HY57V161610D-I 2 Banks x 512K x 16 Bit Synchronous DRAM DESCRIPTION THE Hynix HY57V161610D is a 16,777,216-bits CMOS Synchronous DRAM, ideally suited for the Mobile applications which require low power consumption and industrial temperature range. HY57V161610D is organized as 2banks of 524,288x16. HY57V161610D is offering fully synchronous operation referenced to a positive edge clock. All inputs and outputs are synchronized with the rising edge of the clock input. The data paths are internally pipelined to achieve very high bandwidth. All input and output voltage levels are compatible with LVTTL. Programmable options include the length of pipeline (Read latency of 1,2 or 3), the number of consecutive read or write cycles initiated by a single control command (Burst length of 1,2,4,8 or full page), and the burst count sequence(sequential or interleave). A burst of read or write cycles in progress can be terminated by a burst terminate command or can be interrupted and replaced by a new burst read or write command on any cycle. (This pipeline design is not restricted by a `2N` rule.) FEATURES • Single 3.0V to 3.6V power supplyNote1) • Auto refresh and self refresh • All device pins are compatible with LVTTL interface • 4096 refresh cycles / 64ms • JEDEC standard 400mil 50pin TSOP-II with 0.8mm of pin pitch • Programmable Burst Length and Burst Type • All inputs and outputs referenced to positive edge of system clock • Data mask function by UDQM/LDQM • Internal two banks operation - 1, 2, 4, 8 and Full Page for Sequence Burst - 1, 2, 4 and 8 for Interleave Burst • Programmable CAS Latency ; 1, 2, 3 Clocks ORDERING INFORMATION Part No. Clock Frequency HY57V161610DTC-55I 183MHz HY57V161610DTC-6I 166MHz HY57V161610DTC-7I 143MHz HY57V161610DTC-10I 100MHz Organization Interface Package 2Banks x 512Kbits x 16 LVTTL 400mil 50pin TSOP II This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any responsibility for use of circuits described. No patent licenses are implied Rev. 0.3/Mar. 02 1 HY57V161610D-I PIN CONFIGURATION V DD DQ0 DQ1 V SSQ DQ2 DQ3 V DDQ DQ4 DQ5 V SSQ DQ6 DQ7 VDDQ LDQM /WE /CAS /RAS /CS A11 A10 A0 A1 A2 A3 V DD 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 50pin TSOP II 400mil x 825mil 0.8mm pin pitch 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 V SS DQ15 DQ14 VSSQ DQ13 DQ12 VDDQ DQ11 DQ10 VSSQ DQ9 DQ8 VDDQ NC UDQM CLK CKE NC A9 A8 A7 A6 A5 A4 VSS PIN DESCRIPTION PIN PIN NAME DESCRIPTION CLK Clock The system clock input. All other inputs are referenced to the SDRAM on the rising edge of CLK. CKE Clock Enable Controls internal clock signal and when deactivated, the SDRAM will be one of the states among power down, suspend or self refresh. CS Chip Select Command input enable or mask except CLK, CKE and DQM BA Bank Address Select either one of banks during both RAS and CAS activity. A0 ~ A10 Address Row Address : RA0 ~ RA10, Column Address : CA0 ~ CA7 Auto-precharge flag : A10 RAS, CAS, WE Row Address Strobe, Column Address Strobe, Write Enable RAS, CAS and WE define the operation. Refer function truth table for details LDQM, UDQM Data Input/Output Mask DQM control output buffer in read mode and mask input data in write mode DQ0 ~ DQ15 Data Input/Output Multiplexed data input / output pin VDD/VSS Power Supply/Ground Power supply for internal circuit and input buffer VDDQ/VSSQ Data Output Power/Ground Power supply for DQ NC No Connection No connection Rev. 0.3/Mar. 02 2 HY57V161610D-I FUNCTIONAL BLOCK DIAGRAM 1Mx16 Synchronous DRAM Row Decoder Ref. Addr.[0:11] Address[0:10] Refresh Counter Auto/Self Refresh Refresh Interval Timer Row Addr. Latch/Predecoder Self Refresh Counter 512Kx16 Bank 0 Sense AMP & I/O gates Column Decoder Precharge CKE Row Active CS RAS CAS State Machine BA(A11) Address Register Column Addr. Latch & Counter Column Active Burst Length Counter Overflow WE UDQM Column Decoder Sense AMP & I/O gates Row Addr. Latch/Predecoder LDQM Mode Register Rev. 0.3/Mar. 02 Data Input/Output Buffers CLK DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 512Kx16 Bank 1 Test Mode I/O Control 3 HY57V161610D-I ABSOLUTE MAXIMUM RATINGS Parameter Symbol Rating Unit Ambient Temperature TA - 40 ~ 85 °C Storage Temperature TSTG -55 ~ 125 °C Voltage on Any Pin relative to VSS VIN, VOUT -1.0 ~ 4.6 V Voltage on VDD relative to VSS VDD -1.0 ~ 4.6 V Short Circuit Output Current IOS 50 mA Power Dissipation PD 1 W Soldering Temperature·Time TSOLDER 260·10 °C ·Sec Note : Operation at above absolute maximum rating can adversely affect device reliability. DC OPERATING CONDITION (TA= -40°C to 85°C) Parameter Symbol Min Typ. Max Unit Note Power Supply Voltage VDD, VDDQ 3.0 3.3 3.6 V 1, 2 Input high voltage VIH 2.0 3.0 VDD + 0.3 V 1, 4 Input low voltage VIL -0.5 0 0.8 V 1, 5 Note Note : 1.All voltages are referenced to VSS = 0V. 2.VDD(min) is 3.15V when HY57V161610DTC-7I operates at CAS latency=2 3.VIH(max) is acceptable 4.6V AC pulse width with ≤ 10ns of duration. 4.VIL(min) is acceptable -1.5V AC pulse width with ≤ 10ns of duration. AC OPERATING CONDITION (TA= - 40°C to 85°C, VDD=3.0V to 3.6V, VSS=0V) Parameter Symbol Value Unit AC input high / low level voltage VIH / VIL 2.4/0.4 V Vtrip 1.4 V Input rise / fall time tR / tF 1 ns Output timing measurement reference level Voutref 1.4 V CL 30 pF Input timing measurement reference level voltage Output load capacitance for access time measurement 1 Note : 1. Output load to measure access times is equivalent to two TTL gates and one capacitance(30pF). For details, refer to AC/DC output load circuit. 2. VDD(min) is 3.15V when HY57V161610DTC-7I operates at CAS latency=2 and tCK2=8.9ns Rev. 0.3/Mar. 02 4 HY57V161610D-I CAPACITANCE (TA=25°C, f=1MHz) Parameter Pin Input capacitance Data input / output capacitance Symbol Min Max Unit CLK CI1 2.5 4 pF A0 ~ A10, BA CKE, CS, RAS, CAS, WE, UDQM, LDQM CI2 2.5 5 pF DQ0 ~ DQ15 CI/O 4 6.5 pF OUTPUT LOAD CIRCUIT Vtt=1.4V RT=250 Ω Output Output 30pF 30pF AC Output Load Circuit DC Output Load Circuit DC CHARACTERISTICS I (TA= - 40°C to 85°C) Parameter Symbol Min. Max Unit Note Power Supply Voltage VDD 3.0 3.6 V 1 Input leakage current IL -1 1 uA 2 Output leakage current IO -1 1 uA 3 Output high voltage VOH 2.4 - V IOH = -4mA Output low voltage VOL - 0.4 V IOL =+4mA Note : 1.VDD(min) is 3.15V when HY57V161610DTC-7I operates at CAS latency=2 and tCK2=8.9ns. 2.VIN = 0 to 3.6V, All other pins are not under test = 0V 3.DOUT is disabled, VOUT=0 to 3.6V Rev. 0.3/Mar. 02 5 HY57V161610D-I DC CHARACTERISTICS II (TA= -40°C to 85°C, VDD=3.0V to 3.6V, VSS=0VNote1,2) Speed Parameter Symbol Test Condition Unit -55I -6I -7I -10I 130 120 110 110 Operating Current IDD1 Burst Length=1, One bank active tRAS ≥ tRAS(min),tRP ≥ tRP(min), IO=0mA Precharge Standby Current in power down mode IDD2P CKE ≤ VIL(max), tCK = min. 1 IDD2PS CKE ≤ VIL(max), tCK = ∞ 1 IDD2N CKE ≥ VIH(min), CS ≥ VIH(min), tCK = min Input signals are changed one time during 2Clks. All other pins ≥ VDD-0.2V or ≤ 0.2V 20 IDD2NS CKE ≥ VIH(min), tCK = ∞ Input signals are stable. 15 IDD3P CKE ≤ VIL(max), tCK = min 3.0 IDD3PS CKE ≤ VIL(max), tCK = ∞ 3.0 IDD3N CKE ≥ VIH(min), CS ≥ VIH(min), tCK = min Input signals are changed one time during 2CLKs. All other pins ≥ VDD-0.2V or ≤ 0.2V 50 IDD3NS CKE ≥ VIH(min), tCK = ∞ Input signals are stable 30 Burst Mode Operating Current IDD4 tCK ≥ tCK(min), tRAS ≥ tRAS(min), IO=0mA All banks active Auto Refresh Current IDD5 tRRC ≥ tRRC(min), All banks active Self Refresh Current IDD6 CKE ≤ 0.2V Precharge Standby Current in non power down mode Active Standby Current in power down mode Active Standby Current in non power down mode Note mA mA mA mA mA CL=3 130 120 110 90 CL=2 110 110 110 - 130 110 110 110 mA 2 2 mA mA Note : 1.VDD(min) is 3.15V when HY57V161610DTC-7I operates at CAS latency=2 and tCK2=8.9ns. 2.IDD1 and IDD4 depend on output loading and cycle rates. Specified values are measured with the output open. Rev. 0.3/Mar. 02 6 HY57V161610D-I AC CHARACTERISTICS (TA= - 40°C to 85°C, VDD=3.0V to 3.6V, VSS=0VNote1,2) -55I Parameter -6I -7I -10I Symbol Unit Min Max Min Max Min Max Min Max Note CL=3 tCK3 5.5 6 - 7 - 10 - CL=2 tCK2 - 10 - 10 - 12 - Clock high pulse width tCHW 2 2 - 2.5 - 3 - ns 3 Clock low pulse width tCLW 2 2 - 2.5 - 3 - ns 3 - 5.5 - 6 - 7 - 6 - 6 - 7 System clock cycle time Access time from clock ns CL=3 tAC3 CL=2 tAC2 5 2 ns 2 Data-out hold time tOH 2 2 - 2.5 - 2.5 - ns Data-Input setup time tDS 1.5 1.5 - 1.75 - 2.5 - ns 3 Data-Input hold time tDH 1 1 - 1 - 1 - ns 3 Address setup time tAS 1.5 1.5 - 1.75 - 2.5 - ns 3 Address hold time tAH 1 1 - 1 - 1 - ns 3 CKE setup time tCKS 1.5 1.5 - 1.75 - 2.5 - ns 3 CKE hold time tCKH 1 1 - 1 - 1 - ns 3 Command setup time tCS 1.5 1.5 - 1.75 - 2.5 - ns 3 Command hold time tCH 1 1 - 1 - 1 - ns 3 CLK to data output in low Ztime tOLZ 2 2 - 2 - 2 - ns CLK to data output in high Ztime tOHZ 2 2 6 2 7 3 10 ns 5.5 Note : 1.VDD(min) is 3.15V when HY57V161610DTC-7I operates at CAS latency=2 and tCK2=8.9ns. 2.tCK2 is 8.9ns only when tAC2 is 7.9ns in HY57V161610DTC-6I and HY57V161610DTC-7I. 3.Assume tR / tF (input rise and fall time ) is 1ns. Rev. 0.3/Mar. 02 7 HY57V161610D-I AC CHARACTERISTICS Paramter Symbo l (TA= - 40°C to 85°C, VDD=3.0V to 3.6V, VSS=0VNote1,2)) -55I -6I -7I -10I Unit Min Max Min Max Min Max Min Max Operation tRC 55 60 - 70 - 70 - ns Auto Refresh tRRC 55 60 - 70 - 80 - ns RAS to CAS delay tRCD 16.5 18 - 20 - 20 - ns RAS active time tRAS 38.5 40 100K 45 100K 45 100K ns RAS precharge time tRP 3 3 - 3 - 2 - CLK RAS to RAS bank active delay tRRD 2 2 - 2 - 2 - CLK CAS to CAS bank active delay tCCD 1 1 - 1 - 1 - CLK Write command to data-in delay tWTL 0 0 - 0 - 0 - CLK Data-in to precharge command tDPL 1 1 - 1 - 1 - CLK Data-in to active command tDAL 4 4 - 4 - 3 - CLK DQM to data-in Hi-Z tDQZ 2 2 - 2 - 2 - CLK DQM to data mask tDQM 0 0 - 0 - 0 - CLK MRS to new command tMRD 2 2 - 2 - 2 - CLK Precharge to data output Hi-Z tPROZ 3 3 - 3 - 3 - CLK Power down exit time tPDE 1 1 - 1 - 1 - CLK Self refresh exit time tSRE 1 1 - 1 - 1 - CLK Refresh Time tREF 64 - 64 - 64 ms RAS cycle time 100K 64 Note 2 Note : 1. VDD(min) is 3.15V when HY57V161610DTC-7I operates at CAS latency=2 and tCK2=8.9ns. 2. A new command can be given tRRC after self refresh exit. Rev. 0.3/Mar. 02 8 HY57V161610D-I DEVICE OPERATING OPTION TABLE HY57V161610DTC-55I CAS Latency tRCD tRAS tRC tRP tAC tOH 183MHz 3CLKs 3CLKs 7CLKs 10CLKs 3CLKs 5ns 2ns 166MHz 3CLKs 3CLKs 7CLKs 10CLKs 3CLKs 5.5ns 2ns CAS Latency tRCD tRAS tRC tRP tAC tOH 166MHz 3CLKs 3CLKs 7CLKs 10CLKs 3CLKs 5.5ns 2ns 143MHz 3CLKs 3CLKs 7CLKs 10CLKs 3CLKs 5.5ns 2.5ns CAS Latency tRCD tRAS tRC tRP tAC tOH 143MHz 3CLKs 3CLKs 7CLKs 10CLKs 3CLKs 5.5ns 2.5ns 100MHz 2CLKs 2CLKs 5CLKs 7CLKs 2CLKs 7ns 2.5ns CAS Latency tRCD tRAS tRC tRP tAC tOH 100MHz 3CLKs 2CLKs 5CLKs 7CLKs 2CLKs 7ns 2.5ns 83MHz 2CLKs 2CLKs 4CLKs 6CLKs 2CLKs 7ns 2.5ns HY57V161610DTC-6I HY57V161610DTC-7I HY57V161610DTC-10I Rev. 0.3/Mar. 02 9 HY57V161610D-I COMMAND TRUTH TABLE Command CKEn CS RAS CAS WE DQM Mode Register Set H X L L L L X OP code H X X X No Operation H X X X L H H H Bank Active H X L L H H X H X L H L H X Read Read with Auto precharge Write H X L H L L X Write with Auto precharge A0~A9 A10/ AP CKEn-1 Row Address Column Address Column Address Precharge All Bank H X L L H L X Precharge selected Bank Burst Stop H U/LDQM H Auto Refresh H H L L L Burst-READ-SingleWRITE H X L L Entry H L L H Exit L H Self Refresh1 Entry H X L H H L Note V L V H L V H H X L V X X X V X H X X L L X A9 Pin High (Other Pins OP code) L L H X X X X X X X L H H H H X X X L H H H H X X X L H H H H X X X L V V V L Precharge power down BA X X Exit Entry L H H L Clock Suspend Exit L X H X X X X Note : 1. Exiting Self Refresh occurs by asynchronously bringing CKE from low to high. 2. X=Do not care, L=Low, H=High, BA=Bank Address, RA= Row Address, CA=Column Address, Opcode=Operand Code, NOP=No Operation. Rev. 0.3/Mar. 02 10 HY57V161610D-I PACKAGE INFORMATION 400mil 50pin Thin Small Outline Package (TC) 1Mx16 Synchronous DRAM UNIT : mm(inch) 11.938(0.4700) 10.262(0.4040) 11.735(0.4620) 10.059(0.3960) 0.8(0.0315 BSC) 0.45(0.0177) 0.30(0.0118) 1.2(0.0472) 1.0(0.0394) 0.150(0.0059) 21.057(0.8290) 20.879(0.8220) 0.646 REF 0.050(0.0020) GAGE PLANE 0~5deg 0.597(0.0235) 0.406(0.0160) Rev. 0.3/Mar. 02 0.210(0.0083) 0.120(0.0118) 11