ECG008 The Communications Edge TM Product Information InGaP HBT Gain Block Product Features x DC – 4 GHz x +24 dBm P1dB at 1 GHz x +40 dBm OIP3 at 1 GHz x 15 dB Gain at 1 GHz x 4.6 dB Noise Figure at 2 GHz x SOT-89 and lead-free / green SOT-89 Package Styles x Internally matched to 50 : Applications x Mobile Infrastructure x CATV / DBS x W-LAN / ISM x RFID x Defense / Homeland Security x Fixed Wireless Product Description Functional Diagram The ECG008 is a general-purpose buffer amplifier that offers high dynamic range in a low-cost surface-mount package. At 1000 MHz, the ECG008 typically provides 15 dB of gain, +40 dBm Output IP3, and +24 dBm P1dB. GND The ECG008 consists of Darlington pair amplifiers using the high reliability InGaP/GaAs HBT process technology and only requires DC-blocking capacitors, a bias resistor, and an inductive RF choke for operation. The device is ideal for wireless applications and is available in a low cost, surface-mountable SOT-89 package. The ECG008 is also available in a lead-free/green/RoHS-compliant SOT89 package. All devices are 100% RF and DC tested. 4 1 2 3 RF IN GND RF OUT ECG008B / ECG008B-G The broadband MMIC amplifier can be directly applied to various current and next generation wireless technologies such as GPRS, GSM, CDMA, and W-CDMA. In addition, the ECG008 will work for other various applications within the DC to 4 GHz frequency range such as CATV and fixed wireless. Specifications (1) Typical Performance (3) Parameter Units Min Operational Bandwidth Test Frequency Gain Output P1dB Output IP3 (3) MHz MHz dB dBm dBm dB MHz dB dB dB dBm dBm dB V mA VSWR DC Noise Figure Test Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 (2) Noise Figure Device Voltage Device Current Output mismatch w/o spurs 13 +34 6.8 Typ Max Parameter 4000 Frequency S21 S11 S22 Output P1dB Output IP3 Noise Figure 1000 15 +24 +40 4.6 2000 14.3 25 14 +23 +37 4.8 7.3 120 10:1 Units MHz dB dB dB dBm dBm dB Typical 500 14.7 -26 -19.4 +24.3 +41 4.7 900 14.6 -28.5 -17.4 +24 +40 4.6 1900 14.3 -28 -13.4 +23.3 +37 4.7 3. Test conditions: T = 25º C, Supply Voltage = +9 V, Device Voltage = +7.3V, Rbias = 14 , 50 2140 14.3 -19.5 -15 +19.0 +30.5 4.8 System. 7.8 1. Test conditions unless otherwise noted: 25º C, Supply Voltage = +9 V, Rbias = 14 , 50 System. 2. 3OIP measured with two tones at an output power of +9 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. Absolute Maximum Rating Parameter Operating Case Temperature Storage Temperature RF Input Power (continuous) Device Current Junction Temperature Ordering Information Rating Part No. -40 to +85 qC -65 to +150 qC +15 dBm 160 mA +250 qC Description ECG008B InGaP HBT Gain Block ECG008B-G InGaP HBT Gain Block ECG008B-PCB 700 –2400 MHz Fully Assembled Eval. Board (leaded SOT-89 Pkg) (lead-free/green/RoHS-compliant SOT-89 Pkg) Operation of this device above any of these parameters may cause permanent damage. Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: [email protected] Web site: www.wj.com December 2004 ECG008 The Communications Edge TM Product Information InGaP HBT Gain Block Typical Device RF Performance Supply Bias = +9 V, Rbias = 14 :, Icc = 120 mA Frequency S21 S11 S22 Output P1dB Output IP3 Noise Figure MHz dB dB dB dBm dBm dB 100 14.8 -25 -20 +24.5 +41.6 4.9 500 14.7 -26 -19 +24.3 +41 4.7 900 14.6 -28.5 -17 +24 +40 4.6 1900 14.3 -28 -13 +23.2 +37 4.7 2140 14.3 -25 -13 +22.8 +36 4.9 2400 14.2 -23.2 -12 +21.8 +34 5.2 3500 14.5 -15.4 -7.9 +17.3 5800 12.4 -6 -2.7 1. Test conditions: T = 25º C, Supply Voltage = +9 V, Device Voltage = 7.3 V, Rbias = 14 , Icc = 120 mA typical, 50 System. 2. 3OIP measured with two tones at an output power of +9 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit. The performance data does not account for losses attributed to recommended input and output series resistances shown in the application circuit on page 3. Gain vs. Frequency S11, S22 vs. Frequency 0 18 -10 S11, S22 (dB) Gain (dB) -5 16 14 12 10 500 1000 -40°C +85°C 1500 2000 Frequency (MHz) Vde vs. Icc 140 120 S22 100 -15 Icc (mA) 20 +25°C S11 -20 -25 80 60 -30 40 -35 20 -40 2500 0 3000 1 OIP3 vs. Frequency 2 3 4 Frequency (GHz) 5 0 0.0 6 NF (dB) 30 25 500 1000 4 3.5 3 2.5 +85°C 1500 2000 Frequency (MHz) P1dB (dBm) Ouput IP3 (dBm) 35 2500 3000 8.0 10.0 P1dB vs. Frequency 4.5 40 4.0 6.0 Vde (V) 30 5 -40°C 2.0 Noise Figure vs. Frequency 45 +25°C +25°C 25 20 15 +25°C 2 500 1000 1500 2000 10 500 1000 Frequency (MHz) 1500 -40°C +85°C 2000 2500 3000 Frequency (MHz) S-Parameters (Vdevice = +7.3 V, ICC = 120 mA, T = 25 C, calibrated to device leads) Freq (MHz) 50 500 1000 1500 2000 2500 3000 3500 4000 4500 5000 5500 6000 S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) -24.87 -26.14 -28.46 -30.86 -28.14 -23.15 -18.78 -15.39 -12.91 -10.59 -8.44 -6.76 -5.43 176.05 167.68 166.94 -178.22 -144.76 -137.68 -150.37 -171.26 161.38 132.87 105.27 80.71 61.63 14.88 14.71 14.60 14.39 14.30 14.20 14.30 14.48 14.65 14.51 14.04 13.17 12.10 177.77 161.26 142.99 125.46 108.38 91.08 74.41 56.29 35.57 13.60 -8.75 -31.25 -50.89 -18.94 -18.94 -19.02 -18.94 -18.86 -18.64 -18.20 -17.52 -16.85 -16.36 -16.20 -16.26 -16.59 -1.51 -5.99 -11.44 -16.56 -21.00 -25.54 -29.98 -36.74 -45.50 -56.53 -68.74 -81.52 -93.75 -20.41 -19.43 -17.47 -15.40 -13.40 -11.63 -9.65 -7.83 -6.06 -4.68 -3.62 -2.87 -2.41 -4.20 -39.76 -72.27 -95.62 -116.18 -133.34 -151.20 -171.17 165.56 141.33 117.07 94.30 73.89 Device S-parameters are available for download off of the website at: http://www.wj.com Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: [email protected] Web site: www.wj.com December 2004 ECG008 The Communications Edge TM Product Information InGaP HBT Gain Block Recommended Application Circuit Vcc Icc = 120 mA R4 Bias Resistor C4 Bypass Capacitor C3 0.018 µF L1 RF Choke RF IN R2 R3 RF OUT ECG008B C1 Blocking Capacitor Reference Designator L1 C1, C2, C4 R2 18 R3 4.7 C2 Blocking Capacitor Recommended Component Values Frequency (MHz) 500 900 1900 2200 220 nH 68 nH 27 nH 22 nH 1000 pF 100 pF 68 pF 68 pF 50 820 nH .018 µF Recommended Bias Resistor Values 2500 18 nH 56 pF 3500 15 nH 39 pF 1. The proper values for the components are dependent upon the intended frequency of operation. 2. The component values in the table below are contained on the evaluation board to achieve optimal broadband performance. 3. R2 and R3 are shown in the circuit diagram to avoid potential instabilities. The configuration shown above assures of unconditional stability with the use of the device. It is expected that linearity parameters (OIP3 and P1dB) to degrade about only 0.5 dB, while overall gain will be about 2 dB less than the performance shown in page 1 and 2 of this datasheet. Input and output return loss is expected to improve with the use of the I/O series resistances at 2 GHz. Ref. Desig. L1 C1, C2 C3 C4 R2 R3 R4 Value / Type 39 nH wirewound inductor 56 pF chip capacitor 0.018 PF chip capacitor Do Not Place 18 : chip resistor 4.7 : chip resistor 14 : 1% tolerance Supply Voltage R1 value Size 9V 10 V 12 V 14 ohms 23 ohms 39 ohms 2010 2512 2512 The proper value for R1 is dependent upon the supply voltage and allows for bias stability over temperature. WJ recommends a minimum supply bias of +9 V. A 1% tolerance resistor is recommended. Size 0603 0603 0603 0603 0603 2010 ECG008B-PCB Performance Data (WJ’s evaluation board uses the circuit shown above.) Gain 14 Return Loss 0 S11 12 S22 -10 10 8 -20 6 -30 4 0 1 2 3 4 Frequency (GHz) 0 1 2 3 4 Frequency (GHz) Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: [email protected] Web site: www.wj.com December 2004 ECG008 The Communications Edge TM Product Information InGaP HBT Gain Block ECG008B (SOT-89 Package) Mechanical Information This package may contain lead-bearing materials. The plating material on the leads is SnPb. Product Marking Outline Drawing The component will be marked with an “E008” designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the “Application Notes” section. MSL / ESD Rating ESD Rating: Value: Test: Standard: Class 1A Passes between 250 and 500V Human Body Model (HBM) JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +235 C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135” ) diameter drill and have a final plated thru diameter of .25 mm (.010” ). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Land Pattern Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: [email protected] Web site: www.wj.com December 2004 ECG008 The Communications Edge TM Product Information InGaP HBT Gain Block ECG008B-G (Green / Lead-free SOT-89 Package) Mechanical Information This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260qC reflow temperature) and leaded (maximum 245qC reflow temperature) soldering processes. The plating material on the leads is NiPdAu. Product Marking Outline Drawing The component will be marked with an “ E008G” designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the “ Application Notes” section. MSL / ESD Rating ESD Rating: Value: Test: Standard: Class 1A Passes between 250 and 500V Human Body Model (HBM) JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +260 C convection reflow Standard: JEDEC Standard J-STD-020 Land Pattern Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135” ) diameter drill and have a final plated thru diameter of .25 mm (.010” ). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Specifications and information are subject to change without notice WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: [email protected] Web site: www.wj.com December 2004