ECG002

ECG002
InGaP HBT Gain Block
Product Features
Product Description
Functional Diagram
GND
•
•
•
•
•
•
•
•
DC – 6 GHz
20 dB Gain @ 1 GHz
+15.5 dBm P1dB @ 1 GHz
+29 dBm OIP3 @ 1 GHz
3.8 dB Noise Figure
Internally matched to 50 Ω
Robust 1000V ESD, Class 1C
Lead-free/green/RoHS-compliant
SOT-86, SOT-363, & SOT-89
package
The ECG002 is a general-purpose buffer amplifier that
offers high dynamic range in a low-cost surface-mount
package. At 1000 MHz, the ECG002 typically provides 20
dB of gain, +29 dBm Output IP3, and +15.5 dBm P1dB.
4
The ECG002 consists of a Darlington-pair amplifier using
the high reliability InGaP/GaAs HBT process technology
and only requires DC-blocking capacitors, a bias resistor,
and an inductive RF choke for operation. The device is
ideal for wireless applications and is available in low-cost,
surface-mountable plastic lead-free/green/RoHS-compliant
SOT-363, SOT-86 and SOT-89 packages. All devices are
100% RF and DC tested.
1
2
3
RF IN
GND
RF OUT
ECG002B-G
GND
4
RF In
RF Out
1
3
2
Applications
•
•
•
•
•
Mobile Infrastructure
CATV / FTTX
WLAN / ISM
RFID
WiMAX / WiBro
Operational Bandwidth
Test Frequency
Gain
Output P1dB
Output IP3 (2)
Test Frequency
Gain
Large-signal Gain (3)
Output P1dB
Output IP3 (2)
Noise Figure
Device Voltage
Device Current
ECG002C-G
GND
1
6
RF OUT
GND
2
5
GND
RF IN
3
4
GND
ECG002F-G
Specifications (1)
Parameter
GND
The broadband MMIC amplifier can be directly applied to
various current and next generation wireless technologies
such as GPRS, GSM, CDMA, and W-CDMA. In addition,
the ECG002 will work for other various applications within
the DC to 6 GHz frequency range such as CATV and
mobile wireless.
Typical Performance (1)
Units
Min
MHz
MHz
dB
dBm
dBm
MHz
dB
dB
dBm
dBm
dB
V
mA
DC
17
16
+13
3.5
Typ
1000
20
+15.5
+29
2000
19
18
+15
+29
3.8
3.9
45
Max
Parameter
6000
Frequency
S21
S11
S22
Output P1dB
Output IP3
Noise Figure
Units
MHz
dB
dB
dB
dBm
dBm
dB
Typical
500
20.6
-17
-18
+15.8
+28
3.8
900
20
-17
-18
+15.5
+29
3.7
1900
19.5
-15
-21
+15
+29
3.8
2140
18.7
-15
-21
+14.9
+29
3.8
4.3
1. Test conditions unless otherwise noted: 25 ºC, Supply Voltage = +5 V, Rbias = 24 Ω, 50 Ω System.
2. 3OIP measured with two tones at an output power of +2 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. Large-signal gain is tested with an input power level of -3 dBm.
Ordering Information
Absolute Maximum Rating
Parameter
Rating
Device Current
RF Input Power (continuous)
Thermal Resistance - ECG002B-G
Thermal Resistance - ECG002C-G
Thermal Resistance - ECG002F-G
Junction Temperature
150 mA
+12 dBm
131 °C/W
233 °C/W
233 °C/W
+160°C
Operation of this device above any of these parameters may cause permanent damage.
Part No.
Description
ECG002B-G
InGaP HBT Gain Block
ECG002C-G
InGaP HBT Gain Block
ECG002F-G
InGaP HBT Gain Block
ECG002B-PCB
ECG002C-PCB
ECG002F-PCB
700 – 2400 MHz Fully Assembled Eval. Board
700 – 2400 MHz Fully Assembled Eval. Board
700 – 2400 MHz Fully Assembled Eval. Board
(lead-free/green/RoHS-compliant SOT-89 package)
(lead-free/green/RoHS-compliant SOT-86 package)
(lead-free/green/RoHS-compliant SOT-363 package)
Standard T/R size = 1000 pieces on a 7” reel for ECG002B-G.
Standard T/R size = 1000 pieces on a 7” reel for ECG002C-G.
Standard T/R size = 3000 pieces on a 7” reel for ECG002F-G.
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com, www.TriQuint.com
Page 1 of 7 March 2008
ECG002
InGaP HBT Gain Block
Typical Device RF Performance
Supply Bias = +5 V, Rbias = 24 Ω, Icc = 45 mA
Frequency
S21
S11
S22
Output P1dB
Output IP3
Noise Figure
MHz
dB
dB
dB
dBm
dBm
dB
100
21
-18
-17
+15.4
+28
3.9
500
20.6
-17
-17
+15.6
+28
3.8
900
20
-17
-18
+15.5
+29
3.8
1900
19.5
-15
-20
+15
+29
3.8
2140
18.7
-15
-21
+15
+29
3.8
2400
18.2
-15
-22
+15
+29
3.9
3500
16.4
-16
-35
+14.5
5800
13.3
-19
-16
+11
1. Test conditions: T = 25º C, Supply Voltage = +5 V, Device Voltage = +3.9 V, Rbias = 24 Ω, Icc = 45 mA typical, 50 Ω System.
2. 3OIP measured with two tones at an output power of -1 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit.
Gain vs. Frequency
S11, S22 vs. Frequency
22
-5
18
16
14
+25C
1000
-40C
2500
S11
-20
-25
-30
S22
0
3000
1
2
3
4
Frequency (GHz)
5
Noise Figure vs. Frequency
18
26
P1dB (dBm)
4
NF (dB)
30
28
3.5
3
2.5
1000
1500
2000
Frequency (MHz)
3000
3.80
4.00
4.20
4.40
14
12
+25C
2
500
3.60
16
+85C
2500
3.40
P1dB vs. Frequency
20
24
500
3.20
Vde (V)
4.5
-40C
40
0
3.00
6
32
+25C
+25C
60
20
-40
OIP3 vs. Frequency
OIP3 (dBm)
80
-15
-35
+85C
1500
2000
Frequency (MHz)
100
-10
Icc (mA)
S11, S22 (dB)
Gain (dB)
20
12
500
Vde vs. Icc
120
0
1000
1500
Frequency (MHz)
2000
10
500
1000
-40C
1500
2000
Frequency (MHz)
+85C
2500
3000
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com, www.TriQuint.com
Page 2 of 7 March 2008
ECG002
InGaP HBT Gain Block
Recommended Application Circuit
Vcc
Icc = 45 mA
ECG002C-PCB
R4
Bias
Resistor
C4
Bypass
Capacitor
C3
0.018 µF
L1
RF Choke
RF IN
RF OUT
ECG002
C1
Blocking
Capacitor
C2
Blocking
Capacitor
ECG002B-PCB
Reference
Designator
L1
C1, C2, C4
50
820 nH
.018 µF
ECG002F-PCB
Recommended Component Values
Frequency (MHz)
500
900
1900
2200
220 nH
68 nH
27 nH
22 nH
1000 pF
100 pF
68 pF
68 pF
2500
18 nH
56 pF
1. The proper values for the components are dependent upon the intended frequency of operation.
2. The following values are contained on the evaluation board to achieve optimal broadband performance:
Ref. Desig.
L1
C1, C2
C3
C4
R4
Value / Type
39 nH wirewound inductor
56 pF chip capacitor
0.018 μF chip capacitor
Do Not Place
24Ω 1% tolerance
Size
0603
0603
0603
0805
3500
15 nH
39 pF
Recommended Bias Resistor Values
Supply
R1 value
Size
Voltage
5V
24.4 ohms
0805
6V
46.7 ohms
0805
8V
91 ohms
1210
9V
113 ohms
1210
10 V
136 ohms
2010
12 V
180 ohms
2010
The proper value for R1 is dependent upon the supply
voltage and allows for bias stability over temperature.
WJ recommends a minimum supply bias of +5 V. A
1% tolerance resistor is recommended.
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com, www.TriQuint.com
Page 3 of 7 March 2008
ECG002
InGaP HBT Gain Block
ECG002B-G Mechanical Information
This package is lead-free/Green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free
(maximum 260 °C reflow temperature) and leaded (maximum 245 °C reflow temperature) soldering processes.
Outline Drawing
Product Marking
The component will be marked with an
“E002G” designator with an alphanumeric lot
code on the top surface of the package. The
obsolete tin-lead package is marked with an
“E002” designator followed by an
alphanumeric lot code; it may also have been
marked with a “C” designator followed by a
3-digit numeric lot code.
E002G
XXXX-X
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
Land Pattern
ESD Rating:
Value:
Test:
Standard:
Class 1A
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260 °C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of
this device. Vias should use a .35mm (#80 / .0135”) diameter
drill and have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board
to a heatsink. Ensure that the ground / thermal via region
contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com, www.TriQuint.com
Page 4 of 7 March 2008
ECG002
InGaP HBT Gain Block
ECG002C-G Mechanical Information
This package is lead-free/Green/RoHS-compliant. The plating material on the pins is annealed matte tin over copper. It is compatible with
both lead-free (maximum 260 °C reflow temperature) and leaded (maximum 245 °C reflow temperature) soldering processes.
Outline Drawing
Product Marking
The component will be marked with a twodigit numeric lot code (shown as “XX”)
followed with a “K” designator on the top
surface of the package. The obsolete tin-lead
package is marked with a two-digit numeric
lot code followed with a “J” designator; it
may also have been marked with a “J”
designator followed by a two-digit lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating:
Value:
Test:
Standard:
Class 1A
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260 °C convection reflow
Standard:
JEDEC Standard J-STD-020
Land Pattern
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of
this device. Vias should use a .35mm (#80 / .0135”) diameter
drill and have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board
to a heatsink. Ensure that the ground / thermal via region
contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com, www.TriQuint.com
Page 5 of 7 March 2008
ECG002
InGaP HBT Gain Block
ECG002F-G Mechanical Information
This package is lead-free/Green/RoHS-compliant. The plating material on the leads is annealed matte tin over copper. It is compatible with
both lead-free (maximum 260 °C reflow temperature) and leaded (maximum 245 °C reflow temperature) soldering processes.
Outline Drawing
Product Marking
The component will be marked with a twodigit numeric lot code (shown as “XX”)
followed with a “5” designator on the top
surface of the package. The obsolete tin-lead
package is marked with a two-digit numeric
lot code followed with a “1” designator; it
may also have been marked with a “10”
designator followed by a letter lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating:
Value:
Test:
Standard:
Class 1A
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260 °C convection reflow
Standard:
JEDEC Standard J-STD-020
Land Pattern
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of
this device. Vias should use a .35mm (#80 / .0135”) diameter
drill and have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board
to a heatsink. Ensure that the ground / thermal via region
contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com, www.TriQuint.com
Page 6 of 7 March 2008
ECG002
InGaP HBT Gain Block
Typical Device S-Parameters – ECG002B-G
S-Parameters (Vdevice = +3.9 V, ICC = 45 mA, T = 25 °C, calibrated to device leads)
Freq (MHz)
50
500
1000
1500
2000
2500
3000
3500
4000
4500
5000
5500
6000
S11 (dB)
S11 (ang)
S21 (dB)
S21 (ang)
S12 (dB)
S12 (ang)
S22 (dB)
S22 (ang)
-17.15
-16.04
-14.81
-13.59
-13.14
-13.40
-13.96
-15.15
-17.07
-19.43
-24.29
-26.31
-21.31
0.33
0.38
-8.39
-21.57
-38.98
-54.87
-68.82
-79.85
-85.86
-86.07
-76.56
-15.89
17.01
21.23
20.84
20.03
19.11
18.50
18.01
17.49
16.95
16.36
15.78
15.19
14.64
14.08
177.70
156.45
135.90
118.25
103.23
87.48
71.83
56.22
41.14
26.53
12.27
-1.79
-16.11
-23.14
-23.06
-22.83
-22.47
-21.81
-21.28
-20.73
-20.34
-19.95
-19.57
-19.34
-19.04
-18.87
-0.19
-1.64
-2.70
-4.36
-7.40
-11.83
-17.30
-22.68
-28.74
-34.89
-42.28
-49.74
-57.89
-15.62
-15.69
-15.79
-15.62
-15.49
-15.86
-16.64
-17.60
-17.11
-15.61
-13.30
-10.79
-8.79
-1.52
-20.22
-38.56
-58.17
-81.71
-107.96
-139.16
-171.00
151.84
119.05
94.72
76.65
61.13
Typical Device S-Parameters – ECG002C-G
S-Parameters (Vdevice = +3.9 V, ICC = 45 mA, T = 25 °C, calibrated to device leads)
Freq (MHz)
50
500
1000
1500
2000
2500
3000
3500
4000
4500
5000
5500
6000
S11 (dB)
S11 (ang)
S21 (dB)
S21 (ang)
S12 (dB)
S12 (ang)
S22 (dB)
S22 (ang)
-37.42
-22.95
-20.13
-19.79
-19.82
-16.54
-15.67
-15.94
-17.24
-19.29
-23.85
-28.00
-22.34
134.67
51.84
57.46
55.23
31.10
-1.82
-7.79
-8.76
-5.83
-2.21
-16.76
-81.95
-134.50
22.11
21.83
21.21
20.35
19.41
18.63
17.69
16.88
15.94
15.15
14.45
13.89
13.34
177.84
159.38
140.39
123.69
108.29
95.93
83.59
71.85
60.22
49.25
39.80
30.92
21.26
-23.75
-23.57
-23.62
-23.56
-23.07
-23.05
-22.20
-21.97
-21.37
-20.84
-20.62
-19.77
-19.58
0.04
1.76
1.39
2.36
2.45
1.89
3.83
1.75
-2.61
-5.08
-6.52
-7.93
-13.03
-36.75
-24.35
-22.33
-17.57
-15.79
-17.22
-15.86
-14.21
-12.04
-10.26
-9.57
-9.86
-10.90
-5.01
-54.15
-124.91
-159.03
-172.54
-173.92
168.33
145.59
128.60
120.09
116.71
118.09
119.18
Typical Device S-Parameters – ECG002F-G
S-Parameters (Vdevice = +3.9 V, ICC = 45 mA, T = 25 °C, calibrated to device leads)
Freq (MHz)
50
500
1000
1500
2000
2500
3000
3500
4000
4500
5000
5500
6000
S11 (dB)
S11 (ang)
S21 (dB)
S21 (ang)
S12 (dB)
S12 (ang)
S22 (dB)
S22 (ang)
-35.58
-25.34
-22.93
-21.74
-22.60
-19.67
-18.00
-17.76
-18.59
-20.60
-27.53
-37.18
-24.38
153.00
51.37
66.15
76.98
53.21
6.41
3.61
4.44
7.79
19.66
28.83
-144.72
-146.24
22.09
21.86
21.29
20.47
19.58
18.83
17.93
17.12
16.21
15.42
14.71
14.08
13.53
177.80
159.87
141.06
124.48
108.93
96.29
83.64
71.47
59.28
48.02
38.32
29.10
19.53
-23.58
-23.60
-23.30
-23.66
-23.31
-22.86
-22.60
-22.02
-21.64
-21.30
-20.52
-20.32
-19.40
1.09
0.02
2.10
2.66
1.22
-0.98
1.33
-1.64
-1.94
-4.58
-9.65
-9.39
-14.12
-41.45
-25.01
-22.43
-16.71
-14.43
-15.12
-13.82
-12.58
-10.90
-9.39
-8.57
-8.88
-9.58
-0.41
-55.13
-134.17
-168.31
179.01
176.50
164.54
145.98
130.27
117.60
112.39
113.57
114.73
Device S-parameters are available for download from the website at: http://www.wj.com
Specifications and information are subject to change without notice
WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com, www.TriQuint.com
Page 7 of 7 March 2008