TI TL5580IDR

TL5580, TL5580A
DUAL LOW-NOISE WIDE-BANDWIDTH PRECISION AMPLIFIER
www.ti.com
SLOS477A – JUNE 2005 – REVISED JULY 2005
FEATURES
APPLICATIONS
•
•
•
•
•
•
•
•
•
•
•
•
Operating Voltage…±2 V to ±18 V
Low Offset Voltage…1 mV Max at 25°C,
TL5580A
Wide GBW…12 MHz Typ
Slew Rate…5 V/µs Typ
Low THD…0.0005% Typ
Low-Noise Voltage…7 nV/√Hz at 1 kHz Typ
Audio
Test Equipment
Industrial Process Controls
Data-Acquisition Systems
Active Filters
Power-Supply Regulation
D, P, OR PW PACKAGE
(TOP VIEW)
1OUT
1IN−
1IN+
VCC−
1
8
2
7
3
6
4
5
VCC+
2OUT
2IN−
2IN+
DESCRIPTION/ORDERING INFORMATION
The TL5580 is a dual bipolar operational amplifier that combines both high dc and ac performance with its low
offset voltage, high-gain bandwidth, low harmonic distortion, and low-noise characteristics. In addition, its output
is capable of driving 600-Ω loads. All these characteristics make the device ideally suited for use in audio, active
filtering, and industrial measurement applications.
ORDERING INFORMATION
TA
VIO
(25°C, MAX)
PACKAGE (1)
PDIP – P
Standard grade
1.5 mV
SOIC – D
TSSOP – PW
–40°C to 85°C
PDIP – P
A grade
1 mV
SOIC – D
TSSOP – PW
(1)
ORDERABLE PART NUMBER
Tube of 50
TL5580IP
Tube of 75
TL5580ID
Reel of 2500
TL5580IDR
Tube of 150
TL5580IPW
Reel of 2000
TL5580IPWR
Tube of 50
TL5580AIP
Tube of 75
TL5580AID
Reel of 2500
TL5580AIDR
Tube of 150
TL5580AIPW
Reel of 2000
TL5580AIPWR
TOP-SIDE MARKING
TL5580IP
Z5580
Z5580
TL5580AIP
Z5580A
Z5580A
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2005, Texas Instruments Incorporated
TL5580, TL5580A
DUAL LOW-NOISE WIDE-BANDWIDTH PRECISION AMPLIFIER
www.ti.com
SLOS477A – JUNE 2005 – REVISED JULY 2005
EQUIVALENT SCHEMATIC
VCC+
Output
− Input
+ Input
VCC−
2
TL5580, TL5580A
DUAL LOW-NOISE WIDE-BANDWIDTH PRECISION AMPLIFIER
www.ti.com
SLOS477A – JUNE 2005 – REVISED JULY 2005
Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MAX
UNIT
VCC±
Supply voltage
MIN
±18
V
VI
Input voltage (any input)
±15
V
VID
Differential input voltage
±30
V
IO
Output current
±50
mA
D package
θJA
Package thermal
impedance (2) (3)
97
P package
85
PW package
TJ
Operating virtual junction temperature
Tstg
Storage temperature range
(1)
(2)
(3)
°C/W
149
–60
150
°C
125
°C
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions
VCC+
VCC–
TA
Supply voltage
Operating free-air temperature
MIN
MAX
2
16
–2
–16
–40
85
UNIT
V
°C
3
TL5580, TL5580A
DUAL LOW-NOISE WIDE-BANDWIDTH PRECISION AMPLIFIER
www.ti.com
SLOS477A – JUNE 2005 – REVISED JULY 2005
Electrical Characteristics
VCC± = ±15 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TL5580A
VIO
αVIO
IIO
Input offset current
IIB
Input bias current
AVD
Large-signal differential-voltage
amplification
Output voltage swing
1
0.3
1.8
25°C
5
–40°C to 85°C
100
–40°C to 85°C
Common-mode input voltage range
CMRR
Common-mode rejection ratio
RS ≤ 10 kΩ,
VICR = –12 V to 12 V
kSVR (1)
Supply-voltage rejection ratio
RS ≤ 10 kΩ
ICC
Supply current (all amplifiers)
25°C
90
87
12.75
– 12.25
–40°C to 85°C
12.5
–12
25°C
±13
–40°C to 85°C
±12
25°C
90
–40°C to 85°C
85
25°C
85
–40°C to 85°C
83
25°C
–40°C to 85°C
75
500
800
–40°C to 85°C
RL ≥ 2 kΩ
5
100
25°C
RL ≥ 2 kΩ, VO = ±10 V
1.5
UNIT
mV
2
–40°C to 85°C
VICR
(1)
MAX
0.3
–40°C to 85°C
25°C
VOM
TYP
1.35
25°C
TL5580
Average temperature coefficient of input
offset voltage
MIN
–40°C to 85°C
RS ≤ 10 kΩ
Input offset voltage
TA
25°C
110
µV/°C
nA
nA
dB
±13.5
V
±13.5
V
110
dB
110
6
dB
9
12
mA
Measured with VCC± varied simultaneously
Operating Characteristics
VCC± = ±15 V, TA = 25°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
SR
Slew rate at unity gain
RL ≥ 2 kΩ
GBW
Gain bandwidth product
f = 10 kHz
THD
Total harmonic distortion
VO = 5 V, RL = 2 kΩ, f = 1 kHz, AVD = 20 dB
Vn
Equivalent input noise voltage
f = 1 kHz
4
TYP
UNIT
5
V/µs
12
MHz
0.0005
7
%
nV/√Hz
TL5580, TL5580A
DUAL LOW-NOISE WIDE-BANDWIDTH PRECISION AMPLIFIER
www.ti.com
SLOS477A – JUNE 2005 – REVISED JULY 2005
TYPICAL CHARACTERISTICS
MAXIMUM OUTPUT VOLTAGE SWING
vs
LOAD RESISTANCE
MAXIMUM OUTPUT VOLTAGE SWING
vs
FREQUENCY
30
VO − Maximum Output Voltage Swing − V
VO − Maximum Output Voltage Swing − V
15
VCC± = ±15 V
TA = 25°C
10
VOM+
5
0
−5
VOM−
−10
25
20
15
10
−15
1k
100
V+/V− = ±15 V
RL = 2 kΩ
TA = 25°C
5
0
1
5
10 50 60 70 80 100 200 300 500 700 1M 10M
10k
Frequency − kHz
RL − Load Resistance − Ω
Figure 1.
Figure 2.
OUTPUT VOLTAGE SWING
vs
OUTPUT CURRENT
EQUIVALENT INPUT NOISE VOLTAGE
vs
FREQUENCY
Vn − Equivalent Input Noise Voltage − nV/ Hz
20
VCC± = ±15 V
VO − Output Voltage Swing − V
15
VOM+
10
5
0
−5
−10
VOM−
−15
−20
1
10
100
IO − Output Current − mA
Figure 3.
1000
30
VCC± = ±1.5 V
RS = 50 Ω
AV = 60 dB
TA = 25°C
20
10
0
10
100
1k
Frequency − Hz
10k
100k
Figure 4.
5
TL5580, TL5580A
DUAL LOW-NOISE WIDE-BANDWIDTH PRECISION AMPLIFIER
www.ti.com
SLOS477A – JUNE 2005 – REVISED JULY 2005
TYPICAL CHARACTERISTICS (continued)
OPERATING CURRENT
vs
TEMPERATURE
OUTPUT VOLTAGE SWING
vs
TEMPERATURE
18
15
VCC± = ±15 V
VOM+
V O − Output Voltage Swing − V
ICC − Operating Current − mA
16
14
12
10
8
6
4
VCC± = 15 V
RL = 2 kΩ
10
5
0
−5
−10
2
VOM−
0
−55
−15
−40
0
25
70
85
125
−55
TA − Ambient Temperature − °C
0
25
70
85
105
TA − Ambient Temperature − °C
Figure 5.
Figure 6.
INPUT OFFSET VOLTAGE
vs
TEMPERATURE
INPUT BIAS CURRENT
vs
TEMPERATURE
400
0
VCC± = ±15 V
Five Representative Units
VCC± = ±15 V
−50
IIB − Input Bias Current − nA
VIO − Input Offset Voltage − µV
−40
−100
−150
−200
−250
−300
−350
−400
300
200
100
−450
−500
−40 −30 −20 −10 0
10 20 30 40 50 60 70 80 90
TA − Ambient Temperature − °C
Figure 7.
6
0
−40
0
25
70
TA − Ambient Temperature − °C
Figure 8.
85
TL5580, TL5580A
DUAL LOW-NOISE WIDE-BANDWIDTH PRECISION AMPLIFIER
www.ti.com
SLOS477A – JUNE 2005 – REVISED JULY 2005
TYPICAL CHARACTERISTICS (continued)
MAXIMUM OUTPUT VOLTAGE SWING
vs
OPERATING VOLTAGE
OPERATING CURRENT
vs
OPERATING VOLTAGE
7
+VOM
6
10
5
0
−5
−10
5
4
3
2
−VOM
1
−15
±5
0
0.1
±10
±15
0
±0
±20
±2
±4
±8
±10
Figure 9.
Figure 10.
TOTAL HARMONIC DISTORTION
vs
OUTPUT VOLTAGE
VOLTAGE GAIN, PHASE
vs
FREQUENCY
VCC± = ±15 V
RL = 2 kΩ
40-dB Amplification
TA = 25°C
40
Voltage Gain − dB
0.01
20 kHz
20 Hz
30
1
VO − Output Voltage − V
Figure 11.
10
0
−30
−90
25
−120
20
−150
15
−180
10
−210
5
−240
0
0.1
±16
−60
Phase
Gain
1 kHz
±14
30
45
35
0.0001
±12
VCC+/VCC− − Operating Voltage − V
VCC± = ±15 V
Gain = 20 dB
RL = 2 kΩ
0.001
±6
VCC+/VCC− − Operating Voltage − V
10k
100k
1M
Frequency − Hz
Phase − Deg
15
−20
THD − Total Harmonic Distortion − %
TA = 25°C
TA = 25°C
RL = 2 kΩ
ICC − Operating Current − mA
V O − Maximum Output Voltage Swing − V
20
−270
10M
Figure 12.
7
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TL5580AID
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TL5580AIDE4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TL5580AIDR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TL5580AIDRE4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TL5580AIP
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TL5580AIPE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TL5580AIPW
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TL5580AIPWE4
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TL5580AIPWR
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TL5580AIPWRE4
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TL5580ID
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TL5580IDE4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TL5580IDR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TL5580IDRE4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TL5580IP
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TL5580IPE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TL5580IPW
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TL5580IPWE4
ACTIVE
TSSOP
PW
8
150
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TL5580IPWR
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TL5580IPWRE4
ACTIVE
TSSOP
PW
8
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MPDI001A – JANUARY 1995 – REVISED JUNE 1999
P (R-PDIP-T8)
PLASTIC DUAL-IN-LINE
0.400 (10,60)
0.355 (9,02)
8
5
0.260 (6,60)
0.240 (6,10)
1
4
0.070 (1,78) MAX
0.325 (8,26)
0.300 (7,62)
0.020 (0,51) MIN
0.015 (0,38)
Gage Plane
0.200 (5,08) MAX
Seating Plane
0.010 (0,25) NOM
0.125 (3,18) MIN
0.100 (2,54)
0.021 (0,53)
0.015 (0,38)
0.430 (10,92)
MAX
0.010 (0,25) M
4040082/D 05/98
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001
For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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