05180 PKFC3.3C* thru PKFC36C* PACKAGED FLIP CHIP ARRAY APPLICATIONS ✔ Cellular Phones ✔ MCM Boards ✔ Wireless Communication Circuits ✔ IR LEDs ✔ SMART & PCMCIA Cards IEC COMPATIBILITY (EN61000-4) ✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV ✔ 61000-4-4 (EFT): 40A - 5/50ns FEATURES ✔ Chip Scale Package 0.050” (1.270mm) x 0.030” (0.762mm) ✔ ESD Protection > 25 kilovolts ✔ Available in Voltages Ranging From 3.3V to 36V ✔ 250 Watts Peak Pulse Power per Line (tp = 8/20µs) ✔ Bidirectional Configuration & Monolithic Structure ✔ Protects 1 Line ✔ RoHS Compliant MECHANICAL CHARACTERISTICS ✔ ✔ ✔ ✔ Encapsulated 0502 Chip Weight 0.73 milligrams (Approximate) Available in Lead-Free Plating Solder Reflow Temperature: Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C ✔ Consult Factory for Leaded Device Availability ✔ Flammability Rating UL 94V-0 ✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481 ✔ Device Marking On Reel PIN CONFIGURATION 05180.R4 2/07 1 www.protekdevices.com *PATENT PENDING PKFC3.3C* thru PKFC36C* DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25°C Unless Otherwise Specified PARAMETER Peak Pulse Power (tp = 8/20µs) - See Figure 1 Operating Temperature Storage Temperature SYMBOL VALUE UNITS PPP 250 Watts TA -55 to 150 °C TSTG -55 to 150 °C ELECTRICAL CHARACTERISTICS PER LINE PART NUMBER (See Note 1) DEVICE MARKING CODE 03 05 08 12 15 24 36 PKFC3.3C PKFC05C PKFC08C PKFC12C PKFC15C PKFC24C PKFC36C @ 25°C Unless Otherwise Specified RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM CLAMPING VOLTAGE (See Fig. 2) MAXIMUM CLAMPING VOLTAGE (See Fig. 2) MAXIMUM LEAKAGE CURRENT (See Note 2) TYPICAL CAPACITANCE VWM VOLTS @ 1mA V(BR) VOLTS @ IP = 1A VC VOLTS @8/20µs VC @ IPP @VWM ID µA @0V, 1 MHz C pF 3.3 5.0 8.0 12.0 15.0 24.0 36.0 4.0 6.0 8.5 13.3 16.7 26.7 40.0 7.0 9.8 13.4 19.0 24.0 43.0 64.0 12.5V @ 20A 14.7V @ 17A 19.2V @ 13A 29.7V @ 9.0A 35.7V @ 7.0A 55.0V @ 5.0A 84.0V @ 3.0A 75* 10** 10*** 1 1 1 1 150 100 75 50 40 30 25 Note 1: All devices are bidirectional. Electrical characteristics apply in both directions. Note 2: *Typical leakage current < 5µA @ 2.8V. **Typical leakage current <500nA @ 3.3V. ***Typical leakage current <200nA @ 5V. FIGURE 1 PEAK PULSE POWER VS PULSE TIME IPP - Peak Pulse Current - % of IPP PPP - Peak Pulse Current - Watts 10,000 1,000 250W, 8/20µs Waveform 100 10 0.01 05180.R4 2/07 FIGURE 2 PULSE WAVE FORM 120 tf 100 TEST WAVEFORM PARAMETERS tf = 8µs td = 20µs Peak Value IPP 80 e-t 60 40 td = t I /2 PP 20 0 1 10 100 td - Pulse Duration - µs 1,000 10,000 2 0 5 10 15 t - Time - µs 20 25 30 www.protekdevices.com *PATENT PENDING PKFC3.3C* thru PKFC36C* GRAPHS FIGURE 3 POWER DERATING CURVE 100 Peak Pulse Power 8/20µs % Of Rated Power 80 60 40 20 Average Power 0 0 25 50 75 100 125 TA - Ambient Temperature - °C 150 FIGURE 4 OVERSHOOT & CLAMPING VOLTAGE FOR PKFC05C 5 Volts per Division 35 25 15 5 -5 ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape) FIGURE 5 TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR PKFC05C VC - Clamping Voltage - Volts 14 12 10 8 6 4 2 0 0 5 10 15 20 IPP - Peak Pulse Current - Amps 05180.R4 2/07 3 www.protekdevices.com *PATENT PENDING PKFC3.3C* thru PKFC36C* APPLICATION INFORMATION PRINTED CIRCUIT BOARD RECOMMENDATIONS VALUE PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183°C) Soldering Maximum Temperature 0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) ±50µm ±20µm 60 Seconds 270°C RECOMMENDED NON-SOLDER MASK DEFINED PAD ILLUSTRATION REQUIREMENTS Non-Solder Mask Defined Pad 0.275mm DIA. Temperature: TP for Lead-Free (SnAgCu): 260-270°C TP for Tin-Lead: 240-245°C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating. Solder Mask Opening 0.325mm DIA. Solder Stencil Opening 0.330mm DIA. TP Temperature - °C Ramp-up Ramp-down TL TSMAX 155° TSMIN 140° TS - Preheat t 25°C to Peak 30-60 seconds 05180.R4 2/07 Ramp-up 15 seconds 4 Solder Time 15-20 seconds Ramp-down www.protekdevices.com *PATENT PENDING PKFC3.3C* thru PKFC36C* 0502 PACKAGE OUTLINE & DIMENSIONS PACKAGE OUTLINE PACKAGE DIMENSIONS DIM A C H A B C D E F G H J K D K TOP BOTTOM B J SIDE E F MIN NOM MAX MIN NOM MAX 0.73 1.22 0.73 0.54 0.10 0.55 0.27 0.38 0.35 0.35 0.76 1.27 0.76 0.57 0.13 0.58 0.30 0.41 0.38 0.38 0.79 1.32 0.79 0.60 0.16 0.61 0.33 0.44 0.41 0.41 0.029 0.048 0.029 0.021 0.004 0.022 0.011 0.015 0.014 0.014 0.030 0.050 0.030 0.023 0.005 0.023 0.012 0.016 0.015 0.015 0.031 0.052 0.031 0.024 0.006 0.024 0.013 0.017 0.016 0.016 NOTES 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad : ± 0.003” (± 0.08mm). 3. Maximum size: 0.052” (1.321mm) by 0.036” (0.914mm). 4. All dimensions ±0.003” on package outline. G PAD DIMENSIONS MOUNTING PAD DIM A A B C E F G J G B F E INCHES MILLIMETERS MILLIMETERS MIN NOM MAX 1.00 0.62 1.44 0.18 0.49 0.31 0.31 C 1.02 0.64 1.47 0.20 0.51 0.33 0.33 1.04 0.66 1.50 0.22 0.53 0.35 0.35 MIN INCHES NOM MAX 0.039 0.024 0.056 0.007 0.019 0.012 0.012 0.040 0.025 0.058 0.008 0.020 0.013 0.013 0.041 0.026 0.060 0.009 0.021 0.014 0.014 TAPE & REEL ORIENTATION Package Outline J XX Package Contact Pads Solder Print Diameter 0.010” - 0.012” TAPE & REEL ORDERING NOMENCLATURE NOTE 1. Top view of tape. Solder PADS face down in tape package. Outline & Dimensions: Rev 1 - 8/03, 06040 1. Surface mount product is taped and reeled in accordance with EIA 481. 2. 8mm Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., PKFC05C-T75-1). 3. Suffix - LF = Lead-Free, Pure-Tin Plating, i.e., PKFC05C-LF-T75-1. Tape & Reel Specifications (Dimensions in millimeters) Reel Dia. Tape Width 178mm (7”) 8mm A0 B0 K0 D E F W P0 P2 P t 1.08 ± 0.05 1.60 ± 0.05 0.72 ± 0.05 1.50 ± 0.10 1.75 ± 0.10 3.50 ± 0.05 8.00 ±0.30 4.00 ±0.10 2.00 ±0.05 4.00 ±0.10 0.20±0.025 P0 t P2 D 10 Pitches Cumulative Tolerance on Tape. ± 0.2 E Top cover tape A0 F W K0 B0 P User Direction of Feed COPYRIGHT © ProTek Devices 2007 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products. 05180.R4 2/07 5 ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: [email protected] Web Site: www.protekdevices.com www.protekdevices.com *PATENT PENDING