ECG015 The Communications Edge TM ¼ Watt, High Linearity InGaP HBT Amplifier Product Description Functional Diagram The ECG015 is a high dynamic range driver amplifier in a low-cost surface mount package. The InGaP/GaAs HBT is able to achieve performance over a broad range with +41 dBm OIP3 and +24 dBm of compressed 1dB power and is housed in a lead-free/green/RoHS-compliant SOT-89 SMT package. All devices are 100% RF and DC tested. GND Product Features • 1800 – 2500 MHz • +24 dBm P1dB • +41 dBm OIP3 • 15 dB Gain • 5 dB Noise Figure • Single Positive Supply (+8V) • Available in a lead-free / green SOT-89 Package Style Applications • • • • • Product Information The product is targeted for use as a gain block/driver amplifier for various current and next generation wireless technologies such as GPRS, UMTS and WCDMA, where high linearity and medium power is required. In addition, the ECG015 will work for numerous other applications within the 1800 to 2500 MHz frequency range. 4 1 2 3 RF IN GND RF OUT ECG015B / ECG015B-G Mobile Infrastructure W-LAN / ISM RFID Defense / Homeland Security Fixed Wireless Specifications (1) Parameter Operational Bandwidth Test Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 (2) Noise Figure Device Voltage Device Current Typical Performance (3) Units Min MHz MHz dB dB dB dBm dBm dB V mA 1800 13.5 +22 +37.5 85 Typ 2140 15 17 10 +24 +41 5 5 100 Max Parameter 2500 Frequency S21 S11 S22 Output P1dB Output IP3 (2) Noise Figure Units MHz dB dB dB dBm dBm dB Typical 1900 21 -15 -10 +24 +41 5 2140 15 -17 -10 +24 +41 5 2450 14 -19 -10 +23 +42 5 3. Typical parameters reflect performance in a tuned application circuit: Supply Voltage = +8 V, Icc = 100 mA, +25° C, Rbias = 30 Ω. 135 1. Test conditions unless otherwise noted: 25 °C, Vsupply = +8V, in tuned application circuit with Rbias = 30 Ω. 2. 3OIP measured with two tones at an output power of +9Bm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. Absolute Maximum Rating Parameter Operating Case Temperature Storage Temperature Device Current RF Input Power (continuous) Junction Temperature Rating Ordering Information Part No. Description -40 to +85 °C -55 to +125 °C ECG015B 180 mA ECG015B-G +15 dBm +250 °C ECG015B-PCB1900 1900 MHz Fully Assembled Eval. Board ECG015B-PCB2140 2140 MHz Fully Assembled Eval. Board 0.2 Watt, High Linearity InGaP HBT Amplifier (leaded SOT-89 Pkg) 0.2 Watt, High Linearity InGaP HBT Amplifier (lead-free/green/RoHS-compliant SOT-89 Pkg) Operation of this device above any of these parameters may cause permanent damage. Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com September 2004 ECG015 The Communications Edge TM ¼ Watt, High Linearity InGaP HBT Amplifier Product Information Typical Device Data S-parameters (Vdevice = +5V, Icc = 100 mA, 25° C, unmatched 50 ohm system) S11 0. 4 2. 0 0 3. 0 4. 0 4. 5.0 5.0 0.2 0.2 10.0 5.0 4.0 3.0 2.0 1.0 0.8 0.6 0.4 0.2 10.0 0 10.0 5.0 4.0 3.0 2.0 1.0 0.8 0.6 0.2 20 0.4 10.0 0 Gain (dB) 0.8 0 3. 25 Swp Max 2.50123GHz 6 0. 2. 0 DB(GMax) 1.0 1.0 0.8 6 0. DB(|S[2,1]|) S22 Swp Max 2.50123GHz 0. 4 Gain / Maximum Stable Gain 30 -10.0 -3 .0 Swp Min 1.79083GHz .0 -2 -1.0 2.5 -0 .6 2.4 .0 -2 2.3 -1.0 2.1 2.2 Frequency (GHz) -0.8 2 -0 .6 1.9 .4 -0 -0.8 -4 .0 -5. 0 1.8 2 -3 .0 .4 -0 10 -0. -4 .0 -5. 0 2 -0. -10.0 15 Swp Min 1.79083GHz Notes: The gain for the unmatched device in 50 ohm system is shown as the trace in blue color. For a tuned circuit for a particular frequency, it is expected that actual gain will be higher, up to the maximum stable gain. The maximum stable gain is shown in the dashed red line. The impedance plots are shown from 1800 – 2500 MHz, with markers placed at 1.8 – 2.5 GHz in 0.1 GHz increments. S-Parameters (Vdevice = +5 V, Icc = 100 mA, T = 25° C, unmatched 50 ohm system, calibrated to device leads) Freq (MHz) 1800 1900 2000 2100 2200 2300 2400 2500 S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) -6.70 -7.55 -8.60 -9.85 -11.07 -11.69 -10.87 -9.15 80.76 68.30 53.47 35.06 10.07 -21.71 -56.13 -86.03 15.90 15.77 15.66 15.53 15.40 15.08 14.67 14.14 24.47 16.51 7.76 -1.19 -10.90 -20.90 -31.83 -43.53 -28.55 -28.96 -30.14 -31.49 -33.04 -36.28 -40.69 -42.21 -25.74 -32.29 -38.84 -45.79 -59.63 -78.21 -106.46 163.73 -5.34 -4.96 -4.56 -4.12 -3.67 -3.20 -2.80 -2.44 156.39 156.21 155.58 155.07 153.49 150.85 147.22 142.35 Device S-parameters are available for download off of the website at: http://www.wj.com Application Circuit PC Board Layout Circuit Board Material: .014” Getek, 4 - layer, 1 oz copper, Microstrip line details: width = .026”, spacing = .026” The silk screen markers ‘A’, ‘B’, ‘C’, etc. and ‘1’, ‘2’, ‘3’, etc. are used as placemarkers for the input and output tuning shunt capacitors. The markers and vias are spaced in .050” increments. Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com September 2004 ECG015 The Communications Edge TM ¼ Watt, High Linearity InGaP HBT Amplifier Product Information Typical Device RF Performance Supply Bias = +8 V, Rbias = 30 Ω, Icc = 100 mA 1. Test conditions: T = 25º C, Supply Voltage = +8 V, Device Voltage = 5.0 V, Rbias = 30 Ω, Icc = 100 mA typical, 50 Ω System. 2. 3OIP measured with two tones at an output power of +11 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit. Ssg & P1dB vs. Temperature @1.96GHz ACPR1 vs. Pout at 1.9GHz (IS95 9 Ch. Fwd) 24 0 22 10 24 85°C 20 20 P1dB vs. Frequency 24.5 -40°C 25°C dBc dBm 30 18 40 23 50 16 60 14 Ssg OIP3 P1dB 22.5 70 11 12 -40°C 25°C 25°C -40°C 15 22 1.96GHz 17 Icc vs. Vde 120 85°C 2.14GHz 2.45GHz Ssg, OIP3 and P1dB vs. Temperature at 2.45GHz 140 0 10 13 Average power out(dBm) 85°C ACPR1vs. Pout at 2.14GHz (IS95 9 Ch Fwd) 44 24 42 20 40 16 100 Icc (mA) 20 dBc 23.5 30 40 80 60 50 40 60 20 70 11 13 15 Average power out(dBm) 17 0 4.5 25°C 4.7 4.9 Vde OIP3 5.1 38 5.3 -40°C Ssg 25°C P1dB 12 85°C Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com September 2004 ECG015 The Communications Edge TM ¼ Watt, High Linearity InGaP HBT Amplifier Product Information ECG015B (SOT-89 Package) Mechanical Information This package may contain lead-bearing materials. Outline Drawing Product Marking The component will be marked with an “E015” designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the “Application Notes” section. ESD / MSL Information ESD Rating: Class 1B Value: Passes at between 500 and 1000V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +240 °C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Land Pattern Thermal Specifications Parameter Rating Operating Case Temperature Thermal Resistance, Rth (1) Junction Temperature, Tjc (2) -40 to +85° C 128° C / W 149° C Notes: 1. The thermal resistance is referenced from the junction-to-case at a case temperature of 85° C. 2. This corresponds to the typical biasing condition of +5V, 100 mA at an 85° C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247° C. MTTF vs. GND Tab Temperature 100000 10000 1000 100 60 70 80 90 100 110 120 Tab Temperature (°C) Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com September 2004 ECG015 The Communications Edge TM ¼ Watt, High Linearity InGaP HBT Amplifier Product Information ECG015B (Green / Lead-free SOT-89 Package) Mechanical Information This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260°C reflow temperature) and leaded (maximum 245°C reflow temperature) soldering processes. Outline Drawing Product Marking The component will be marked with an “E015G” designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the “Application Notes” section. ESD / MSL Information ESD Rating: Class 1B Value: Passes at between 500 and 1000V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +260 °C convection reflow Standard: JEDEC Standard J-STD-020 Land Pattern Mounting Config. Notes 1. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 2. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 3. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 4. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 5. RF trace width depends upon the PC board material and construction. 6. Use 1 oz. Copper minimum. 7. All dimensions are in millimeters (inches). Angles are in degrees. Thermal Specifications Parameter Rating Operating Case Temperature Thermal Resistance, Rth (1) Junction Temperature, Tjc (2) -40 to +85° C 128° C / W 149° C Notes: 1. The thermal resistance is referenced from the junction-to-case at a case temperature of 85° C. 2. This corresponds to the typical biasing condition of +5V, 100 mA at an 85° C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247° C. MTTF vs. GND Tab Temperature 100000 10000 1000 100 60 70 80 90 100 110 120 Tab Temperature (°C) Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com September 2004