ETC ECG055B

ECG055
The Communications Edge TM
Product Information
InGaP HBT Gain Block
Product Features
x DC – 3 GHz
x +18 dBm P1dB at 1 GHz
x +34 dBm OIP3 at 1 GHz
x 20 dB Gain at 1 GHz
x 4.3 dB Noise Figure at 2 GHz
x Available in SOT-86, SOT-89
89 and lead-free / green SOT-89
Package Styles
x Internally matched to 50 :
Applications
x Mobile Infrastructure
x CATV / DBS
x W-LAN / ISM
x RFID
x Defense / Homeland Security
x Fixed Wireless
Product Description
Functional Diagram
The ECG055 is a general-purpose buffer amplifier that
offers high dynamic range in a low-cost surface-mount
package. At 1000 MHz, the ECG055 typically provides
20 dB of gain, +34 dBm Output IP3, and +18 dBm P1dB.
GND
The ECG055 consists of Darlington pair amplifiers using
the high reliability InGaP/GaAs HBT process technology
and only requires DC-blocking capacitors, a bias resistor,
and an inductive RF choke for operation. The device is
ideal for wireless applications and is available in lowcost, surface-mountable plastic SOT-86 and SOT-89
packages.
The ECG055 is also available in a leadfree/green/RoHS-compliant SOT-89 package.
All
devices are 100% RF and DC tested.
The broadband MMIC amplifier can be directly applied
to various current and next generation wireless
technologies such as GPRS, GSM, CDMA, and WCDMA. In addition, the ECG055 will work for other
various applications within the DC to 3 GHz frequency
range such as CATV and fixed wireless.
Specifications (1)
Parameter
4
1
2
3
RF IN
GND
RF OUT
ECG055B / ECG055B-G
GND
4
RF In
3 RF Out
1
2
GND
ECG055C
Typical Performance (3)
Units
Min
MHz
MHz
dB
dBm
dBm
MHz
dB
dB
dB
dBm
dBm
dB
V
mA
DC
Operational Bandwidth
Test Frequency
Gain
Output P1dB
Output IP3 (2)
Test Frequency
Gain
Input Return Loss
Output Return Loss
Output P1dB
Output IP3 (2)
Noise Figure
Device Voltage
Device Current
4.2
Typ
Max
Parameter
3000
Frequency
S21
S11
S22
Output P1dB
Output IP3
Noise Figure
1000
19.7
+18
+34
2000
19
20
20.8
+18
+32
4.3
4.8
65
Units
MHz
dB
dB
dB
dBm
dBm
dB
Typical
500
20
-30
-23
+18
+34
4.6
900
19.7
-27
-23
+18
+34
4.5
1900
19
-22
-21
+18.2
+32
4.3
3. Test conditions: T = 25º C, Supply Voltage = +6 V, Device Voltage = +5.0V, Rbias = 18 , 50
2140
18.5
-20
-15
+19.0
+30.5
3.8
System.
5.3
1. Test conditions unless otherwise noted: 25º C, Supply Voltage = +6 V, Rbias = 18 , 50 System.
2. 3OIP measured with two tones at an output power of +4 dBm/tone separated by 1 MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Ordering Information
Absolute Maximum Rating
Parameter
Operating Case Temperature
Storage Temperature
RF Input Power (continuous)
Device Current
Junction Temperature
Part No.
Rating
-40 to +85 qC
-65 to +150 qC
+12 dBm
150 mA
+250 qC
Description
ECG055B
InGaP HBT Gain Block
ECG055B-G
InGaP HBT Gain Block
ECG055C
ECG055B-PCB
ECG055C-PCB
InGaP HBT Gain Block (SOT-86 Pkg)
700 –2400 MHz Fully Assembled Eval. Board
700 –2400 MHz Fully Assembled Eval. Board
(leaded SOT-89 Pkg)
(lead-free/green/RoHS-compliant SOT-89 Pkg)
Operation of this device above any of these parameters may cause permanent damage.
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: [email protected]
Web site: www.wj.com
December 2004
ECG055
The Communications Edge TM
Product Information
InGaP HBT Gain Block
Typical Device RF Performance
Supply Bias = +6 V, Rbias = 18 :, Icc = 65 mA
Frequency
S21
S11
S22
Output P1dB
Output IP3
Noise Figure
MHz
dB
dB
dB
dBm
dBm
dB
100
20.2
-36
-23
+18.2
+33
3.4
500
20.1
-30
-23
+18
+33.5
4.6
900
19.7
-27
-23
+18.1
+34.5
4.5
1900
18.5
-22
-21
+18.2
+33.5
4.3
2140
18.2
-22
-20
+17.8
+32.9
4.2
2400
17.8
-22
-20
+17.8
+32
4.2
3500
16.2
-24
-17
+17.2
5800
14
-21
-11
1. Test conditions: T = 25º C, Supply Voltage = +6 V, Device Voltage = 4.8 V, Rbias = 18 , Icc = 65 mA typical, 50 System.
2. 3OIP measured with two tones at an output power of +4 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
3. Data is shown as device performance only. Actual implementation for the desired frequency band will be determined by external components shown in the application circuit.
Gain vs. Frequency
S11, S22 vs. Frequency
0
20
-5
120
Icc
S21(dB)
100
S22
-10
15
-15
10
5
-20
0
-25
1
2
3
4
Frequency (GHz)
5
6
60
40
S11
20
0
OIP3 vs. Frequency
1
2
3
4
Frequency (GHz)
5
35
5
NF (dB)
OIP3 (dBm)
6
30
1
-40°C
85°C
2
3
Frequency (MHz)
4
1.0
2.0
3.0
4.0
5.0
6.0
Vcc
P1dB vs. Frequency
20
18
4
16
3
25
25°C
0
0.0
6
Noise Figure vs. Frequency
40
20
80
P1dB (dBm)
0
Icc vs. Vde
160
140
S11, S22 (dB)
25
2
500
1000
1500
2000
2500
3000
Frequency (MHz)
25°C
14
1
-40°C
85°C
2
3
Frequency (MHz)
4
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: [email protected]
Web site: www.wj.com
December 2004
ECG055
The Communications Edge TM
Product Information
InGaP HBT Gain Block
Recommended Application Circuit
Vcc
Icc = 65 mA
R4
Bias
Resistor
C4
Bypass
Capacitor
C3
0.018 µF
L1
RF Choke
RF IN
RF OUT
ECG055
C2
Blocking
Capacitor
C1
Blocking
Capacitor
ECG055B-PCB
Reference
Designator
L1
C1, C2, C4
50
820 nH
.018 µF
ECG055C-PCB
Recommended Component Values
Frequency (MHz)
500
900
1900
2200
220 nH
68 nH
27 nH
22 nH
1000 pF
100 pF
68 pF
68 pF
2500
18 nH
56 pF
3500
15 nH
39 pF
1. The proper values for the components are dependent upon the intended frequency of operation.
2. The following values are contained on the evaluation board to achieve optimal broadband performance:
Ref. Desig.
L1
C1, C2
C3
C4
R4
Value / Type
39 nH wirewound inductor
56 pF chip capacitor
0.018 PF chip capacitor
Do Not Place
18 : 1% tolerance
Size
0603
0603
0603
Recommended Bias Resistor Values
Supply
R1 value
Size
Voltage
6V
18.5 ohms
0805
7V
33.8 ohms
1210
8V
49 ohms
1210
9V
65 ohms
2010
10 V
80 ohms
2010
12 V
111 ohms
2512
The proper value for R1 is dependent upon the supply
voltage and allows for bias stability over temperature.
WJ recommends a minimum supply bias of +6 V. A
1% tolerance resistor is recommended.
0805
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: [email protected]
Web site: www.wj.com
December 2004
ECG055
The Communications Edge TM
Product Information
InGaP HBT Gain Block
ECG055B (SOT-89 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Product Marking
The component will be marked with an
“E055” designator with an alphanumeric lot
code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating:
Value:
Test:
Standard:
Class 1A
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +235 C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135” ) diameter drill and have a final plated
thru diameter of .25 mm (.010” ).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
Land Pattern
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: [email protected]
Web site: www.wj.com
December 2004
ECG055
The Communications Edge TM
Product Information
InGaP HBT Gain Block
ECG055B-G (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260qC reflow temperature) and leaded
(maximum 245qC reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Product Marking
Outline Drawing
The component will be marked with an
“ E055G” designator with an alphanumeric lot
code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “ Application
Notes” section.
MSL / ESD Rating
ESD Rating:
Value:
Test:
Standard:
Class 1A
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
MSL Rating: Level 3 at +260 C convection reflow
Standard:
JEDEC Standard J-STD-020
Land Pattern
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135” ) diameter drill and have a final plated
thru diameter of .25 mm (.010” ).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: [email protected]
Web site: www.wj.com
December 2004
ECG055
The Communications Edge TM
Product Information
InGaP HBT Gain Block
ECG055C (SOT-86 Package) Mechanical Information
Outline Drawing
Product Marking
The component will be marked with a twodigit numeric lot code followed by a “ Y”
designator on the top surface of the
package.
Tape and reel specifications for this part are
located on the website in the “ Application
Notes” section.
MSL / ESD Rating
ESD Rating:
Value:
Test:
Standard:
Class 1A
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
MSL Rating: Level 1 at +235 C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device.
Vias should use
a .35mm (#80 / .0135” ) diameter drill and have a
final plated thru diameter of .25 mm (.010” ).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC
board in the region where the board contacts the
heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles
are in degrees.
Land Pattern
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: [email protected]
Web site: www.wj.com
December 2004
ECG055
The Communications Edge TM
Product Information
InGaP HBT Gain Block
Typical Device S-Parameters – ECG055B / ECG055B-G
S-Parameters (Vdevice = +4.8 V, ICC = 65 mA, T = 25 C, calibrated to device leads)
Freq (MHz)
50
500
1000
1500
2000
2500
3000
3500
4000
4500
5000
5500
6000
S11 (dB)
S11 (ang)
S21 (dB)
S21 (ang)
S12 (dB)
S12 (ang)
S22 (dB)
S22 (ang)
-43.39
-35.69
-36.17
-39.67
-47.76
-34.49
-27.47
-22.05
-17.95
-14.46
-11.17
-8.90
-6.98
36.98
21.69
9.50
-13.97
-168.22
149.36
131.16
110.28
92.80
78.77
65.64
51.85
40.70
20.59
20.33
19.97
19.43
18.94
18.33
17.71
17.12
16.51
15.85
15.20
14.33
13.37
177.68
157.95
136.78
116.67
97.59
78.63
60.90
43.22
25.75
8.27
-9.36
-27.36
-44.65
-22.62
-22.54
-22.43
-22.21
-21.89
-21.57
-21.15
-20.74
-20.33
-19.98
-19.77
-19.71
-19.82
-0.53
-3.66
-7.11
-10.88
-14.89
-19.36
-24.45
-30.55
-37.20
-44.69
-53.40
-62.31
-71.82
-24.22
-22.15
-19.38
-16.82
-14.74
-13.12
-11.44
-10.09
-8.35
-6.89
-5.48
-4.20
-3.18
-3.40
-55.60
-94.63
-124.20
-149.72
-171.09
168.48
149.65
131.32
113.94
97.62
81.72
66.66
Typical Device S-Parameters – ECG055C
S-Parameters (Vdevice = +4.8 V, ICC = 65 mA, T = 25 C, calibrated to device leads)
Freq (MHz)
50
500
1000
1500
2000
2500
3000
3500
4000
4500
5000
5500
6000
S11 (dB)
S11 (ang)
S21 (dB)
S21 (ang)
S12 (dB)
-38.17
-30.35
-26.51
-23.32
-22.01
-21.87
-21.62
-23.63
-26.77
-31.76
-32.57
-24.49
-18.97
9.34
38.64
30.55
16.54
8.06
-3.80
-11.61
-13.22
-23.25
-20.76
122.50
133.61
125.72
20.30
20.11
19.67
19.00
18.39
17.62
16.91
16.27
15.65
15.09
14.65
14.16
13.73
178.31
161.09
143.04
126.43
111.18
96.71
83.83
71.31
59.48
47.94
36.34
24.39
13.11
-22.39
-22.33
-22.23
-22.09
-21.81
-21.55
-21.16
-20.78
-20.29
-19.79
-19.25
-18.78
-18.29
S12 (ang)
0.12
0.74
1.87
2.57
3.37
3.41
3.82
3.21
2.65
1.21
-0.79
-3.46
-6.40
S22 (dB)
S22 (ang)
-22.58
-23.00
-22.48
-21.21
-20.79
-19.71
-18.27
-17.28
-15.32
-14.24
-12.75
-11.56
-10.39
-1.41
-29.41
-50.33
-77.23
-101.82
-119.95
-141.35
-155.62
-170.83
174.50
163.59
150.73
140.55
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: [email protected]
Web site: www.wj.com
December 2004