANGER WITH 3-STATE OUTPUTS www.ti.com SCES050O – AUGUST 1995 – REVISED SEPTEMBER 2004 DESCRIPTION/ORDERING INFORMATION (CONTINUED) To ensure the high-impedance state during power up or power down, a clock pulse should be applied as soon as possible, and OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. Due to OE being routed through a register, the active state of the outputs cannot be determined prior to the arrival of the first clock pulse. Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended. All outputs are designed to sink up to 12 mA and include equivalent 26-Ω resistors to reduce overshoot and undershoot. FUNCTION TABLES OUTPUT ENABLE INPUTS OUTPUTS CLK OEA OEB A ↑ H H Z 1B, 2B Z ↑ H L Z Active ↑ L H Active Z ↑ L L Active Active A-TO-B STORAGE (OEB = L) INPUTS (1) OUTPUTS CLKENA1 CLKENA2 CLK A 1B 2B L H ↑ L L 2B0 (1) L H ↑ H H 2B0 (1) L L ↑ L L L L L ↑ H H H H L ↑ L 1B0 (1) H L ↑ H 1B0 (1) H H X X 1B0 (1) L H 2B0 (1) Output level before the indicated steady-state input conditions were established B-TO-A STORAGE (OEA = L) INPUTS (1) 2 CLK SEL 1B 2B OUTPUT A X H X X A0 (1) X L X X A0 (1) ↑ H L X L ↑ H H X H ↑ L X L L ↑ L X H H Output level before the indicated steady-state input conditions were established SN74ALVCHR16269A 12-BIT TO 24-BIT REGISTERED BUS EXCHANGER WITH 3-STATE OUTPUTS www.ti.com SCES050O – AUGUST 1995 – REVISED SEPTEMBER 2004 LOGIC DIAGRAM (POSITIVE LOGIC) CLK OEB1 29 C1 2 1D C1 OEB2 CLKENA1 CLKENA2 56 1D 30 55 C1 SEL OEA 28 1D 1 1D 1 of 12 Channels C1 G1 A1 8 C1 1 1D 23 1B1 1 CE C1 1D 6 2B1 CE C1 1D 3 SN74ALVCHR16269A 12-BIT TO 24-BIT REGISTERED BUS EXCHANGER WITH 3-STATE OUTPUTS www.ti.com SCES050O – AUGUST 1995 – REVISED SEPTEMBER 2004 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VCC MIN MAX Supply voltage range -0.5 4.6 Except I/O ports (2) -0.5 4.6 I/O ports (2) (3) -0.5 VCC + 0.5 UNIT V VI Input voltage range VO Output voltage range (2) (3) IIK Input clamp current VI < 0 -50 mA IOK Output clamp current VO < 0 -50 mA IO Continuous output current ±50 mA ±100 mA VCC + 0.5 Continuous current through each VCC or GND θJA Package thermal impedance (4) Tstg Storage temperature range DGG package 64 DGV package 48 DL package (1) (2) (3) (4) V V °C/W 56 -65 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. This value is limited to 4.6 V, maximum. The package thermal impedance is calculated in accordance with JESD 51-7. RECOMMENDED OPERATING CONDITIONS (1) VCC Supply voltage VCC = 1.65 V to 1.95 V VIH High-level input voltage MIN MAX 1.65 3.6 Low-level input voltage V 0.65 × VCC VCC = 2.3 V to 2.7 V 1.7 VCC = 2.7 V to 3.6 V 2 V 0.35 × VCC VCC = 1.65 V to 1.95 V VIL UNIT VCC = 2.3 V to 2.7 V 0.7 VCC = 2.7 V to 3.6 V 0.8 V VI Input voltage 0 VCC V VO Output voltage 0 VCC V IOH High-level output current VCC = 1.65 V -2 VCC = 2.3 V -6 VCC = 2.7 V -8 VCC = 3 V IOL Low-level output current -12 VCC = 1.65 V 2 VCC = 2.3 V 6 VCC = 2.7 V 8 VCC = 3 V ∆t/∆v Input transition rise or fall rate TA Operating free-air temperature (1) 4 mA mA 12 -40 10 ns/V 85 °C All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. SN74ALVCHR16269A 12-BIT TO 24-BIT REGISTERED BUS EXCHANGER WITH 3-STATE OUTPUTS www.ti.com SCES050O – AUGUST 1995 – REVISED SEPTEMBER 2004 ELECTRICAL CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = -100 µA VOH 1.65 V to 3.6 V 1.2 IOH = -4 mA 2.3 V 1.9 2.3 V 1.7 3V 2.4 IOH = -8 mA 2.7 V 2 IOH = -12 mA 3V 2 IOL = 100 µA 1.65 V to 3.6 V 0.2 1.65 V 0.45 IOL = 4 mA 2.3 V 0.4 2.3 V 0.55 3V 0.55 IOL = 8 mA 2.7 V 0.6 IOL = 12 mA 3V 0.8 ±5 3.6 V VI = 0.58 V 1.65 V VI = 1.07 V VI = 0.7 V 2.3 V VI = 1.7 V VI = 0.8 V 3V VI = 2 V UNIT V IOL = 2 mA VI = VCC or GND II(hold) MAX VCC - 0.2 1.65 V IOL = 6 mA II MIN TYP (1) IOH = -2 mA IOH = -6 mA VOL VCC V µA 25 -25 45 µA -45 75 -75 VI = 0 to 3.6 V (2) 3.6 V ±500 IOZ (3) VO = VCC or GND 3.6 V ±10 µA ICC VI = VCC or GND, IO = 0 3.6 V 40 µA One input at VCC - 0.6 V, Other inputs at VCC or GND 750 µA ∆ICC 3 V to 3.6 V Ci Control inputs VI = VCC or GND 3.3 V 5 pF Cio A or B ports VO = VCC or GND 3.3 V 8.5 pF (1) (2) (3) All typical values are at VCC = 3.3 V, TA = 25°C. This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another. For I/O ports, the parameter IOZ includes the input leakage current. 5 SN74ALVCHR16269A 12-BIT TO 24-BIT REGISTERED BUS EXCHANGER WITH 3-STATE OUTPUTS www.ti.com SCES050O – AUGUST 1995 – REVISED SEPTEMBER 2004 TIMING REQUIREMENTS over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) VCC = 1.8 V MIN Clock frequency tw Pulse duration, CLK high or low Setup time th (1) Hold time MIN MAX (1) fclock tsu MAX VCC = 2.5 V ± 0.2 V VCC = 2.7 V MIN MAX 95 VCC = 3.3 V ± 0.3 V MIN UNIT MAX 115 135 (1) 5.2 4.3 A data before CLK↑ (1) 1.4 1.4 1 B data before CLK↑ (1) 1.6 1.5 1.1 SEL before CLK↑ (1) 0.8 1.1 1.3 CLKENA1 or CLKENA2 before CLK↑ (1) 0.8 1 0.8 OE before CLK↑ (1) 1.7 1.6 1.2 A data after CLK↑ (1) 0.9 0.9 1.2 B data after CLK↑ (1) 0.8 0.6 1 SEL after CLK↑ (1) 1.1 0.8 1.7 CLKENA1 or CLKENA2 after CLK↑ (1) 1.4 1 1.6 OE after CLK↑ (1) 0.9 0.8 1.2 3.3 MHz ns ns ns This information was not available at the time of publication. SWITCHING CHARACTERISTICS over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) PARAMETER FROM (INPUT) VCC = 1.8 V TO (OUTPUT) MIN (1) ten CLK tdis CLK MAX B (1) 2.3 7.7 6.9 2.2 5.8 A (1) 1.9 6.4 5.8 2 5.2 B (1) 2.5 7.7 6.9 2.3 5.8 A (1) 2.2 6.7 6 2.1 5.3 B (1) 3.3 8.1 6.7 2.4 6 A (1) 2.7 8 6.2 2.1 6 95 MIN MAX 115 MIN UNIT MIN (1) CLK VCC = 3.3 V ± 0.3 V VCC = 2.7 V TYP fmax tpd VCC = 2.5 V ± 0.2 V MAX 135 MHz ns ns ns This information was not available at the time of publication. OPERATING CHARACTERISTICS TA = 25°C TEST CONDITIONS PARAMETER Cpd Power dissipation capacitance (1) 6 Outputs enabled Outputs disabled CL = 0, f = 10 MHz This information was not available at the time of publication. VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V TYP TYP TYP (1) 142 172 (1) 115 129 UNIT pF SN74ALVCHR16269A 12-BIT TO 24-BIT REGISTERED BUS EXCHANGER WITH 3-STATE OUTPUTS www.ti.com SCES050O – AUGUST 1995 – REVISED SEPTEMBER 2004 PARAMETER MEASUREMENT INFORMATION VLOAD S1 RL From Output Under Test Open GND CL (see Note A) RL TEST S1 tpd tPLZ/tPZL tPHZ/tPZH Open VLOAD GND LOAD CIRCUIT INPUT VCC 1.8 V ± 0.15 V 2.5 V ± 0.2 V 2.7 V 3.3 V ± 0.3 V VI tr/tf VCC VCC 2.7 V 2.7 V ≤2 ns ≤2 ns ≤2.5 ns ≤2.5 ns VM VLOAD CL RL V∆ VCC/2 VCC/2 1.5 V 1.5 V 2 × VCC 2 × VCC 6V 6V 30 pF 30 pF 50 pF 50 pF 1 kΩ 500 Ω 500 Ω 500 Ω 0.15 V 0.15 V 0.3 V 0.3 V tw VI Timing Input VM VM VM 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VM VM 0V tPLH Output Control (low-level enabling) tPLZ VLOAD/2 VM tPZH VOH VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES VM 0V Output Waveform 1 S1 at VLOAD (see Note B) tPHL VM VI VM tPZL VI Input VOLTAGE WAVEFORMS PULSE DURATION th VI Data Input VM 0V 0V tsu Output VI VM Input Output Waveform 2 S1 at GND (see Note B) VOL + V∆ VOL tPHZ VOH VM VOH − V∆ 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 7 PACKAGE OPTION ADDENDUM www.ti.com 27-Sep-2007 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty 74ALVCHR16269AGRE4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ALVCHR16269AGRG4 ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ALVCHR16269ALG4 ACTIVE SSOP DL 56 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ALVCHR16269ALRG4 ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ALVCHR16269AVRE4 ACTIVE TVSOP DGV 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74ALVCHR16269AVRG4 ACTIVE TVSOP DGV 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVCHR16269AGR ACTIVE TSSOP DGG 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVCHR16269AL ACTIVE SSOP DL 56 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVCHR16269ALR ACTIVE SSOP DL 56 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74ALVCHR16269AVR ACTIVE TVSOP DGV 56 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 20 20 Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SN74ALVCHR16269AGR TSSOP SN74ALVCHR16269ALR SSOP SN74ALVCHR16269AVR TVSOP SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DGG 56 2000 330.0 24.4 8.6 15.6 1.8 12.0 24.0 Q1 DL 56 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1 DGV 56 2000 330.0 24.4 6.8 11.7 1.6 12.0 24.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74ALVCHR16269AGR TSSOP DGG 56 2000 346.0 346.0 41.0 SN74ALVCHR16269ALR SSOP DL 56 1000 346.0 346.0 49.0 SN74ALVCHR16269AVR TVSOP DGV 56 2000 346.0 346.0 41.0 Pack Materials-Page 2 MECHANICAL DATA MTSS003D – JANUARY 1995 – REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001 DL (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0.025 (0,635) 0.0135 (0,343) 0.008 (0,203) 48 0.005 (0,13) M 25 0.010 (0,25) 0.005 (0,13) 0.299 (7,59) 0.291 (7,39) 0.420 (10,67) 0.395 (10,03) Gage Plane 0.010 (0,25) 1 0°–ā8° 24 0.040 (1,02) A 0.020 (0,51) Seating Plane 0.110 (2,79) MAX 0.004 (0,10) 0.008 (0,20) MIN PINS ** 28 48 56 A MAX 0.380 (9,65) 0.630 (16,00) 0.730 (18,54) A MIN 0.370 (9,40) 0.620 (15,75) 0.720 (18,29) DIM 4040048 / E 12/01 NOTES: A. B. C. D. All linear dimensions are in inches (millimeters). This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15). Falls within JEDEC MO-118 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000 DGV (R-PDSO-G**) PLASTIC SMALL-OUTLINE 24 PINS SHOWN 0,40 0,23 0,13 24 13 0,07 M 0,16 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 0°–8° 1 0,75 0,50 12 A Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,08 14 16 20 24 38 48 56 A MAX 3,70 3,70 5,10 5,10 7,90 9,80 11,40 A MIN 3,50 3,50 4,90 4,90 7,70 9,60 11,20 DIM 4073251/E 08/00 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side. 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