SCDS056H − MARCH 1998 − REVISED OCTOBER 2003
D Member of the Texas Instruments
D
D
D
D
D
D
D
DGG, DGV, OR DL PACKAGE
(TOP VIEW)
Widebus Family
Rail-to-Rail Switching on Data I/O Ports
Ioff Supports Partial-Power-Down Mode
Operation
Make-Before-Break Feature
Internal 500-Ω Pulldown Resistors to
Ground
Input/Output Ports Have Equivalent 25-Ω
Series Resistors, So No External Resistors
Are Required
Latch-Up Performance Exceeds 250 mA Per
JESD 17
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
S
1A
NC
2A
NC
3A
NC
GND
4A
NC
5A
NC
6A
NC
7A
NC
VCC
8A
GND
NC
9A
NC
10A
NC
11A
NC
12A
NC
description/ordering information
The SN74CBTLVR16292 is a 12-bit 1-of-2
high-speed FET multiplexer/demultiplexer. The
low on-state resistance of the switch allows
connections to be made with minimal propagation
delay.
When the select (S) input is low, port A is
connected to port B1, and RINT is connected to
port B2. When S is high, port A is connected to
port B2, and RINT is connected to port B1.
The input/output ports include equivalent 25-Ω
series resistors to reduce overshoot and
undershoot.
1
56
2
55
3
54
4
53
5
52
6
51
7
50
8
49
9
48
10
47
11
46
12
45
13
44
14
43
15
42
16
41
17
40
18
39
19
38
20
37
21
36
22
35
23
34
24
33
25
32
26
31
27
30
28
29
NC
NC
1B1
1B2
2B1
2B2
3B1
GND
3B2
4B1
4B2
5B1
5B2
6B1
6B2
7B1
7B2
8B1
GND
8B2
9B1
9B2
10B1
10B2
11B1
11B2
12B1
12B2
NC − No internal connection
This
device
is
fully
specified
for
partial-power-down applications using Ioff. The Ioff
feature ensures that damaging current will not
backflow through the device when it is powered
down. The device has isolation during power off.
ORDERING INFORMATION
SSOP − DL
−40°C to 85°C
ORDERABLE
PART NUMBER
PACKAGE†
TA
TSSOP − DGG
TOP-SIDE
MARKING
Tube
SN74CBTLVR16292L
Tape and reel
SN74CBTLVR16292LR
Tape and reel
SN74CBTLVR16292GR
CBTLVR16292
CBTLVR16292
TVSOP − DGV
Tape and reel
SN74CBTLVR16292VR
CE292
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
Copyright 2003, Texas Instruments Incorporated
!"#$%&" ' ()##*& %' "! +),-(%&" .%&*/
#".)(&' ("!"#$ &" '+*(!(%&"' +*# &0* &*#$' "! *1%' '&#)$*&'
'&%.%#. 2%##%&3/ #".)(&" +#"(*''4 ."*' "& *(*''%#-3 (-).*
&*'&4 "! %-- +%#%$*&*#'/
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
SCDS056H − MARCH 1998 − REVISED OCTOBER 2003
FUNCTION TABLE
INPUT
S
FUNCTION
L
A port = B1 port
RINT = B2 port
H
A port = B2 port
RINT = B1 port
logic diagram (positive logic)
54
2
1A
1B1
SW
RINT
RINT
53
SW
27
30
12B1
SW
12A
1B2
RINT
RINT
29
12B2
SW
1
S
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
SCDS056H − MARCH 1998 − REVISED OCTOBER 2003
simplified schematic, each FET switch
A
B
(OE)
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V
Continuous channel current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA
Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA
Package thermal impedance, θJA (see Note 2): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48°C/W
DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56°C/W
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
VCC
Supply voltage
VIH
High-level control input voltage
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
VIL
Low-level control input voltage
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
MIN
MAX
2.3
3.6
UNIT
V
1.7
V
2
0.7
0.8
V
TA
Operating free-air temperature
−40
85
°C
NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
SCDS056H − MARCH 1998 − REVISED OCTOBER 2003
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
VIK
II
VCC = 3 V,
VCC = 3.6 V,
II = −18 mA
VI = VCC or GND
Ioff
ICC
VCC = 0,
VCC = 3.6 V,
VI or VO = 0 to 3.6 V
IO = 0,
VI = VCC or GND
One input at 3 V,
Other inputs at VCC or GND
∆ICC‡
Control input
Ci
Control input
VCC = 3.6 V,
VI = 3.3 V or 0
Cio
A or B port
VO = 3.3 V or 0
TYP†
MAX
UNIT
−1.2
V
±1
µA
10
µA
10
µA
300
µA
3.5
pF
23
VCC = 2.3 V,
TYP at VCC = 2.5 V
ron§
VCC = 3 V
pF
30
47
VI = 0
II = 64 mA
II = 24 mA
30
47
VI = 1.7 V,
II = 15 mA
36
80
30
42
VI = 0
II = 64 mA
II = 24 mA
30
42
Ω
VI = 2.4 V,
II = 15 mA
32
47
† All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
‡ This is the increase in supply current for each input that is at the specified voltage level, rather than VCC or GND.
§ Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by
the lower of the voltages of the two (A or B) terminals.
switching characteristics over recommended operating free-air temperature range (unless
otherwise noted) (see Figure 1)
VCC = 2.5 V
± 0.2 V
FROM
(INPUT)
TO
(OUTPUT)
tpd¶
tpd#
A or B
B or A
S
A
3.2
8.5
ten
tdis
S
B
1
S
B
1
PARAMETER
MIN
MAX
VCC = 3.3 V
± 0.3 V
MIN
0.15
UNIT
MAX
0.25
ns
3.2
8
ns
6.5
1
5.8
ns
5.3
1
4.6
ns
¶ The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when
driven by an ideal voltage source (zero output impedance).
# This propagation delay was measured by observing the change of voltage on the A output introduced by static levels equal to 3-V or 0 for
3.3 V ± 0.3 V or VCC or 0 for 2.5 V ± 0.2 V on B1 and B2 to achieve the desired transition.
switching characteristics over recommended operating free-air temperature range (unless
otherwise noted) (see Figure 1)
PARAMETER
DESCRIPTION
VCC = 2.5 V
± 0.2 V
MIN
MAX
VCC = 3.3 V
± 0.3 V
MIN
tmbb||
Make-before-break time
0
2
0
2
|| The make-before-break time is the time interval between make and break, during the transition from one selected port to the other.
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
UNIT
MAX
ns
SCDS056H − MARCH 1998 − REVISED OCTOBER 2003
PARAMETER MEASUREMENT INFORMATION
2 × VCC
RL
From Output
Under Test
S1
Open
GND
CL
(see Note A)
TEST
S1
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCC
GND
RL
LOAD CIRCUIT
VCC
CL
RL
V∆
2.5 V ±0.2 V
3.3 V ±0.3 V
30 pF
50 pF
500 Ω
500 Ω
0.15 V
0.3 V
VCC
Timing Input
VCC/2
0V
tw
tsu
VCC
VCC/2
Input
VCC/2
th
VCC
VCC/2
Data Input
VCC/2
0V
0V
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VCC
VCC/2
Input
VCC/2
0V
tPHL
tPLH
VOH
VCC/2
Output
VCC/2
VOL
VOH
Output
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
tPLH
tPHL
VCC/2
VCC/2
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VCC
Output
Control
Output
Waveform 2
S1 at GND
(see Note B)
VCC/2
VCC/2
0V
tPLZ
tPZL
VCC
VCC/2
VOL + V∆
VOL
tPHZ
tPZH
VCC/2
VOH − V∆
VOH
≈0 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2 ns, tf ≤ 2 ns.
D. The outputs are measured one at a time with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
PACKAGE OPTION ADDENDUM
www.ti.com
25-Feb-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package
Type
Package
Drawing
Pins Package Eco Plan (2)
Qty
Lead/Ball Finish
MSL Peak Temp (3)
SN74CBTLVR16292DL
ACTIVE
SSOP
DL
56
None
Call TI
Call TI
SN74CBTLVR16292GR
ACTIVE
TSSOP
DGG
56
None
Call TI
Call TI
SN74CBTLVR16292LR
ACTIVE
SSOP
DL
56
None
Call TI
Call TI
SN74CBTLVR16292VR
ACTIVE
TVSOP
DGV
56
None
Call TI
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
MECHANICAL DATA
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
0,40
0,23
0,13
24
13
0,07 M
0,16 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
0°–8°
1
0,75
0,50
12
A
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,08
14
16
20
24
38
48
56
A MAX
3,70
3,70
5,10
5,10
7,90
9,80
11,40
A MIN
3,50
3,50
4,90
4,90
7,70
9,60
11,20
DIM
4073251/E 08/00
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
Falls within JEDEC: 24/48 Pins – MO-153
14/16/20/56 Pins – MO-194
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0.025 (0,635)
0.0135 (0,343)
0.008 (0,203)
48
0.005 (0,13) M
25
0.010 (0,25)
0.005 (0,13)
0.299 (7,59)
0.291 (7,39)
0.420 (10,67)
0.395 (10,03)
Gage Plane
0.010 (0,25)
1
0°–ā8°
24
0.040 (1,02)
A
0.020 (0,51)
Seating Plane
0.110 (2,79) MAX
0.004 (0,10)
0.008 (0,20) MIN
PINS **
28
48
56
A MAX
0.380
(9,65)
0.630
(16,00)
0.730
(18,54)
A MIN
0.370
(9,40)
0.620
(15,75)
0.720
(18,29)
DIM
4040048 / E 12/01
NOTES: A.
B.
C.
D.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
Falls within JEDEC MO-118
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
0,50
48
0,08 M
25
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
0,25
24
0°– 8°
A
0,75
0,50
Seating Plane
0,15
0,05
1,20 MAX
PINS **
0,10
48
56
64
A MAX
12,60
14,10
17,10
A MIN
12,40
13,90
16,90
DIM
4040078 / F 12/97
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold protrusion not to exceed 0,15.
Falls within JEDEC MO-153
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright 2005, Texas Instruments Incorporated