TI SN74LVCZ32245AZKER

SN74LVCZ32245A
32-BIT BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES423 – JANUARY 2003 – REVISED JUNE 2005
•
FEATURES
•
•
•
•
•
Member of the Texas Instruments Widebus+™
Family
Operates From 2.7 V to 3.6 V
Inputs Accept Voltages to 5.5 V
Max tpd of 3.7 ns at 3.3 V
Ioff and Power-Up 3-State Support Hot
Insertion
Supports Mixed-Mode Signal Operation on All
Ports (5-V Input/Output Voltage With
3.3-V VCC)
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 1000-V Charged-Device Model (C101)
•
•
GKE PACKAGE
(TOP VIEW)
<br/>
<br/>
1
2
3
4
5
6
TERMINAL ASSIGNMENTS
1
2
3
A
1B2
1B1
B
1B4
1B3
C
1B6
D
A
B
C
D
E
4
5
6
1DIR
1OE
1A1
1A2
GND
GND
1A3
1A4
1B5
VCC
VCC
1A5
1A6
1B8
1B7
GND
GND
1A7
1A8
E
2B2
2B1
GND
GND
2A1
2A2
F
F
2B4
2B3
VCC
VCC
2A3
2A4
G
G
2B6
2B5
GND
GND
2A5
2A6
H
H
2B7
2B8
2DIR
2OE
2A8
2A7
J
J
3B2
3B1
3DIR
3OE
3A1
3A2
K
K
3B4
3B3
GND
GND
3A3
3A4
L
M
N
P
R
L
3B6
3B5
VCC
VCC
3A5
3A6
M
3B8
3B7
GND
GND
3A7
3A8
N
4B2
4B1
GND
GND
4A1
4A2
P
4B4
4B3
VCC
VCC
4A3
4A4
R
4B6
4B5
GND
GND
4A5
4A6
T
4B7
4B8
4DIR
4OE
4A8
4A7
T
DESCRIPTION/ORDERING INFORMATION
This 32-bit (quad-octal) noninverting bus transceiver is designed for 2.7-V to 3.6-V VCC operation.
The SN74LVCZ32245A is designed for asynchronous communication between data buses. The control-function
implementation minimizes external timing requirements.
ORDERING INFORMATION
TA
–40°C to 85°C
(1)
PACKAGE (1)
LFBGA – GKE
Tape and reel
ORDERABLE PART NUMBER
SN74LVCZ32245AGKER
TOP-SIDE MARKING
ZC245A
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus+ is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2003–2005, Texas Instruments Incorporated
SN74LVCZ32245A
32-BIT BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES423 – JANUARY 2003 – REVISED JUNE 2005
DESCRIPTION/ORDERING INFORMATION (CONTINUED)
This device can be used as four 8-bit transceivers, two 16-bit transceivers, or one 32-bit transceiver. It allows
data transmission from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the
direction-control (DIR) input. The output-enable (OE) input can be used to disable the device so that the buses
effectively are isolated.
Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of these devices as translators
in a mixed 3.3-V/5-V system environment.
When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down.
However, to ensure the high-impedance state above 1.5 V, OE should be tied to VCC through a pullup resistor;
the minimum value of the resistor is determined by the current-sinking capability of the driver.
This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry
disables the outputs, preventing damaging current backflow through the device when it is powered down. The
power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,
which prevents driver conflict.
FUNCTION TABLE
(EACH 8-BIT SECTION)
INPUTS
OE
2
DIR
OPERATION
L
L
B data to A bus
L
H
A data to B bus
H
X
Isolation
SN74LVCZ32245A
32-BIT BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES423 – JANUARY 2003 – REVISED JUNE 2005
LOGIC DIAGRAM (POSITIVE LOGIC)
1DIR
A3
2DIR
A4
1A1
H4
1OE
A5
2A1
A2
H3
E5
E2
1B1
To Seven Other Channels
3DIR
2B1
To Seven Other Channels
J3
4DIR
J4
3A1
2OE
T4
3OE
J5
4A1
J2
T3
4OE
N5
N2
3B1
To Seven Other Channels
4B1
To Seven Other Channels
Absolute Maximum Ratings (1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
VCC
Supply voltage range
–0.5
6.5
V
VI
Input voltage range (2)
–0.5
6.5
V
VO
Voltage range applied to any output in the high-impedance or power-off state (2)
–0.5
6.5
V
–0.5
VCC + 0.5
state (2) (3)
UNIT
VO
Voltage range applied to any output in the high or low
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
±100
Continuous current through each VCC or GND
θJA
Package thermal impedance (4)
Tstg
Storage temperature range
(1)
(2)
(3)
(4)
–65
V
mA
40
°C/W
150
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
The value of VCC is provided in the recommended operating conditions table.
The package thermal impedance is calculated in accordance with JESD 51-7.
3
SN74LVCZ32245A
32-BIT BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES423 – JANUARY 2003 – REVISED JUNE 2005
Recommended Operating Conditions (1)
VCC
Supply voltage
VIH
High-level input voltage
VCC = 2.7 V to 3.6 V
VIL
Low-level input voltage
VCC = 2.7 V to 3.6 V
VI
Input voltage
MIN
MAX
2.7
3.6
2
V
V
V
0
5.5
0
VCC
3-state
0
5.5
Output voltage
IOH
High-level output current
IOL
Low-level output current
∆t/∆v
Input transition rise or fall rate
∆t/∆VCC
Power-up ramp rate
150
TA
Operating free-air temperature
–40
V
0.8
High or low state
VO
(1)
UNIT
VCC = 2.7 V
–12
VCC = 3 V
–24
VCC = 2.7 V
12
VCC = 3 V
24
6
V
mA
mA
ns/V
µs/V
85
°C
All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
Electrical Characteristics
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IOH = –100 µA
VOH
2.7 V to 3.6 V
II
Control inputs
Ioff
MIN
TYP (1)
MAX
2.2
3V
2.4
IOH = –24 mA
3V
2.2
IOL = 100 µA
2.7 V to 3.6 V
IOL = 12 mA
2.7 V
0.4
IOL = 24 mA
3V
0.55
VI = 0 to 5.5 V
VI or VO = 5.5 V
UNIT
VCC – 0.2
2.7 V
IOH = –12 mA
VOL
VCC
V
0.2
V
3.6 V
±5
µA
0
±5
µA
3.6 V
±5
µA
IOZPU
VO = 0.5 V to 2.5 V,
OE = don't care
0 to 1.5 V
±5
µA
IOZPD
VO = 0.5 V to 2.5 V,
OE = don't care
1.5 V to 0
±5
µA
IOZ
(2)
VO = 0 to 5.5 V
VI = VCC or GND
ICC
3.6 V ≤ VI ≤ 5.5 V (3)
∆ICC
IO = 0
One input at VCC – 0.6 V, Other inputs at VCC or GND
120
3.6 V
120
2.7 V to 3.6 V
500
µA
µA
Ci
Control inputs
VI = VCC or GND
3.3 V
5
pF
Cio
A or B ports
VO = VCC or GND
3.3 V
6.5
pF
(1)
(2)
(3)
4
All typical values are at VCC = 3.3 V, TA = 25°C.
For I/O ports, the parameter IOZ includes the input leakage current.
This applies in the disabled state only.
SN74LVCZ32245A
32-BIT BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES423 – JANUARY 2003 – REVISED JUNE 2005
Switching Characteristics
over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1)
FROM
(INPUT)
TO
(OUTPUT)
tpd
A or B
ten
OE
tdis
OE
PARAMETER
VCC = 2.7 V
MIN
VCC = 3.3 V
± 0.3 V
UNIT
MAX
MIN
MAX
B or A
4.2
1.3
4
ns
A or B
6.1
1.4
5.6
ns
A or B
7.1
2
6.6
ns
Switching Characteristics
over recommended operating free-air temperature range, CL = 30 pF (unless otherwise noted) (see Figure 1)
FROM
(INPUT)
TO
(OUTPUT)
tpd
A or B
B or A
ten
OE
A or B
tdis
OE
A or B
PARAMETER
VCC = 2.7 V
MIN
MAX
VCC = 3.3 V
± 0.3 V
UNIT
MIN
MAX
3.9
1
3.7
ns
5.9
1.1
5.4
ns
6.7
1.6
6.2
ns
Operating Characteristics
TA = 25°C
TEST
CONDITIONS
PARAMETER
Cpd
Power dissipation capacitance per transceiver
Outputs enabled
Outputs disabled
f = 10 MHz
VCC = 3.3 V
TYP
42
4
UNIT
pF
5
SN74LVCZ32245A
32-BIT BUS TRANSCEIVER
WITH 3-STATE OUTPUTS
www.ti.com
SCES423 – JANUARY 2003 – REVISED JUNE 2005
PARAMETER MEASUREMENT INFORMATION
VCC = 2.7 V AND 3.3 V ± 0.3 V
2 × VCC
S1
500 Ω
From Output
Under Test
Open
GND
CL = 30 pF or 50 pF
(see Note A)
500 Ω
TEST
S1
tpd
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCC
GND
LOAD CIRCUIT
tw
VCC
Timing
Input
VCC/2
VCC/2
VCC/2
0V
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VCC/2
VCC/2
0V
tPLH
Output
Control
(low-level
enabling)
VCC/2
VOL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
tPLZ
VCC
VCC/2
tPZH
VOH
VCC/2
0V
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
tPHL
VCC/2
VCC
VCC/2
tPZL
VCC
Input
VOLTAGE WAVEFORMS
PULSE DURATION
th
VCC
Data
Input
VCC/2
0V
0V
tsu
Output
VCC
VCC/2
Input
Output
Waveform 2
S1 at GND
(see Note B)
VOL + 0.3 V
VOL
tPHZ
VOH
VCC/2
VOH − 0.3 V
0V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2 ns, tf ≤ 2 ns.
D. The outputs are measured one at a time, with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Figure 1. Load Circuit and Voltage Waveforms
6
PACKAGE OPTION ADDENDUM
www.ti.com
30-Mar-2007
PACKAGING INFORMATION
Status (1)
Package
Type
Package
Drawing
SN74LVCZ32245AGKER
NRND
LFBGA
GKE
96
1000
SN74LVCZ32245AZKER
ACTIVE
LFBGA
ZKE
96
1000 Green (RoHS &
no Sb/Br)
Orderable Device
Pins Package Eco Plan (2)
Qty
TBD
Lead/Ball Finish
MSL Peak Temp (3)
SNPB
Level-3-220C-168 HR
SNAGCU
Level-3-250C-168 HR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
27-Apr-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
Device
27-Apr-2007
Package Pins
Site
Reel
Diameter
(mm)
Reel
Width
(mm)
A0 (mm)
B0 (mm)
K0 (mm)
P1
(mm)
W
Pin1
(mm) Quadrant
SN74LVCZ32245AGKER
GKE
96
HIJ
330
24
5.7
13.7
2.0
8
24
Q1
SN74LVCZ32245AZKER
ZKE
96
HIJ
330
24
5.7
13.7
2.0
8
24
Q1
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm)
Width (mm)
Height (mm)
SN74LVCZ32245AGKER
GKE
96
HIJ
346.0
346.0
41.0
SN74LVCZ32245AZKER
ZKE
96
HIJ
346.0
346.0
41.0
Pack Materials-Page 2
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