HITTITE HMC253QS24

MICROWAVE CORPORATION
v03.0701
HMC253QS24
GaAs MMIC SP8T NON-REFLECTIVE
SWITCH, DC - 2.5 GHz
Typical Applications
Features
The HMC253QS24 is ideal for
DC - 2.5 GHz applications:
Low Insertion Loss (2 GHz): 1.3dB
Single Positive Supply: Vdd = +5V
• CATV/DBS
Integrated 3:8 TTL Decoder
• CDMA
24 Lead QSOP Package
• Cellular/PCS
Functional Diagram
General Description
The HMC253QS24 is a low-cost non-reflective
SP8T switch in a 24-lead QSOP package featuring wideband operation from DC to 2.5 GHz.
The switch offers a single positive bias and true
TTL/CMOS compatibility. A 3:8 decoder is integrated on the switch requiring only 3 control lines
and a positive bias to select each path. The
HMC253QS24 SP8T will replace multiple configurations of SP4T and SPDT MMIC switches.
SWITCHES - SMT
14
Electrical Specifications,
TA = +25° C, For TTL Control and Vdd = +5V in a 50 Ohm system
Parameter
Min.
Typ.
Max.
Units
1.1
1.3
1.8
1.5
1.7
2.4
dB
dB
dB
Insertion Loss
DC - 1.0 GHz
DC - 2.0 GHz
DC - 2.5 GHz
Isolation
DC - 1.0 GHz
DC - 2.0 GHz
DC - 2.5 GHz
32
26
24
36
30
28
dB
dB
dB
Return Loss
“On State”
DC - 1.0 GHz
DC - 2.0 GHz
DC - 2.5 GHz
14
9
6
18
12
8
dB
dB
dB
Return Loss (RF1-8)
“Off State”
0.3 - 2.5 GHz
0.5 - 2.5 GHz
7
10
10
13
dB
dB
Input Power for 1 dB Compression
0.3 - 2.5 GHz
20
23
dBm
Input Third Order Intercept
(Two-Tone Input Power = +7 dBm Each Tone)
0.3 - 2.5 GHz
40
43
dBm
Switching Characteristics
0.3 - 2.5 GHz
30
100
ns
ns
tRISE, tFALL (10/90% RF)
tON, tOFF (50% CTL to 10/90% RF)
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Frequency
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
HMC253QS24
v03.0701
MICROWAVE CORPORATION
GaAs MMIC SP8T NON-REFLECTIVE
SWITCH, DC - 2.5 GHz
GaAs
MMIC
Insertion
Loss
SUB-HARMONICALLY Isolation
PUMPED MIXER 17 - 25 GHz
0
0
-10
RF6, RF3
-40 C
ISOLATION (dB)
INSERTION LOSS (dB)
-0.5
-1
-1.5
+25 C
-2
-20
-30
-40
-50
+85 C
-2.5
-60
-3
-70
RF1, RF2, RF4, RF5, RF7, RF8
0
1
2
3
0
1
FREQUENCY (GHz)
2
3
FREQUENCY (GHz)
Return Loss
14
0
RF1-6 On
RFC
-10
-15
-20
RF1-6 Off
-25
-30
0
1
2
3
FREQUENCY (GHz)
Bias Voltage & Current
Truth Table
Control Input
Vdd Range = +5.0 Vdc ± 10%
Vdd
(Vdc)
Idd (Typ.)
(mA)
Idd (Max.)
(mA)
+5.0
6.0
9.0
TTL/CMOS Control Voltages
State
Bias Condition
Low
0 to +0.8 Vdc @ 5 uA Typ.
High
+2.0 to +5.0 Vdc @ 70 uA Typ.
Signal Path State
A
B
C
RFCOM to:
Low
Low
Low
RF1
High
Low
Low
RF2
Low
High
Low
RF3
High
High
Low
RF4
Low
Low
High
RF5
High
Low
High
RF6
Low
High
High
RF7
High
High
High
RF8
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
SWITCHES - SMT
RETURN LOSS (dB)
-5
14 - 143
MICROWAVE CORPORATION
v03.0701
HMC253QS24
GaAs MMIC SP8T NON-REFLECTIVE
SWITCH, DC - 2.5 GHz
Absolute Maximum Ratings
Bias Voltage Range (Port Vdd)
+7.0 Vdc
Control Voltage Range (A, B, C)
-0.5V to Vdd +1Vdc
Storage Temperature
-65 to +150 °C
Operating Temperature
-40 to +85 °C
Maximum Input Power
Vdd = +5V
+20 dBm (0.05 - 0.5 GHz)
+24 dBm (0.5 - 2.5 GHz)
NOTE:
DC Blocking capacitors are required at ports RFC and RF1,
2, 3, 4, 5, 6, 7, 8.
Outline Drawing
SWITCHES - SMT
14
NOTES:
1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED
PLASTIC SILICA AND SILICON IMPREGNATED.
2. LEADFRAME MATERIAL: COPPER ALLOY
3. LEADFRAME PLATING: Sn/Pb SOLDER
4. DIMENSIONS ARE IN INCHES [MILLIMETERS].
5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.
6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.
7. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.
14 - 144
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
MICROWAVE CORPORATION
v03.0701
HMC253QS24
GaAs MMIC SP8T NON-REFLECTIVE
SWITCH, DC - 2.5 GHz
Evaluation Circuit Board
The circuit board used in the final application should be generated with proper RF circuit design techniques. Signal
lines at the RF ports should have 50 ohm impedance while the package ground leads should be connected directly to
the ground plane similar to that shown above. A sufficient number of VIA holes should be used to connect the top and
bottom ground planes. The evaluation circuit board shown above is available from Hittite Microwave Corporation upon
request.
List of Material
Item
J1 - J9
J10 - J14
Description
PC Mount SMA Connector
DC Pin
C1 - C9
100 pF Capacitor, 0402 Pkg.
C10
0.01 uF Capacitor, 0603 Pkg.
U1
HMC253QS24 SP8T Switch
PCB*
SWITCHES - SMT
14
103704 Eval Board
* Circuit Board Material: Rogers 4350
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
14 - 145