EN C1+ V+ C1− C2+ C2− V− DOUT2 RIN2 ROUT2 Battery-Powered Systems PDAs Notebooks Laptops Palmtop PCs Hand-Held Equipment DESCRIPTION/ ORDERING INFORMATION The SN65C3222E and SN75C3222E consist of two line drivers, two line receivers, and a dual charge-pump circuit with ±15-kV ESD protection pin to pin (serial-port connection pins, including GND). The devices meet the requirements of TIA/EIA-232-F and provide the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. The devices operate at typical data signaling rates up to 1000 kbit/s and are improved drop-in replacements for industry-popular '3222 two-driver, two-receiver functions. 20 2 3 19 18 4 17 5 16 6 7 15 14 8 9 13 12 10 11 PWRDOWN VCC GND DOUT1 RIN1 ROUT1 NC DIN1 DIN2 NC NC − No internal connection RHL PACKAGE (TOP VIEW) APPLICATIONS • • • • • • 1 C1+ NC V+ C1– C2+ C2– V– DOUT2 NC RIN2 PWRDOWN • • • • • • DB, DW, OR PW PACKAGE (TOP VIEW) 1 24 2 3 4 23 VCC 22 NC 21 GND 5 6 20 DOUT1 19 RIN1 7 8 18 ROUT1 17 NC 9 10 16 DIN1 15 NC 14 DIN2 11 12 13 NC • ESD Protection for RS-232 Bus Pins – ±15-kV Human-Body Model (HBM) – ±8-kV IEC 61000-4-2, Contact Discharge – ±15-kV IEC 61000-4-2, Air-Gap Discharge Meet or Exceed the Requirements of TIA/EIA-232-F and ITU v.28 Standards Operate With 3-V to 5.5-V VCC Supply Operate up to 1000 kbit/s Two Drivers and Two Receivers Low Standby Current . . . 1 µA Typ External Capacitors . . . 4 × 0.1 µF Accepts 5-V Logic Input With 3.3-V Supply EN FEATURES • SLLS725A – JUNE 2006 – REVISED JULY 2006 ROUT2 www.ti.com SN65C3222E,, SN75C3222E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVERS/RECEIVERS WITH ±15-kV ESD PROTECTION NC − No internal connection The SN65C3222E and SN75C3222E can be placed in the power-down mode by setting the power-down (PWRDOWN) input low, which draws only 1 µA from the power supply. When the devices are powered down, the receivers remain active while the drivers are placed in the high-impedance state. Also, during power down, the onboard charge pump is disabled; V+ is lowered to VCC, and V– is raised toward GND. Receiver outputs also can be placed in the high-impedance state by setting enable (EN) high. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006, Texas Instruments Incorporated SN65C3222E,, SN75C3222E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVERS/RECEIVERS WITH ±15-kV ESD PROTECTION www.ti.com SLLS725A – JUNE 2006 – REVISED JULY 2006 ORDERING INFORMATION PACKAGE (1) TA SOIC – DW 0°C to 70°C SSOP – DB TSSOP – PW SOIC – DW –40°C to 85°C SSOP – DB TSSOP – PW (1) ORDERABLE PART NUMBER Tube of 25 SN75C3222EDW Reel of 2000 SN75C3222EDWR Tube of 70 SN75C3222EDB Reel of 2000 SN75C3222EDBR Tube of 70 SN75C3222EPW Reel of 2000 SN75C3222EPWR Tube of 25 SN65C3222EDW Reel of 2000 SN65C3222EDWR Tube of 70 SN65C3222EDB Reel of 2000 SN65C3222EDBR Tube of 70 SN65C3222EPW Reel of 2000 SN65C3222EPWR 75C3222E MY222E MY222E 65C3222E MU222E MU222E Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLES XXX Each Driver (1) INPUTS (1) DIN PWRDOWN OUTPUT DOUT X L Z L H H H H L H = high level, L = low level, X = irrelevant, Z = high impedance Each Receiver (1) INPUTS (1) 2 TOP-SIDE MARKING RIN EN OUTPUT ROUT L L H H L L X H Z Open L H H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or connected driver off Submit Documentation Feedback SN65C3222E,, SN75C3222E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVERS/RECEIVERS WITH ±15-kV ESD PROTECTION www.ti.com SLLS725A – JUNE 2006 – REVISED JULY 2006 LOGIC DIAGRAM (POSITIVE LOGIC) DIN1 DIN2 PWRDOWN EN ROUT1 13 17 12 8 20 DOUT1 DOUT2 Powerdown 1 15 16 RIN1 5 kW ROUT2 10 9 RIN2 5 kW Pin numbers are for the DB, DW, and PW packages. Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range (2) –0.3 6 V V+ Positive-output supply voltage range (2) –0.3 7 V V– Negative-output supply voltage range (2) 0.3 –7 V 13 V V+ – V– Supply voltage difference (2) VI Input voltage range VO Output voltage range θJA Package thermal impedance (3) (4) TJ Operating virtual junction temperature Tstg Storage temperature range Driver (EN, PWRDOWN) –0.3 6 Receiver –25 25 –13.2 13.2 –0.3 VCC + 0.3 Driver Receiver DB package 70 DW package 58 PW package 83 RHL package (1) (2) (3) (4) UNIT V V °C/W TBD –65 150 °C 150 °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to network GND. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. Submit Documentation Feedback 3 SN65C3222E,, SN75C3222E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVERS/RECEIVERS WITH ±15-kV ESD PROTECTION www.ti.com SLLS725A – JUNE 2006 – REVISED JULY 2006 Recommended Operating Conditions (1) See Figure 5 MIN NOM MAX UNIT VCC = 3.3 V Supply voltage VCC = 5 V VIH Driver and control high-level input voltage DIN, EN, PWRDOWN VIL Driver and control low-level input voltage DIN, EN, PWRDOWN VI Driver and control input voltage DIN, EN, PWRDOWN VI Receiver input voltage TA (1) Operating free-air temperature VCC = 3.3 V VCC = 5 V 3 3.3 3.6 4.5 5 5.5 V 2 V 2.4 0.8 V 0 5.5 V –25 25 V SN75C3222E 0 70 SN65C3222E –40 85 °C Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V. Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5) PARAMETER II ICC (1) (2) 4 TEST CONDITIONS Input leakage current (EN, PWRDOWN) Supply current No load, PWRDOWN at VCC Supply current (powered off) No load, PWRDOWN at GND MIN TYP (2) MAX ±0.01 ±1 µA 0.3 1 mA 1 10 µA Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Submit Documentation Feedback UNIT SN65C3222E,, SN75C3222E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVERS/RECEIVERS WITH ±15-kV ESD PROTECTION www.ti.com SLLS725A – JUNE 2006 – REVISED JULY 2006 DRIVER SECTION abc Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5) PARAMETER TEST CONDITIONS MIN TYP (2) MAX UNIT VOH High-level output voltage DOUT at RL = 3 kΩ to GND, DIN = GND 5 5.4 VOL Low-level output voltage DOUT at RL = 3 kΩ to GND, DIN = VCC –5 –5.4 IIH High-level input current VI = VCC ±0.01 ±1 µA IIL Low-level input current VI at GND ±0.01 ±1 µA ±35 ±60 mA IOS Short-circuit output current (3) ro Output resistance IOZ (1) (2) (3) VCC = 3.6 V VO = 0 V VCC = 5.5 V VCC, V+, and V– = 0 V, Output leakage current PWRDOWN = GND VO = ±2 V 300 V V Ω 10M VCC = 3 V to 3.6 V, VO = ±12 V ±25 VCC = 4.5 V to 5.5 V, VO = ±10 V ±25 µA Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one output should be shorted at a time. Switching Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5) PARAMETER Maximum data rate (See Figure 1) tsk(p) SR(tr) (1) (2) (3) Pulse skew (3) Slew rate, transition region (see Figure 1) MIN TYP (2) TEST CONDITIONS CL = 1000 pF RL = 3 kΩ, One DOUT switching UNIT 250 CL = 250 pF, VCC = 3 V to 4.5 V 1000 CL = 1000 pF, VCC = 4.5 V to 5.5 V 1000 CL = 150 pF to 2500 pF, RL = 3 kΩ to 7 kΩ, See Figure 2 RL = 7 kΩ, CL = 150 pF to 1000 pF RL = 3 kΩ MAX kbit/s 300 ns 8 90 CL = 1000 pF 12 60 CL = 150 pF to 250 pF 24 150 V/µs Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Pulse skew is defined as |tPLH – tPHL| of each channel of the same device. Submit Documentation Feedback 5 SN65C3222E,, SN75C3222E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVERS/RECEIVERS WITH ±15-kV ESD PROTECTION www.ti.com SLLS725A – JUNE 2006 – REVISED JULY 2006 RECEIVER SECTION abc Electrical Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5) PARAMETER VOH High-level output voltage IOH = –1 mA VOL Low-level output voltage IOL = 1.6 mA TYP (2) VCC – 0.6 VCC – 0.1 MAX 1.5 2.4 VCC = 5 V 1.8 2.4 Positive-going input threshold voltage VIT– Negative-going input threshold voltage Vhys Input hysteresis (VIT+ – VIT–) IOZ Output leakage current EN = 1 ri Input resistance VI = ±3 V to ±25 V VCC = 3.3 V 0.6 1.2 VCC = 5 V 0.8 1.5 UNIT V 0.4 VCC = 3.3 V VIT+ (1) (2) MIN TEST CONDITIONS V V V 0.3 V ±0.05 ±10 µA 5 7 kΩ 3 Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Switching Characteristics (1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TYP (2) UNIT tPLH Propagation delay time, low- to high-level output CL = 150 pF, See Figure 3 300 ns tPHL Propagation delay time, high- to low-level output CL = 150 pF, See Figure 3 300 ns ten Output enable time CL = 150 pF, RL = 3 kΩ, See Figure 4 200 ns tdis Output disable time CL = 150 pF, RL = 3 kΩ, See Figure 4 200 ns tsk(p) Pulse skew (3) See Figure 3 300 ns (1) (2) (3) 6 TEST CONDITIONS Test conditions are C1–C4 = 0.1 µF at VCC = 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at VCC = 5 V ± 0.5 V. All typical values are at VCC = 3.3 V or VCC = 5 V, and TA = 25°C. Pulse skew is defined as |tPLH – tPHL| of each channel of the same device. Submit Documentation Feedback SN65C3222E,, SN75C3222E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVERS/RECEIVERS WITH ±15-kV ESD PROTECTION www.ti.com SLLS725A – JUNE 2006 – REVISED JULY 2006 PARAMETER MEASUREMENT INFORMATION 3V Input Generator (see Note B) 1.5 V RS-232 Output 50 Ω RL 1.5 V 0V CL (see Note A) tTHL 3V PWRDOWN tTLH VOH 3V 3V Output −3 V −3 V VOL TEST CIRCUIT VOLTAGE WAVEFORMS SR(tr) + t THL 6V or t TLH A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 1. Driver Slew Rate 3V Generator (see Note B) RS-232 Output 50 Ω RL Input 1.5 V 1.5 V 0V CL (see Note A) tPHL tPLH VOH 3V PWRDOWN 50% 50% Output VOL TEST CIRCUIT VOLTAGE WAVEFORMS A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 250 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 2. Driver Pulse Skew EN 0V 3V Input 1.5 V 1.5 V −3 V Output Generator (see Note B) 50 Ω tPHL CL (see Note A) tPLH VOH 50% Output 50% VOL TEST CIRCUIT VOLTAGE WAVEFORMS A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 3. Receiver Propagation Delay Times Submit Documentation Feedback 7 SN65C3222E,, SN75C3222E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVERS/RECEIVERS WITH ±15-kV ESD PROTECTION www.ti.com SLLS725A – JUNE 2006 – REVISED JULY 2006 PARAMETER MEASUREMENT INFORMATION (continued) VCC GND S1 3V Input 1.5 V RL 3 V or 0 V 0V tPZH (S1 at GND) tPHZ Output CL (see Note A) EN S1 at GND) VOH Output 50% 0.3 V Generator (see Note B) 1.5 V 50 Ω tPLZ (S1 at VCC) 0.3 V Output 50% VOL tPZL (S1 at VCC) TEST CIRCUIT VOLTAGE WAVEFORMS A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 4. Receiver Enable and Disable Times 8 Submit Documentation Feedback SN65C3222E,, SN75C3222E 3-V TO 5.5-V MULTICHANNEL RS-232 LINE DRIVERS/RECEIVERS WITH ±15-kV ESD PROTECTION www.ti.com SLLS725A – JUNE 2006 – REVISED JULY 2006 APPLICATION INFORMATION 1 EN 2 + C1 − 3 C3† + 20 Powerdown VCC C1+ V+ GND 19 18 17 C1− 16 5 C2+ − 6 7 DOUT2 RIN2 − 15 C2− 14 V− RIN1 ROUT1 NC + 13 8 9 12 5 kW ROUT2 DOUT1 5 kW + C4 + C BYPASS − = 0.1 µF − 4 C2 PWRDOWN 11 10 DIN1 DIN2 NC † C3 can be connected to V CC or GND. NOTES: A. Resistor values shown are nominal. B. NC − No internal connection C. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown. VCC vs CAPACITOR VALUES VCC 3.3 V " 0.3 V C1 0.1 µF C2, C3, and C4 0.1 µF 5 V " 0.5 V 0.047 µF 0.33 µF 3 V to 5.5 V 0.1 µF 0.47 µF Figure 5. Typical Operating Circuit and Capacitor Values Submit Documentation Feedback 9 PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 PACKAGING INFORMATION (1) Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty SN65C3222EDB ACTIVE SSOP DB 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65C3222EDBG4 ACTIVE SSOP DB 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65C3222EDBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65C3222EDBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65C3222EDW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65C3222EDWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65C3222EDWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65C3222EDWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65C3222EPW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65C3222EPWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65C3222EPWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65C3222EPWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3222EDB ACTIVE SSOP DB 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3222EDBG4 ACTIVE SSOP DB 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3222EDBR ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3222EDBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3222EDW ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3222EDWG4 ACTIVE SOIC DW 20 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3222EDWR ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3222EDWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3222EPW ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3222EPWG4 ACTIVE TSSOP PW 20 70 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3222EPWR ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN75C3222EPWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM The marketing status values are defined as follows: Addendum-Page 1 Lead/Ball Finish MSL Peak Temp (3) PACKAGE OPTION ADDENDUM www.ti.com 6-Dec-2006 ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999 PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 14 PINS SHOWN 0,30 0,19 0,65 14 0,10 M 8 0,15 NOM 4,50 4,30 6,60 6,20 Gage Plane 0,25 1 7 0°– 8° A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 8 14 16 20 24 28 A MAX 3,10 5,10 5,10 6,60 7,90 9,80 A MIN 2,90 4,90 4,90 6,40 7,70 9,60 DIM 4040064/F 01/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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