ETC LBH1035

LBH1035
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CONTENTS
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1. Features
2. Package Outline Dimensions
3. Package material
4. Absolute Maximum Ratings
5. Electrical Optical Characteristics
6. Ranks
7. Taping
8. Packing Structure
9. Characteristic Diagrams
10. Reliability
11. Cautions
12. Warranty
13. Others
14. Revision history sheet
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1. Features
• Package : SMD Top View Type
• Colorless transparency
• 3.5 × 2.8 × 1.8 mm(L×W×H) small size surface mount type
• Viewing angle : extremely wide(120˚)
• Technology : InGaN
• Soldering methods : IR reflow soldering
• Taping : 8 mm conductive black carrier tape & antistatic clear cover tape.
2,000pcs/reel, Φ180 mm wheel
2. Outline dimensions
(unit : mm)
Anode
Anode
Cathode
Cathode
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3. Package material
(1) Material construction
Number
Item
1
LED Chip
2
Gold Wire
3
Lead Frame
4
Epoxy or Silicon Resin
5
Heat-Resistant Polymer
6
Zener Diode Chip
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4. Absolute Maximum Ratings
Parameter
(Ta = 25℃)
Symbol
Value
Unit
Power dissipation
PD
120
mW
Forward Current
IF
30
mA
*1Peak Forward Current
IFP
100
mA
*2Reverse Current
IRDC
100
mA
Operating Temperature
Topr
-30∼+85
℃
Storage Temperature
Tstg
-40∼+100
℃
Reflow Soldering Temperature
Tsol
Reflow Soldering : 240℃ for 10 sec.
Hand Soldering : 300℃ for 3 sec.
*1. IFP Conditions : Pulse Width ≤ 10msec. and Duty ≤ 1/10
*2. IRDC Rating : This Rating for Zener Diode
5. Electrical - Optical Characteristics
Characteristic
(Ta = 25℃)
Symbol
Test Condition
Min.
Typ.
Max.
Unit
Forward Voltage
VF
IF= 20mA
-
3.3
3.6
V
Reverse Voltage
VR
IR=10mA
0.8
-
1.5
V
Dominant Wavelength
λd
IF= 20mA
460
-
475
nm
θ1/2
IF= 20mA
-
±60
-
deg
*3Half Angle
3
* θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity
ESD Class(Mil Std-883d Method 3015.7) based on Human Body Model(HBM) : Class 3
ESD Class(EIAJ ED-4701A) based on Machine Model(MM) : Class 4
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6. Ranks
(IF=20mA, Ta=25℃)
(1) Dominant Wavelength
Wd RANK
Test Condition
A
B
IF= 20mA
C
Min.
Typ.
Max.
460
-
465
465
-
470
470
-
475
Unit
nm
* Chromaticity coordinates Measured : 0.01sr(CIE. LED_B)
* Measurement Uncertainty of the Wavelength : ±0.1nm
(2) Luminous intensity ranks
Iv RANK
Test Condition
(Ta=25℃)
Min.
Typ.
Max.
80
-
110
110
-
150
J
150
-
210
K
210
-
280
G
H
IF= 20mA
Unit
mcd
* Luminous intensity is tested at a current pulse duration of 25 ms and an accuracy of ±11%.
* Luminous Intensity Measured : 0.01sr(CIE. LED_B)
(3) Forward Voltage
VF RANK
(Ta=25℃)
Test Condition
Min.
Typ.
Max.
2.8
-
3.0
3.0
-
3.2
2
3.2
-
3.4
3
3.4
-
3.6
0
1
IF=20mA
Unit
V
* Voltages are tested at a current pulse duration of 1 ms and an accuracy of ±0.1V.
(4) Precautions On LED using
* To avoid optical difference, Please do not mix differently-ranked product.
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7. Taping
(1) Dimension of wheel((Material : PS Conductive, 10E9~12Ω)
(Unit : mm)
(2) Dimension of tape(Material : PS Conductive, 10E4~5Ω)
(Unit : mm)
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(3) Details of CHIP LEDs loading on tape
(End)
(Start)
more than 40mm
unloaded tape
mounted with LED
(2,000ea)
more than 40mm
unloaded tape
150 ~ 380mm
leading part
(4) Loading quantity per reel : 2,000pcs
(5) Label Outline
PART No.
LBH1035
* SIZE(L X W) : 40mm X 23mm
QUANTITY
2,000 EA
LOT No.
LXXXXX-xxx
○ – □ ◇
Wd Rank(ex. A, B)
Iv Rank(ex. H, J)
VF Rank(ex. 1, 2)
(6) Lot Number
The first six digits number shows lot number
The lot number is composed of the following characters:
○□◇△■●-×××
○ - Luxpia Initial
(L for Luxpia)
□ - Chip maker
(A for Chip Maker)
◇ - Year
(04 for 2004, 05 for 2005)
△ - Month
(A for Jan., B for Feb.)
■ - Day
(01 for 01., 12 for 12.)
● - Product input No. (A for first, B for second.)
××× - Luxpia’s Product Number
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8. Packing Structure
• The LEDs are packed in cardboard boxes after taping
Please refer to figure : page 8
The label on the minimum packing unit shows : Part Number, Lot Number, Ranking, Quantity
• In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes
for transportation.
• The LEDs may be damaged if the boxes are dropped or receive a strong impact against them,
so precautions must be taken to prevent any damage.
• The boxes are not water resistant and therefore must be kept away from water and moisture.
• When the LEDs are transported, we recommend that you use the same packing method as Luxpia.
• If a box shows noticeable damage upon arrival at the User’s warehouse. It is recommended that
the User submit a claim to Luxpia within one weeks after arrival of the products. If the submitted
notice regarding the damage exceeds the aforementioned two weeks, it will be treated in the
manner shown in term 13.
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9. Characteristic Diagrams
(1) Relative Luminous Intensity
(2) Max. Permissible Forward Current
vs Forward Current (IF-Iv)
1.6
35
30
1.2
Allowable If(mA)
Relative Luminosity
1.4
1.0
0.8
0.6
0.4
25
20
15
10
5
0.2
0.0
0
0
5
10
15
20
25
30
0
20
40
60
80
100
Ambient temp(℃)
Forw ard Current(mA)
(3) Forward Current vs Forward Voltage(IF-VF)
(4) Ambient Temperature vs Relative Luminosity
10
80
60
Relative Luminosity
Forward Current IF[mA]
70
50
40
30
20
1
10
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
Forward Voltage VF[V]
0.1
-40 -20
0
20
40
60
80
100
Ambient Temp(℃)
.
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(5) Radiation Characteristic
(TA=25℃ , IF = 20mA)
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10. Reliability
(1) The Reliability criteria of SMD LED
Limit
ITEM
Symbol
Test Condition
Min.
Max.
Forward Voltage
VF
IF = 20mA
I.V × 0.9
I.V × 1.1
Reverse Voltage
VR
IR
= 10mA
I.V × 0.9
I.V × 1.1
Luminous intensity
Iv
IF = 20mA
I.V × 0.7
I.V × 1.3
Chromaticity Coordinates
x, y
IF = 20mA
I.V × 0.8
I.V × 1.2
* I.V : Initial Value
U : Upper Spec Limit
L : Lower Spec Limit
(2) Results of reliability Test
NO
Item
Test Conditions
Time
Ac/Re
(검토,보증)
1
Steady State Operating Life
Ta=25℃, If=30mA
1000hrs
0/22, 0/45
2
Steady State Operating Life of
Low Temperature
Ta=-30℃, If=20mA
1000hrs
0/22, 0/45
3
Steady State Operating Life of
High Temperature
Ta=85℃, If=7.5mA
1000hrs
0/22, 0/45
4
Steady State Operating Life of
High Humidity Heat
Ta=60℃, RH=90%, If=20mA
1000hrs
0/22, 0/45
5
Temperature Cycle
100Cycle
0/22, 0/45
Ta=-40℃~25℃~100℃~25℃
Time=30min~5min~30min~5min
6
Low Temperature Storage
Ta=-40℃
1000hrs
0/22, 0/45
7
High Temperature Storage
Ta=100℃
1000hrs
0/22, 0/45
8
Temperature Humidity
Storage
Ta=60℃, RH=90%
1000hrs
0/22, 0/45
9
SHT(Reflow)
Tsld=240℃, 10sec
1 time
0/22, 0/45
10
Solderability(Reflow)
Tsld=230±5℃, 3sec
1 time
(over5%)
0/22, 0/45
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11. Cautions
(1) Moisture Proof Package
• When moisture is absorbed into the SMT package it may vaporize and expand during soldering.
There is a possibility that this can cause exfoliation of the contacts and damage to the optical
characteristics of the LEDs. For this reason, the moisture proof package is used to keep
moisture to a minimum in the package.
• A package of a moisture absorbent material (silica gel) is inserted into the shielding bag.
The silica gel changes its color from blue to pink as it absorbs moisture.
(2) Storage
• Storage Conditions
Before opening the package :
The LEDs should be kept at 30℃ or less and 90%RH or less. The LEDs should be used
within a year. When storing the LEDs, moisture proof packaging with absorbent material
(silica gel) is recommended.
After opening the package :
The LEDs should be kept at 30℃ or less and 70%RH or less. The LEDs should be soldered
within 168 hours (7days) after opening the package. If unused LEDs remain, they should be
stored in moisture proof packages, such as sealed containers with packages of moisture
absorbent material (silica gel). It is also recommended to return the LEDs to the original
moisture proof bag and to reseal the moisture proof bag again.
• If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions.
Baking treatment : more than 24 hours at 65±5℃
• Luxpia LED electrode sections are comprised of a silver plated copper alloy. The silver surface
may be affected by environments which contain corrosive gases and so on. Please avoid
condition may cause difficulty during soldering operations. It is recommended that the User
use the LEDs as soon as possible.
• Please avoid rapid transitions in ambient temperature, especially in high humidity environments
where condensation can occur.
(3) Heat Generation
• Thermal design of the end product is of paramount importance. Please consider the heat
generation of the LED when making the system design. The coefficient of temperature
increase per input electric power is affected by the thermal resistance of the circuit board and
density of LED placement on the board, as well as other components. It is necessary to avoid
intense heat generation and operate within the maximum ratings given in this specification.
• The operating current should be decided after considering the ambient maximum temperature
of LEDs.
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(4) Soldering Conditions
• The LEDs can be soldered in place using the reflow soldering method. Luxpia cannot make a
guarantee on the LEDs after they have been assembled using the dip soldering method.
• Recommended soldering conditions
Reflow Soldering
Hand Soldering
Lead Solder
Lead-free Solder
Temperature
300℃ Max
Pre-heat
180~200℃
120~150℃
Soldering time
3sec Max
Pre-heat time
120sec Max
120sec Max
(one time only)
Peak temperature 240℃ Max
260℃ Max
Soldering time
10sec Max
10sec Max
refer to
refer to
Temperature
Temperature
1
2
- profile ○
- profile ○
* After reflow soldering rapid cooling should be avoided.
Temperature-profile (Surface of circuit board)
Use the conditions shown to the under figure.
1 : Lead Solder]
2 : Lead-free Solder]
[○
[○
[Recommended soldering pad design]
Use the following conditions shown in the figure.
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• Occasionally there is a brightness decrease caused by the influence of heat or ambient
atmosphere during air reflow. It is recommended that the User use the nitrogen reflow method.
• Repairing should not be done after the LEDs have been soldered. When repairing is
unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand
whether the characteristics of the LEDs will or will not be damaged by repairing.
• Reflow soldering should not be done more than two times.
• When soldering, do not put stress on the LEDs during heating.
• After soldering, do not warp the circuit board.
(5) Cleaning
• It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When
using other solvents, it should be confirmed beforehand whether the solvents will
dissolve the package and the resin or not. Freon solvents should not be
used to clean the LEDs because of worldwide regulations. Do not clean the LEDs by the
ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs
depends on factors such as ultrasonic power and the assembled condition.
Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will
occur.
(6) Static Electricity
• Static electricity or surge voltage damages the LEDs.
It is recommended that a wrist band or an anti-electrostatic glove be used when handling the
LEDs.
• All devices, equipment and machinery must be properly grounded.
It is recommended that measures be taken against surge voltage to the equipment that mounts
The LEDs.
•When inspecting the final products in which LEDs were assembled,it is recommended to check
whether the assembled LEDs are damaged by static electricity or not. It is easy to find staticdamaged LEDs by a light-on test or a VF test at a lower current(below 1mA is recommended).
• Damaged LEDs will show some unusual characteristics such as the leak current remarkably
increases, the forward voltage becomes lower, or the LEDs do not light at the low current.
Criteria : (VF > 2.0V at
IF=0.5mA)
(7) Others
• Care must be taken to ensure that the reverse voltage will not exceed the absolute maximum
rating when using the LEDs with matrix drive.
• The LED light output is strong enough to injure human eyes. Precautions must be taken to
prevent looking directly at the LEDs with unaided eyes for more than a few seconds.
• Flashing lights have been known to cause discomfort in people; you can prevent this by taking
precautions during use. Also, people should be cautious when using equipment that has had
LEDs incorporated into it.
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12. Warranty
(1) Luxpia warrants that its LEDs conform to the foregoing specifications and that Luxpia will
convey good title to all LEDs sold.
(2) Luxpia Disclaims all other warranties including the implied warranties of merchantability and
fitness for a particular purpose.
(3) In the event any LED supplied by Luxpia is found not to conform to the foregoing
specifications within ninety days of receipt, Luxpia will repair or replace the LED, at Luxpia’s
discretion, provided that the User (1) promptly notifies Luxpia in writing of the details of the
defect (2) ships the LEDs at the User’s expense to Luxpia for examination, and (3) the defect
is due to the negligence of Luxpia and not mishandling or misuse by the User.
(4) Luxpia will not take responsibility for any trouble that is caused by using the LEDs at
conditions exceeding our specifications.
(5) These specifications are applied only when a LED stands alone and it is strongly
recommended that the User of the LEDs confirms the properties upon assembly. Luxpia is not
responsible for failures caused during and after assembling.
It will be excepted from the rule if the failure would caused undoubtedly by Luxpia.
(6) A claim report stating details about the defect shall be made when returning defective LEDs.
Luxpia will investigate the report immediately and inform the user of the results.
(7) The LEDs described in this brochure are intended to be used for ordinary electronic equipment
(Such as office equipment, communications equipment, on the applications in which
exceptional quality and reliability are required, particularly when the failure or malfunction of
the LEDs may directly jeopardize life or health (such as for airplanes, aerospace, submersible
repeaters, nuclear reactor control systems, automobiles, traffic control equipment, life support
systems and safety devices)
(8) Luxpia’s liability for defective lamps shall be limited to replacement and in no event shall
Luxpia be liable for consequential damage or lost profits.
13. Others
(1) The warranties of quality set forth herein are exclusive. All previous negotiations and
agreements not specifically incorporated herein are superseded and rendered null and void.
(2) Both parties shall sincerely try to find a solution when any disagreement occurs regarding
these specifications.
(3) User shall not reverse engineer by disassembling or analysis of the LEDs without having prior
written consent from Luxpia. When defective LEDs are found, the User shall inform Luxpia
directly before disassembling or analysis.
(4) These specifications can be revised upon mutual agreement.
(5) Luxpia understands that the User accepts the content of these specifications, if the User does
not return these specifications with signatures within 3 weeks after receipt.
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14. Revision history sheet
Spec NO.
Title
Specification for Approval
Times
Date
Summary of revision
1
2
3
2003. 04. 16.
2004. 09. 09.
2004. 11. 15.
신규제정
Format 변경
Mold재료 및 Soldering 조건 추가
Remarks
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