TI TS12A4514D

TS12A4514,, TS12A4515
LOW-VOLTAGE, LOW ON-STATE RESISTANCE
SPST CMOS ANALOG SWITCHES
www.ti.com
SCDS193B – AUGUST 2006 – REVISED MARCH 2007
FEATURES
•
•
•
2-V to 12-V Single-Supply Operation
Specified ON-State Resistance:
– 15 Ω Max With 12-V Supply
– 20 Ω Max With 5-V Supply
– 50 Ω Max With 3.3-V Supply
Specified Low OFF-Leakage Currents:
– 1 nA at 25°C
– 10 nA at 85°C
•
•
•
•
•
Specified Low ON-Leakage Currents:
– 1 nA at 25°C
– 10 nA at 85°C
Low Charge Injection: 11.5 pC (12-V Supply)
Fast Switching Speed:
tON = 80 ns, tOFF = 50 ns (12-V Supply)
Break-Before-Make Operation (tON > tOFF)
TTL/CMOS-Logic Compatible With 5-V Supply
DESCRIPTION/ORDERING INFORMATION
The TS12A4514/TS12A4515 are single pole/single throw (SPST), low-voltage, single-supply CMOS analog
switches, with very low switch ON-state resistance. The TS12A4514 is normally open (NO). The TS12A4515 is
normally closed (NC).
These CMOS switches can operate continuously with a single supply between 2 V and 12 V. Each switch can
handle rail-to-rail analog signals. The OFF-leakage current maximum is only 1 nA at 25°C or 10 nA at 85°C.
All digital inputs have 0.8-V to 2.4-V logic thresholds, ensuring TTL/CMOS-logic compatibility when using a 5-V
supply.
For pin-compatible parts for use with dual supplies, see the TS12A4516/TS12A4517.
ORDERING INFORMATION
PACKAGE (1)
TA
PDIP – P
Reel of 1500
TS12A4514D
Reel of 2500
TS12A4514DR
SOP (SOT-23) – DBV
Reel of 3000
TS12A4514DBVR
PREVIEW
PDIP – P
Reel of 1000
TS12A4515P
TS12A4515P
Reel of 1500
TS12A4515D
Reel of 2500
TS12A4515DR
Reel of 3000
TS12A4515DBVR
SOIC – D
SOP (SOT-23) – DBV
(1)
TOP-SIDE MARKING
TS12A4514P
SOIC – D
–40°C to 85°C
ORDERABLE PART NUMBER
Reel of 1000
TS12A4514P
YD514
YD515
PREVIEW
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
UNLESS OTHERWISE NOTED this document contains
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2006–2007, Texas Instruments Incorporated
TS12A4514,, TS12A4515
LOW-VOLTAGE, LOW ON-STATE RESISTANCE
SPST CMOS ANALOG SWITCHES
www.ti.com
SCDS193B – AUGUST 2006 – REVISED MARCH 2007
PIN CONFIGURATIONS
TS12A4514
D OR P PACKAGE
(TOP VIEW)
COM 1
TS12A4515
D OR P PACKAGE
(TOP VIEW)
8 NO
COM 1
8 NC
NC 2
7 GND
NC 2
7 GND
NC 3
6 IN
NC 3
6 IN
V+ 4
5 NC
V+ 4
5 NC
INPUT
LOW
HIGH
SWITCH STATE
TS12A4514 TS12A4515
OFF
ON
ON
OFF
TS12A4514
SOT-23 PACKAGE
(TOP VIEW)
COM 1
5 V+
5 V+
COM 1
NC 2
NO 2
GND 3
TS12A4515
SOT-23 PACKAGE
(TOP VIEW)
4 IN
GND 3
4 IN
MARKNG INFORMATION (SOTs only)
LOT SPECIFIC CODE
XX XX
AE = TS12A4514
AF = TS12A4515
N.C. = Not internally connected
NO = Normally open
Absolute Minimum and Maximum Ratings (1) (2)
voltages referenced to GND
MIN
MAX
V+
Supply voltage range (3)
–0.3
13
V
VNC
VNO
VCOM
Analog voltage range (4)
–0.3
V+ + 0.3
or ±20 mA
V
Continuous current into any terminal
Peak current, NO or COM (pulsed at 1 ms, 10% duty cycle)
ESD per method 3015.7
Continuous power dissipation (TA = 70°C)
mA
±30
mA
8-pin plastic DIP (derate 9.09 mW/°C above 70°C)
727
8-pin SOIC (derate 5.88 mW/°C above 70°C)
471
V
mW
571
TA
Operating temperature range
–40
85
°C
Tstg
Storage temperature range
–65
150
°C
300
°C
Lead temperature (soldering, 10 s)
(1)
(2)
(3)
(4)
2
±20
>2000
5-pin SOT-23 (derate 7.1 mW/°C above 70°C)
UNIT
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum
All voltages are with respect to ground, unless otherwise specified.
Voltages exceeding V+ or GND on any signal terminal are clamped by internal diodes. Limit forward-diode current to maximum current
rating.
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TS12A4514,, TS12A4515
LOW-VOLTAGE, LOW ON-STATE RESISTANCE
SPST CMOS ANALOG SWITCHES
www.ti.com
SCDS193B – AUGUST 2006 – REVISED MARCH 2007
Electrical Characteristics for 5-V Supply
(1)
V+ = 4.5 V to 5.5 V, VINH = 2.4 V, VINL = 0.8 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
TA
MIN TYP (2)
MAX
UNIT
Analog Switch
Analog signal range
VCOM, VNO, VNC
ON-state resistance
ron
ON-state resistance
flatness
ron(flat)
0
V+ = 4.5 V, VCOM = 3.5 V,
ICOM = 1 mA
25°C
VCOM = 1 V, 2 V, 3 V,
ICOM = 1 mA
25°C
V+
9.5
Full
15
20
1
Full
3
4
NO, NC
OFF leakage current (3)
INO(OFF),
INC(OFF)
V+ = 5.5 V, VCOM = 1 V,
VNO or VNC = 4.5 V
25°C
1
Full
10
COM
OFF leakage current (3)
ICOM(OFF)
V+ = 5.5 V, VCOM = 1 V,
VNO or VNC = 4.5 V
25°C
1
Full
10
COM
ON leakage current (3)
ICOM(ON)
V+ = 5.5 V, VCOM = 4.5 V,
VNO or VNC = 4.5 V
25°C
1
Full
10
V
Ω
Ω
nA
nA
nA
Digital Control Input (IN)
Input logic high
VIH
Full
2.4
V+
V
Input logic low
VIL
Full
0
0.8
V
0.01
µA
Input leakage current
IIH, IIL
VIN = V+, 0 V
Full
Turn-on time
tON
see Figure 2
Turn-off time
tOFF
see Figure 2
Charge injection (4)
QC
CL = 1 nF, VNO = 0 V,
RS = 0 Ω, See Figure 1
25°C
–3
pC
NO, NC
OFF capacitance
CNO(OFF),
CNC(OFF)
f = 1 MHz, See Figure 4
25°C
7.5
pF
COM
OFF capacitance
CCOM(OFF)
f = 1 MHz, See Figure 4
25°C
7.5
pF
COM
ON capacitance
CCOM(ON)
f = 1 MHz, See Figure 4
25°C
19
pF
VIN = V+, 0 V
25°C
1.5
pF
25°C
475
MHz
Dynamic
Digital input capacitance
CI
25°C
32
Full
25°C
100
125
25
Full
50
60
ns
ns
Bandwidth
BW
RL = 50 Ω, CL = 15 pF,
VNO = 1 VRMS, f = 100 kHz
OFF isolation
OISO
RL = 50 Ω, CL = 15 pF,
VNO = 1 VRMS, f = 100 kHz
25°C
–94
dB
Total harmonic distortion
THD
RL = 50 Ω, CL = 15 pF,
VNO = 1 VRMS, f = 100 kHz
25°C
0.08
%
Supply
V+ supply current
(1)
(2)
(3)
(4)
I+
VIN = 0 V or V+
25°C
0.05
Full
0.1
µA
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
Typical values are at TA = 25°C.
Leakage parameters are 100% tested at maximum-rated hot operating temperature, and are ensured by correlation at 25°C.
Specified by design, not production tested
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TS12A4514,, TS12A4515
LOW-VOLTAGE, LOW ON-STATE RESISTANCE
SPST CMOS ANALOG SWITCHES
www.ti.com
SCDS193B – AUGUST 2006 – REVISED MARCH 2007
Electrical Characteristics for 12-V Supply (1)
V+ = 11.4 V to 12.6 V, VINH = 5 V, VINL = 0.8 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
TA
MIN TYP (2)
MAX
UNIT
Analog Switch
Analog signal range
VCOM, VNO, VNC
ON-state resistance
ron
ON-state resistance
flatness
ron(flat)
0
V+ = 11.4 V, VCOM = 10 V,
ICOM = 1 mA
25°C
V+ = 11.4 V,
VCOM = 2 V, 5 V, 10 V,
ICOM = 1 mA
25°C
V+
6.5
Full
10
15
1.5
Full
3
4
NO, NC
OFF leakage current (3)
INO(OFF),
INC(OFF)
V+ = 12.6 V, VCOM = 1 V,
VNO or VNC = 10 V
25°C
1
Full
10
COM
OFF leakage current (3)
ICOM(OFF)
V+ = 12.6 V, VCOM = 1 V,
VNO or VNC = 10 V
25°C
1
Full
10
COM
ON leakage current (3)
ICOM(ON)
V+ = 12.6 V, VCOM = 10 V,
VNO or VNC = 10 V
25°C
1
Full
10
V
Ω
Ω
nA
nA
nA
Digital Control Input (IN)
Input logic high
Input logic low
Input leakage current
VIH
VIL
Full
5
Full
0
V+
Full
V
0.8
V
0.001
µA
IIH, IIL
VIN = V+, 0 V
Turn-on time
tON
See Figure 2
Turn-off time
tOFF
See Figure 2
Charge injection (4)
QC
CL = 1 nF, VNO = 0 V,
RS = 0 Ω, See Figure 1
25°C
–11.5
pC
NO, NC
OFF capacitance
CNO(OFF)
CNC(OFF)
f = 1 MHz, See Figure 4
25°C
7.5
pF
COM
OFF capacitance
CCOM(OFF)
f = 1 MHz, See Figure 4
25°C
7.5
pF
COM
ON capacitance
CCOM(ON)
f = 1 MHz, See Figure 4
25°C
21.5
pF
VIN = V+, 0 V
25°C
1.5
pF
25°C
520
MHz
Dynamic
Digital input capacitance
CI
25°C
22
Full
25°C
75
80
20
Full
45
50
ns
ns
Bandwidth
BW
RL = 50 Ω, CL = 15 pF,
VNO = 1 VRMS, f = 100 kHz
OFF isolation
OISO
RL = 50 Ω, CL = 15 pF,
VNO = 1 VRMS, f = 100 kHz
25°C
–95
dB
Total harmonic distortion
THD
RL = 50 Ω, CL = 15 pF,
VNO = 1 VRMS, f = 100 kHz
25°C
0.07
%
Supply
V+ supply current
(1)
(2)
(3)
(4)
4
I+
VIN = 0 V or V+
25°C
0.05
Full
0.2
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
Typical values are at TA = 25°C.
Leakage parameters are 100% tested at maximum-rated hot operating temperature, and are ensured by correlation at 25°C.
Specified by design, not production tested
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µA
TS12A4514,, TS12A4515
LOW-VOLTAGE, LOW ON-STATE RESISTANCE
SPST CMOS ANALOG SWITCHES
www.ti.com
SCDS193B – AUGUST 2006 – REVISED MARCH 2007
Electrical Characteristics for 3-V Supply
(1)
V+ = 3 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER
SYMBOL
TEST CONDITIONS
TA
MIN TYP (2)
MAX
UNIT
Analog Switch
Analog signal range
VCOM, VNO, VNC
0
V+
ON-state resistance
ron
V+ = 3 V, VCOM = 1.5 V,
INO = 1 mA,
25°C
ON-state resistance
flatness
V+ = 3 V,
VCOM = 1 V, 1.5 V, 2 V,
ICOM = 1 mA
25°C
ron(flat)
NO, NC
OFF leakage current (3)
INO(OFF),
INC(OFF)
V+ = 3.6 V, VCOM = 1 V,
VNO or VNC = 3 V
25°C
1
Full
10
COM
OFF leakage current (3)
ICOM(OFF)
V+ = 3.6 V, VCOM = 1 V,
VNO or VNC = 3 V
25°C
1
Full
10
COM
ON leakage current (3)
ICOM(ON)
V+ = 3.6 V, VCOM = 3 V,
VNO or VNC = 3 V
25°C
1
Full
10
18.5
Full
40
50
1
Full
3
4
V
Ω
Ω
nA
nA
nA
Digital Control Input (IN)
Input logic high
Input logic low
Input leakage current
VIH
VIL
IIH, IIL
VIN = V+, 0 V
Turn-on time (4)
tON
See Figure 2
Turn-off time (4)
tOFF
See Figure 2
Full
2.4
Full
0
V+
Full
V
0.8
V
0.01
µA
Dynamic
Charge injection (4)
25°C
63
Full
25°C
120
175
33
Full
80
120
ns
ns
QC
CL = 1 nF, See Figure 1
25°C
–1.5
pC
NO, NC
OFF capacitance
CNO(OFF),
CNC(OFF)
f = 1 MHz, See Figure 4
25°C
7.5
pF
COM
OFF capacitance
CCOM(OFF)
f = 1 MHz, See Figure 4
25°C
7.5
pF
COM
ON capacitance
CCOM(ON)
f = 1 MHz, See Figure 4
25°C
17
pF
VIN = V+, 0 V
25°C
1.5
pF
25°C
460
MHz
Digital input capacitance
CI
Bandwidth
BW
RL = 50 Ω, CL = 15 pF,
VNO = 1 VRMS, f = 100 kHz
OFF isolation
OISO
RL = 50 Ω, CL = 15 pF,
VNO = 1 VRMS, f = 100 kHz
25°C
–94
dB
Total harmonic distortion
THD
RL = 50 Ω, CL = 15 pF,
VNO = 1 VRMS, f = 100 kHz
25°C
0.15
%
Supply
V+ supply current
(1)
(2)
(3)
(4)
I+
VIN = 0 V or V+
25°C
0.03
Full
0.05
µA
The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
Typical values are at TA = 25°C.
Leakage parameters are 100% tested at maximum-rated hot operating temperature, and are ensured by correlation at 25°C.
Specified by design, not production tested
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TS12A4514,, TS12A4515
LOW-VOLTAGE, LOW ON-STATE RESISTANCE
SPST CMOS ANALOG SWITCHES
www.ti.com
SCDS193B – AUGUST 2006 – REVISED MARCH 2007
PIN DESCRIPTION (1)
PIN NO.
TS12A4514
(1)
6
TS12A4515
D, P
SOT-23
NAME
D, P
SOT-23
DESCRIPTION
1
1
1
1
COM
2, 3, 5
–
2, 3, 5
–
NC
Common
No connect (not internally connected)
4
5
4
5
V+
Power supply
6
4
6
4
IN
Digital control to connect COM to NO or NC
7
3
7
3
GND
Digital ground
8
2
–
–
NO
Normally open
–
–
8
2
NC
Normally closed
NO, NC, and COM pins are identical and interchangeable. Any may be considered as an input or an output; signals pass in both
directions.
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TS12A4514,, TS12A4515
LOW-VOLTAGE, LOW ON-STATE RESISTANCE
SPST CMOS ANALOG SWITCHES
www.ti.com
SCDS193B – AUGUST 2006 – REVISED MARCH 2007
APPLICATION INFORMATION
Power-Supply Considerations
The TS12A4514/TS12A4515 construction is typical of most CMOS analog switches, except that they have only
two supply pins: V+ and GND. V+ and GND drive the internal CMOS switches and set their analog voltage limits.
Reverse ESD-protection diodes are internally connected between each analog-signal pin and both V+ and GND.
One of these diodes conducts if any analog signal exceeds V+ or GND.
Virtually all the analog leakage current comes from the ESD diodes to V+ or GND. Although the ESD diodes on
a given signal pin are identical and, therefore, fairly well balanced, they are reverse biased differently. Each is
biased by either V+ or GND and the analog signal. This means their leakages will vary as the signal varies. The
difference in the two diode leakages to the V+ and GND pins constitutes the analog-signal-path leakage current.
All analog leakage current flows between each pin and one of the supply terminals, not to the other switch
terminal. This is why both sides of a given switch can show leakage currents of the same or opposite polarity.
There is no connection between the analog-signal paths and V+ or GND.
V+ and GND also power the internal logic and logic-level translators. The logic-level translators convert the logic
levels to switched V+ and GND signals to drive the analog signal gates.
Logic-Level Thresholds
The logic-level thresholds are CMOS/TTL compatible when V+ is 5 V. As V+ is raised, the level threshold
increases slightly. When V+ reaches 12 V, the level threshold is about 3 V – above the TTL-specified high-level
minimum of 2.8 V, but still compatible with CMOS outputs.
CAUTION:
Do not connect the TS12A4514/MAS4515 V+ to 3 V and then connect the
logic-level pins to logic-level signals that operate from 5-V supply. Output
levels can exceed 3 V and violate the absolute maximum ratings, damaging the
part and/or external circuits.
High-Frequency Performance
In 50-Ω systems, signal response is reasonably flat up to 250 MHz (see Typical Operating Characteristics).
Above 20 MHz, the on response has several minor peaks that are highly layout dependent. The problem is not
in turning the switch on; it is turning it off. The OFF-state switch acts like a capacitor and passes higher
frequencies with less attenuation. At 10 MHz, OFF isolation is about –45 dB in 50-Ω systems, decreasing
(approximately 20 dB per decade) as frequency increases. Higher circuit impedances also make OFF isolation
decrease. OFF isolation is about 3 dB above that of a bare IC socket, and is due entirely to capacitive coupling.
Test Circuits/Timing Diagrams
V+
V+
NO
VNO or VNC = 0 V
TS12A4514
TS12A4515
VIN
IN
COM
GND
50 Ω
V+
VIN
0V
TS12A4514
TS12A4515
VOUT
VOUT
∆VOUT
CL
1000 pF
∆VOUT is the measured voltage due to charge
transfer error Q when the channel turns off.
Q = DVOUT x CL
Figure 1. Charge Injection
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TS12A4514,, TS12A4515
LOW-VOLTAGE, LOW ON-STATE RESISTANCE
SPST CMOS ANALOG SWITCHES
www.ti.com
SCDS193B – AUGUST 2006 – REVISED MARCH 2007
APPLICATION INFORMATION (continued)
V+
V+
V+
NO
0V
VNO
TS12A4514
VIN
IN
50%
VIN
VNOPEAK
COM
90%
90%
VOUT
VOUT
GND
50 Ω
35 pF
300 Ω
0V
tOFF
tON
V+
V+
V+
0V
VNO
NC
TS12A4515
VIN
VNOPEAK
COM
IN
50%
VIN
GND
50 Ω
90%
VOUT
VOUT
35 pF
300 Ω
90%
0V
tON
tOFF
Figure 2. Switching Times
V+
V+
10 nF
V+
NO
TS12A4514
TS12A4515
VIN
VOUT
50 Ω
50 Ω
MEAS
REF
COM
IN
GND
50 Ω 50 Ω
Measurements are standardized against short at socket
terminals. OFF isolation is measured between COM and OFF
terminals on each switch. ON loss is measured between COM
and ON terminals on each switch. Signal direction through
switch is reversed; worst values are recorded.
OFF Isolation = 20log
VOUT
VIN
ON Loss = 20log
VOUT
VIN
Figure 3. OFF Isolation and ON Loss
V+
V+
As
Required
NO
or
NC
TS12A4514
TS12A4515
IN
COM
GND
1-MHz
Capacitance
Analyzer
Figure 4. NO, NC, and COM Capacitance
8
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PACKAGE OPTION ADDENDUM
www.ti.com
5-Feb-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
TS12A4514D
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS12A4514DG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS12A4514DR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS12A4514DRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS12A4514P
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TS12A4514PE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TS12A4515D
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS12A4515DG4
ACTIVE
SOIC
D
8
75
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS12A4515DR
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS12A4515DRG4
ACTIVE
SOIC
D
8
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
TS12A4515P
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
TS12A4515PE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
Lead/Ball Finish
MSL Peak Temp (3)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
5-Feb-2007
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Apr-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
27-Apr-2007
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
TS12A4514DR
D
8
MLA
330
12
6.4
5.2
2.1
8
12
Q1
TS12A4515DR
D
8
MLA
330
12
6.4
5.2
2.1
8
12
Q1
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
TS12A4514DR
D
8
MLA
338.1
340.5
20.64
TS12A4515DR
D
8
MLA
338.1
340.5
20.64
Pack Materials-Page 2
MECHANICAL DATA
MPDI001A – JANUARY 1995 – REVISED JUNE 1999
P (R-PDIP-T8)
PLASTIC DUAL-IN-LINE
0.400 (10,60)
0.355 (9,02)
8
5
0.260 (6,60)
0.240 (6,10)
1
4
0.070 (1,78) MAX
0.325 (8,26)
0.300 (7,62)
0.020 (0,51) MIN
0.015 (0,38)
Gage Plane
0.200 (5,08) MAX
Seating Plane
0.010 (0,25) NOM
0.125 (3,18) MIN
0.100 (2,54)
0.021 (0,53)
0.015 (0,38)
0.430 (10,92)
MAX
0.010 (0,25) M
4040082/D 05/98
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001
For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm
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