HTMOSTM High Temperature Products Advance Information HIGH TEMPERATURE µP COMPATIBLE 12-BIT A/D CONVERTER HT574 FEATURES APPLICATIONS • Specified Over -55 to +225°C • Down-Hole Oil Well • Includes On-Chip Clock, Reference, µP Interface and Sample/Hold • Avionics • Turbine Engine Control • 11-Bit Linearity • Industrial Process Control • 10 µs Maximum Conversion, Including Acquisition • Nuclear Reactor • Hermetic 28-Lead Ceramic DIP • Electric Power Conversion • Heavy Duty Internal Combustion Engines GENERAL DESCRIPTION tecture which allows it to be used with minimal external components. Tristate output buffers and digital control pins are also provided for microprocessor interfacing. Analog input signal ranges of 0 to +10V, 0 to +20V, or ±5V may be selected from the internal resistor scaling network. The HT574 is a general purpose, 12-bit successive approximation A/D converter intended for applications with an extremely wide operating temperature range. Fabricated with Honeywell’s dielectrically isolated high temperature (HTMOS™) process, it is designed specifically for severe high-temperature applications. The HT574 provides 12-bit conversions in 10µs over the entire -55 to +225°C temperature range. Typically, parts will operate up to +300°C for a year, with derated performance. All parts are burned in at 250°C to eliminate infant mortality. The HT574 includes a switched capacitor, digital-to-analog converter, internal reference, comparator, successive approximation register, sample and hold, oscillator and archi- 28-LEAD PACKAGE C D All dimensions in inches Right Reading on Lid Ceramic Body E 1 S2 A Q L b2 eA A b b2 C D E e eA L Q S1 S2 0.175 (max) 0.018 ± 0.002 0.050 (typ) 0.010 to 0.002 1.400 ± 0.014 0.594 ± 0.010 0.100 ±0.005 0.600 ±0.010 0.125 to 0.175 0.050 ±0.010 0.005 (min) 0.005 (min) S1 b (width) e (pitch) Solid State Electronics Center • 12001 State Highway 55, Plymouth, MN 55441 • (800) 323-8295 • http://www.ssec.honeywell.com HT574 FUNCTIONAL DIAGRAM 28 12_N8 NCS Ao R_NC CE STS 2 3 4 5 TIMING & CONTROL 6 OSC VREF_OUT 8 REF VBG 27 1 10 TRI STATE OUTPUT BUFFERS VREF_IN 2.5K VREF = 5V 12-BIT SAR (5.0V) 20V_IN 12-BIT CAPACITOR DAC 14 (0 TO 5V) 13 5K 12 7 9 15 24 23 22 21 20 19 4-BIT WORD 5K BIP_OFF 25 AAA 10K 10V_IN 26 AAA COMP 4-BIT WORD VTRIM 4-BIT WORD (5.0V) 18 17 16 DB11 MSB DB10 DB9 DB8 DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0 LSB 1 +5V +10V 10µF//0.1µF 1µF PINOUT DIAGRAM NAME 1 2 VLOGIC (+5V) 12_N8 STS 28 DB11 27 VLOGIC FUNCTION Digital Supply (5V) 12_N8 Data Mode Select (1 = 12 bits; 0 = 8 bits) NCS Chip Select (Active Low) 3 NCS Ao Byte Size Select 4 Ao DB9 25 R_NC Read/Convert (1 = Read; 0 = Convert) 5 R_NC DB8 24 CE Chip Enable (Active High) DB7 23 VDD Analog Supply (10V) DB6 22 VREF_OUT Reference Output (5 V) AGND Analog Ground 6 7 CE VDD (+10V) DB10 26 8 VREF_OUT DB5 21 VREF_IN Reference Input 9 AGND DB4 20 VTRIM Trims Vref-out VREF_IN DB3 19 BIP_OFF Bipolar Offset VTRIM DB2 18 10V_IN 10 Volt Analog Input DB1 17 20V_IN 20 Volt Analog Input DGND Digital Ground DB0:11 12-Bit Digital Output (DB11 = MSB, DB0 = LSB) Status 10 11 12 BIP_OFF 13 10V_IN DB0 16 20V_IN DGND 15 14 STS 2 HT574 DC ELECTRICAL CHARACTERISTICS P arame te r Temperature ranges = -55 to +225°C, VDD = 10.0V ±10% Typical @ +25°C, Vlogic = +5V, unless otherwise specified Conditions Typ Min Resolution Max Units 12 Bits Integral Non-Linearity (INL) Tmin to Tmax ±1 LSB Differential Non-Linearity (DNL) Tmin to Tmax ±1 LSB Unipolar Offset Error Adjustable to zero ±2 LSB Bipolar Offset Error Adjustable to zero ±10 LSB Full Scale Calibration Error (1) Temperature Coefficients No adjustment at +25°C, Tmin to Tmax 0.8 % of FS With adjustment at +25°C, Tmin to Tmax 0.5 % of FS Using internal reference, Tmin to Tmax Unipolar Offset ±2 (5) LSB (ppm/°C) Bipolar Offset ±4 (10) LSB (ppm/°C) Full Scale Calibration ±20 (50) LSB (ppm/°C) ±2 ±0.5 LSB LSB Power Supply Rejection Max change in full scale calibration +9.0V<VDD<11>V +4.5V<VLOGIC<5.5V Analog Input Ranges Bipolar -5 +5 V Unipolar 0 +10 V 0 +20 V Impedance Temperature coefficient = ±100ppm/°C 10 Volt Span 3.3 2.64 3.96 KΩ 20 Volt Span 13.3 10.64 15.96 kΩ +4.5 +5.5 V +9 +11 V Operating Voltage Range VLOGIC VDD Operating Current ILOGIC 1 3 mA IDD 7 9 mA 75 105 mW 5.035 V 8 mA Power Dissipation VDD = 10V, VLOGIC = 5 V Internal Reference Voltage Output Current (2) 5 Sink or source (1) Can be adjusted by tying VTRIM to external resistor and VREF_OUT or VSSA. (2) Available for external loads, external load should not change during conversion. 3 4.965 HT574 DIGITAL CHARACTERISTICS Parameter Temperature ranges = -55 to +225°C, VDD = 10.0V ±10% Typical @ +25°C, Vlogic = +5V, unless otherwise specified Conditions Typical Min Max Units Logic "1" 2.4 5.5 V Logic "0" -0.5 +0.8 V +5 µA Logic Inputs (CE, NCS, R_NC, Ao, 12_N8) Current ±0.01 0 to +5.5V input Capacitance 5 pF Logic Outputs (DB11-DBO, STS) Logic "0" (ISink = 1.6mA) +0.4 Logic "1" (ISource = 500µA) Leakage (High Z state, DB11-DBO only) +2.4 Capacitance ±0.1 -5 V +5 5 READ MODE AC TIMING CHARACTERISTICS V µA pF Temperature ranges = -55 to +225°C, VDD = 10.0V ±10% Typical @ +25°C, Vlogic = +5V, unless otherwise specified Symbol Parameter Conditions (1) Typical Min Max Units tDD Access Time from CE 150 ns tHD Data Valid after CE Low tHL Output Float Delay tSSR NCS to CE Setup 0 50 ns tSRR R_NC to CE Setup 0 0 ns tSAR Ao to CE Setup 50 ns tHSR NCS Valid after CE Low 0 0 ns tHRR R_NC High after CE Low 0 0 ns tHAR Ao Valid after CE Low 50 ns tHS STS Delay after Data Valid 25 ns 150 300 1000 ns ns (1) Time is measured from 50% level of digital transitions. Tested with a 100pF and 3kΩ load for high impedance to drive and tested with 10pF and 3kΩ load for drive to high impedance. 4 HT574 Temperature ranges = -55 to +225°C, VDD = 10.0V ±10% Typical @ +25°C, Vlogic = +5V, unless otherwise specified CONVERT MODE TIMING CHARACTERISTICS Symbol Parameter Conditions (1) Typical Min tDSC STS Delay from CE tHEC CE Pulse Width 50 ns tSSC NCS to CE Setup 50 ns tHCS NCS Low during CE High 50 ns tSRC R_NC to CE Setup 50 ns tHRC R_NC Low during CE High 50 ns tSAC Ao to CE Setup 0 ns tHAC Ao Valid during CE High 50 ns tC Conversion Time 12-Bit Cycle 8-Bit Cycle Including Acquisition Tmin to Tmax Tmin to Tmax Max Units 200 ns µs µs 10 7.2 (1) Time is measured from 50% level of digital transitions. Tested with a 100pF and 3kΩ load for high impedance to drive and tested with 10pF and 3kΩ load for drive to high impedance. CONVERT MODE TIMING DIAGRAM READ MODE TIMING DIAGRAM CE CE NCS tHEC tSSR tHSR tSSC NCS tHRR tSRC tHSC R_NC R_NC tSRR tHRC Ao Ao tSAR tSAC tHAR tHAC STS tDSC STS tC DB11-DB0 DB11-DB0 Impedance tDD 5 tHD tHS High High Impedance Data Valid tHL HT574 Temperature ranges = -55 to +225°C, VDD = 10.0V ±10% Typical @ +25°C, Vlogic = +5V, unless otherwise specified STAND ALONE MODE TIMING CHARACTERISTICS Symbol Parameter Conditions (1) Typical Min tHRL Low R_NC Pulse Width tDS STS Delay from R_NC tHDR Data Valid after R_NC Low 25 tHS STS Delay after Data Valid 300 tHRH High R_NC Pulse Width 150 tDDR Data Access Time Max 50 ns 200 Parameter ns ns 1000 ns ns 150 SAMPLE AND HOLD CHARACTERISTICS Units ns -55 to 225°C, VDD = +10V, VLOGIC = +5V Unless otherwise specified Conditions (1) Typical Acquisition Time Aperture Uncertainty Time Min Max Units 1.26 µs 20 ns (1) Time is measured from 50% level of digital transitions. Tested with a 100pF and 3kΩ load for high impedance to drive and tested with 10pF and 3kΩ load for drive to high impedance. STAND ALONE MODE TIMING LOW PULSE FOR R_NC STAND ALONE MODE TIMING HIGH PULSE FOR R_NC tHRL R_NC R_NC tHRH tDS STS tDS STS tC tC tHDR tDDR tHS Data Valid DB11-DB0 Data Valid tHDR High-Z DB11-DB0 High-Z Data Valid 6 HT574 UNIPOLAR INPUT CONNECTIONS 100K -15V VIN (0 TO 20V) Range 14 VIN (0 TO 10V) Range 13 +15V 100K BIP_OFF 10K 5K 12 5K VIN (0 TO 5V) 100 VREF_OUT 8 VBG REF OUT = 5V REF 11 VREF_IN 10 VREF = 5V 2.5K VTRIM Note: If no offset adjustment is required, BIP_OFF can be tied directy to AGND (0 volts). BIPOLAR INPUT CONNECTIONS Open VIN (±5V) Range 14 10K 13 5K BIP_OFF VIN (0 TO 5V) 12 5K VREF_OUT 8 VBG REF OUT = 5V REF 11 VREF_IN 10 2.5K VREF = 5V 7 VTRIM HT574 TRUTH TABLE FOR HT574 CONTROL Case CE NCS R_NC 12_N8 A0 Operation 1 0 X X X X None 2 X 1 X X X None 3 0 0 X 0 Initiate 12 Bit Conversion 4 0 0 X 1 Initiate 8 Bit Conversion 5 1 0 X 0 Initiate 12 Bit Conversion 6 1 0 X 1 Initiate 8 Bit Conversion 7 1 0 X 0 Initiate 12 Bit Conversion 8 1 0 X 1 Initiate 8 Bit Conversion 9 1 0 1 1 X Enable 12 Bit Output 10 1 0 1 0 0 Enable 8 MSB's Only 11 1 0 1 0 1 Enable 4 LSB's + 4 Trailing Zero's ABSOLUTE MAXIMUM RATINGS (1) VDD to Analog Common ........................................................................................................................... 0V to +12.5V VLOGIC to Digital Common ........................................................................................................................... 0V to +7V Analog Common to Digital Common ....................................................................................................................... ±1V Control Inputs (CE, NCS, 12_N8, Ao, R_NS) to Digital Common............................................ -0.5V to VLOGIC +0.5V Analog Inputs (VREF_IN, BIP_OFF, 10V_IN) to Analog Common .................................................................... ±12.5V 20V_IN to Analog Common .................................................................................................................................. ±24V VREF_OUT ............................................................................................................... Indefinite Short Circuit to Ground Power Dissipation ........................................................................................................................................... 1000mW Storage Temperature .............................................................................................................................. -65 to +325°C Lead Temperature (Attachment, 10 sec.) ............................................................................................................ 355°C ESD Protection .................................................................................................................................................... 2000V (1) Stresses in excess of those listed above may result in permanent damage. These are stress ratings only, and operation at these levels is not implied. Frequent or extended exposure to absolute maximum conditions may effect device reliability. To learn more about Honeywell Solid State Electronics Center, visit our web site at http://www.ssec.honeywell.com Honeywell reserves the right to make changes to any products or technology herein to improve reliability, function or design. Honeywell does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights nor the rights of others. Helping You Control Your World 900177 Rev. B 4-98 8