SN74LVCH244A-Q1 OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES492A – SEPTEMBER 2003 – REVISED DECEMBER 2005 FEATURES • • • • • • • • • • • • (1) DW OR PW PACKAGE (TOP VIEW) Qualification in Accordance With AEC-Q100 (1) Qualified for Automotive Applications Customer-Specific Configuration Control Can Be Supported Along With Major-Change Approval ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0) Operates From 2 V to 3.6 V Inputs Accept Voltages to 5.5 V Max tpd of 6.5 ns at 3.3 V Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C Typical VOHV (Output VOH Undershoot) >2 V at VCC = 3.3 V, TA = 25°C Supports Mixed-Mode Signal Operation on All Ports (5-V Input/Output Voltage With 3.3-V VCC) Ioff Supports Partial-Power-Down Mode Operation Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors 1OE 1A1 2Y4 1A2 2Y3 1A3 2Y2 1A4 2Y1 GND 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC 2OE 1Y1 2A4 1Y2 2A3 1Y3 2A2 1Y4 2A1 Contact factory for details. Q100 qualification data available on request. DESCRIPTION/ORDERING INFORMATION The SN74LVCH244A octal buffer/line driver is designed for 2.7-V to 3.6-V VCC operation. This device is organized as two 4-bit line drivers with separate output-enable (OE) inputs. When OE is low, this devices passes data from the A inputs to the Y outputs. When OE is high, the outputs are in the high-impedance state. Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended. Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator in a mixed 3.3-V/5-V system environment. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. ORDERING INFORMATION PACKAGE (1) TA –40°C to 125°C (1) ORDERABLE PART NUMBER TOP-SIDE MARKING SOIC – DW Reel of 2000 SN74LVCH244AQDWRQ1 LH244AQ TSSOP – PW Reel of 2000 SN74LVCH244AQPWRQ1 LH244AQ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2003–2005, Texas Instruments Incorporated SN74LVCH244A-Q1 OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES492A – SEPTEMBER 2003 – REVISED DECEMBER 2005 FUNCTION TABLE (EACH BUFFER) INPUTS OE A OUTPUT Y L H H L L L H X Z LOGIC DIAGRAM (POSITIVE LOGIC) 1OE 1A1 1A2 1A3 1A4 1 19 2OE 2 18 4 16 6 14 8 12 1Y1 2A1 1Y2 2A2 1Y3 2A3 1Y4 2A4 11 9 13 7 15 5 17 3 2Y1 2Y2 2Y3 2Y4 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN MAX VCC Supply voltage range –0.5 6.5 V VI Input voltage range (2) –0.5 6.5 V –0.5 6.5 V –0.5 VCC + 0.5 state (2) UNIT VO Voltage range applied to any output in the high-impedance or power-off VO Voltage range applied to any output in the high or low state (2) (3) IIK Input clamp current VI < 0 –50 mA IOK Output clamp current VO < 0 –50 mA IO Continuous output current ±50 mA ±100 mA Continuous current through VCC or GND θJA Package thermal impedance (4) Tstg Storage temperature range (1) (2) (3) (4) 2 DW package 58 PW package 83 –65 150 V °C/W °C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed. The value of VCC is provided in the recommended operating conditions table. The package thermal impedance is calculated in accordance with JESD 51-7. SN74LVCH244A-Q1 OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES492A – SEPTEMBER 2003 – REVISED DECEMBER 2005 Recommended Operating Conditions (1) Operating VCC Supply voltage VIH High-level input voltage VCC = 2.7 V to 3.6 V VIL Low-level input voltage VCC = 2.7 V to 3.6 V VI Input voltage VO Output voltage IOH High-level output current IOL Low-level output current ∆t/∆v Input transition rise or fall rate TA Operating free-air temperature (1) Data retention only MIN MAX 2 3.6 1.5 2 UNIT V V 0.8 V 0 5.5 V High or low state 0 VCC 3-state 0 5.5 VCC = 2.7 V –12 VCC = 3 V –24 VCC = 2.7 V 12 VCC = 3 V 24 –40 V mA mA 10 ns/V 125 °C All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Electrical Characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS IOH = –100 µA VOH VOL II 2.7 V to 3.6 V IOZ ICC ∆ICC (1) (2) (3) MAX 2.2 3V 2.4 IOH = –24 mA 3V 2.2 IOL = 100 µA 2.7 V to 3.6 V IOL = 12 mA 2.7 V 0.4 IOL = 24 mA 3V 0.55 VI = 0 to 5.5 V V 0.2 ±5 3.6 V 3V VI = 2 V ±500 VO = 0 to 5.5 V 3.6 V ±15 IO = 0 One input at VCC – 0.6 V, Other inputs at VCC or GND µA µA –75 3..6 V 3.6 V ≤ VI ≤ 5.5 V (3) V 75 VI = 0 to 3.6 V (2) VI = VCC or GND UNIT VCC – 0.2 2.7 V IOH = –12 mA VI = 0.8 V II(hold) MIN TYP (1) VCC 10 3.6 V 10 2.7 V to 3.6 V µA µA 500 µA Ci VI = VCC or GND 3.3 V 4 12 pF Co VO = VCC or GND 3.3 V 5.5 12 pF All typical values are at VCC = 3.3 V, TA = 25°C. This is the bus-hold maximum dynamic current required to switch the input from one state to another. This applies in the disabled state only. 3 SN74LVCH244A-Q1 OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES492A – SEPTEMBER 2003 – REVISED DECEMBER 2005 Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1) FROM (INPUT) TO (OUTPUT) tpd A ten OE tdis OE PARAMETER VCC = 3.3 V ± 0.3 V VCC = 2.7 V MIN UNIT MAX MIN MAX Y 7.5 1 6.5 ns Y 9 1 8 ns Y 8 1 7 ns Operating Characteristics TA = 25°C TEST CONDITIONS PARAMETER Cpd (1) 4 Power dissipation capacitance per buffer/driver Outputs enabled Outputs disabled This information was not available at the time of publication. f = 10 MHz VCC = 2.5 V VCC = 3.3 V TYP TYP (1) 47 (1) 2 UNIT pF SN74LVCH244A-Q1 OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS www.ti.com SCES492A – SEPTEMBER 2003 – REVISED DECEMBER 2005 PARAMETER MEASUREMENT INFORMATION VLOAD S1 RL From Output Under Test CL (see Note A) Open GND RL TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open VLOAD GND LOAD CIRCUIT INPUTS VCC 2.7 V 3.3 V ± 0.3 V VI tr/tf 2.7 V 2.7 V ≤2.5 ns ≤2.5 ns VM VLOAD CL RL V∆ 1.5 V 1.5 V 6V 6V 50 pF 50 pF 500 Ω 500 Ω 0.3 V 0.3 V VI Timing Input VM 0V tw tsu VI Input VM VM th VI Data Input VM VM 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VI VM Input VM 0V tPLH VM VM VOL tPHL VM VM 0V Output Waveform 1 S1 at VLOAD (see Note B) tPLH tPLZ VLOAD/2 VM tPZH VOH Output VM tPZL tPHL VOH Output VI Output Control VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS Output Waveform 2 S1 at GND (see Note B) VOL + V∆ VOL tPHZ VM VOH – V∆ VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 5 PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 PACKAGING INFORMATION Orderable Device Status (1) SN74LVCH244AQDWRQ1 SN74LVCH244AQPWRQ1 Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) Package Type Package Drawing OBSOLETE SOIC DW 20 TBD Call TI Call TI OBSOLETE TSSOP PW 20 TBD Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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