ETC PKFC05C

05180
PKFC3.3C*
thru
PKFC36C*
Only One Name Means ProTek’Tion™
PACKAGED FLIP CHIP ARRAY
APPLICATIONS
✔ Cellular Phones
✔ MCM Boards
✔ Wireless Communication Circuits
✔ IR LEDs
✔ SMART & PCMCIA Cards
IEC COMPATIBILITY (EN61000-4)
✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔ 61000-4-4 (EFT): 40A - 5/50ns
FEATURES
✔ CHIP SCALE PACKAGE 0.050” (1.270mm) x 0.030” (0.762mm)
✔ ESD Protection > 25 kilovolts
✔ Available in Multiple Voltage Types Ranging From 3.3V to 36V
✔ 250 Watts Peak Pulse Power per Line (tp = 8/20µs)
✔ Bidirectional Configuration & Monolithic Structure
✔ Protects 1 Line
✔ RoHS Compliant in Lead-Free Versions
MECHANICAL CHARACTERISTICS
✔ Encapsulated 0502 Chip
✔ Weight 0.73 milligrams (Approximate)
✔ Available in Tin-Lead or Lead-Free Pure-Tin Plating(Annealed)
✔ Solder Reflow Temperature:
Tin-Lead - Sn/Pb, 85/15: 240-245°C
Pure-Tin - Sn, 100: 260-270°C
✔ Flammability Rating UL 94V-0
✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481
✔ Device Marking On Reel
PIN CONFIGURATION
*PATENT PENDING”
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PKFC3.3C*
thru
PKFC36C*
DEVICE CHARACTERISTICS
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
SYMBOL
VALUE
UNITS
Peak Pulse Power (tp = 8/20µs) - See Figure 1
PPP
250
Watts
Operating Temperature
TJ
-55°C to 150°C
°C
TSTG
-55°C to 150°C
°C
PARAMETER
Storage Temperature
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PART
NUMBER
(See Note 1)
PKFC3.3C
PKFC05C
PKFC08C
PKFC12C
PKFC15C
PKFC24C
PKFC36C
RATED
STAND-OFF
VOLTAGE
MINIMUM
BREAKDOWN
VOLTAGE
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
MAXIMUM
CLAMPING
VOLTAGE
(See Fig. 2)
MAXIMUM
LEAKAGE
CURRENT
(See Note 2)
TYPICAL
CAPACITANCE
V WM
VOLTS
@ 1mA
V(BR)
VOLTS
@ IP = 1A
VC
VOLTS
@8/20µs
VC @ IPP
@VWM
ID
µA
@0V, 1 MHz
C
pF
3.3
5.0
8.0
12.0
15.0
24.0
36.0
4.0
6.0
8.5
13.3
16.7
26.7
40.0
7.0
9.8
13.4
19.0
24.0
43.0
64.0
12.5V @ 20A
14.7V @ 17A
19.2V @ 13A
29.7V @ 9.0A
35.7V @ 7.0A
55.0V @ 5.0A
84.0V @ 3.0A
75*
10**
10***
1
1
1
1
150
100
75
50
40
30
25
Note 1: All devices are bidirectional. Electrical characteristics apply in both directions.
Note 2: *Typical leakage current < 5µA @ 2.8V. **Typical leakage current <500nA @ 3.3V. ***Typical leakage current <200nA @ 5V.
FIGURE 1
PEAK PULSE POWER VS PULSE TIME
IPP - Peak Pulse Current - % of IPP
PPP - Peak Pulse Current - Watts
10,000
1,000
250W, 8/20µs Waveform
100
10
0.01
FIGURE 2
PULSE WAVE FORM
120
tf
100
TEST
WAVEFORM
PARAMETERS
tf = 8µs
td = 20µs
Peak Value IPP
80
e-t
60
40
td = t I /2
PP
20
0
1
10
100
td - Pulse Duration - µs
1,000
10,000
0
5
10
15
t - Time - µs
20
25
30
*PATENT PENDING
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PKFC3.3C*
thru
PKFC36C*
GRAPHS
FIGURE 3
POWER DERATING CURVE
100
Peak Pulse Power
8/20µs
% Of Rated Power
80
60
40
20
Average Power
0
0
25
50
75
100
125
TL - Lead Temperature - °C
150
FIGURE 4
OVERSHOOT & CLAMPING VOLTAGE FOR PKFC05C
5 Volts per Division
35
25
15
5
-5
ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)
FIGURE 5
TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR PKFC05C
VC - Clamping Voltage - Volts
14
12
10
8
6
4
2
0
0
5
10
15
20
IPP - Peak Pulse Current - Amps
*PATENT PENDING
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PKFC3.3C*
thru
PKFC36C*
APPLICATION INFORMATION
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER
VALUE
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Paste Type
Pad Protective Finish
Tolerance - Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183°C)
Soldering Maximum Temperature
0.275mm
Round
Non-Solder Mask Defined Pads
0.325mm Round
0.150mm
0.330mm Round
No Clean
OSP(Entek Cu Plus 106A)
±50µm
±20µm
60 Seconds
270°C
RECOMMENDED NON-SOLDER MASK
DEFINED PAD ILLUSTRATION
REQUIREMENTS
Non-Solder Mask Defined Pad
0.275mm DIA.
Temperature:
TP for Lead-Free (SnAgCu): 260-265°C
TP for Tin-Lead: 240-245°C
Preheat time and temperature depends on solder paste and flux
activation temperature, component size, weight, surface area &
plating.
Solder Mask Opening
0.325mm DIA.
Solder Stencil Opening
0.330mm DIA.
TP
Temperature - °C
Ramp-up
Ramp-down
TL
TSMAX
155°
TSMIN
140°
TS - Preheat
t 25°C to Peak
30-60 seconds
Ramp-up
15 seconds
Solder Time
15-20 seconds
Ramp-down
*PATENT PENDING
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PKFC3.3C*
thru
PKFC36C*
PACKAGE OUTLINE & DIMENSIONS
PACKAGE OUTLINE
A
PACKAGE DIMENSIONS
C
H
D
K
B
TOP
BOTTOM
SIDE
E
DIM
MILLIMETERS
INCHES
A
B
C
D
E
F
G
H
J
K
0.838
1.245
0.762
0.533
0.228
0.533
0.305
0.432
0.432
0.355
0.033
0.049
0.030
0.021
0.009
0.021
0.012
0.017
0.017
0.014
NOTES
J
F
1. Controlling dimensions in inches.
2. Decimal tolerances for mounting pad : ± 0.003”
(± 0.08mm).
3. Maximum size: 0.052” (1.321mm) by 0.036”
(0.914mm).
4. All dimensions ±0.003” on package outline.
G
PAD DIMENSIONS
MOUNTING PAD
A
G
B
DIM
MILLIMETERS
INCHES
A
B
C
E
F
G
J
1.016
0.635
1.473
0.203
0.508
0.343
0.343
0.040
0.025
0.058
0.008
0.020
0.0135
0.0135
TAPE & REEL ORIENTATION
F
E
C
Package Outline
J
Solder Print Diameter
0.010” - 0.012”
Package Contact Pads
NOTE
1. Top view of tape. Solder PADS face down in tape
package.
TAPE & REEL ORDERING NOMENCLATURE
1.
2.
3.
4.
Surface mount product is taped and reeled in accordance with EIA 481.
8mm Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., PKFC05C-T75-1).
8mm Paper Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-2 (i.e., PKFC05C-T75-2).
Suffix - LF = Lead-Free, Pure-Tin Plating, i.e., PKFC05C-LF-T75-2.
COPYRIGHT © ProTek Devices 2005
SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical
characteristics described herein without notice (except JEDEC).
Outline & Dimensions: Rev 1 - 8/03, 06040
ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288
E-Mail: [email protected]
Web Site: www.protekdevices.com
DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that
the final judgement concerning selection and specifications is the buyer’s and that in furnishing
engineering and technical assistance, ProTek assumes no responsibility with respect to the
selection or specifications of such products.
*PATENT PENDING
05180.R1 3/05
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