ETC HT574

HTMOSTM High Temperature Products
Advance Information
HIGH TEMPERATURE µP COMPATIBLE
12-BIT A/D CONVERTER
HT574
FEATURES
APPLICATIONS
• Specified Over -55 to +225°C
• Down-Hole Oil Well
• Includes On-Chip Clock, Reference,
µP Interface and Sample/Hold
• Avionics
• Turbine Engine Control
• 11-Bit Linearity
• Industrial Process Control
• 10 µs Maximum Conversion, Including Acquisition
• Nuclear Reactor
• Hermetic 28-Lead Ceramic DIP
• Electric Power Conversion
• Heavy Duty Internal Combustion Engines
GENERAL DESCRIPTION
tecture which allows it to be used with minimal external
components. Tristate output buffers and digital control pins
are also provided for microprocessor interfacing. Analog
input signal ranges of 0 to +10V, 0 to +20V, or ±5V may be
selected from the internal resistor scaling network.
The HT574 is a general purpose, 12-bit successive approximation A/D converter intended for applications with an
extremely wide operating temperature range. Fabricated
with Honeywell’s dielectrically isolated high temperature
(HTMOS™) process, it is designed specifically for severe
high-temperature applications.
The HT574 provides 12-bit conversions in 10µs over the
entire -55 to +225°C temperature range. Typically, parts will
operate up to +300°C for a year, with derated performance.
All parts are burned in at 250°C to eliminate infant mortality.
The HT574 includes a switched capacitor, digital-to-analog
converter, internal reference, comparator, successive approximation register, sample and hold, oscillator and archi-
28-LEAD PACKAGE
C
D
All dimensions in inches
Right
Reading
on Lid
Ceramic
Body
E
1
S2
A
Q
L
b2
eA
A
b
b2
C
D
E
e
eA
L
Q
S1
S2
0.175 (max)
0.018 ± 0.002
0.050 (typ)
0.010 to 0.002
1.400 ± 0.014
0.594 ± 0.010
0.100 ±0.005
0.600 ±0.010
0.125 to 0.175
0.050 ±0.010
0.005 (min)
0.005 (min)
S1
b
(width)
e
(pitch)
Solid State Electronics Center • 12001 State Highway 55, Plymouth, MN 55441 • (800) 323-8295 • http://www.ssec.honeywell.com
HT574
FUNCTIONAL DIAGRAM
28
12_N8
NCS
Ao
R_NC
CE
STS
2
3
4
5
TIMING
&
CONTROL
6
OSC
VREF_OUT
8
REF
VBG
27
1
10
TRI STATE OUTPUT BUFFERS
VREF_IN
2.5K VREF = 5V
12-BIT SAR
(5.0V)
20V_IN
12-BIT
CAPACITOR
DAC
14
(0 TO 5V)
13
5K
12
7
9
15
24
23
22
21
20
19
4-BIT WORD
5K
BIP_OFF
25
AAA
10K
10V_IN
26
AAA
COMP
4-BIT WORD
VTRIM
4-BIT WORD
(5.0V)
18
17
16
DB11 MSB
DB10
DB9
DB8
DB7
DB6
DB5
DB4
DB3
DB2
DB1
DB0 LSB
1
+5V
+10V
10µF//0.1µF
1µF
PINOUT DIAGRAM
NAME
1
2
VLOGIC (+5V)
12_N8
STS 28
DB11 27
VLOGIC
FUNCTION
Digital Supply (5V)
12_N8
Data Mode Select (1 = 12 bits; 0 = 8 bits)
NCS
Chip Select (Active Low)
3
NCS
Ao
Byte Size Select
4
Ao
DB9 25
R_NC
Read/Convert (1 = Read; 0 = Convert)
5
R_NC
DB8 24
CE
Chip Enable (Active High)
DB7 23
VDD
Analog Supply (10V)
DB6 22
VREF_OUT
Reference Output (5 V)
AGND
Analog Ground
6
7
CE
VDD (+10V)
DB10 26
8
VREF_OUT
DB5 21
VREF_IN
Reference Input
9
AGND
DB4 20
VTRIM
Trims Vref-out
VREF_IN
DB3 19
BIP_OFF
Bipolar Offset
VTRIM
DB2 18
10V_IN
10 Volt Analog Input
DB1 17
20V_IN
20 Volt Analog Input
DGND
Digital Ground
DB0:11
12-Bit Digital Output
(DB11 = MSB, DB0 = LSB)
Status
10
11
12 BIP_OFF
13 10V_IN
DB0 16
20V_IN
DGND 15
14
STS
2
HT574
DC ELECTRICAL CHARACTERISTICS
P arame te r
Temperature ranges = -55 to +225°C, VDD = 10.0V ±10%
Typical @ +25°C, Vlogic = +5V, unless otherwise specified
Conditions
Typ
Min
Resolution
Max
Units
12
Bits
Integral Non-Linearity (INL)
Tmin to Tmax
±1
LSB
Differential Non-Linearity (DNL)
Tmin to Tmax
±1
LSB
Unipolar Offset Error
Adjustable to zero
±2
LSB
Bipolar Offset Error
Adjustable to zero
±10
LSB
Full Scale Calibration Error (1)
Temperature Coefficients
No adjustment at +25°C, Tmin to Tmax
0.8
% of FS
With adjustment at +25°C, Tmin to Tmax
0.5
% of FS
Using internal reference, Tmin to Tmax
Unipolar Offset
±2 (5)
LSB (ppm/°C)
Bipolar Offset
±4 (10)
LSB (ppm/°C)
Full Scale Calibration
±20 (50)
LSB (ppm/°C)
±2
±0.5
LSB
LSB
Power Supply Rejection
Max change in full scale calibration
+9.0V<VDD<11>V
+4.5V<VLOGIC<5.5V
Analog Input Ranges
Bipolar
-5
+5
V
Unipolar
0
+10
V
0
+20
V
Impedance
Temperature coefficient = ±100ppm/°C
10 Volt Span
3.3
2.64
3.96
KΩ
20 Volt Span
13.3
10.64
15.96
kΩ
+4.5
+5.5
V
+9
+11
V
Operating Voltage Range
VLOGIC
VDD
Operating Current
ILOGIC
1
3
mA
IDD
7
9
mA
75
105
mW
5.035
V
8
mA
Power Dissipation
VDD = 10V, VLOGIC = 5 V
Internal Reference Voltage
Output Current (2)
5
Sink or source
(1) Can be adjusted by tying VTRIM to external resistor and VREF_OUT or VSSA.
(2) Available for external loads, external load should not change during conversion.
3
4.965
HT574
DIGITAL CHARACTERISTICS
Parameter
Temperature ranges = -55 to +225°C, VDD = 10.0V ±10%
Typical @ +25°C, Vlogic = +5V, unless otherwise specified
Conditions
Typical
Min
Max
Units
Logic "1"
2.4
5.5
V
Logic "0"
-0.5
+0.8
V
+5
µA
Logic Inputs
(CE, NCS, R_NC, Ao, 12_N8)
Current
±0.01
0 to +5.5V input
Capacitance
5
pF
Logic Outputs (DB11-DBO, STS)
Logic "0"
(ISink = 1.6mA)
+0.4
Logic "1"
(ISource = 500µA)
Leakage
(High Z state, DB11-DBO only)
+2.4
Capacitance
±0.1
-5
V
+5
5
READ MODE AC TIMING CHARACTERISTICS
V
µA
pF
Temperature ranges = -55 to +225°C, VDD = 10.0V ±10%
Typical @ +25°C, Vlogic = +5V, unless otherwise specified
Symbol
Parameter
Conditions (1)
Typical
Min
Max
Units
tDD
Access Time from CE
150
ns
tHD
Data Valid after CE Low
tHL
Output Float Delay
tSSR
NCS to CE Setup
0
50
ns
tSRR
R_NC to CE Setup
0
0
ns
tSAR
Ao to CE Setup
50
ns
tHSR
NCS Valid after CE Low
0
0
ns
tHRR
R_NC High after CE Low
0
0
ns
tHAR
Ao Valid after CE Low
50
ns
tHS
STS Delay after Data Valid
25
ns
150
300
1000
ns
ns
(1) Time is measured from 50% level of digital transitions. Tested with a 100pF and 3kΩ load for high impedance to drive and
tested with 10pF and 3kΩ load for drive to high impedance.
4
HT574
Temperature ranges = -55 to +225°C, VDD = 10.0V ±10%
Typical @ +25°C, Vlogic = +5V, unless otherwise specified
CONVERT MODE TIMING CHARACTERISTICS
Symbol
Parameter
Conditions (1)
Typical
Min
tDSC
STS Delay from CE
tHEC
CE Pulse Width
50
ns
tSSC
NCS to CE Setup
50
ns
tHCS
NCS Low during CE High
50
ns
tSRC
R_NC to CE Setup
50
ns
tHRC
R_NC Low during CE High
50
ns
tSAC
Ao to CE Setup
0
ns
tHAC
Ao Valid during CE High
50
ns
tC
Conversion Time
12-Bit Cycle
8-Bit Cycle
Including Acquisition
Tmin to Tmax
Tmin to Tmax
Max
Units
200
ns
µs
µs
10
7.2
(1) Time is measured from 50% level of digital transitions. Tested with a 100pF and 3kΩ load for high impedance to drive and
tested with 10pF and 3kΩ load for drive to high impedance.
CONVERT MODE TIMING DIAGRAM
READ MODE TIMING DIAGRAM
CE
CE
NCS
tHEC
tSSR
tHSR
tSSC
NCS
tHRR
tSRC
tHSC
R_NC
R_NC
tSRR
tHRC
Ao
Ao
tSAR
tSAC
tHAR
tHAC
STS
tDSC
STS
tC
DB11-DB0
DB11-DB0
Impedance
tDD
5
tHD
tHS
High
High Impedance
Data Valid
tHL
HT574
Temperature ranges = -55 to +225°C, VDD = 10.0V ±10%
Typical @ +25°C, Vlogic = +5V, unless otherwise specified
STAND ALONE MODE TIMING CHARACTERISTICS
Symbol
Parameter
Conditions (1)
Typical
Min
tHRL
Low R_NC Pulse Width
tDS
STS Delay from R_NC
tHDR
Data Valid after R_NC Low
25
tHS
STS Delay after Data Valid
300
tHRH
High R_NC Pulse Width
150
tDDR
Data Access Time
Max
50
ns
200
Parameter
ns
ns
1000
ns
ns
150
SAMPLE AND HOLD CHARACTERISTICS
Units
ns
-55 to 225°C, VDD = +10V, VLOGIC = +5V
Unless otherwise specified
Conditions (1)
Typical
Acquisition Time
Aperture Uncertainty Time
Min
Max
Units
1.26
µs
20
ns
(1) Time is measured from 50% level of digital transitions. Tested with a 100pF and 3kΩ load for high impedance to drive and
tested with 10pF and 3kΩ load for drive to high impedance.
STAND ALONE MODE TIMING
LOW PULSE FOR R_NC
STAND ALONE MODE TIMING
HIGH PULSE FOR R_NC
tHRL
R_NC
R_NC
tHRH
tDS
STS
tDS
STS
tC
tC
tHDR
tDDR
tHS
Data Valid
DB11-DB0
Data Valid
tHDR
High-Z
DB11-DB0
High-Z
Data Valid
6
HT574
UNIPOLAR INPUT CONNECTIONS
100K
-15V
VIN (0 TO
20V)
Range
14
VIN (0 TO
10V)
Range
13
+15V
100K
BIP_OFF
10K
5K
12
5K
VIN (0 TO 5V)
100
VREF_OUT
8
VBG
REF OUT = 5V
REF
11
VREF_IN
10
VREF = 5V
2.5K
VTRIM
Note: If no offset adjustment is required, BIP_OFF can be tied directy to AGND (0 volts).
BIPOLAR INPUT CONNECTIONS
Open
VIN (±5V)
Range
14
10K
13
5K
BIP_OFF
VIN (0 TO 5V)
12
5K
VREF_OUT
8
VBG
REF OUT = 5V
REF
11
VREF_IN
10
2.5K
VREF = 5V
7
VTRIM
HT574
TRUTH TABLE FOR HT574 CONTROL
Case
CE
NCS
R_NC
12_N8
A0
Operation
1
0
X
X
X
X
None
2
X
1
X
X
X
None
3
0
0
X
0
Initiate 12 Bit Conversion
4
0
0
X
1
Initiate 8 Bit Conversion
5
1
0
X
0
Initiate 12 Bit Conversion
6
1
0
X
1
Initiate 8 Bit Conversion
7
1
0
X
0
Initiate 12 Bit Conversion
8
1
0
X
1
Initiate 8 Bit Conversion
9
1
0
1
1
X
Enable 12 Bit Output
10
1
0
1
0
0
Enable 8 MSB's Only
11
1
0
1
0
1
Enable 4 LSB's + 4 Trailing Zero's
ABSOLUTE MAXIMUM RATINGS (1)
VDD to Analog Common ........................................................................................................................... 0V to +12.5V
VLOGIC to Digital Common ........................................................................................................................... 0V to +7V
Analog Common to Digital Common ....................................................................................................................... ±1V
Control Inputs (CE, NCS, 12_N8, Ao, R_NS) to Digital Common............................................ -0.5V to VLOGIC +0.5V
Analog Inputs (VREF_IN, BIP_OFF, 10V_IN) to Analog Common .................................................................... ±12.5V
20V_IN to Analog Common .................................................................................................................................. ±24V
VREF_OUT ............................................................................................................... Indefinite Short Circuit to Ground
Power Dissipation ........................................................................................................................................... 1000mW
Storage Temperature .............................................................................................................................. -65 to +325°C
Lead Temperature (Attachment, 10 sec.) ............................................................................................................ 355°C
ESD Protection .................................................................................................................................................... 2000V
(1) Stresses in excess of those listed above may result in permanent damage. These are stress ratings only, and operation at these levels is not implied.
Frequent or extended exposure to absolute maximum conditions may effect device reliability.
To learn more about Honeywell Solid State Electronics Center,
visit our web site at http://www.ssec.honeywell.com
Honeywell reserves the right to make changes to any products or technology herein to improve reliability, function or design. Honeywell does not assume any liability
arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights nor the rights of others.
Helping You Control Your World
900177 Rev. B
4-98
8