2SK3210(L), 2SK3210(S) Silicon N Channel MOS FET High Speed Power Switching ADE-208-760(Z) Target Specification, 1st. Edition Dec. 1, 1998 Features • Low on-resistance R DS =35mΩ typ. • High speed switching • 4V gate drive device can be driven from 5V source Outline LDPAK 4 D 1 1 G S 4 2 3 2 3 1. Gate 2. Drain 3. Source 4. Drain 2SK3210(L), 2SK3210(S) Absolute Maximum Ratings (Ta = 25°C) Item Symbol Ratings Unit Drain to source voltage VDSS 150 V Gate to source voltage VGSS ±20 V Drain current ID 30 A 120 A 30 A 30 A 67 mJ 100 W Drain peak current I D(pulse) Body-drain diode reverse drain current I DR Avalanche current Avalanche energy I AP Note1 Note3 EAR Note3 Note2 Channel dissipation Pch Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C Note: 2 1. PW ≤ 10µs, duty cycle ≤ 1 % 2. Value at Tc = 25°C 3. Value at Tch = 25°C, Rg ≥ 50Ω 2SK3210(L), 2SK3210(S) Electrical Characteristics (Ta = 25°C) Item Symbol Min Typ Max Unit Test Conditions Drain to source breakdown voltage V(BR)DSS 150 — — V I D = 10mA, VGS = 0 Gate to source breakdown voltage V(BR)GSS ±20 — — V I G = ±100µA, VDS = 0 Gate to source leak current I GSS — — ±10 µA VGS = ±16V, VDS = 0 Zero gate voltege drain current I DSS — — 10 µA VDS = 150 V, VGS = 0 Gate to source cutoff voltage VGS(off) 1.0 — 2.5 V I D = 1mA, VDS = 10V Static drain to source on state RDS(on) — 35 45 mΩ I D = 15A, VGS = 10VNote4 resistance RDS(on) — 42 75 mΩ I D = 15A, VGS = 4V Note4 Forward transfer admittance |yfs| 18 30 — S I D = 15A, VDS = 10V Note4 Input capacitance Ciss — 2600 — pF VDS = 10V Output capacitance Coss — 820 — pF VGS = 0 Reverse transfer capacitance Crss — 350 — pF f = 1MHz Turn-on delay time t d(on) — 25 — ns I D = 15A, VGS = 10V Rise time tr — 180 — ns RL = 2Ω Turn-off delay time t d(off) — 600 — ns Fall time tf — 280 — ns Body–drain diode forward voltage VDF — 0.95 — V I F = 30A, VGS = 0 Body–drain diode reverse recovery time t rr — 110 — ns I F = 30A, VGS = 0 diF/ dt =50A/µs Note: 4. Pulse test 3 2SK3210(L), 2SK3210(S) 1.2 ± 0.2 0.4 ± 0.1 2.54 ± 0.5 2.54 ± 0.5 L type 2.54 ± 0.5 (1.4) (1.5) (1.5) 1.27 ± 0.2 3.0 +0.3 –0.5 2.59 ± 0.2 4.44 ± 0.2 8.6 ± 0.3 10.0 +0.3 –0.5 10.2 ± 0.3 1.27 ± 0.2 0.76 ± 0.1 1.3 ± 0.2 11.3 ± 0.5 4.44 ± 0.2 11.0 ± 0.5 1.2 ± 0.2 0.86 +0.2 –0.1 8.6 ± 0.3 10.0 +0.3 –0.5 (1.5) 10.2 ± 0.3 (1.4) Package Dimensions (Unit: mm) 1.3 ± 0.2 0.1 +0.2 –0.1 2.59 ± 0.2 0.4 ± 0.1 0.86 +0.2 –0.1 2.54 ± 0.5 S type Hitachi Code EIAJ JEDEC 4 LDPAK — — 2SK3210(L), 2SK3210(S) Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & IC Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109 URL NorthAmerica : http:semiconductor.hitachi.com/ Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htm For further information write to: Hitachi Semiconductor (America) Inc. 2000 Sierra Point Parkway Brisbane, CA 94005-1897 Tel: <1> (800) 285-1601 Fax: <1> (303) 297-0447 Hitachi Europe GmbH Electronic components Group Dornacher Straße 3 D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00 Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322 Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HX Copyright © Hitachi, Ltd., 1998. All rights reserved. Printed in Japan. 5