TI SN74AC11PW

 SCAS532D − AUGUST 1995 − REVISED OCTOBER 2003
D 2-V to 6-V VCC Operation
D Inputs Accept Voltages to 6 V
D Max tpd of 7.5 ns at 5 V
1
14
2
13
3
12
4
11
5
10
6
9
7
8
VCC
1C
1Y
3A
3B
3C
3Y
2A
NC
2B
NC
2C
4
3 2 1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
1Y
NC
3A
NC
3B
2Y
GND
NC
3Y
3C
1A
1B
2A
2B
2C
2Y
GND
SN54AC11 . . . FK PACKAGE
(TOP VIEW)
1B
1A
NC
VCC
1C
SN54AC11 . . . J OR W PACKAGE
SN74AC11 . . . D, DB, N, NS, OR PW PACKAGE
(TOP VIEW)
NC − No internal connection
description/ordering information
The ’AC11 devices contain three independent 3-input AND gates. These devices perform the Boolean function
Y = A • B • C or Y = A + B + C in positive logic.
ORDERING INFORMATION
PDIP − N
SN74AC11N
Tube
SN74AC11D
Tape and reel
SN74AC11DR
SOP − NS
Tape and reel
SN74AC11NSR
AC11
SSOP − DB
Tape and reel
SN74AC11DBR
AC11
Tube
SN74AC11PW
Tape and reel
SN74AC11PWR
CDIP − J
Tube
SNJ54AC11J
SNJ54AC11J
CFP − W
Tube
SNJ54AC11W
SNJ54AC11W
LCCC − FK
Tube
SNJ54AC11FK
SNJ54AC11FK
TSSOP − PW
−55°C
−55
C to 125
125°C
C
TOP-SIDE
MARKING
Tube
SOIC − D
−40°C
−40
C to 85
85°C
C
ORDERABLE
PART NUMBER
PACKAGE†
TA
SN74AC11N
AC11
AC11
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
FUNCTION TABLE
(each gate)
INPUTS
A
B
C
OUTPUT
Y
H
H
H
H
L
X
X
L
X
L
X
L
X
X
L
L
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright  2003, Texas Instruments Incorporated
!"# $"%&! '#(
'"! ! $#!! $# )# # #* "#
'' +,( '"! $!#- '# #!#&, !&"'#
#- && $##(
$'"! !$& ./0 && $## # ##'
"&# )#+# #'( && )# $'"! $'"!
$!#- '# #!#&, !&"'# #- && $##(
POST OFFICE BOX 655303
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1
SCAS532D − AUGUST 1995 − REVISED OCTOBER 2003
logic diagram, each gate (positive logic)
1A
1B
1C
2A
2B
2C
3A
3B
3C
1
2
13
12
3
4
5
6
11
10
9
8
1Y
2Y
3Y
Pin numbers shown are for the D, DB, J, N, NS, PW, and W packages.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V
Input clamp current, IIK (VI < 0 or VI > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
Continuous output current, IO (VO = 0 to VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±200 mA
Package thermal impedance, θJA (see Note 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86°C/W
DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
2
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SCAS532D − AUGUST 1995 − REVISED OCTOBER 2003
recommended operating conditions (see Note 3)
VCC
Supply voltage
VIH
VCC = 3 V
VCC = 4.5 V
High-level input voltage
VCC = 5.5 V
VCC = 3 V
VIL
Input voltage
Low-level output current
∆t /∆v
MAX
MIN
MAX
2
6
2
6
2.1
2.1
3.15
3.15
3.85
3.85
0
High-level output current
IOL
MIN
0
Output voltage
IOH
SN74AC11
VCC = 4.5 V
VCC = 5.5 V
Low-level input voltage
VI
VO
SN54AC11
0.9
1.35
1.35
1.65
1.65
0
0
VCC
VCC
VCC = 3 V
VCC = 4.5 V
−12
−12
−24
−24
VCC = 5.5 V
VCC = 3 V
−24
−24
12
12
VCC = 4.5 V
VCC = 5.5 V
24
24
24
24
8
8
Input transition rise or fall rate
V
V
0.9
VCC
VCC
UNIT
V
V
V
mA
mA
ns / V
TA
Operating free-air temperature
−55
125
−40
85
°C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
IOH = −50 µA
VOH
IOH = −12 mA
IOH = −24 mA
IOH = −50 mA†
IOH = −75 mA†
SN54AC11
SN74AC11
MIN
MIN
MIN
3V
2.9
2.99
2.9
2.9
4.5 V
4.4
4.49
4.4
4.4
5.5 V
5.4
5.49
5.4
5.4
3V
2.56
2.4
2.46
4.5 V
3.86
3.7
3.76
5.5 V
4.86
4.7
4.76
5.5 V
MAX
IOL = 12 mA
IOL = 24 mA
3.85
0.002
0.1
0.1
0.1
4.5 V
0.001
0.1
0.1
0.1
5.5 V
0.001
0.1
0.1
0.1
3V
0.36
0.5
0.44
4.5 V
0.36
0.5
0.44
5.5 V
0.36
0.5
0.44
5.5 V
II
ICC
VI = VCC or GND
VI = VCC or GND,
5.5 V
Ci
VI = VCC or GND
V
1.65
5.5 V
1.65
5.5 V
5V
UNIT
V
3V
IOL = 50 mA†
IOL = 75 mA†
IO = 0
MAX
3.85
5.5 V
IOL = 50 µA
VOL
TA = 25°C
TYP
MAX
VCC
±0.1
±1
±1
µA
2
40
20
µA
2.6
pF
† Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms.
POST OFFICE BOX 655303
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3
SCAS532D − AUGUST 1995 − REVISED OCTOBER 2003
switching characteristics over recommended operating free-air temperature range,
VCC = 3.3 V " 0.3 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A, B, or C
Y
TA = 25°C
MIN
TYP
MAX
SN54AC11
SN74AC11
MIN
MAX
MIN
MAX
1.5
5.5
9.5
1
11
1
10
1.5
5.5
8.5
1
10.5
1
9.5
UNIT
ns
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V " 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
tPLH
tPHL
A, B, or C
Y
MIN
TA = 25°C
TYP
MAX
SN54AC11
SN74AC11
MIN
MAX
MIN
MAX
1.5
4
1.5
4
8
1
8.5
1
8.5
7
1
8
1
7.5
UNIT
ns
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER
Cpd
TEST CONDITIONS
Power dissipation capacitance
CL = 50 pF,
f = 1 MHz
TYP
UNIT
20
pF
PARAMETER MEASUREMENT INFORMATION
TEST
tPLH/tPHL
S1
Open
From Output
Under Test
CL = 50 pF
(see Note A)
S1
Open
50% VCC
50 % VCC
0V
tPHL
tPLH
2 × VCC
500 Ω
VCC
Input
(see Note B)
In-Phase
Output
50% VCC
tPLH
tPHL
500 Ω
Out-of-Phase
Output
LOAD CIRCUIT
VOH
50% VCC
VOL
50% VCC
VOH
50% VCC
VOL
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr v 2.5 ns, tf v 2.5 ns.
C. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
17-Oct-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
5962-87611012A
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
5962-8761101CA
ACTIVE
CDIP
J
14
1
TBD
Call TI
Level-NC-NC-NC
5962-8761101DA
ACTIVE
CFP
W
14
1
TBD
Call TI
Level-NC-NC-NC
SN74AC11D
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
SN74AC11DBLE
OBSOLETE
SSOP
DB
14
SN74AC11DBR
ACTIVE
SSOP
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC11DBRE4
ACTIVE
SSOP
DB
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC11DE4
ACTIVE
SOIC
D
14
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC11DR
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC11DRE4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC11N
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74AC11NE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74AC11NSR
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC11NSRE4
ACTIVE
SO
NS
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC11PW
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC11PWE4
ACTIVE
TSSOP
PW
14
90
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC11PWLE
OBSOLETE
TSSOP
PW
14
TBD
Call TI
SN74AC11PWR
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74AC11PWRE4
ACTIVE
TSSOP
PW
14
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SNJ54AC11FK
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
SNJ54AC11J
ACTIVE
CDIP
J
14
1
TBD
Call TI
Level-NC-NC-NC
SNJ54AC11W
ACTIVE
CFP
W
14
1
TBD
Call TI
Level-NC-NC-NC
TBD
50
Call TI
Level-1-260C-UNLIM
Call TI
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
17-Oct-2005
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MLCC006B – OCTOBER 1996
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
28 TERMINAL SHOWN
18
17
16
15
14
13
NO. OF
TERMINALS
**
12
19
11
20
10
A
B
MIN
MAX
MIN
MAX
20
0.342
(8,69)
0.358
(9,09)
0.307
(7,80)
0.358
(9,09)
28
0.442
(11,23)
0.458
(11,63)
0.406
(10,31)
0.458
(11,63)
21
9
22
8
44
0.640
(16,26)
0.660
(16,76)
0.495
(12,58)
0.560
(14,22)
23
7
52
0.739
(18,78)
0.761
(19,32)
0.495
(12,58)
0.560
(14,22)
24
6
68
0.938
(23,83)
0.962
(24,43)
0.850
(21,6)
0.858
(21,8)
84
1.141
(28,99)
1.165
(29,59)
1.047
(26,6)
1.063
(27,0)
B SQ
A SQ
25
5
26
27
28
1
2
3
4
0.080 (2,03)
0.064 (1,63)
0.020 (0,51)
0.010 (0,25)
0.020 (0,51)
0.010 (0,25)
0.055 (1,40)
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.045 (1,14)
0.035 (0,89)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
4040140 / D 10/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
The terminals are gold plated.
Falls within JEDEC MS-004
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MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
0,15 M
15
0,25
0,09
8,20
7,40
5,60
5,00
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
2,00 MAX
0,10
0,05 MIN
PINS **
14
16
20
24
28
30
38
A MAX
6,50
6,50
7,50
8,50
10,50
10,50
12,90
A MIN
5,90
5,90
6,90
7,90
9,90
9,90
12,30
DIM
4040065 /E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-150
POST OFFICE BOX 655303
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MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
0,65
14
0,10 M
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
8
14
16
20
24
28
A MAX
3,10
5,10
5,10
6,60
7,90
9,80
A MIN
2,90
4,90
4,90
6,40
7,70
9,60
DIM
4040064/F 01/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
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