LP324, LP2902 ULTRA-LOW-POWER QUADRUPLE OPERATIONAL AMPLIFIERS www.ti.com SLOS460A – MARCH 2005 – REVISED MAY 2005 FEATURES • • • • • • • D, N, OR PW PACKAGE (TOP VIEW) Low Supply Current . . . 85 µA Typ Low Offset Voltage . . . 2 mV Typ Low Input Bias Current . . . 2 nA Typ Input Common Mode to GND Wide Supply Voltage . . . 3 V < VCC < 32 V Pin Compatible With LM324 Applications – LCD Displays – Portable Instrumentation – Sensor/Metering Equipment – Consumer Electronics (MP3 Players, Toys, Etc.) – Power Supplies 1OUT 1IN− 1IN+ VCC 2IN+ 2IN− 2OUT 1 14 2 13 3 12 4 11 5 10 6 9 7 8 4OUT 4IN− 4IN+ GND 3IN+ 3IN− 3OUT DESCRIPTION/ORDERING INFORMATION The LP324 and LP2902 are quadruple low-power operational amplifiers especially suited for battery-operated applications. Good input specifications and wide supply-voltage range still are achieved, despite the ultra-low supply current. Single-supply operation is achieved with an input common-mode range that includes GND. The LP324 and LP2902 are ideal in applications where wide supply voltage and low power are more important than speed and bandwidth. These applications include portable instrumentation, LCD displays, consumer electronics (MP3 players, toys, etc.), and power supplies. ORDERING INFORMATION PACKAGE (1) TA PDIP – N 0°C to 70°C SOIC – D TSSOP – PW PDIP – N –40°C to 85°C SOIC – D TSSOP – PW (1) ORDERABLE PART NUMBER Tube of 25 LP324N Tube of 50 LP324D Reel of 2500 LP324DR Tube of 90 LP324PW Reel of 2000 LP324PWR Tube of 25 LP2902N Tube of 50 LP2902D Reel of 2500 LP2902DR Tube of 50 LP2902PW Reel of 2500 LP2902PWR TOP-SIDE MARKING LP324N LP324 LP324 LP2902N LP2902 LP2902 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. SYMBOL (EACH AMPLIFIER) − IN− OUT + IN+ Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2005, Texas Instruments Incorporated LP324, LP2902 ULTRA-LOW-POWER QUADRUPLE OPERATIONAL AMPLIFIERS www.ti.com SLOS460A – MARCH 2005 – REVISED MAY 2005 SCHEMATIC (EACH AMPLIFIER) VCC OUT IN− IN+ Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN VCC MAX Supply voltage range (2) V ±32 V 32 V voltage (3) VID Differential input VI Input voltage (either input) –0.3 Duration of output short circuit (one amplifier) to ground at (or below) TA = 25°C, VCC ≤ 15 V (4) Unlimited D package θJA Package thermal impedance (5) (6) 86 N package 80 PW package TJ Operating virtual junction temperature Tstg Storage temperature range (1) (2) (3) (4) (5) (6) UNIT ±16 or 32 °C/W 113 –65 150 °C 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values (except differential voltages and VCC specified for the measurement of IOS) are with respect to the network GND. Differential voltages are at IN+, with respect to IN–. Short circuits from outputs to VCC can cause excessive heating and eventual destruction. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. ESD Protection TEST CONDITIONS Human-Body Model 2 TYP UNIT ±2 kV LP324, LP2902 ULTRA-LOW-POWER QUADRUPLE OPERATIONAL AMPLIFIERS www.ti.com SLOS460A – MARCH 2005 – REVISED MAY 2005 Electrical Characteristics TA = 25°C, VCC = 5 V, VIC = VCC/2, RL = 100 kΩ to GND (unless otherwise noted) PARAMETER TEST CONDITIONS (1) TA (2) LP324 MAX MIN TYP (3) MAX 2 4 2 4 25°C VIO Input offset voltage IIB Input bias current IIO Input offset current AV Large-signal voltage gain RL = 10 kΩ to GND, VCC = 30 V 25°C 50 Full range 40 CMRR Common-mode rejection ratio VCC = 30 V, VIC = 0 V to VCC – 1.5 V 25°C 80 Full range 75 kVSR Power-supply rejection ratio VCC = 5 V to 30 V 25°C 80 Full range 75 ICC Supply current RL = ∞ VOH Output voltage swing (high) IL = 0.35 mA to GND, VIC = 0 V VOL Output voltage swing (low) IL = 0.35 mA from VCC, VIC = 0 V IO Output source current VO = 3 V, VID = 1 V Full range 9 25°C 2 Full range 25°C 0.2 25°C Output sink current VO = 1.5 V, VID = –1 V, VIC = 0 V 25°C 25°C 2 2 0.5 40 70 90 80 90 80 90 85 1 25°C 7 Full range 4 25°C 4 Full range 3 25°C 2 Full range 1 150 275 3.6 3.4 3.6 0.82 0.7 7 10 mA 4 5 4 5 3 4 2 µA V 1 10 nA V VCC – 1.9 0.7 nA V 75 150 mV dB 75 90 UNIT V/mV 30 VCC – 1.9 0.82 4 8 250 3.4 20 40 100 85 Full range 25°C 10 4 Full range Full range 10 20 Full range VO = 1.5 V, VID = –1 V IO LP2902 MIN TYP (3) mA 4 1 20 35 20 35 IOS,GND Output short to GND VID = 1 V IOS,VCC Output short to VCC ∝VIO Input offset voltage drift 25°C 10 10 µV/°C ∝IIO Input offset current drift 25°C 10 10 pA/°C (1) (2) (3) VID = –1 V Full range 25°C 40 15 Full range 30 40 15 45 30 45 mA mA For full-range temperature limits: VCC = 3 V to 32 V, VICR = 0 V to VCC – 1.5 V (unless otherwise noted) Full range is 0°C to 70°C for LP324 and –40°C to 85°C for LP2902. All typical values are at TA = 25°C. Operating Conditions VCC = ±15 V, TA = 25°C PARAMETER TYP UNIT GBW Gain bandwidth product 100 kHz SR Slew rate 50 V/ms 3 PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty LP2902D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LP2902DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LP2902DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LP2902DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LP2902N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type LP2902NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type LP2902PW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LP2902PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LP2902PWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LP2902PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LP324D ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LP324DE4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LP324DR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LP324DRE4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LP324N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type LP324NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type LP324PW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LP324PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LP324PWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LP324PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2006 TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. 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