ECP052 The Communications Edge TM ½ Watt, High Linearity InGaP HBT Amplifier • Single Positive Supply (+5V) • Available in SOIC-8 or 16pin 4mm QFN package Applications • Final stage amplifiers for Repeaters • Mobile Infrastructure The ECP052 is targeted for use as a driver amplifier in wireless infrastructure where high linearity and medium power is required. An internal active bias allows the ECP052 to maintain high linearity over temperature and operate directly off a single +5V supply. This combination makes the device an excellent candidate for transceiver line cards in current and next generation multi-carrier 3G base stations. N/C N/C 15 14 13 12 N/C N/C 2 11 RF OUT RF IN 3 10 RF OUT 9 N/C N/C 4 5 6 7 8 N/C • 18 dB Gain @ 900 MHz 16 Vref 1 N/C • +44 dBm Output IP3 Vbias • +28.5 dBm P1dB The ECP052 is a high dynamic range driver amplifier in a low-cost surface mount package. The InGaP/GaAs HBT is able to achieve high performance for various narrowband-tuned application circuits with up to +44 dBm OIP3 and +28.5 dBm of compressed 1dB power. It is housed in an industry standard SOIC-8 or 16-pin 4x4mm QFN SMT package. All devices are 100% RF and DC tested. N/C • 800 – 1000 MHz Functional Diagram N/C Product Description N/C Product Features Product Information ECP052D Vref 1 8 Vbias N/C 2 7 RF OUT RF IN 3 6 RF OUT N/C 4 5 N/C ECP052G Specifications (1) Parameter Operational Bandwidth Test Frequency Gain Output P1dB Output IP3 (2) Test Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 (2) IS-95A Channel Power @ -45 dBc ACPR, 1960 MHz Noise Figure Operating Current Range, Icc (3) Device Voltage, Vcc Units Min MHz MHz dB dBm dBm MHz dB dB dB dBm dBm 15.5 +27 +42.5 15.5 +27 +42.5 dBm dB mA V Typ 800 Max 1000 850 17 +28 +44 900 17.8 18 7 +28.7 +43 +23 200 7 250 +5 300 1. Test conditions unless otherwise noted: 25ºC, Vsupply = +5 V, in tuned application circuit. 2. 3OIP measured with two tones at an output power of +11 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. This corresponds to the quiescent current or operating current under small-signal conditions into pins 6, 7, and 8. It is expected that the current can increase by an additional 50 mA at P1dB. Pin 1 is used as a reference voltage for the internal biasing circuitry. It is expected that Pin 1 will pull 12mA of current when used with a series bias resistor of R1=100Ω. (ie. total device current typically will be 262 mA.) Absolute Maximum Rating Parameters Operating Case Temperature Storage Temperature RF Input Power (continuous) Device Voltage Device Current Device Power Rating -40 to +85 °C -65 to +150 °C +28 dBm +8 V 400 mA 2W Ordering Information Part No. Description ECP052D ECP052G ECP052D-PCB900 ECP052G-PCB900 ½ Watt InGaP HBT Amplifier (16p 4mm Pkg) ½ Watt InGaP HBT Amplifier (SOIC-8 Pkg) 900 MHz Evaluation Board 900 MHz Evaluation Board Operation of this device above any of these parameters may cause permanent damage. Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com August 2004 ECP052 The Communications Edge TM ½ Watt, High Linearity InGaP HBT Amplifier Product Information Typical Device Data S-Parameters (Vcc = +5 V, Icc = 250 mA, T = 25°C, unmatched 50 ohm system) DB(GMax) Swp Max 1GHz 2. 0 2. 0 6 0. 0.8 1.0 1.0 0.8 6 0. Swp Max 1GHz 0. 4 DB(|S[2,1]|) 35 S22 S11 Gain / Maximum Stable Gain 40 0. 4 0 3. 30 0 3. 0 4. 25 5.0 5.0 0.2 0.2 10.0 10.0 5.0 4.0 3.0 2.0 1.0 0.8 0.6 0.4 0 10.0 5.0 4.0 3.0 2.0 1.0 0.8 0.6 0.4 0.2 20 0.2 10.0 0 Gain (dB) 0 4. 15 -10.0 -10.0 -3 .0 Swp Min 0.05GHz .0 -2 -0.8 -0 .6 1 .4 -0 .0 -2 0.8 -0.8 0.4 0.6 Frequency (GHz) -1.0 0.2 -0 .6 0 2 -1.0 -4 .0 -5. 0 .4 -0 0 -0. -3 .0 2 -0. 5 -4 .0 -5. 0 10 Swp Min 0.05GHz Notes: The gain for the unmatched device in 50 ohm system is shown as the trace in black color. For a tuned circuit for a particular frequency, it is expected that actual gain will be higher, up to the maximum stable gain. The maximum stable gain is shown in the dashed red line. The return loss plots are shown from 50 – 1000 MHz, with markers placed at 0.2 – 1 GHz in 0.1 GHz increments. S-Parameters (Vcc = +5 V, Icc = 250 mA, T = 25°C, unmatched 50 ohm system, calibrated to device leads) Freq (MHz) S11 (dB) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) 50 100 200 400 600 800 1000 1200 1400 1600 1800 2000 2200 2400 2600 2800 3000 -2.72 -2.25 -2.31 -3.08 -5.79 -19.72 -6.06 -2.34 -1.28 -0.91 -0.71 -0.60 -0.58 -0.55 -0.51 -0.51 -0.54 24.16 20.33 17.23 15.63 15.58 15.22 11.91 6.92 2.28 -1.17 -4.40 -6.78 -8.70 -9.87 -10.59 -11.66 -13.08 133.35 124.95 119.37 98.28 69.70 25.60 -22.67 -56.59 -78.59 -96.56 -112.20 -128.36 -146.80 -169.80 160.74 128.82 95.01 -36.72 -35.31 -34.90 -33.62 -32.10 -31.19 -33.26 -38.16 -41.14 -42.62 -40.78 -40.27 -37.79 -39.90 -37.66 -35.78 -35.88 29.75 13.96 2.32 -16.36 -37.73 -78.95 -129.67 176.95 132.98 113.65 98.57 74.44 53.03 53.88 41.18 31.88 27.61 -2.23 -3.08 -3.32 -3.48 -2.87 -2.27 -1.40 -1.49 -1.96 -2.53 -2.92 -3.29 -3.72 -3.96 -3.25 -1.97 -1.09 -102.97 -137.03 -159.63 -172.70 -176.25 -179.74 173.15 165.12 160.84 160.80 157.57 155.77 155.24 158.19 160.80 158.05 149.64 Application Circuit PC Board Layout Circuit Board Material: .014” Getek, 4 - layer, 1 oz copper, Microstrip line details: width = .026”, spacing = .026” The silk screen markers ‘A’, ‘B’, ‘C’, etc. and ‘1’, ‘2’, ‘3’, etc. are used as placemarkers for the input and output tuning Shunt capacitors – C8 and C9. The markers and vias are spaced in .050” increments. Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com August 2004 ECP052 The Communications Edge TM ½ Watt, High Linearity InGaP HBT Amplifier Product Information 900 MHz Application Circuit (ECP052G-PCB900) Typical RF Performance at 25°C Frequency S21 – Gain S11 – Input Return Loss S22 – Output Return Loss Output P1dB Output IP3 900 MHz 17.5 dB -18 dB -7 dB +28.7 dBm +43 dBm (+11 dBm / tone, 1 MHz spacing) Channel Power +23 dBm (@-45 dBc ACPR, IS-95 9 channels fwd) 7 dB +5 V 250 mA S21 vs Frequency S 1 1 (d B ) S 2 1 (d B ) 18 16 +25°C 12 10 840 0 0 -5 -5 -10 -10 -15 -20 +85°C -25 -40°C -30 860 880 900 920 +25°C 860 880 30 8 28 P 1 d B (d B m ) N F (d B ) -40°C -30 920 -35 840 940 6 +25°C +80°C 900 +25°C 24 +85°C -40°C 920 20 840 940 860 Frequency (MHz) 880 900 920 -40°C 19 20 43 41 39 85 41 39 37 35 35 24 +25°, +13 dBm / tone 37 37 23 45 O IP 3 (d B m ) O I P 3 (d B m ) 39 22 OIP3 vs. Frequency 43 41 21 Output Channel Power (dBm) 45 43 O IP 3 (d B m ) 940 +85°C freq. = 900, 901 MHz, +25°C 60 920 +25°C 18 940 45 10 35 Temperature (°C) 900 -60 -65 -70 -75 -80 Frequency (MHz) freq. = 900, 901 MHz, +13 dBm /tone -15 880 -40 -45 -50 -55 OIP3 vs. Output Power OIP3 vs. Temperature -40 860 ACPR vs. Channel Power 26 22 880 -40°C Frequency (MHz) -40°C 860 +85°C IS-95, 9 Ch. Fwd, ±885KHz Meas BW, 900 MHz 10 0 840 +25°C P1 dB vs. Frequency Noise Figure vs. Frequency 2 -20 Frequency (MHz) Frequency (MHz) 4 900 -15 -25 +85°C -35 840 940 S 2 2 (d B ) 20 14 S22 vs. Frequency S11 vs. Frequency A C P R (d B m ) Noise Figure Device / Supply Voltage Quiescent Current 8 10 12 14 16 18 35 840 20 Output Power (dBm) 860 880 900 920 940 Frequency (MHz) Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com August 2004 ECP052 The Communications Edge TM ½ Watt, High Linearity InGaP HBT Amplifier Product Information ECP052G (SOIC-8 Package) Mechanical Information Outline Drawing Product Marking The component will be marked with an “ECP052G” designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the “Application Notes” section. ESD / MSL Information ESD Rating: Value: Test: Standard: Class 1B Passes between 500 and 1000V Human Body Model (HBM) JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +235° C convection reflow Standard: JEDEC Standard J-STD-020 Functional Diagram Land Pattern 1 8 2 7 3 6 4 5 Function Vref Input Output Vbias GND N/C or GND Pin No. 1 3 6, 7 8 Backside Paddle 2, 4, 5 Mounting Config. Notes 1. Parameter Rating Operating Case Temperature Thermal Resistance, Rth (1) Junction Temperature, Tjc (2) -40 to +85° C 62° C / W 162° C Notes: 1. The thermal resistance is referenced from the junctionto-case at a case temperature of 85° C. Tjc is a function of the voltage at pins 6 and 7 and the current applied to pins 6, 7, and 8 and can be calculated by: Tjc = Tcase + Rth * Vcc * Icc 2. This corresponds to the typical biasing condition of +5V, 250 mA at an 85° C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247° C. 2. MTTF vs. GND Tab Temperature 100000 MTTF (million hrs) Thermal Specifications 3. 4. 10000 5. 1000 6. 7. 8 100 60 70 80 90 100 110 A heatsink underneath the area of the PCB for the mounted device is strictly required for proper thermal operation. Damage to the device can occur without the use of one. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. RF trace width depends upon the PC board material and construction. Use 1 oz. Copper minimum. All dimensions are in millimeters (inches). Angles are in degrees. 120 Tab Temperature (°C) Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com August 2004 ECP052 The Communications Edge TM ½ Watt, High Linearity InGaP HBT Amplifier Product Information ECP052D (16-pin 4x4mm Package) Mechanical Information Outline Drawing Product Marking The component will be marked with an “ECP052D” designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the “Application Notes” section. ESD / MSL Information ESD Rating: Value: Test: Standard: Land Pattern MSL Rating: Level 3 at +235° C convection reflow Standard: JEDEC Standard J-STD-020 0.25mm DIA. THERMAL GROUND VIA HOLE VIAS ARE PLACED ON A 0.65mm GRID. VIAS ARE TO BE CONNECTED TO TOP, BOTTOM, AND INTERNAL GROUND PLANES IN ORDER TO MAXIMIZE HEAT DISSIPATION. FOR .031" THK FR4 MATERIAL, VIA BARREL PLATING TO BE MIN. 0.0014 THICK. VIAS TO BE PLUGGED WITH EITHER CONDUCTIVE OR NON-CONDUCTIVE EPOXY TO PREVENT SOLDER. DRAINS THROUGH VIA IN REFLOW PROCESS N/C N/C GROUND PLANE AREA FOR VIAS 2.23mm X 2.23mm Vbias Functional Diagram N/C 0.65mm TYP. Class 1B Passes between 500 and 1000V Human Body Model (HBM) JEDEC Standard JESD22-A114 16 15 14 13 DEVICE GROUND PAD 2.0mm X 2.0mm Vref 1 12 N/C N/C 2 11 RF OUT RECOMMENDED PAD 0.76mm X 0.34mm RF IN 3 10 RF OUT 9 N/C Function Vref RF Input RF Output Vbias GND N/C or GND 16L 4.0mm X 4.0mm PACKAGE Parameter Rating Operating Case Temperature Thermal Resistance, Rth (1) Junction Temperature, Tjc (2) -40 to +85° C 62° C / W 162° C Notes: 1. The thermal resistance is referenced from the junctionto-case at a case temperature of 85° C. Tjc is a function of the voltage at pins 10 and 11 and the current applied to pins 10, 11, and 16 and can be calculated by: Tjc = Tcase + Rth * Vcc * Icc 2. This corresponds to the typical biasing condition of +5V, 250 mA at an 85° C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247° C. MTTF vs. GND Tab Temperature 100000 MTTF (million hrs) Thermal Specifications 10000 7 8 N/C 6 N/C TYP. 4.00mm 5 N/C SOLDERMASK SWELL TO BE 0.5mm FROM OUTSIDE EDGE OF ALL PADS N/C N/C 4 Pin No. 1 3 10, 11 16 Backside Paddle 2, 4-9, 12-15 Mounting Config. Notes 1. 1000 2. 100 60 70 80 90 100 110 120 Tab Temperature (°C) 3. 4. 5. 6. 7. 8 A heatsink underneath the area of the PCB for the mounted device is strictly required for proper thermal operation. Damage to the device can occur without the use of one. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. RF trace width depends upon the PC board material and construction. Use 1 oz. Copper minimum. All dimensions are in millimeters (inches). Angles are in degrees. Specifications and information are subject to change without notice WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com August 2004